MMA20312BT1 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

  • Active Bias Control (On- -chip)
  • Frequency: 1800- -2200 MHz
  • P1dB: 30.5 dBm @ 2140 MHz (CW Application Circuit)
  • Power Gain: 26.4 dB @ 2140 MHz (CW Application Circuit)
  • OIP3: 44.5 dBm @ 2140 MHz (W- -CDMA Application Circuit)
  • Single 5 Volt Supply
  • Low Cost QFN Surface Mount Package
  • RoHS Compliant
  • In Tape and Reel. T1 Suffix = 1000 Units, 12 mm Tape Width, 7 inch Reel.

Table 1. Typical CW Performance(1)

  1. VCC1 =V CC2 =V CTRL =5V d c ,TA =2 5°C, 50 ohm system, CW

Table 2. Maximum Ratings

  1. For reliable operation, the junction temperature should not

Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955. © Freescale Semiconductor, Inc., 2010- -2011.All rights reserved.

Table 4. Electrical Characteristics(VCC1 =V CC2 =V CTRL = 5 Vdc, 2140 MHz, TA =2 5°C, 50 ohm system, in Freescale W- -CDMA Table 5. ESD Protection Characteristics Table 6. Moisture Sensitivity Level

  1. Specified data is based on performance of soldered down part in W- -CDMA application circuit.
  2. For reliable operation, the junction temperature should not exceed 150°C.

Figure 1. Functional Block Diagram Figure 2. Pin Connections

Figure 3. MMA20312BT1 Test Circuit Schematic - - TD- -SCDMA Note: Component numbers C9, C10, C11, C12, C14, and C15 are not used. Table 7. MMA20312BT1 Test Circuit Component Designations and Values - - TD- -SCDMA

Figure 4. MMA20312BT1 TestCircuit Component Layout - - TD- -SCDMA Note: Component numbers C9, C10, C11, C12, C14, and C15 are not used.

Figure 11. MMA20312BT1 Test Circuit Schematic - - W- -CDMA Note: Component numbers C10, C11, C12, C14, and C15 are not used. Table 8. MMA20312BT1 Test Circuit Component Designations and Values - - W- -CDMA

Figure 12. MMA20312BT1 Test Circuit Component Layout - - W- -CDMA Note: Component numbers C10, C11, C12, C14, and C15 are not used.

PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, tools and software to aid your design process. Application Notes

  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software
  • .s2p File Development Tools
  • Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Oct. 2010 • Initial Release of Data Sheet 1 Mar. 2011 • Added “OIP3: 44.5 dBm @ 2140 MHz (W- -CDMA Application Circuit)” to Features list, p. 1

  • Typical CW Performance table: removed OIP3, p. 1
  • Figs. 4 and 12, Test Circuit Component Layout, updated component part layout identifier to reflect package type. Changed from MMA20312B to QFN 3x3- -12B, p. 4, 8

Information in this document is provided solely to enablesystem and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its productsfor any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and allliability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components insystems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributorsharmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2010- -2011. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516

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