MIC4126 MICREL | Alldatasheet

Document overview

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Technical content

Features

  • Dual 1.5A-peak drivers
  • 4.5V to 20V operating range
  • Exposed backside pad packaging reduces heat – ePAD SOIC-8L ( θJA = 58°C/W) – ePAD MSOP-8L ( θJA = 60°C/W) – 3mm x 3mm MLF™-8L ( θJA = 60°C/W)
  • Bipolar/CMOS/DMOS construction – 25mV maximum output offset from supply or ground
  • Latch-up protection to >200mA reverse current
  • Switches 1000pF in 25ns
  • Logic-input threshold independent of supply voltage
  • Logic-input protection to –5V
  • 6pF typical equivalent input capacitance
  • Dual inverting, dual non-inverting, and complementary configurations
  • -40 °C to +125°C operating junction temperature range

Applications

  • DC/DC converters
  • Motor drivers
  • Clock line driver Functional Diagram MIC4126/27/28 Block Diagram

(408) 955-1690

Ordering Information

EPAD SOIC-8L (ME) EPAD MSOP-8L (MME) MLF-8L (ML) EPAD SOIC-8L (ME) EPAD MSOP-8L (MME) MLF-8L (ML) EPAD SOIC-8L (ME) EPAD MSOP-8L (MME) MLF-8L (ML) Pin Description Pin Number Pin Name Pin Function 1, 8 NC Not internally connected

2 INA Control Input A: TTL/ CMOS compatible logic input

3 GND Ground

4 INB Control Input B: TTL/CMOS compatible logic input. 5 OUTB Output B: CMOS totem-pole output. 6 VS Supply Input: +4.5V to +20V 7 OUTA Output A: CMOS totem-pole output. EP GND Ground, backside pad. Part Number Configuration Package Junction Temp. Range (1) Lead Finish MIC4126YME Dual Inverting EPAD 8-lead SOIC –40° to +125°C Pb-Free MIC4126YMME Dual Inverting EPAD 8- lead MSOP –40° to +125°C Pb-Free MIC4126YML Dual Inverting 8-lead MLF –40° to +125°C Pb-Free MIC4127YME Dual Non-inverting EPAD 8-lead SOIC –40° to +125°C Pb-Free MIC4127YMME Dual Non-inverting EPAD 8-lead MSOP –40° to +125°C Pb-Free MIC4127YML Dual Non-inverting 8-lead MLF –40° to +125°C Pb-Free MIC4128YME Inverting + Non-inverting EPAD 8-lead SOIC –40° to +125°C Pb-Free MIC4128YMME Inverting + Non-inverting EPAD 8-lead MSOP –40° to +125°C Pb-Free MIC4128YML Inverting + Non-inverting 8-lead MLF –40° to +125°C Pb-Free

(408) 955-1690 Absolute Maximum Ratings (1) ESD Rating, Note 3 Operating Ratings (2) Package Thermal Resistance Electrical Characteristics (4) 4.5V ≤ VS ≤ 20V; Input voltage slew rate >1V/µs; COUT = 1000pF. TA = 25°C, bold values indicate full specified temperature range; unless noted. Symbol Parameter Condition Min Typ Max Units Input VIH Logic 1 Input Voltage 2.4 2.4 1.4 1.6 V VIL Logic 0 Input Voltage 1.1 1.3 0.8 0.8 V IIN Input Current 0 ≤ VIN ≤ VS –1 1 µA Output VOH High Output Voltage VS–0.025 V VOL Low Output Voltage 0.025 V RO Output Resistance IOUT = 10mA, VS = 20V 6 12 Ω IPK Peak Output Current 1.5 A I Latch-Up Protection Withstand reverse current >200 mA Switching Time tR Rise Time Test Figure 1 13 40 ns tF Fall Time Test Figure 1 15 40 ns tD1 Delay Time Test Figure 1 37 60 ns tD2 Delay Time Test Figure 1 40 70 ns Power Supply IS Power Supply Current VINA = VINB = 3.0V 1.4 1.5 4.5 8 mA IS Power Supply Current VINA = VINB = 0.0V 0.18 0.19 0.4 0.6 mA Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. The device is not guaranteed to function outside its operating rating. 4. Specification for packaged product only.

(408) 955-1690 Typical Characteristics

(408) 955-1690

Application Information

Large currents are required to charge and discharge large capacitive loads quickly. For example, changing a 1000pF load by 16V in 25ns requires 0.8A from the supply input. To guarantee low supply impedance over a wide frequency range, parallel capacitors are recommended for power supply bypassing. Low-inductance ceramic MLC capacitors with short lead lengths (< 0.5") should be used. A 1.0µF film capacitor in parallel with one or two 0.1µF ceramic MLC capacitors normally provides adequate bypassing. Grounding When using the inverting drivers in the MIC4126 or MIC4128, individual ground returns for the input and output circuits or a ground plane are recommended for optimum switching speed. The voltage drop that occurs between the driver’s ground and the input signal ground, during normal high-current switching, will behave as negative feedback and degrade switching speed. The E-pad and MLF packages have an exposed pad under the package. It’s important for good thermal performance that this pad is connected to a ground plane. Control Input Unused driver inputs must be connected to logic high (which can be V S) or ground. For the lowest quiescent current (< 500µA), connect unused inputs-to-ground. A logic-high signal will cause the driver to draw up to 9mA. The control input voltage thre shold is approximately 1.5V. The control input recognizes 1.5V up to V S as a logic high and draws less than 1µA within this range. Power Dissipation Power dissipation should be calculated to make sure that the driver is not operated beyond its thermal ratings. Quiescent power dissipation is negligible. A practical value for total power dissipation is the sum of the dissipation caused by the load and the transition power dissipation (P L + PT). Load Dissipation Power dissipation caused by continuous load current (when driving a resistive load) through the driver’s output resistance is: P L = IL2 RO For capacitive loads, the dissipation in the driver is: P L = f CL VS2 Transition Dissipation In applications switching at a high frequency, transition power dissipation can be significant. This occurs during switching transitions when the P-channel and N-channel output FETs are both conduct ing for the brief moment when one is turning on and the other is turning off. P T = 2 f VS Q Charge (Q) is read from the following graph: Crossover Energy Loss per Transition

(408) 955-1690

Package Information

8-Pin Exposed Pad SOIC (M) 8-Pin Exposed Pad MSOP (MM)

(408) 955-1690 8-Pin MLF (ML) MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2004 Micrel, Incorporated.