DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 22

Technical content

Features

  • 1.7V to 5.5V Input Voltage Range
  • 2A Continuous Operating Current
  • 77 mΩ (typ.) RDS(ON)
  • Built-In Level Shift for Control Logic; Can be Operated by 1.5V Logic
  • Low 2 μA Quiescent Current
  • Soft-Start: MIC94062, MIC94063
  • Micropower Shutdown <1 μA
  • Load Discharge Circuit: MIC94061, MIC94063
  • Space Saving 1.2 mm x 1.6 mm UDFN Package

Applications

  • Load Switch in Portable Applications - Cellular Phones - PDAs - MP3 Players - Digital Cameras - Portable Instrumentation
  • Battery Switch-Over Circuits
  • Level Translator General Description The MIC94060, MIC94061, MIC94062, and MIC94063 are high-side load switches designed for operation between 1.7V to 5.5V. The devices contain a low on-resistance P-channel MOSFET that supports over 2A of continuous current. The MIC94061 and MIC94063 feature an active load discharge circuit which ensures capacitive loads retain no charge when the main switch is in an OFF state. MIC94060-61 feature rapid turn-on while MIC94062-63 provide a slew-rate controlled soft-start turn-on of 800 μs (typical) to prevent in-rush current from glitching supply rails. An active pull-down on the enable input keeps MIC94060-63 in a default OFF state until the EN pin is pulled to a high level. Built-in level shift circuitry allows low voltage logic signals to switch higher supply voltages, or vice versa; high level logic signals can control low level voltages. MIC94060-63’s operating voltage range makes them suitable for 1-cell Lithium ion and 2- to 3-cell NiMH/NiCad/Alkaline powered systems, as well as all 5V applications. Their low operating current of 2 μA and low shutdown current of <1 μA maximize battery life. Package Types MIC94060/1/2/3 6-Lead SC-70 (C6) (Top View) MIC94060/1/2/3 4-Lead UDFN (MT) (Top View)

1 VOUT

DS20006517B-page 2  2021 - 2022 Microchip Technology Inc. and its subsidiaries. Typical Application Circuits EN VIN 75mŸ LOADLevel Shift and Slew Rate Control MIC94060/MIC94062 Load Switch Application MIC94061/MIC94063 Load Switch with Capacitive Load Discharge EN VIN 75mŸ LOAD Level Shift Slew Rate Control and Load Discharge 200Ÿ

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 3 MIC94060/1/2/3

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † Continuous Drain Current (ID) (Note 1) Operating Ratings †† † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. †† Notice: The device is not guaranteed to function outside its operating ratings. Note 1:With backside thermal contact to PCB. 2: Pulse width <300 µs with <2% duty cycle. 3: Continuous body diode current conduction (reverse conduction, i.e. VOUT to VIN) is not recommended. 4: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with 100 pF.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: VIN = 5V; TA = +25°C, bold values valid for –40°C ≤ TA ≤ +85°C, unless noted. Parameter Symbol Min. Typ. Max. Units Conditions Enable Threshold Voltage V EN_TH 0.5 — 1.2 V VIN = 1.8V to 4.5V, ID = –250 μA 0.4 — 1.2 VIN = 1.7V to 4.5V, ID = –250 μA Enable Input Current IEN — 2 4 µA V IN = VEN = 5.5V OFF State Leakage Current I VIN — — 1 µA VIN = +5.5V, VEN = 0V P-Channel Drain to Source ON Resistance, SC-70 Package RDS(ON) — 77 110 mΩ VIN=+4.5V, ID=–100 mA, VEN=1.5V — 85 115 VIN=+3.6V, ID=–100 mA, VEN=1.5V — 100 140 VIN=+2.5V, ID=–100 mA, VEN=1.5V — 145 200 VIN=+1.8V, ID=–100 mA, VEN=1.5V — 155 215 VIN=+1.7V, ID=–100 mA, VEN=1.5V P-Channel Drain to Source ON Resistance, UDFN Package RDS(ON) — 85 115 mΩ VIN=+4.5V, ID=–100 mA, VEN=1.5V — 100 140 VIN=+3.6V, ID=–100 mA, VEN=1.5V — 145 200 VIN=+2.5V, ID=–100 mA, VEN=1.5V — 155 215 VIN=+1.8V, ID=–100 mA, VEN=1.5V — 165 225 VIN=+1.7V, ID=–100 mA, VEN=1.5V Turn-Off Resistance RSHDN — 200 300 Ω VIN = +3.6V, ITEST = 1 mA, VEN = 0V, MIC94061, 63

