MK1491-09FILN

MK1491-09 RENESAS | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 11

Technical content

Features

• Packaged in 28-pin SSOP (209 mil body)
• Pb free, RoHS compliant package
• Provides all critical timing for the AMD Geode companion chip
• Four selectable PCI clocks
• Three LPC interface clocks
• One Fixed 66 MHz clock
• 2 Reference clocks
• 48 MHz USB and 48 MHz IO support
• Power down mode
• Low EMI Enable pin reduces EMI radiation on PCI clocks, LCLKS , and 66 MHz clock
• Operating voltage of 3.3 V ±5%
• Down Spread of 0.5% for PCI, LPC and 66 MHz clocks
• Industrial and commercial temperature ranges available Block Diagram Crystal Oscillator USB Clock Clocks PCI&LPC Clocks with Spread Option Sel66/33# PD# VDD GND LCLK or LPC, (33 MHz)

66 MHz

48 MHz

REFCLK0/Spread# 48/TS#

14.31818 MHz

PCI (66/33 MHz)4

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 2 MK1491-09 REV M 051310 Pin Assignment PCI Frequency Select Table EMI Control Spread direction is DOWN. Sel66/33# PCI Frequency 03 3 M H z 16 6 M H z Spread# PCI, LPC and 66MHz Clocks Down Spread amount 0O N -0 . 5 % F F 0 GND VDD LCLK2/33M GND Sel66/33# GND VDD PCICLK0/33-66M VDD PD# GND 48M 66M 48M/TS# GND LCLK0/33M LCLK1/33M XO VDD VDD RefCLK1 GND XI RefCLK0/Spread# VDD PCICLK1/33-66M PCICLK2/33-66M PCICLK3/33-66M

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 3 MK1491-09 REV M 051310 Pin Descriptions KEY: I = Input, TI = Tri-level, O = Output, P = Power supply connection, (T)I/O = Input on power up, becomes an Output after 10 ms, Weak internal pull-up resistors are present on TS#, Spread#, PD#, and Sel66/33. Pin Number Pin Name Pin Type Pin Description 1, 7, 11, 15, 21, 22 GND P Connect to Ground. 2 XI I Crystal connection. Connect to a 14.31818 MHz crystal or input clock. 3 XO O Crystal connection. Connect to a 14.31818 MHz crystal or leave unconnected. 4, 8, 12, 19, 25, 28 VDD P Connect to 3.3 V. 5, 6, 9 LPC or LCLK O 33 MHz low skew clock outputs for LPC interface. These clocks are synchronous outputs with low skew.

10 Sel66/33# I When high, the PCICLK runs at 66 MHz; when low, the PCICLK runs at

33 MHz. This pin has a weak internal pull-up resistor. This is an active input, not a latched input. 13 48M O 48 MHz clock output. 14 48M/TS# I/O 48 MHz clock output. TS# is a latched input at power up and tristates all outputs when low upon power up. When high upon power up, all outputs are enabled. Power must be cycled for a change of state to be detected. This pin has a weak internal pull-up resistor. 16 66M O 66 MHz clock output. 17 PD# I Power-down input. This is an active input not latched input. When this pin is set low, all clock outputs will be stopped, all PLL ’s will be stopped, and the oscillator will be powered off. Weak pull-up resistor (see Power Down table). 18, 20, 23, 24 PCICLK O 33 to 66 MHz PCI synchronous clock outputs with low skew. 26 RefCLK1 O Buffered reference output of 14.31818 MHz.

27 RefCLK0/

Spread# I/O Buffered reference output of 14.31818 MHz. Spread# is a latched input upon power up. Spread is applied to all clocks except REFCLK’s and 48 MHz. Power must be cycled for a change of state to be detected. This pin has a weak internal pull-up resistor. See spread table.

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 4 MK1491-09 REV M 051310 Power Down Control Table Power-on Default Conditions External Components The MK1491-09 requires some inexpensive external components for proper operation. Decoupling capacitors of 0.1µF should be connected on each VDD pin to ground, as close to the MK1491-09 as possible. A series termination resistor of 33Ω may be used for each clock output. See the discussion below for other external resistors required for proper I/O operation. The 14.318 MHz oscillator has internal caps that provide the proper load for a parallel resonant crystal with C L=18 pF . For tuning with other values of CL, the formula 2*(CL-18) gives the value of each capacitor that should be connected between X1 and ground and X2 and ground. I/O Structure The MK1491-09 provides more functionality in a 28-pin package by using a unique I/O technique. The device checks the status of all I/O pins during power-up. This status (pulled high or low) then determines the frequency selections and power down modes (see the tables on pages 2 and 3). Within 10ms after power up, the inputs change to outputs and the clocks start up. In the diagrams below, the 33Ω resistors are the normal output termination resistors. The 10kΩ resistor pulls low to generate a logic zero when needed. Weak internal pull-up resistors are present on TS#, Spread#, PD#, and Sel66/33 to pull the pin to high when left floating. *Note: Do not use a TTL load. This will overcome the 10 kΩ pull-down and force the input to a logic 1. PD# Functions 0 All clocks are stopped low. 1 All clocks are running. Pin # Function Default Condition 14 TS# H Latched input. All outputs enabled when high. When low, all outputs are in tristate. 27 Spread# H Latched input. Spread disabled when high. When low, spread is enabled on all outputs except ref clocks and 48 MHz. 10 Sel66/33# H This is an active input. When high, it selects PCI=66 MHz outputs; when low, selects PCI frequency = 33 MHz outputs. To load* 10 k I/O For select = 0 (low) Do not stuff for “1” selection

