MIC33153-4YHJ-TR

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Document overview

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• PDF pages: 28

Technical content

Features

• Internal Inductor
• Simplifies Design to Two External Capacitors
• Input Voltage: 2.7V to 5.5V
• Output Voltage: Fixed or Adjustable (0.62V to 3.6V)
• Up to 1.2A Output Current
• Up to 93% Peak Efficiency
• 85% Typical Efficiency at 1 mA
• Power Good (PG) Output
• Programmable Soft-Start
• 22 µA Typical Quiescent Current
• 4 MHz PWM Operation in Continuous Mode
• Ultra-Fast Transient Response
• Low Ripple Output Voltage - 35 mVPP Ripple in HyperLight Load® Mode - 7 mV Output Voltage Ripple in Full PWM Mode
• 0.01 µA Shutdown Current
• Thermal Shutdown and Current Limit Protection
• 14-lead 3.0 x 3.5 x 1.1 mm TDFN Package
• –40°C to +125°C Junction Temperature Range

Applications

• Solid State Drives (SSD)
• Mobile Handsets
• Portable Media/MP3 Players
• Portable Navigation Devices (GPS)
• WiFi/WiMax/WiBro Modules
• Wireless LAN Cards
• Portable Applications General Description The MIC33153 is a high-efficiency 4 MHz 1.2A synchronous buck regulator with an internal inductor, HyperLight Load ® mode, Power Good (PG) output indicator, and programmable soft-start. HyperLight Load® provides very high efficiency at light loads and ultra-fast transient response which makes the MIC33153 perfectly suited for supplying processor core voltages. An additional benefit of this proprietary architecture is very low output ripple voltage throughout the entire load range with the use of small output capacitors. The MIC33153 is designed so that only two external capacitors as small as 2.2 µF are needed for stability. This gives the MIC33153 the ease of use of an LDO with the efficiency of a HyperLight Load® DC converter. The MIC33153 achieves efficiency in HyperLight Load® mode as high as 85% at 1 mA, with a very low quiescent current of 22 µA. At higher loads, the MIC33153 provides a constant switching frequency up to 4 MHz. The MIC33153 is available in 14-lead 3.0 mm x 3.5 mm TDFN package with an operating junction temperature range from –40°C to +125°C. 4 MHz 1.2A Internal Inductor PWM Buck Regulator with HyperLight Load® and Power Good

DS20006223B-page 2  2019 - 2022 Microchip Technology Inc. Package Types Typical Application Circuits 14-Lead 3.0 mm x 3.5 mm TDFN Fixed (Top View) 14-Lead 3.0 mm x 3.5 mm TDFN Adjustable (Top View) Fixed Output MIC33153 Adjustable Output MIC33153 J J

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 3 MIC33153 Functional Block Diagrams Simplified MIC33153 Fixed Output Functional Block Simplified MIC33153 Adjustable Output Functional Block

DS20006223B-page 4  2019 - 2022 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † Operating Ratings ‡ † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Specifications are for packaged product only. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1:Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1. kΩ in series with 100 pF.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; COUT = 4.7 µF; unless otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameter Symbol Min. Typ. Max. Units Conditions Supply Voltage Range VIN 2.7 — 5.5 V — Undervoltage Lockout Threshold VUVTHR 2.45 2.55 2.65 V Turn-On Undervoltage Lockout Hysteresis VUVHYS — 75 — mV — Quiescent Current IQ — 22 45 µA I OUT = 0 mA, VSNS > 1.2 * VOUT(NOM) Shutdown Current ISD — 0.01 5 µA V EN = 0V; VIN = 5.5V Output Voltage Accuracy ΔV OUT –2.5 — +2.5 % VIN = 3.6V if VOUT(NOM) < 2.5V, ILOAD = 20 mA VIN = 4.5V to 5.5V if VOUT(NOM) ≥ 2.5V, ILOAD = 20 mA Feedback Regulation Voltage VFB 0.6045 0.62 0.6355 V I LOAD = 20 mA Current Limit ILIM 2.2 3.3 — A V SNS = 0.9*VOUT(NOM) Output Voltage Line Regulation ΔVO_LINE — 0.3 %/V VIN = 3.6V to 5.5V if VOUT(NOM) < 2.5V, ILOAD = 20 mA — VIN = 4.5V to 5.5V if VOUT(NOM) ≥ 2.5V, ILOAD = 20 mA Output Voltage Load Regulation ΔVO_LOAD — 0.8 — %/A 1 mA < ILOAD < 1A, VIN = 3.6V if VOUT(NOM) < 2.5V — 0.85 — 1 mA < ILOAD < 1A, VIN = 5.0V if VOUT(NOM) ≥ 2.5V

