MKT-E32B NSC | Alldatasheet
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[CREVISIONS [em] eens ee rrr] [REVISE ANO REDRAW PER NEW STaNDARO | t0237 [02/27/84 | oFGiger | 2x 300.005 -450¢.010 — 089 +.006 i7.6280.121 if}as 0.25) i1-7540.15) j asesans : 4S x 015.010 . #4 t + io. 3020251 iff ie 080 +.008 eee avgzong i2.03é0.29 30 R44 Lok * WOU | UU 5 4s bo cq 550 #.010 Pp 4 113.910.25) 2x 400% p— C4 R.003+.002_ TYP | Etat ie so 12) b] C4 £0.2340.05) 540 MAX ff Pp] Cg ,0254.003 TYP | C4 pI C4 050,005 505.005 T¥P aah LEI EI EIEN ET 7 itSrie'tn : 20 fe 1 3x 4S x 0402. 010 WE 2 i1.02 30.25) MIL/AERO (CONFIGURA’ NOTES: UNLESS OTHERWISE SPECIFIED. TION CONTROL 1. LEAD FIWISH To BE ONE OF THE FOLLOWING: CONTROLLING DIMENSION 1S INCH MIL-M-38510 a. 50 WICROINCHES/12.7 MICROWETERS MINIMUM GOLD PLATING VALUES TN CY ARE WILTTMETERS ONFIGURATION CONTROL OVER 50-350 WICROINCHES/1.27-8.89 MICROMETERS NICKEL. c b. SOLDER DIP. APPROVALS | DATE WATTONAL SEMICONDUCTOR CORPORATION SOLDER THICKNESS PER LATEST REVISION OF KIL-STD-1835, Po pon erapl verre |AP ses toner sete, seat ctor, ca vnse-sve bas 2 a us ay A ce a Ce PEF rcnorl Jovi LEADLESS CHIP CARRIER, ACCOMPLISH THE 01 “1 TYPE C 4. REFERENCE JEDEC REGISTRATION WO-O41, VARIATION AB, DATED 8/86. pep | 32 TERMINAL im [00 MOT SCALE DRAWING] sneer i of tJ