MM5Z10V

MM5Z2V4 PACELEADER | Alldatasheet

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o MAXIMUM RATINGS (at TA=25 C unless otherwise noted) FEATURES MECHANICAL DATA SURFACE MOUNT ZENER DIODESSURFACE MOUNT ZENER DIODES www.paceleader.tw 150mW Surface Mount Zener Diodes - 2.4V-75V Dimensions in inches and (millimeters) SOD-523FL .035(0.90) .028(0.70) .002(0.05) .007(0.20) .028(0.70) .028(0.50) .0098(0.25) .014(0.35) .006(0.15) .0098(0.25) .043(1.10) .051(1.30) .051(1.50) .067(1.70) 1 2 Silicon epitaxial planar chip structure. Wide zener reverse voltage range 2.40V to 75V. Tiny package size for high density applications. Ideally suited for automated assembly processes. Lead-free parts meet environmental standards of MIL-STD-19500 /228

• Suffix "-H" indicates Halogen-free parts, ex. ΜΜ5Ζ2V4-H.
• Case : Molded plastic, SOD-523FL
• Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.002 gram Epoxy : UL94-V0 rated flame retardant PARAMETER CONDITIONS Symbol VF PTOT MIN. TYP. MAX. 0.9 150 UNIT V mW Thermal Resistance Storage temperature Operating temperature Junction to the ambient RθJA TSTG TJ -55 -65 625 +150 +150 °C/W o C o C Forward voltage Power Dissipation I = 10 mA DCF Diode on FR-5 Board MM5Z2V4 thru MM5Z75V

Z @ IZT ZT Max.(V) V @ IZ ZT mA IZK µA IR Volts VR OHMs Z @ IZK ZK 3.9 2.4 4.3 2.7 4.7 3.0 5.1 3.3 5.6 3.6 6.2 6.8 7.5 8.2 9.1 100 100 100 130 150 07 55 00 50 08 56 01 51 09 57 02 52 0A 58 05 53 0C 59 06 54 0E 5A 0F 5B 0G 5C 0H 5D 0K 5E 0L 5F 0M 5G 0N 5H 0U 5L 0W 5M 0Z 5N 10 5P 11 5R 12 5S 14 5T 18 5U 19 5V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.7 0.2 0.1 0.1 0.1 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 1.0 1.0 1.0 1.0 2.0 1.0 2.0 2.0 4.0 4.0 1.0 1.0 5.0 5.0 7.0 8.0 8.0 8.0 10.5 11.2 12.6 14.0 15.4 16.8 18.9 21.0 23.2 25.2 27.3 30.1 1000 1000 1000 1000 800 1000 500 1000 200 1000 100 160 160 160 160 160 160 100 100 120 300 300 300 500 500 500 500 Part No. MM5Z3V9 MM5Z2V4 MM5Z4V3 MM5Z2V7 MM5Z4V7 MM5Z3V0 MM5Z5V1 MM5Z3V3 MM5Z5V6 MM5Z3V6 MM5Z6V2 MM5Z6V8 MM5Z7V5 MM5Z8V2 MM5Z9V1 MM5Z10V MM5Z11V MM5Z12V MM5Z15V MM5Z16V MM5Z18V MM5Z20V MM5Z22V MM5Z24V MM5Z27V MM5Z30V MM5Z33V MM5Z36V MM5Z39V MM5Z43V Nom.(V)Min.(V) 3.7 2.2 4.0 2.5 4.4 2.8 4.8 3.1 5.2 3.4 5.8 6.4 7.0 7.7 8.5 9.4 10.4 11.4 15.3 16.8 18.8 20.8 22.8 25.1 28.0 31.0 34.0 37.0 40.0 4.1 2.6 4.6 2.9 5.0 3.2 5.4 3.5 6.0 3.8 6.6 7.2 7.9 8.7 9.6 10.6 11.6 12.7 17.1 19.1 21.2 23.3 25.6 28.9 32.0 35.0 38.0 41.0 46.0 o Electrical characteristics (at T =25 C unless otherwise noted)A 170 1.0 0.05 32.9 500 MM5Z47V 44.0 50.0 180 1.0 0.05 35.7 500 MM5Z51V 48.0 54.0 20 5X 21 5Y 1A 5Z 1C 5– 1D 5= 56 62 5 200 215 1.0 1.0 0.05 0.05 39.2 43.4500 500 MM5Z56V MM5Z62V 52.0 58.0 60.0 66.0 240 1.0 0.05 47.6 500 MM5Z68V 64.0 72.0 15 5 30 1.0 0.0580 MM5Z75V 14.3 15.8 1E 5Ξ 1F 5> 1G 5< 0T 5K 7570.0 79.0 255 52.5 Vz (mV/k) @IZT C @VR=0 f=1MHz pFMin. Max. -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2.0 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6.0 10.4 12.4 14.4 16.4 18.4 21.4 24.4 27.4 30.4 33.4 37.6 42.0 -2.5 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7.0 8.0 9.0 25.3 29.4 33.4 37.4 41.2 46.6 51.8 450 450 450 450 260 450 225 200 185 155 450 450 140 135 130 130 130 130 110 105 100 46.6 57.2 52.2 63.8 7.0 11 120 58.8 65.6 71.6 79.8 73.4 88.6 9.2 13 Device date code see page6 Note1 SURFACE MOUNT ZENER DIODESSURFACE MOUNT ZENER DIODES MM5Z2V4 thru MM5Z75V 2www.paceleader.tw