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 5 MK1491-09 REV M 051310 Absolute Maximum Ratings VDD = 3.3 V 0 to +70° C (commercial); -40 to 85° C (industrial) Item Rating Supply Voltage, VDD (referenced to VSS) 4.6 V All Inputs and Outputs (referenced to VSS) -0.5 V to VDD+0.5 V Ambient Operating Temperature (commercial) 0 to +70 ° C Ambient Operating Temperature (industrial) -40 to +85 ° C Storage Temperature -65 to +150 ° C Junction Temperature 125 ° C Soldering Temperature (10 seconds max) 260 ° C Spread Spectrum Enabled for PCI and LPC Clocks 30 kHz min., 33 kHz max. Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 3.13 3.3 3.46 V Input High Voltage V IH 2V D D V Input Low Voltage V IL VSS 0.8 V Output High Voltage V OH IOH = -12 mA 2.4 V Output Low Voltage V OL IOL = 12 mA 0.4 V Operating Supply Current IDD VDD = 3.3 V 60 mA Clock Disable Mode Supply Current 0.5 mA Internal Pull-up Resistor All inputs except XI 120 k Ω Input Capacitance C IN All inputs except XI 5 pF Spread Spectrum Modulation Rate fmod Enabled for PCI and LPC Clocks 30 33 KHz

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 6 MK1491-09 REV M 051310 Unless stated otherwise, VDD = 3.3 V, Ambient Temp. 0 to +70° C (commercial); -40 to 85° C (industrial), CL=30pf Note 1: Only valid when PCI is at 33 MHz. Thermal Characteristics Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency F IN 14.31818 MHz Output Clock Skew Rate (PCI and LPC), load=30 pF Between 0.4 V and 2.4 V 4 V/ns Output Clock Rise and Fall Time (all but PCI and LPC), load=30 pF t OR, tOF Between 0.4 V and 2.4 V 0.5 2 ns Output Clock Duty Cycle, all MHz Clocks tOD At 1.5 V 40 60 % PCI Output to Output Skew, at 33 MHz Rising edges at 1.5 V 500 ps PCI Output to Output Skew, at 66 MHz Rising edges at 1.5 V 250 ps LPC Output to Output Skew Rising edges at 1.5 V 500 ps PCI to LPC Output to Output Skew (note 1) Rising edge at 1.5 V 500 ps Cycle-to-Cycle Jitter, PCICLK 300 ps Cycle-to-Cycle Jitter, LPCCLK 500 ps Cycle-to-Cycle Jitter, USBCLK and 48 MHz 500 ps Cycle-to-Cycle Jitter, REFCLK’s 1400 ps Power-on Time, applied VDD to all Clocks Stable 5m s Load Capacitance Crystal 18 30 pF Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θJA Still air 100 ° C/W θJA 1 m/s air flow 80 ° C/W θJA 3 m/s air flow 67 ° C/W Thermal Resistance Junction to Case θJC 60 ° C/W

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 7 MK1491-09 REV M 051310 Marking Diagram (MK1491-09FLN) Marking Diagram (MK1491-09FILN) Notes: YYWW is the last two digits of the year, and the week number that the part was assembled. 3. “L N” designates RoHS compliant package. 4. “I” designates industrial temperature grade. Bot tom marking: country of origin if not USA. 28 15 MK1491-09FLN YYWW 1 14 28 15 MK149109FILN YYWW

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 8 MK1491-09 REV M 051310 Package Outline and Package Dimensions (28-pin SSOP, 209 mil Body) Package dimensions are kept current with JEDEC Publication No. 95, MO-150

Ordering Information

Parts that are ordered with a “LN” suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Part / Order Number Marking Low EMI Feature Shipping Packaging Package Temperature MK1491-09FLN see page 7 Y es Tubes 28-pin SSOP 0 to +70 ° C MK1491-09FLNTR Y es Tape and Reel 28-pin SSOP 0 to +70 ° C MK1491-09FILN Y es Tubes 28-pin SSOP -40 to +85 ° C MK1491-09FILNTR Y es Tape and Reel 28-pin SSOP -40 to +85 ° C INDEX AREA 1 2 D E1 E SEATING PLANE AA2 e - C - b c L *For reference only. Controlling dimensions in mm. Inches* Symbol Min Max Min Max A — 2.00 — 0.079 A1 0.05 — 0.002 — A2 1.65 1.85 0.065 0.073 b 0.22 0.38 0.009 0.015 c 0.09 0.25 0.0035 0.010 D 9.90 10.50 0.390 0.413 E 7.40 8.20 0.291 0.323 E1 5.00 5.60 0.197 0.220 e 0.65 Basic 0.0256 Basic L 0.55 0.95 0.022 0.037 α 0° 8° 0° 8°

AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER IDT™ AMD GEODE™ GX2 CLOCK SOURCE 9 MK1491-09 REV M 051310

Revision History

Rev. Originator Date Description of Change F S.Gardner 06/23/04 Corrected pitch dimension on package diagram. G S.Gardner 08/02/04 Added LF . H A.Ilkbahar 01/11/06 Changed units from “ns” to “ps” for “ PCI to LPC Output to Output Skew” spec in AC char table I J.Sarma 02/15/06 Updates to Block Diagram; correction s and additions to Pin Descriptions; updates to EMI Control table; updated Power Default table; updates to AC table. J J.Sarma 07/05/06 Corrections to device markings/diagrams. K R.Willner 07/24/06 Added industrial temperature range markings and ordering info. L 12/18/09 Added EOL note for non-green parts. M 05/13/10 Removed EOL note and non-green orderables

© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names a nd marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA Corporate Headquarters Integrated Device Technology, Inc. www.idt.com For Sales 800-345-7015 408-284-8200 Fax: 408-284-2775 For Tech Support www.idt.com/go/clockhelp Innovate with IDT and accelerate your future networks. Contact: www.IDT.com MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER

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