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 5 MIC33153 PWM Switch On-Resistance RDSON(HS) — 0.2 — Ω ISW = 100 mA PMOS RDSON(LS) — 0.19 — ISW = –100 mA NMOS Maximum Switching Frequency fSW(MAX) — 4 — MHz I OUT = 300 mA Soft-Start Time tSS — 320 — µs V OUT = 90%, CSS = 470 pF Soft-Start Current ISS — 2.7 — µA V SS = 0V PG Threshold (Rising) V PGTHR 86 92 96 %V OUT — PG Threshold Hysteresis V PGHYS — 7 — %V OUT — PG Delay Time tD_PG — 68 — µs Rising Enable Threshold VENTH 0.5 0.9 1.2 V Turn-On Enable Input Current IEN — 0.1 2 µA — Overtemperature Shutdown T SD — 160 — °C — Overtemperature Shutdown Hysteresis TSDHYS — 20 — °C — TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges Operating Junction Temperature Range T J –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — 260 °C Soldering, 10 sec. Package Thermal Resistances Thermal Resistance 14-Lead TDFN JA — 55 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; COUT = 4.7 µF; unless otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameter Symbol Min. Typ. Max. Units Conditions

DS20006223B-page 6  2019 - 2022 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: Efficiency (VOUT = 3.3V). FIGURE 2-2: Efficiency (VOUT = 2.5V). FIGURE 2-3: Efficiency (VOUT = 1.8V) FIGURE 2-4: Efficiency (VOUT = 1.5V). FIGURE 2-5: Efficiency (VOUT = 1.2V). FIGURE 2-6: Efficiency (VOUT = 1.0V). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

DS20006223B-page 12  2019 - 2022 Microchip Technology Inc.

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number (Fixed) Pin Number (Adjustable) Pin Name Description 1 1 SS Soft-Start: Place a capacitor from this pin to ground to program the soft start time. Do not leave floating, 100 pF minimum CSS is required. 2 2 AGND Analog Ground: Connect to central ground point where all high current paths meet (CIN, COUT, PGND) for best operation. 3 3 VIN Input Voltage: Connect a capacitor to ground to decouple the noise. 4 4 PGND Power Ground. 5, 6, 7 5, 6, 7 OUT Output Voltage: The output of the regulator. Connect to SNS pin. For adjustable option, connect to feedback resistor network. 8, 9, 10 8, 9, 10 SW Switch: Internal power MOSFET output switches before inductor. 11 11 EN Enable: Logic high enables operation of the regulator. Logic low will shut down the device. Do not leave floating. 12 12 SNS Sense: Connect to VOUT as close to output capacitor as possible to sense output voltage. 13 13 PG Power Good: Open-drain output for the Power Good (PG) indicator. Use a pull-up resistor from this pin to a voltage source to detect a power good condition. 14 — NC Not internally connected. — 14 FB Feedback: Connect a resistor divider from the output to ground to set the output voltage.

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 13 MIC33153

4.0 FUNCTIONAL DESCRIPTION

4.1 VIN

The input supply (VIN) provides power to the internal MOSFETs for the switch mode regulator along with the internal control circuitry. The VIN operating range is 2.7V to 5.5V so an input capacitor, with a minimum voltage rating of 6.3V, is recommended. Due to the high switching speed, a minimum 2.2 µF bypass capacitor placed close to VIN and the power ground (PGND) pin is required. 4.2 EN A logic high signal on the enable pin activates the output voltage of the device. A logic low signal on the enable pin deactivates the output and reduces supply current to 0.01 µA. MIC33153 features external soft-start circuitry via the soft-start (SS) pin that reduces in rush current and prevents the output voltage from overshooting at start up. Do not leave the EN pin floating. 4.3 SW The switch (SW) connects directly to one end of the inductor and provides the current path during switching cycles. The other end of the inductor is connected to the load, SNS pin and output capacitor. Due to the high speed switching on this pin, the switch node should be routed away from sensitive nodes whenever possible.

4.4 SNS

The sense (SNS) pin is connected to the output of the device to provide feedback to the control circuitry. The SNS connection should be placed close to the output capacitor.

