MK5811A RENESAS | Alldatasheet

Document overview

  • Manufacturer or author: mamiller
  • PDF pages: 8

Technical content

Features

  • Packaged in 8-pin SOIC
  • Pb (lead) free package
  • Provides a spread spectrum output clock
  • Supports flat panel controllers
  • Accepts a clock or crystal input (provides same fr equency dithered output)
  • Input frequency range of 4 to 32 MHz
  • Output frequency range of 4 to 32 MHz
  • 1X frequency multiplication
  • Center and down spread
  • Peak reduction by 8 dB to 16 dB typical on 3rd through 19t h odd harmonics
  • Low EMI feature can be disabled
  • Operating voltage of 3.3 V
  • Advanced, low-power CMOS process Block Diagram PLL Clock Synthesis and Spread Spectrum Circuitry S1:0 Spread Direction FRSEL SSCLK GND VDD Clock Buffer/ Crystal Ocsillator X1/CLK The crystal requires external capacitors for accurate tuning of the clock

LOW EMI CLOCK GENERATOR SSCG IDT® LOW EMI CLOCK GENERATOR 2 MK5811A REV D 071014 Pin Assignment Spread Direction and Spread Percentage 0 = connect to GND M = unconnected (floating) 1 = connect directly to VDD Frequency Selection 0 = connect to GND M = unconnected (floating) 1 = connect directly to VDD Note 1: The information in this datasheet does not apply to the MK5812 and MK5814 as each have independent datasheets available at www.idt.com. X1/ICLK GND VDD FRSEL SSCLK X21 8-pin (150 mil) SOIC Pin 3 Pin 4 Spread Direction Spread Percentage 0 0C e n t e r ± 1 . 4 0 MC e n t e r ± 1 . 1 0 1C e n t e r ± 0 . 6 M 0C e n t e r ± 0 . 5 M M No Spread - M 1 Down -1.6 1 0D o w n - 2 . 0 1 MD o w n - 0 . 7 1 1 Down -3.0 Product FRSEL (pin 6) Input Freq. Range Multiplier Output Freq. Range MK5811 0 4.0 to 8.0 MHz X1 4.0 to 8.0 MHz 1 8.0 to 16.0MHz X1 8.0 to 16.0MHz M 16.0 to 32.0MHz X1 16.0 to 32.0MHz MK58121 0 4.0 to 8.0 MHz X2 8.0 to 16.0MHz 1 8.0 to 16.0MHz X2 16.0 to 32.0MHz M 16.0 to 32.0MHz X2 32.0 to 64.0MHz MK58141 0 4.0 to 8.0 MHz X4 16.0 to 32.0MHz 1 8.0 to 16.0MHz X4 32.0 to 64.0MHz M 16.0 to 32.0MHz X4 64.0 to 128MHz

LOW EMI CLOCK GENERATOR SSCG IDT® LOW EMI CLOCK GENERATOR 3 MK5811A REV D 071014 Pin Descriptions External Components The MK5811A requires a minimum number of external components for proper operation. Decoupling Capacitor A decoupling capacitor of 0.01µF must be connected between VDD and GND on pins 7 and 2. Connect the capacitor as close to these pins as possible. For optimum device performance, mount the decoupling capacitor on the component side of the PCB. Avoid the use of vias in the decoupling circuit. Series Termination Resistor Use series termination when the PCB trace between the clock output and the load is over 1 inch. To series terminate a 50 trace (a commonly used trace impedance), place a 20 resistor in series with the clock line. Place the resistor as close to the clock output pin as possible. The nominal impedance of the clock output is 30. Tri-level Select Pin Operation The S1 and S0 select pins are tri-level, meaning that they have three separate states to make the selections shown in the table on page 2. To select the M (mid) level, the connection to these pins must be eliminated by either floating them originally, or tri-stating the GPIO pins which drive the select pins. PCB Layout Recommendations For optimum device performance and lowest output phase noise, observe the following guidelines: Mou nt the 0.01µF decoupling capacitor on the component side of the board as close to the VDD pin as po ssible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace to the VDD pin and t he PCB trace to the ground via should be kept as short as possible. 2) T o minimize EMI, place the 20 series-termination resistor (if needed) close to the clock output. 3) An opt imum layout is one with all components on the same side of the board, thus minimizing vias through other sign al layers. Other signal traces should be routed away from the MK5811A device. This includes signal traces loca ted underneath the device, or on layers adjacent to the g round plane layer used by the device. Crystal Information The crystal used should be a fundamental mode (do not use third overtone), parallel resonant crystal. To optimize the initial accuracy, connect crystal capacitors from pins X1 to ground and X2 to ground. The value of these capacitors is given by the following equation: Crystal caps (pF) = (C L - 6) x 2 In the equation, CL is the crystal load capacitance. For example, a crystal with a 16 pF load capacitance uses two 20 pF [(16-6) x 2] capacitors. Pin Number Pin Name Pin Type Pin Description 1 X1/ICLK Input Connect to 4-32 MHz crystal or clock. 2 GND Power Connect to ground. 3 S1 Input Function select 1 input. Selects spread amount and direction per table above. (default-internal mid-level). 4 S0 Input Function select 0 input. Selects spread amount and direction per table above. (default-internal mid-level).