DS20006517B-page 4  2021 - 2022 Microchip Technology Inc. and its subsidiaries. Dynamic Turn-On Delay Time tON_DLY — 0.85 1.5 µs VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94060, 61 — 700 1200 VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94062, 63 Turn-On Rise Time tON_RISE 0.5 1 5 µs VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94060, 61 500 800 1500 VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94062, 63 Turn-Off Delay Time tOFF_DLY — 100 200 ns VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94060, 61 — 60 200 VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94062, 63 Turn-Off Fall Time tOFF_FALL — 60 100 ns VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94060, 61 — 60 100 VIN = +3.6V, ID = –100 mA, VEN = 1.5V, MIC94062, 63 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –55 — +150 °C — Package Thermal Resistances Thermal Resistance, SC-70 6-Ld JA — 240 — °C/W — Thermal Resistance, UDFN 4-Ld JA — 172 — °C/W — Thermal Resistance, UDFN 4-Ld JC — 134 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = 5V; TA = +25°C, bold values valid for –40°C ≤ TA ≤ +85°C, unless noted. Parameter Symbol Min. Typ. Max. Units Conditions

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 5 MIC94060/1/2/3

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: RDS(ON) Variance with Temperature. FIGURE 2-2: EN Threshold Voltage vs. Input Voltage. FIGURE 2-3: On-Resistance vs. Input Voltage. FIGURE 2-4: Voltage Drop vs. Load Current. FIGURE 2-5: MIC94060/61 Turn-On Delay vs. Input Voltage. FIGURE 2-6: MIC94060/61 Rise Time vs. Input Voltage. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 11 MIC94060/1/2/3

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number SC-70 Pin Number UDFN Pin Name Description 1 1 VOUT Drain of P-channel MOSFET. 2, 5 2 GND Ground and the backside pad (UDFN only) should both be connected to electrical ground. 4 3 VIN Source of P-channel MOSFET. 3 4 EN Enable (Input): Active-high CMOS compatible control input for switch A. Do not leave floating. 6 — NC No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.

DS20006517B-page 12  2021 - 2022 Microchip Technology Inc. and its subsidiaries.

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

6-Lead SC70* Example XXX P54 4-Lead UDFN* Example XXX P55 Legend: XX...X Product code or customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package.

  • , ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. TABLE 4-1: MARKING CODES Part Number Marking Code Soft-Start Load Discharge MIC94060YC6 P54 No No MIC94061YC6 P55 No Yes MIC94062YC6 P56 Yes No MIC94063YC6 P57 Yes Yes MIC94060YMT P54 No No MIC94061YMT P55 No Yes MIC94062YMT P56 Yes No MIC94063YMT P57 Yes Yes

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 13 MIC94060/1/2/3 6-Lead SC-70 Package Outline & Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

DS20006517B-page 14  2021 - 2022 Microchip Technology Inc. and its subsidiaries. 4-Lead UDFN Package Outline and Recommended Land Pattern BA 0.05 C 0.05 C (DATUM B) (DATUM A) C TOP VIEW SIDE VIEW NOTE 1 0.10 C For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: D E

0.08 C A B

0.05 C NOTE 1 BOTTOM VIEW

0.05 C A B

3N=4 e 4X b L K 3N=4 0.08 C A SEATING PLANE Microchip Technology Drawing C04-1152 Rev A Sheet 1 of 2 4-Lead Ultra Thin Dual Flat, No Lead Package (HGA) - 1.2x1.6x0.6 mm Body [UDFN] Micrel Legacy Package TMLF1216D-04L