4.5 AGND

The analog ground (AGND) is the ground path for the biasing and control circuitry. The current loop for the signal ground should be separate from the power ground (PGND) loop.

4.6 PGND

The power ground pin is the ground path for the high current in PWM mode. The current loop for the power ground should be as small as possible and separate from the analog ground (AGND) loop as applicable.

4.7 Power Good (PG)

The Power Good (PG) pin is an open-drain output that indicates logic high when the output voltage is typically above 92% of its steady state voltage. When the output voltage is below 86%, the PG pin indicates logic low. A pull up resistor of more than 10 kΩ should be connected from PG to VOUT.

4.8 Soft-Start

The soft-start (SS) pin is used to control the output voltage ramp up time. The approximate equation for the ramp time in milliseconds is: EQUATION 4-1: For example, for a C SS = 470 pF, TRISE ~ 0.3 ms or 300 µs. See Section 2.0, Typical Performance Curves for a graphical guide. The minimum recommended value for CSS is 100 pF. 4.9 FB The feedback (FB) pin is provided for the adjustable voltage option (no internal connection for fixed options). This is the control input for programming the output voltage. A resistor divider network is connected to this pin from the output and is compared to the internal 0.62V reference within the regulation loop. The output voltage can be programmed between 0.65V and 3.6V using the following equation: EQUATION 4-2: tSS 270 10 3 ln 10  CSS  = Where: tSS = Soft-start ramp up time of V OUT CSS = External soft-start capacitance (in Farads) VOUT VREF 1 R1  = Where: R1 = Top resistor R2 = Bottom resistor VREF = 0.62V

DS20006223B-page 14  2019 - 2022 Microchip Technology Inc.

5.0 APPLICATIONS INFORMATION

The MIC33153 is a high performance DC-to-DC step down regulator offering a small solution size. With the HyperLight Load® switching scheme, the MIC33153 is able to maintain high efficiency throughout the entire load range while providing ultra-fast load transient response. The following sections provide additional device application information.

5.1 Input Capacitor

A 2.2µF ceramic capacitor or greater should be placed close to the VIN pin and PGND pin for bypassing. A Murata GRM188R60J475ME84D, size 0603, 4.7 µF ceramic capacitor is recommended based upon performance, size, and cost. A X5R or X7R temperature rating is recommended for the input capacitor. Y5V temperature rating capacitors, aside from losing most of their capacitance over temperature, can also become resistive at high frequencies. This reduces their ability to filter out high frequency noise.

5.2 Output Capacitor

The MIC33153 is designed for use with a 2.2 µF or greater ceramic output capacitor. Increasing the output capacitance will lower output ripple and improve load transient response but could also increase solution size or cost. A low equivalent series resistance (ESR) ceramic output capacitor such as the Murata GRM188R60J475ME84D, size 0603, 4.7 µF ceramic capacitor is recommended based upon performance, size, and cost. Both the X7R or X5R temperature rating capacitors are recommended. The Y5V and Z5U temperature rating capacitors are not recommended due to their wide variation in capacitance over temperature and increased resistance at high frequencies.

5.3 Compensation

The MIC33153 is designed to be stable with a 4.7 µF ceramic (X5R) output capacitor.

5.4 Duty Cycle

The typical maximum duty cycle of the MIC33153 is 80%.

5.5 Efficiency Considerations

Efficiency is defined as the amount of useful output power, divided by the amount of power supplied. EQUATION 5-1: Maintaining high efficiency serves two purposes. It reduces power dissipation in the power supply, reducing the need for heat sinks and thermal design considerations and it reduces consumption of current for battery powered applications. Reduced current draw from a battery increases the devices operating time which is critical in hand held devices. There are two types of losses in switching converters: DC losses and switching losses. DC losses are simply the power dissipation of I2R. Power is dissipated in the high-side switch during the on cycle. Power loss is equal to the high-side MOSFET R DS(ON) multiplied by the switch current squared. During the off cycle, the low-side N-channel MOSFET conducts, also dissipating power. Device operating current also reduces efficiency. The product of the quiescent (operating) current and the supply voltage represents another DC loss. The current required driving the gates on and off at a constant 4 MHz frequency and the switching transitions make up the switching losses. FIGURE 5-1: Efficiency under Load. Figure 5-1 shows an efficiency curve. From no load to 100 mA, efficiency losses are dominated by quiescent current losses, gate drive and transition losses. By using the HyperLight Load ® mode, the MIC33153 is able to maintain high efficiency at low output currents. Over 100 mA, efficiency loss is dominated by MOSFET RDS(ON) and inductor losses. Higher input supply voltages will increase the gate to source threshold on the internal MOSFETs, thereby reducing the internal RDS(ON). This improves efficiency by reducing DC losses in the device. All but the inductor losses are inherent to the device. In which case, inductor selection becomes increasingly critical in efficiency calculations. As the inductors are reduced in size, the DC resistance (DCR) can become quite significant. VOUT IOUT   100=

