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Technical content
30 MICSW
Micromodul™ connectors, pitch 1.27 mm Micromodul™ tab header, angular, solder contacts dual row staggered State: Active of 3
*a cranked solder contacts *b contact 1 *c printed circuit board layout, solder side view *d necessary space for use of pull-off tongs AZ30 *e component area (B x 7) *f recommended thickness of circuit board 1.5 ±0.14 mm Environmental conditions Temperature range -40 °C/+140 °C 1 1 upper limit temperature (insulating body) RTI (electrical) of the UL Yellow Card Materials Insulating body PA GF, V-0 according to UL94 Contact tab CuZn, pre-nickel and tin-plated – MICSW CuZn, pre-nickel and gold-plated – MICSW AU Mechanical data Expression force contact tab from insulating body ≥ 7 N/contact Electrical data (at Tamb 20 °C) Rated current 1,2 A Rated voltage 160 V AC (250 V AC ohne Berücksichtigung der Kriech- und Luftstrecken nach IEC 60664/DIN EN 60664) Material group I (IEC)/0 (UL) (CTI ≥ 600) Creepage distance 0,97 mm Clearance 0,97 mm Insulation resistance > 1 GΩ of 3
Designation Pole Number PU (Pieces) MDQ (Pieces) Dimensions A (mm) B (mm) MICSW 04 4 1000 2000 3.81 8.86 MICSW 06 6 1000 2000 6.35 11.40 MICSW 08 8 1000 2000 8.89 13.94 MICSW 10 10 1000 2000 11.43 16.48 MICSW 12 12 500 2000 13.97 19.02 MICSW 14 14 500 2000 16.51 21.56 MICSW 16 16 500 1000 19.05 24.10 MICSW 18 18 500 1000 21.59 26.64 MICSW 20 20 500 1000 24.13 29.18 MICSW 26 26 500 1000 31.75 36.80 MICSW 04 0,8 AU 4 1000 2000 - - MICSW 10 0,8 AU 10 1000 2000 - - Packaging: in bulk, in a cardboard box of 3