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 15 MIC94060/1/2/3 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-1152 Rev A Sheet 2 of 2 4-Lead Ultra Thin Dual Flat, No Lead Package (HGA) - 1.2x1.6x0.6 mm Body [UDFN] Micrel Legacy Package TMLF1216D-04L Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A b e L E N

0.50 BSC

0.152 REF

0.45 0.30 0.20 0.50 0.00 0.25 0.35 0.50 0.55 0.02

1.60 BSC

0.55 0.40 0.30 0.60 0.05 MAX K– 0.20 –Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 0.81

1.20 BSC

0.86 0.91

DS20006517B-page 16  2021 - 2022 Microchip Technology Inc. and its subsidiaries. RECOMMENDED LAND PATTERN Dimension Limits Units Optional Center Pad Width Optional Center Pad Length Contact Pitch 0.55 0.90 MILLIMETERS E MAX Contact Pad Length (X4) Contact Pad Width (X4) 0.65 0.30 NOM C0 7 . 1g n i c a p S d a P t c a t n o C Contact Pad to Contact Pad (X2) G2 0.20 Thermal Via Diameter V 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Contact Pad to Center Pad (X4) G1 0.25 E Y2C ØV SILK SCREEN Microchip Technology Drawing C04-3152 Rev A 4-Lead Ultra Thin Dual Flat, No Lead Package (HGA) - 1.2x1.6x0.6 mm Body [UDFN] Micrel Legacy Package TMLF1216D-04L

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 17 MIC94060/1/2/3 APPENDIX A: REVISION HISTORY Revision A (March 2021)

  • Converted Micrel document MIC94060/1/2/3 to Microchip data sheet template DS20006517A.
  • Minor grammatical text changes throughout. Revision B (January 2022)
  • Updated package marking drawing in Section 4.1, Package Marking Information.

DS20006517B-page 18  2021 - 2022 Microchip Technology Inc. and its subsidiaries. NOTES:

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 19 MIC94060/1/2/3 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) MIC94060YC6-TR: MIC94060, –40°C to +125°C Temperature Range, 6-Lead SC-70, 3,000/Reel b) MIC94061YMT-TR: MIC94061, –40°C to +125°C Temperature Range, 4-Lead UDFN, 5,000/Reel c) MIC94062YC6-TR: MIC94062, –40°C to +125°C Temperature Range, 6-Lead SC-70, 3,000/Reel d) MIC94063YMT-TR: MIC94063, –40°C to +125°C Temperature Range, 4-Lead UDFN, 5,000/Reel e) MIC94060YMT-TR: MIC94060, –40°C to +125°C Temperature Range, 4-Lead UDFN, 5,000/Reel f) MIC94061YC6-TR: MIC94061 –40°C to +125°C Temperature Range, 6-Lead SC-70, 3,000/Reel Device: MIC94060: High Side Power Switch MIC94061: High Side Power Switch with Load Dis- charge MIC94062: High Side Power Switch with Soft-Start MIC94063: High Side Power Switch with Soft-Start and Load Discharge Junction Temperature Range: Y = –40°C to +125°C Package: C6 = 6-Lead SC-70 MT = 4-Lead 1.6 mm x 1.2 mm UDFN Media Type: TR = 3,000/Reel (SC-70 Package) TR = 5,000/Reel (UDFN Package) Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. Device X XX -XX Part No. Junction Temp. Range Package Media Type

DS20006517B-page 20  2021 - 2022 Microchip Technology Inc. and its subsidiaries. NOTES:

 2021 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006517B-page 21 This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this informa- tion in any other manner violates these terms. Information regarding device applications is provided only for your conve- nience and may be superseded by updates. It is your responsi- bility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-support- services. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON- INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE - QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY , THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applica- tions is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP , INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP , SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY , Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY , ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016 - 2021 - 2022, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. ISBN: 978-1-5224-9577-2 Note the following details of the code protection feature on Microchip products:

  • Microchip products meet the specifications contained in their particular Microchip Data Sheet.
  • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions.
  • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
  • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

DS20006517B-page 22  2021 - 2022 Microchip Technology Inc. and its subsidiaries. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Worldwide Sales and Service 09/14/21