MIS-019-01-F-D-K SAMTEC | Alldatasheet
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(0.635 mm) .025" MIS SERIES MIS–019–01–F–D MIS–057–01–L–D MIS–038–01–F–D Polarized 76 signal lines per linear inch Integral metal plane for power or ground WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. Note: Rugged through-hole ground plane soldered to board (requires paste-over-hole, not press-fit) for added retention to PCB. *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. MIS NO. OF POSITIONS PER ROW DPLATING OPTION01 –019, –038, –057 (38 total positions per bank) OTHER OPTION = (7.00 mm) .275" DIA Polyimide film Pick & Place Pad –TR = Tape & Reel = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –C* = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, 10 µ" (0.25 µm) min Au over 50 µ" (1.27 µm) Ni on Ground Plane in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails (0.635) .025 (0.15) .006 (3.63) .143 (7.49) .295 (0.18) .007 (3.43) .135 (1.32) .052 (6.22) .245 (0.69) .027 (12.70) .500 F-217 MIXED TECHNOLOGY SOCKET Board Mates: MIT Standoffs: SO
- Mixed technology footprint Gbps HIGH-SPEED CHANNEL PERFORMANCE MIT/MIS @ 5 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com For complete specifications and recommended PCB layouts see www.samtec.com?MIS Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +125 °C Voltage Rating:
275 VAC
Max Cycles: 100 RoHS Compliant: Ye s For complete scope of recognitions see www.samtec.com/quality RECOGNITIONS SPECIFICATIONS PROCESSING FILE NO. E111594 Lead–Free Solderable: Ye s SMT Lead Coplanarity: Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com
- 11 mm, 16 mm, 18.75 mm and 22 mm stack height
- 30 µ" (0.76 µm) Gold
- Differential Pair and “Partitionable” (combine differential & single-ended banks in same connector) available.
- 76, 95, 114 and 133 positions per row Contact Samtec. ALSO AVAILABLE (MOQ Required) MATED HEIGHT* MIS LEAD STYLE MIT LEAD STYLE –01 –02 –01 (5.00) .197 (8.00) .315 *Processing conditions will affect mated height. See SO Series for board space tolerances.