5 SSCLK Output Clock output with Spread spectrum

6 FRSEL Input Function select for input frequency range. Default to mid level “M”. 7 VDD Power Connect to +3.3 V. 8 X2 XO Crystal connection to 4-32 MHz crystal. Leave unconnected for clock

LOW EMI CLOCK GENERATOR SSCG IDT® LOW EMI CLOCK GENERATOR 4 MK5811A REV D 071014 Spread Spectrum Profile The MK5811A is a low EMI clock generator using a optimized frequency slew rate algorithm to facilitate down stream tracking of zero delay buffers and other PLL devices. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the MK5811A. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device, at these or any other conditions, above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Recommended Operation Conditions Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature 0 to +85C Time Frequency Modulation R ate Item Rating Supply Voltage, VDD 7 V All Inputs and Outputs -0.5 V to VDD+0.5 V Ambient Operating Temperature 0 to +85 C Storage Temperature -65 to +150 C Junction Temperature 125 C Soldering Temperature 260 C Parameter Min. Typ. Max. Units Ambient Operating Temperature 0 +85 C Power Supply Voltage (measured in respect to GND) +3.0 3.63 V Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 3.0 3.3 3.63 V Supply Current IDD No load, at 3.3 V, Fin=12 MHz 23 25 mA No load, at 3.3 V, Fin=24 MHz 30 mA No load, at 3.3 V, Fin=32 MHz 35 mA Input High Voltage V IH 0.85VDD VDD VDD V Input middle Voltage V IHM 0.4VDD 0.5VDD 0.6VDD V Input Low Voltage V IL 0.0 0.0 0.15VDD V

LOW EMI CLOCK GENERATOR SSCG IDT® LOW EMI CLOCK GENERATOR 5 MK5811A REV D 071014 Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature 0 to +85 C, CL = 15 pF Note 1: Spread is enabled. Thermal Characteristics for 8-pin SOIC Marking Diagram Notes: 1. “# 2. “YYWW” is the last two digits of the year and week the part was assembled. 3. “L ” denotes Pb free. Bot tom marking: country of origin. Output High Voltage V OH CMOS, IOH = 12 mA 2.4 V Output High Voltage V OH IOH = 24 mA 2.0 V Output Low Voltage V OL IOL = -12 mA 0.4 V IOL = -24 mA 1.2 V Input Capacitance C IN1 S0, S1, FRSEL pins 4 6 pF CIN2 X1, X2 pins 6 9 pF Nominal Output Impedance ZO 30  Parameter Symbol Conditions Min. Typ. Max. Units Input Clock Frequency 4 32 MHz Output Clock Frequency 4 32 MHz Input Clock Duty Cycle Time above VDD/2 40 60 % Output Clock Duty Cycle Time above 1.5 V 45 50 55 % Cycle-to-cycle Jitter1 Fin=4MHz, Fout=4 MHz 350 800 ps Cycle-to-cycle Jitter1 Fin=8MHz, Fout=8 MHz 250 450 ps Output Rise Time tR 0.4 to 2.4 V 1.2 ns Output Fall Time tF 2.4 to 0.4 V 1.2 ns EMI Peak Frequency Reduction 8 to 16 dB Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient JA Still air 150 C/W JA 1 m/s air flow 140 C/W JA 3 m/s air flow 120 C/W Thermal Resistance Junction to Case JC 40 C/W Parameter Symbol Conditions Min. Typ. Max. Units MK5811AL YYWW

LOW EMI CLOCK GENERATOR SSCG IDT® LOW EMI CLOCK GENERATOR 6 MK5811A REV D 071014 Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Inc. (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Part / Order Number Marking Shipping Packaging Package Temperature MK5811ASLF see page 5 Tubes 8-pin SOIC 0 to +85  C MK5811ASLFTR Tape and Reel 8-pin SOIC 0 to +85  C INDEX AREA 1 2 D E SEATING PLANE A e - C - B .10 (.004) C C L H h x 45 Millimeters Inches Symbol Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0 . 3 30 . 5 1. 0 1 3. 0 2 0 C 0.19 0.25 .0075 .0098 D 4.80 5.00 .1890 .1968 E 3.80 4.00 .1497 .1574 e 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0 . 2 50 . 5 0. 0 1 0. 0 2 0 L 0 . 4 01 . 2 7. 0 1 6. 0 5 0

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