MK1704A RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 8
Technical content
Features
- 8 pin SOIC package
- Pb (lead) free package
- Provides a spread spectrum output clock
- Supports leading flat panel controllers
- Accepts a clock input, provides same frequency dithered out put
- Optimized for higher resolutions that require up to 140 MHz, as well as 40 MHz (SVGA) and 65 MHz (XVG cl ocks
- Peak reduction by 7 dB - 14 dB typical on 3rd - 19th odd har monics
- Low EMI feature can be disabled
- Operating voltage of 3.3V or 5V
- Advanced, low power CMOS process
- See the MK1714-01 for a multiplier with low EMI which ca n operate from a crystal Block Diagram Input Buffer PLL Clock Synthesis and Spread Spectrum Circuitry CLK S1:0 VDD GND Low EMI Enable Input
LOW EMI CLOCK GENERATOR SSCG IDT™ LOW EMI CLOCK GENERATOR 2 MK1704A REV G 051310 Pin Assignment 8 pin (150 mil) SOIC Output Clock Selection Table Pin Descriptions External Components Series Termination Resistor Clock output traces over one inch should use series termination. To series terminate a 50Ω trace (a commonly used trace impedance), place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. Decoupling Capacitor A decoupling capacitor of 0.01µF must be connected between VDD and GND on pins 2 and 3. PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. Th e 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Distance of the ferrite bead and bulk decoupling from the device is less critical. The external crystal should be mounted just next to the de vice with short traces. The X1 and X2 traces should not be routed next to each other with minimum spaces, instead t hey should be separated and away from other traces. 3) T o minimize EMI the 33Ω series termination resistor, if ne eded, should be placed close to the clock output. 4) An opt imum layout is one with all components on the same side of the board, minimizing vias through other signal ICLK VDD GND CLK LEE NC1 S1 S0 Input Min. Input Nom. Input Max. Mult. Freq. spread vs. CLK 0 0 60 135 140 x1 +0.5, -1.5% 0 1 60 80 120 x1 +0.5, -1.5% 1 0 30 40 60 x1 Down 2.5% 1 1 40 65 100 x1 +0.5, -1.5% Pin Number Pin Name Pin Type Pin Description 1 ICLK XI Connect to a clock input as shown in table above. 2 VDD Power Connect to +3.3V or +5V. 3 GND Power Connect to ground. 4 CLK Output Clock output equal to input frequency. 5 LEE Input Low EMI enable. Turns on the spread spectrum when high. Internal pull-up. 6 S1 Input Frequency select 1 input. Selects input/output clock range per table above. Internal pull-up.
7 S0 Input
Frequency select 0 input. Selects input/output clock range per table above. Internal pull-up. 8 NC - No connect. Do not connect anything to this pin.
LOW EMI CLOCK GENERATOR SSCG IDT™ LOW EMI CLOCK GENERATOR 3 MK1704A REV G 051310 layers. Other signal traces should be routed away from the MK1704A. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. Powerup Considerations To insure proper operation of the spread spectrum generation circuit, some precautions must be taken in the implementation of the MK1704A. 1) An input signal should not be applied to ICLK until VDD is stable. This requirement can easily be met by operating the MK1704A and the ICLK source from the same power supply. 2) LEE should not be enabled (taken high) until after the power supplies and input clock are stable. This requirement can be met by direct control of LEE by system logic; for example, a “power good” signal. Another solution is to leave LEE unconnected to anything but a 0.01 µF capacitor to ground. The pullup resistor on LEE will charge the capacitor and provide approximately a one millisecond delay until spread spectrum is enabled. 3) If the input frequency is changed during operation, disable spread spectrum until the input clock stabilizes at the new frequency. LEE should be disabled for 10 µs minimum. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the MK1704A. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Recommended Operation Conditions Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5V to VDD+0.5V Ambient Operating Temperature 0 to +70 ° C Storage Temperature -65 to +150 ° C Junction Temperature 175 ° C Soldering Temperature 260 ° C Parameter Min. Typ. Max. Units Ambient Operating Temperature 0 +70 ° C Power Supply Voltage (measured in respect to GND) +3.0 +5.5 V