TOTAL POWER DISSIPATION (mW)RELATIVE VOLTAGE CHANGEDIODE CAPACITANCE (pF) VOLTAGE CHANGE (mV) TEMPERATURE COEFFICIENT (10 / K) o AMIBIENT TEMPERATURE ( C) o JUNCTION TEMPERATURE ( C) ZENER VOLTAGE (V) ZENER VOLTAGE (V) ZENER VOLTAGE (V) FIG.1-TOTAL POWER DISSIPATION VS. AMBIENT TEMPERATURE FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE VS. JUNCTION TEMPERATURE FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE o UNDER OPERATING CONDITIONS AT T =25 CA FIG. 4-TEMPERATURE COEFFICIENT OF VZ VS. Z-VOLTAGE FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE 100 125 150 40 80 120 160 200 0 100 1000 5 10 15 20 25 -60 0.8 0.9 1.0 120 1.1 180 1.2 240 1.3 10 20 30 40 50 100 150 200 5 10 15 20 25 8 x 10 /K I = 5mAZ I = 5mAZ 10 x 10 /K -4 x 10 /K -2 x 10 /K 2 x 10 /K 4 x 10 /K 6 x 10 /K Rating and characteristic curves (MM5Z2V4 thru MM5Z75V) SURFACE MOUNT ZENER DIODESSURFACE MOUNT ZENER DIODES MM5Z2V4 thru MM5Z75V www.paceleader.tw 3

ZENER CURRENT (mA) THERMAL RESISTANCE FOR PULSE Cond. (K/W) DIFFERENTIAL Z-RESISTANCE (ohm) FORWARD CURRENT (mA) ZENER CURRENT (mA) ZENER VOLTAGE (V) FORWARD VOLTAGE (V) PULSE LENGTH (mS) ZENER VOLTAGE (V) ZENER VOLTAGE (V) FIG. 6-FORWARD CURRENT VS. FORWARD VOLTAGE FIG. 8-Z-CURRENT VS. Z-VOLTAGE FIG. 10-THERMAL RESPONSE FIG. 7-Z-CURRENT VS. Z-VOLTAGE FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE 0.001 0.1 0.01 0.1 100 20 25 30 35 100 1000 5 10 15 20 25 100 4 8 12 16 20 100 1000 1 10 100 1000 I = 1mAZ I = 5mAZ I = 10mAZ t / T= 0.05p t / T= 0.1p t / T= 0.2p t / T= 0.5p Single Pulse t / T= 0.01p t / T= 0.02p P = 500mWtot P = 500mWtot Rating and characteristic curves (MM5Z2V4 thru MM5Z75V) SURFACE MOUNT ZENER DIODESSURFACE MOUNT ZENER DIODES MM5Z2V4 thru MM5Z75V www.paceleader.tw 4

Pin Simplified outline Symbol Suggested solder pad layout Dimensions in inches and (millimeters) A C B B 0.016 (0.40) A 0.016 (0.40) C 0.048 (1.20) PACKAGE SOD-523FL Marking Type number Marking MM5Z Series DEV+ Σ DEV = Device code (see page 3), Σ=Datecode JAN FEB MAR APR MAY JUN JUL AUG SEP OCT NOV DEC Odd 1 2 3 4 5 6 7 8 9 T V C YearMonth Even E F H J K L N P U X Y Z Example: DEV Σ

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• • Note 1 SURFACE MOUNT ZENER DIODESSURFACE MOUNT ZENER DIODES MM5Z2V4 thru MM5Z75V www.paceleader.tw 5

E B d F W PA D D1D2 C T Item Tolerance SOD-523FL Carrier width Carrier length Carrier depth Sprocket hole 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width E B C d F T W P A D Symbol 0.1 0.1 0.1 min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 unit:mm 178.00 50.00 8.40~9.90 1.75 3.50 4.00 4.00 2.00 0.23 8.00 10.90 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 0.90 1.40 0.76 1.50 Blank Product F Cathode SURFACE MOUNT ZENER DIODESSURFACE MOUNT ZENER DIODES MM5Z2V4 thru MM5Z75V www.paceleader.tw 6

COMPONENT INNER REEL CARTON APPROX. PACKAGE REEL SIZE REEL SPACING BOX BOX DIA, SIZE CARTON GROSS WEIGHT (pcs) (m/m) (pcs) (m/m) (m/m) (m/m) (pcs) (kg) SOD-523FL 7" 3,000 4.0 30,000 183*183*123 178 240,000382*262*387 9.5 Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes o C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time TL TP Ramp-down Temperature SURFACE MOUNT ZENER DIODESSURFACE MOUNT ZENER DIODES MM5Z2V4 thru MM5Z75V www.paceleader.tw 7