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 15 MIC33153 The DCR losses can be calculated by using Equation 5-2: EQUATION 5-2: From that, the loss in efficiency due to inductor resistance can be calculated by using Equation 5-3: EQUATION 5-3: Efficiency loss due to DCR is minimal at light loads and gains significance as the load is increased. Inductor selection becomes a trade-off between efficiency and size in this case. The effect of MOSFET voltage drops and DCR losses in conjunction with the maximum duty cycle combine to limit maximum output voltage for a given input voltage. The following graph shows this relationship based on the typical resistive losses in the MIC33153: FIGURE 5-2: VOUT(MAX) vs. VIN.

5.6 HyperLight Load ® Mode

The MIC33153 uses a minimum on and off time proprietary control loop. When the output voltage falls below the regulation threshold, the error comparator begins a switching cycle that turns the PMOS on and keeps it on for the duration of the minimum on-time. When the output voltage is over the regulation threshold, the error comparator turns the PMOS off for a minimum off-time. The NMOS acts as an ideal rectifier that conducts when the PMOS is off. Using a NMOS switch instead of a diode allows for lower voltage drop across the switching device when it is on. The asynchronous switching combination between the PMOS and the NMOS allows the control loop to work in discontinuous mode for light load operations. In discontinuous mode, MIC33153 works in pulse frequency modulation (PFM) to regulate the output. As the output current increases, the switching frequency increases. This improves the efficiency of the MIC33153 during light load currents. As the load current increases, the MIC33153 goes into continuous conduction mode (CCM) at a constant frequency of 4 MHz. The equation to calculate the load when the MIC33153 goes into continuous conduction mode may be approximated by the following Equation 5-4: EQUATION 5-4: As shown in the above equation, the load at which MIC33153 transitions from HyperLight Load® mode to PWM mode is a function of the input voltage (V IN), output voltage (V OUT), duty cycle (D), inductance (L) and frequency (f). For example, if VIN = 3.6V, VOUT = 1.8V, D = 0.5, f = 4 MHz and the internal inductance of MIC33153 is 0.47 µH, then the device will enter HyperLight Load ® mode or PWM mode at approximately 200 mA.

5.7 Power Dissipation Considerations

As with all power devices, the ultimate current rating of the output is limited by the thermal properties of the package and the PCB it is mounted on. There is a simple Ohm’s law type relationship between thermal resistance, power dissipation, and temperature which is analogous to an electrical circuit: PDCR IOUT

2 DCR=

VOUT IOUT  – 100= 0.5 1.5 2.5 3.5 4.5 2.5 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 1.2A 800mA 400mA 100mA ILOAD VIN VOUT–  D  =

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 17 MIC33153 EQUATION 5-9: The worst case switch and inductor resistance will increase at higher temperatures, so a margin of 20% can be added to account for this: EQUATION 5-10: This is well below the maximum 125°C. PDISS 1.8 1 1    0.45W== PDISS 0.45 1.2 0.54W= = Therefore: TJ = 0.54W x (55°C/W) + 50°C TJ = 79.7°C

DS20006223B-page 18  2019 - 2022 Microchip Technology Inc.

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Note 1:If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space: 6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Char- acters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N Example 14-Lead TDFN (Fixed Output)* 33153 415Y Example14-Lead TDFN (Adjustable Output)* XXX XXXXX NNNY XXXXX NNNY MIC 33153 415Y Legend: XX...X Product code or customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package.

• , ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 19 MIC33153 14-Lead TDFN 3.0 mm x 3.5 mm Recommended Land Pattern BA 0.05 C 0.05 C

0.08 C A B

0.05 C (DATUM B) (DATUM A) CSEATING PLANE NOTE 1 TOP VIEW VIEW A-A BOTTOM VIEW 0.10 C 0.08 C Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN] With 1.33x1.80 Exposed Pad and Fused Terminals © 2018 Microchip Technology Inc. D E e 14X b L (L1) (E4) (E3) D2 (D3) K N 1 2 N (A3) A AA NOTE 1 14X

DS20006223B-page 20  2019 - 2022 Microchip Technology Inc. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2018 Microchip Technology Inc. REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A b e L E N

0.50 BSC

0.203 REF

1.75 0.35 0.20 1.05 0.25 0.40 1.80 1.10

3.00 BSC

1.85 0.45 0.30 1.15 MAX K- 0.20 -Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 1.28

3.50 BSC

1.33 1.38 Exposed Pad Width E3 0.83 REF Exposed Pad Length D3 1.20 REF Exposed Pad Width E4 1.42 REF K1 0.170.12 0.22Package Center to Exposed-Pad Terminal Length L1 0.25 REF Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2 14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN] With 1.33x1.80 Exposed Pad and Fused Terminals 0.00 0.02 0.05

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 21 MIC33153 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2018 Microchip Technology Inc. C EVY2 ØV E Dimension Limits Units Exposed Pad Width Exposed Pad Length Contact Pitch 1.80 1.33 MILLIMETERS E MAX Contact Pad Length (Xnn) Y1 0.55 NOM CContact Pad Spacing 2.80 Contact Pad to Contact Pad G1 0.25 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 Contact Pad to Exposed Pad G2 0.23 Y4Exposed Pad Length 0.82 Y3Exposed Pad Length 0.22 Contact Pad Width (Xnn) X1 0.25 Exposed Pad Width X3 1.25 Package Center to Exposed Pad G3 0.17 Package Center to Exposed Pad G4 0.38 RECOMMENDED LAND PATTERN SILK SCREEN Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2 14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN] With 1.33x1.80 Exposed Pad and Fused Terminals

DS20006223B-page 22  2019 - 2022 Microchip Technology Inc. NOTES:

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 23 MIC33153 APPENDIX A: REVISION HISTORY Revision A (June 2019)

• Converted Micrel document MIC33153 to Micro- chip data sheet DS20006223B.
• Minor text changes throughout. Revision B (April 2022)
• Added new required note below the legend (for APID and some other former Micrel BUs) in Section 6.1 “Package Marking Information” to help clarify the marking codes.
• Updated package type references and package outline images.
• Minor formatting and text corrections throughout.

DS20006223B-page 24  2019 - 2022 Microchip Technology Inc. NOTES:

 2019 - 2022 Microchip Technology Inc. DS20006223B-page 25 MIC33153 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) MIC33153-4YHJ-TR: 4 MHz PWM 1.2A Internal Inductor Buck Regulator with HyperLight Load® and Power Good, 1.2V Fixed Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 14-Lead TDFN Package, 5000/Reel b) MIC33153-SYHJ-TR: 4 MHz PWM 1.2A Internal Inductor Buck Regulator with HyperLight Load® and Power Good, 3.3V Fixed Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 14-Lead TDFN Package, 5000/Reel c) MIC33153YHJ-TR: 4 MHz PWM 1.2A Internal Inductor Buck Regulator with HyperLight Load® and Power Good, Adjustable Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 14-Lead TDFN Package, 5000/Reel PART NO. XX PackageDevice Device: MIC33153: 4 MHz PWM 1.2A Internal Inductor Buck Regulator with HyperLight Load® and Power Good Output Voltage: 4 = 1.2V S = 3.3V Blank = Adjustable Junction Temperature Range: Y = –40°C to +125°C Package: HJ = 14-Lead 3.0 mm x 3.5 mm x 1.1 mm TDFN Media Type: TR = 5000/Reel X Junction Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. –XX Media Type Output Voltage Temperature Range Option Note: Other output voltage options are available. Contact Factory for details.

DS20006223B-page 26  2019 - 2022 Microchip Technology Inc. NOTES:

 2019 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006223B-page 27 This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this informa- tion in any other manner violates these terms. Information regarding device applications is provided only for your conve- nience and may be superseded by updates. It is your responsi- bility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-support- services. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON- INFRINGEMENT, MERCHANTABILITY , AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY , OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE - QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY , THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applica- tions is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019 - 2022, Microchip Technology Incorporated and its subsidiar- ies. All Rights Reserved. ISBN: 978-1-6683-0264-4 Note the following details of the code protection feature on Microchip products:

• Microchip products meet the specifications contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions.
• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

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