MM25G3T120B MACMIC | Alldatasheet

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APPLICATIONS

□ Medical applications □ Motion/servo control □ UPS systems Type VCES IC VCE(sat) TJ=25°C □ IGBT chip in trench FS-technology □ Low switching losses □ V CE(sat) with positive temperature coefficient □ Fast switching and short tail current □ Free wheeling diodes with fast and soft reverse recovery □ High frequency switching application MM25G3T120B 1200V 25A IGBT April 2018 Version 01 RoHS Compliant PRODUCT FEATURES 1.Gate 2.Collector 3.Emitter Unit W V Nm g Tel.:+86-519-85163708 Fax:+86-519-85162291 Post Code:213022 Website:www.macmicst.com Weight 8 MacMic Science & Technology Co., Ltd. Add:#18, Hua Shan Zhong Lu, New District, Changzhou City, Jiangsu Province, P. R .of China Storage Temperature -55~150 Torque to heatsink Recommended(M3) 1.1 TJmax Max. Junction Temperature 175 ℃TJop Operating Temperature -40~175 Tstg IF(AV) Average Forward Current TC=100℃ 20 AIFpuls Diode pulsed current,tp limited by TJmax 40 Ptot Power Dissipation Per IGBT 326 VRRM Repetitive Reverse Voltage TJ=25℃ 1200 ATC=110℃ 25 ICpuls Pulsed collector current,tp limited by TJmax 80 Gate Emitter Voltage ±20 IC DC Collector Current TC=25℃ 40 ABSOLUTE MAXIMUM RATINGS(T C =25°C unless otherwise specified) Symbol Parameter/Test Conditions Values VCES Collector Emitter Voltage TJ=25℃ 1200 VVGES Package MM25G3T120B 1200V 25A 1.8V 175°C MM25G3T120B TO-247 1 1 All d ata sheet.com

µA mA nA nC nF pF ns ns ns ns ns ns ns ns ns nsT =25℃ 100 TJ=125℃ 250 TJ=150℃ 270 TJ=150℃ 40 td(off) Turn off Delay Time VCC=600V,IC=25A RG =30Ω, VGE=±15V TJ=25℃ 210 tr Rise Time TJ=25℃ 35 TJ=125℃ 40 TJ=150℃ 45 td(on) Turn on Delay Time VCC=600V,IC=25A RG =30Ω, VGE=±15V, Inductive Load TJ=25℃ 35 TJ=125℃ Cies Input Capacitance VCE=25V, VGE=0V, f =1MHz 1.9 Cres Reverse Transfer Capacitance 85 400 Qg Gate Charge VCE=600V, IC=25A , VGE=15V 150 100 VCE=1200V, VGE=0V, TJ=150℃ 10 IGES Gate Leakage Current VCE=0V,VGE=±15V, TJ=25℃ -400 IC=25A, VGE=15V, TJ=150℃ 2.2 ICES Collector Leakage Current VCE=1200V, VGE=0V, TJ=25℃ VVCE(sat) Collector Emitter Saturation Voltage IC=25A, VGE=15V, TJ=25℃ 1.8 2.25 IC=25A, VGE=15V, TJ=125℃ 2.1 VGE(th) Gate Emitter Threshold Voltage VCE=VGE, IC=1mA 5.0 5.8 6.5 MM25G3T120B IGBT ELECTRICAL CHARACTERISTICS (T C =25°C unless otherwise specified) Symbol Parameter/Test Conditions Min. Typ. Max. ns ns ns mJ mJ mJ mJ K /W Unit ns A µC mJ K /W E rec Reverse Recovery Energy 1.35 RthJCD Junction to Case Thermal Resistance ( Per Diode) 1.0 QRR Reverse Recovery Charge 4.6 trr Reverse Recovery Time IF=20A , VR=600V dIF/dt=-500A/μs TJ =150℃ 450 IRRM Max. Reverse Recovery Current 21 VIF=20A , VGE=0V, TJ =125℃ 1.6 IF=20A , VGE=0V, TJ =150℃ 1.55 VF Forward Voltage IF=20A , VGE=0V, TJ =25℃ 1.75 2.15 Anti-Parallel Diode ELECTRICAL CHARACTERISTICS (T C =25°C unless otherwise specified) Symbol Parameter/Test Conditions Min. Typ. Max. A RthJC Junction to Case Thermal Resistance ( Per IGBT) 0.46 TJ=150℃ 2.55 ISC Short Circuit Current tpsc≤10µS , VGE=15V TJ=125℃,VCC=600V 100 TJ=150℃ 3.6 Eoff Turn off Energy TJ=125℃ 2.4 TJ=150℃ 180 Eon Turn on Energy VCC=600V,IC=25A RG =30Ω, VGE=±15V, Inductive Load TJ=125℃ 3.4 tf Fall Time TJ=25℃ 100 TJ=125℃ 150 VGE=±15V, Inductive Load 2 2 All d ata sheet.com

Figure 13. Package Outline