LOW EMI CLOCK GENERATOR SSCG IDT™ LOW EMI CLOCK GENERATOR 4 MK1704A REV G 051310 Unless stated otherwise, VDD = 5V, Ambient Temperature 0 to +70° C Unless stated otherwise, VDD = 5V, Ambient Temperature 0 to +70° C Note 1: Measured with 15pF load Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 3.0 5.5 V Supply Current IDD No load, 3.3V 10 mA No load, 5V 15 mA Input High Voltage V IH Clock input (VDD/2)+1 VDD/2 V Input Low Voltage V IL Clock input VDD/2 (VDD/2)-1 V Output High Voltage V OH IOH = -4 mA VDD-0.4 V Output High Voltage V OH IOH = -25 mA 2.4 V Output Low Voltage V OL IOL = 25 mA 0.4 V Input Capacitance C IN S0 pin 7 pF Nominal Output Impedance Z OUT 20 Ω Internal Pull-up Resistor R PU LEE pin only 500 k Ω Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency S1=0, S0=0 60 135 140 MHz S1-0, S0=1 60 80 120 MHz S1=1, S0=0 30 40 60 MHz S1=1, S0=1 40 65 100 MHz Input Clock Duty Cycle Time above VDD/2 20 80 % Output Rise Time t OR 0.8 to 2.0V, Note 1 1.5 ns Output Fall Time t OF 2.0 to 0.8V, Note 1 1.5 ns Output Clock Duty Cycle Time above 1.5V 40 50 60 % Output Clock Frequency Variation from Mean 1-2.5 % EMI Peak Frequency Reduction 3rd - 19th odd harmonics 10-16 dB
LOW EMI CLOCK GENERATOR SSCG IDT™ LOW EMI CLOCK GENERATOR 5 MK1704A REV G 051310 Thermal Characteristics Marking Diagram (Pb free) Notes: 1. YYWW is the last two digits of the year and week the part was assembled. 2. “L ” denotes Pb (lead) free package 3. Bottom Markings: (origin) = country of origin if not USA Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θJA Still air 150 ° C/W θJA 1 m/s air flow 140 ° C/W θJA 3 m/s air flow 120 ° C/W Thermal Resistance Junction to Case θJC 40 ° C/W µCLOCK MK1704AL YYWW
LOW EMI CLOCK GENERATOR SSCG IDT™ LOW EMI CLOCK GENERATOR 6 MK1704A REV G 051310 Package Outline and Package Dimensions (8 pin SOIC, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95
Ordering Information
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Part / Order Number Marking Shipping Packaging Package Temperature MK1704ALF see page 5 Tubes 8 pin SOIC 0 to +70 ° C MK1704ALFTR Tape and Reel 8 pin SOIC 0 to +70 ° C INDEX AREA 1 2 D E SEATING PLANE A e - C - B .10 (.004) C C L H h x 45 Millimeters Inches Symbol Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0 . 3 30 . 5 1. 0 1 3. 0 2 0 C 0.19 0.25 .0075 .0098 D 4.80 5.00 .1890 .1968 E 3.80 4.00 .1497 .1574 e 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0 . 2 50 . 5 0. 0 1 0. 0 2 0 L 0 . 4 01 . 2 7. 0 1 6. 0 5 0 α 0° 8° 0° 8°
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names a nd marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA Corporate Headquarters Integrated Device Technology, Inc. www.idt.com For Sales 800-345-7015 408-284-8200 Fax: 408-284-2775 For Tech Support www.idt.com/go/clockhelp Innovate with IDT and accelerate your future networks. Contact: www.IDT.com MK1704A LOW EMI CLOCK GENERATOR SSCG
© 202 Renesas Electronics Corporation. All rights reserved. IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use o any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. ('LVFODLPHURev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, For further information on a product, technology, the most Koto-ku, Tokyo 135-0061, Japan up-to-date version of a document, or your nearest sales www.renesas.com office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners.