MIC33050-AYHL-T5

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 22

Technical content

Features

• Input Voltage: 2.7V to 5.5V
• 600 mA Output Current
• Fixed and Adjustable Output Voltage Options
• No External Inductor Required
• Ultra-Fast Transient Response
• 20 µA Quiescent Current
• 4 MHz Switching in PWM Mode
• Low Output Voltage Ripple
• >93% Peak Efficiency
• >85% Efficiency at 1 mA
• Micropower Shutdown
• 12-Pin 3 mm x 3 mm HDFN
• –40°C to +125°C Junction Temperature Range

Applications

• MPU Power
• Portable Instrumentation
• Wearable Devices
• Space-Constrained MCU Systems
• RF Modules
• USB-Powered Devices General Description The MIC33050 is a high-efficiency 600 mA PWM synchronous buck (step-down) regulator with internal inductor featuring HyperLight Load ®, a switching scheme that offers best-in-class light load efficiency and transient performance while providing very small external components and low output ripple at all loads. The MIC33050 also has a very low typical quiescent current of 20 µA and can achieve over 85% efficiency even at 1 mA. In contrast to traditional light load schemes, the HyperLight Load ® architecture does not trade off control speed to obtain low standby currents and in doing so, the device only needs a small output capacitor to absorb the load transient as the powered device goes from light load to full load. At higher loads, the MIC33050 provides a nearly constant switching frequency of greater than 4 MHz while providing peak efficiencies greater than 93%. The MIC33050 is available in fixed and adjustable output voltages and comes in a 12-pin 3 mm x 3 mm HDFN with a operating junction temperature range of –40°C to +125°C. Package Types 12-Pin 3 mm x 3 mm HDFN Adjustable (Top View) 12-Pin 3 mm x 3 mm HDFN Fixed (Top View)

4 MHz Internal Inductor PWM Buck Power Module with

HyperLight Load®

DS20006120B-page 2  2018 - 2022 Microchip Technology Inc. Typical Application Circuits Fixed Output MIC33050 Adjustable Output MIC33050

 2018 - 2022 Microchip Technology Inc. DS20006120B-page 3 MIC33050 Functional Block Diagrams Simplified MIC33050 Fixed Functional Block Diagram Simplified MIC33050 Adjustable Functional Block Diagram

DS20006120B-page 4  2018 - 2022 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † Operating Ratings ‡ † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Specifications are for packaged product only. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1:Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; CFF = 560 pF; COUT = 4.7µF; IOUT = 20 mA unless otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C. Specification for packaged product only. Parameter Symbol Min. Typ. Max. Units Conditions Supply Voltage Range VIN 2.7 — 5.5 V — Undervoltage Lockout Threshold UVLO 2.45 2.55 2.65 V Turn-On Undervoltage Lockout Hysteresis UVLOHYS — 100 — mV — Quiescent Current IQ — 20 32 µA I OUT = 0 mA, SNS > 1.2 * VOUT(NOM) Shutdown Current ISHDN — 0.01 4 µA V EN = 0V; VIN = 5.5V Output Voltage Accuracy ΔV OUT –2.5 — +2.5 % V IN = 3.0V; ILOAD = 20 mA Current Limit in PWM Mode I LIM 0.65 1 1.7 A V SNS = 0.9*VOUT(NOM) Output Voltage Line Regulation ΔVO_LINE — 0.5 — %/V V IN = 3.0V to 5.5V, ILOAD = 20 mA Output Voltage Load Regulation ΔVO_LOAD — 0.3 — % 20 mA < I LOAD < 500 mA Feedback Voltage VFB 390 400 410 mV V IN = 3.0V; IOUT = 20 mA Maximum Duty Cycle DMAX 80 89 — % V SNS ≤ VOUT(NOM) PWM Switch On-Resistance RDS(ON)P — 0.45 — Ω ISW = 100 mA PMOS RDS(ON)N — 0.5 — ISW = –100 mA NMOS Switching Frequency fSW — 4 — MHz I OUT = 120 mA Soft Start Time tSS — 650 — µs V OUT = 90% of VOUT(NOM) Enable Threshold VENTH 0.5 0.8 1.2 V Turn-On Enable Hysteresis VENHYS — 35 — mV — Enable Input Current IEN — 0.1 2 µA — Overtemperature Shutdown T SD — 165 — °C — Overtemperature Shutdown Hysteresis TSDHYS — 20 — °C —

 2018 - 2022 Microchip Technology Inc. DS20006120B-page 5 MIC33050 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Junction Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Package Thermal Resistances Thermal Resistance 12-Pin HDFN 3 mm x 3 mm JA — 60 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

DS20006120B-page 6  2018 - 2022 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: Efficiency (VOUT = 3.3V). FIGURE 2-2: Efficiency (VOUT = 1.8V). FIGURE 2-3: Efficiency (VOUT = 1.2V). FIGURE 2-4: Efficiency (VOUT = 1.0V). FIGURE 2-5: Quiescent Current vs. Temperature. FIGURE 2-6: Quiescent Current vs. Input Voltage. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 100 1 10 100 1000 EFFICIENCY (%) OUTPUT CURRENT (mA) VIN = 5.0V VIN = 4.2V VIN = 5.5V 100 1 10 100 1000 EFFICIENCY (%) OUTPUT CURRENT (mA) VIN = 4.2VVIN = 3.6V VIN = 3.0V 100 1 10 100 1000 EFFICIENCY (%) OUTPUT CURRENT (mA) VIN = 2.7V VIN = 3.6V VIN = 4.2V 100 1 10 100 1000 EFFICIENCY (%) OUTPUT CURRENT (mA) VIN = 2.7V VIN = 3.6V VIN = 4.2V L = 1uH -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) QUIESCENT CURRENT (uA) VIN = 3.6V VOUT = 1.8V INPUT VOLTAGE (V) QUIESCENT CURRENT (μA ) VOUT = 1.8V No Load

DS20006120B-page 10  2018 - 2022 Microchip Technology Inc.

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number MIC33050 (Fixed Option) Pin Number MIC33050 (Adj. Option) Pin Name Description 1 1 VIN Supply Voltage (Input): Requires bypass capacitor to GND. 2 2 PGND Power Ground. 3, 4, 5, 6 3, 4, 5, 6 SW Switch (Output): Internal power MOSFET output switches. 7, 8 7, 8 OUT Output after the internal inductor. 9 9 EN Enable (Input): Logic low will shut down the device, reducing the quiescent current to less than 4 µA. Do not leave floating. 10 10 SNS Input to the error amplifier. Connect to the external resistor divider network to see the output voltage. For fixed output voltages connect VOUT (internal resistor network sets the output voltage). 11 — CFF Feed forward capacitor connected to out sense pin. — 11 FB Feedback voltage. Connect a resistor divider from output to ground to set the output voltage. 12 12 AGND Analog ground. ePAD ePAD ePAD Exposed Heatsink Pad. Connect to power ground for best thermal performance.

 2018 - 2022 Microchip Technology Inc. DS20006120B-page 11 MIC33050

4.0 FUNCTIONAL DESCRIPTION

4.1 VIN

VIN provides power to the MOSFETs for the switch mode regulator section and to the analog supply circuitry. Due to the high switching speeds, it is recommended that a 2.2 µF or greater capacitor be placed close to VIN and the power ground (PGND) pin for bypassing. 4.2 EN The enable pin, EN, controls the on and off state of the device. A high logic on the enable pin activates the regulator while a low logic deactivates it. MIC33050 features built-in soft-start circuitry that reduces in-rush current and prevents the output voltage from overshooting at start-up. Do not leave floating. 4.3 SW The pins at the switch node, SW, are connected directly to the internal inductor. Due to the high-speed switching on this pin, the switch node should be routed away from sensitive nodes such as the CFF and FB pins.

4.4 OUT

The OUT pin is for the output voltage following the internal inductor of the device. Connect an output filter capacitor equal to 2.2 µF or greater to this pin.

4.5 SNS

The sense pin, SNS, is needed to sense the output voltage at the output filter capacitor. In order for the control loop to monitor the output voltage accurately it is good practice to sense the output voltage at the positive side of the output filter capacitor where voltage ripple is smallest.

4.6 CFF

The CFF pin is connected to the SNS pin of MIC33050 with a feed-forward capacitor of 560 pF. The CFF pin itself is compared with the internal reference voltage (VREF) of the device and provides the control path to control the output. V REF is equal to 400 mV. The CFF pin is sensitive to noise and should be place away from the SW pin. 4.7 FB The feedback pin is provided for the adjustable output version. An external resistor divider network is connected from the output and is compared to the internal 400 mV internal reference voltage within the control loop. The output voltage, of the circuit in Figure 4-1, may be calculated via the equation below: EQUATION 4-1: FIGURE 4-1: MIC33050-AYHL Application Schematic.

4.8 PGND

Power ground (PGND) is the ground path for high current. The current loop for the power ground should be as small as possible and separate from the analog ground (AGND) loop.

4.9 AGND

Signal ground (AGND) is the ground path for the biasing and control circuitry. The current loop for the signal ground should be separate from the PGND loop. VOUT 0.4V 1 R1  =

DS20006120B-page 12  2018 - 2022 Microchip Technology Inc.

5.0 APPLICATIONS INFORMATION

5.1 Input Capacitor

A minimum of 2.2 µF ceramic capacitor should be placed close to the VIN pin and PGND pin for bypassing. X5R or X7R dielectrics are recommended for the input capacitor. Y5V dielectrics, aside from losing most of their capacitance over temperature, they also become resistive at high frequencies. This reduces their ability to filter out high frequency noise.

5.2 Output Capacitor

The MIC33050 was designed for use with a 2.2 µF or greater ceramic output capacitor. A low equivalent series resistance (ESR) ceramic output capacitor either X7R or X5R is recommended. Y5V and Z5U dielectric capacitors, aside from the undesirable effect of their wide variation in capacitance over temperature, become resistive at high frequencies.

5.3 Compensation

The MIC33050 is designed to be stable with an internal inductor with a minimum of 2.2 µF ceramic (X5R) output capacitor.

5.4 Efficiency Considerations

Efficiency is defined as the amount of useful output power, divided by the amount of power supplied. EQUATION 5-1: Maintaining high efficiency serves two purposes. It reduces power dissipation in the power supply, reducing the need for heat sinks and thermal design considerations and it reduces consumption of current for battery powered applications. Reduced current draw from a battery increases the devices operating time which is critical in hand held devices. There are two types of losses in switching converters; DC losses and switching losses. DC losses are simply the power dissipation of I2R. Power is dissipated in the high-side switch during the on cycle. Power loss is equal to the high-side MOSFET R DS(ON) multiplied by the switch current squared. During the off cycle, the low-side N-channel MOSFET conducts, also dissipating power. Device operating current also reduces efficiency. The product of the quiescent (operating) current and the supply voltage represents another DC loss. The current required driving the gates on and off at a constant 4 MHz frequency and the switching transitions make up the switching losses. FIGURE 5-1: Efficiency under Load. Figure 5-1 shows an efficiency curve. From 1 µA to 100 mA, efficiency losses are dominated by quiescent current losses, gate drive and transition losses. By using the HyperLight Load ® mode, the MIC33050 is able to maintain high efficiency at low output currents. Over 100 mA, efficiency loss is dominated by MOSFET RDS(ON) and inductor losses. Higher input supply voltages will increase the gate to source threshold on the internal MOSFETs, thereby reducing the internal RDS(ON). This improves efficiency by reducing DC losses in the device. All but the inductor losses are inherent to the device. In which case, inductor selection becomes increasingly critical in efficiency calculations. As the inductors are reduced in size, the DC resistance (DCR) can become quite significant. The DCR losses can be calculated by using Equation 5-2: EQUATION 5-2: From that, the loss in efficiency due to inductor resistance can be calculated by using Equation 5-3: VOUT IOUT   100= 100 1 10 100 1000 EFFICIENCY (%) OUTPUT CURRENT (mA) VIN = 4.2VVIN = 3.6V VIN = 3.0V PD L  IOUT

2 DCR 

 2018 - 2022 Microchip Technology Inc. DS20006120B-page 13 MIC33050 EQUATION 5-3: Efficiency loss due to DCR is minimal at light loads and gains significance as the load is increased. Inductor selection becomes a trade-off between efficiency and size in this case.

5.5 HyperLight Load ® Mode

The MIC33050 uses a minimum on and off time proprietary control loop. When the output voltage falls below the regulation threshold, the error comparator begins a switching cycle that turns the PMOS on and keeps it on for the duration of the minimum on-time. When the output voltage is over the regulation threshold, the error comparator turns the PMOS off for a minimum off-time. The NMOS acts as an ideal rectifier that conducts when the PMOS is off. Using a NMOS switch instead of a diode allows for lower voltage drop across the switching device when it is on. The asynchronous switching combination between the PMOS and the NMOS allows the control loop to work in discontinuous mode for light load operations. In discontinuous mode, MIC33050 works in pulse frequency modulation (PFM) to regulate the output. As the output current increases, the switching frequency increases. This improves the efficiency of the MIC33050 during light load currents. As the load current increases, the MIC33050 goes into continuous conduction mode (CCM) at a constant frequency of 4 MHz. The equation to calculate the load when the MIC33050 goes into continuous conduction mode may be approximated by the following Equation 5-4: EQUATION 5-4: EfficiencyLoss 1 VOUT IOUT  – 100= ILOAD VIN VOUT–  D  =

DS20006120B-page 14  2018 - 2022 Microchip Technology Inc.

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space:

6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;

2 Characters = NN; 1 Character = N

X Example12-Lead HDFN* XXXXX A 33050 NNNY 139Y Legend: XX...X Product code or customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package.

• , ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.

 2018 - 2022 Microchip Technology Inc. DS20006120B-page 15 MIC33050 12-Lead HDFN 3 mm x 3 mm Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

DS20006120B-page 16  2018 - 2022 Microchip Technology Inc. NOTES:

 2018 - 2022 Microchip Technology Inc. DS20006120B-page 17 MIC33050 APPENDIX A: REVISION HISTORY Revision A (November 2018)

• Converted Micrel document MIC33050 to Micro- chip data sheet DS20006120B.
• Minor text changes throughout.
• Deleted bullet: Up to 8 MHz PWM Operation in Continuous Mode from the Features, Updated Applications, removed the word patent-pending from General Description, Revised Figure 2-6 and Figure 2-8. Revision B (March 2022)
• Corrected package marking drawings and added note below legend in Section 6.1, Package Mark- ing Information.
• Minor formatting corrections throughout.

DS20006120B-page 18  2018 - 2022 Microchip Technology Inc. NOTES:

 2018 - 2022 Microchip Technology Inc. DS20006120B-page 19 MIC33050 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) MIC33050-4YHL-TR: 4 MHz Internal Inductor PWM Buck Power Module with HyperLight Load®, 1.2V Fixed Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 12-Lead HDFN Package, 5000/Reel b) MIC33050-GYHL-TR: 4 MHz Internal Inductor PWM Buck Power Module with HyperLight Load®, 1.8V Fixed Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 12-Lead HDFN Package, 5000/Reel c) MIC33050-SYHL-TR: 4 MHz Internal Inductor PWM Buck Power Module with HyperLight Load®, 3.3V Fixed Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 12-Lead HDFN Package, 5000/Reel d) MIC33030-AYHL-T5: 4 MHz Internal Inductor PWM Buck Power Module with HyperLight Load®, Adjustable Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 12-Lead HDFN Package, 500/Reel e) MIC33030-AYHL-TR: 4 MHz Internal Inductor PWM Buck Power Module with HyperLight Load®, Adjustable Output Voltage, –40°C to +125°C Junction Temperature Range, Pb-Free, RoHS Compliant, 12-Lead HDFN Package, 5000/Reel PART NO. XX PackageDevice Device: MIC33050: 4 MHz Internal Inductor PWM Buck Power Module with HyperLight Load Output Voltage: C = 1.0V 4 = 1.2V G = 1.8V S = 3.3V A = Adjustable Junction Temperature Range: Y = –40°C to +125°C (Pb-Free, RoHS Compliant) Package: HL = 12-Lead 3 mm x 3 mm x 0.9 mm HDFN Media Type: T5 = 500/Reel TR = 5000/Reel X Junction Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. –XX Media Type Output Voltage Temperature Range Option Note: Other output voltage options are available. Contact Factory for details.

DS20006120B-page 20  2018 - 2022 Microchip Technology Inc. NOTES:

 2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006120B-page 21 This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this informa- tion in any other manner violates these terms. Information regarding device applications is provided only for your conve- nience and may be superseded by updates. It is your responsi- bility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-support- services. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON- INFRINGEMENT, MERCHANTABILITY , AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY , OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE - QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY , THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applica- tions is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018 - 2022, Microchip Technology Incorporated and its subsidiar- ies. All Rights Reserved. ISBN: 978-1-6683-0158-6 Note the following details of the code protection feature on Microchip products:

• Microchip products meet the specifications contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions.
• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

DS20006120B-page 22  2018 - 2022 Microchip Technology Inc. and its subsidiaries. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Worldwide Sales and Service 09/14/21