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Technical content

Features

  • 70 mΩ Typical On-Resistance @ 5V MIC2005A/20X9A - 170 mΩ Typical On-Resistance @ 5V
  • Enable Active-High or Active-Low
  • 2.5V to 5.5V Operating Range
  • Pre-Set Current Limit Values of 0.5A, 0.8A, and 1.2A*
  • Adjustable Current Limit 0.2A to 2.0A* (MIC20X7-MIC20X9)
  • Adjustable Current Limit 0.1A to 0.9A* (MIC20X9A)
  • Undervoltage Lockout (UVLO)
  • Variable UVLO Allows Adjustable UVLO Thresholds*
  • Automatic Load Discharge for Capacitive Loads*
  • Soft-Start Prevents Large Current Inrush
  • Adjustable Slew Rate Allows Custom Slew Rates*
  • Automatic-On Output After Fault
  • Thermal Protection * Available on some family members

Applications

  • Digital Televisions (DTV)
  • Set Top Boxes
  • PDAs
  • Printers
  • USB / IEEE 1394 Power Distribution
  • Desktop and Laptop PCs
  • Game Consoles
  • Docking Stations General Description The MIC20XX family of switches are current limiting, high-side power switches, designed for general purpose power distribution and control in digital televisions (DTV), printers, set top boxes (STB), PCs, PDAs, and other peripheral devices (see MIC20XX Family Package Types and the MIC20XX Family Member Functionality table). MIC20XX family’s primary functions are current limiting and power switching. They are thermally protected and will shutdown should their internal temperature reach unsafe levels, protecting both the device and the load, under high-current or fault conditions. Features include fault reporting, fault blanking to eliminate noise-induced false alarms, output slew rate limiting, under voltage detection, automatic-on output, and enable pin with choice of either active low or active high enable. The FET is self-contained, with a fixed- or user-adjustable current limit. The MIC20XX family is ideal for any system where current limiting and power control are desired. The MIC201X (3 ≤ X ≤ 9) and MIC2019A switches offer a unique new patented feature: Kickstart which allows momentary high-current surges up to the secondary current limit (I LIMIT_2nd) without sacrificing overall system safety. The MIC20XX family is offered, depending on the desired features, in a space-saving 5-lead SOT-23, 6-lead SOT-23, and 2 mm x 2 mm DFN packages. Fixed and Adjustable Current Limiting Power Distribution Switches

DS20006486C-page 2  2021 - 2022 Microchip Technology Inc. and its subsidiaries MIC20XX Family Package Types Fixed Current Limit (MIC20X3) Fixed Current Limit (MIC20X4) Fixed Current Limit (MIC20X5) Fixed Current Limit (MIC20X6) 5-Pin SOT-23 (M5) VIN 1 5 GND NC VOUT NC 6-Pin DFN (ML) Top View 5-Pin SOT-23 (M5) 6-Pin DFN (ML) Top View VIN 1 5 GND ENABLE VOUT NC 6-Pin DFN (ML) MIC20X5 Top View 6-Pin SOT-23 (M6) MIC20X5 VIN 52GND ENABLE VOUT FAULT/ CSLEW VIN 1 5 GND ENABLE VOUT FAULT/ 5-Pin SOT-23 (M5) MIC2005-X.XL 6-Pin SOT-23 (M6) 6-Pin DFN (ML) Top View VIN 52GND ENABLE VOUT VUVLO CSLEW

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 3 MIC20XX MIC20XX Family Package Types (Continued) Adjustable Current Limit (MIC20X7/MIC20X8) Adjustable Current Limit (MIC20X9) Adjustable Current Limit (MIC2005A) Adjustable Current Limit (MIC2009A) 6-Pin SOT-23 (M6) 6-Pin DFN (ML) Top View VIN 52GND ENABLE VOUT ILIMIT CSLEW 6-Pin SOT-23 (M6) 6-Pin DFN (ML) Top View VIN 52GND ENABLE VOUT FAULT/ ILIMIT 5-Pin SOT-23 (M5) VIN 1 5 GND ENABLE VOUT FAULT/ 6-Pin SOT-23 (M6) VIN 52GND ENABLE VOUT FAULT/ CSLEW VIN 52GND ENABLE VOUT FAULT/ ILIMIT 6-Pin SOT-23 (M6)

DS20006486C-page 4  2021 - 2022 Microchip Technology Inc. and its subsidiaries Typical Application Circuit Functional Block Diagram VIN VOUT MIC2005A VBUS USB PortGND EN FAULT/ 5V Supply VIN Logic Controller ON/OFF OVERCURRENT/ 1μF 120μF

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 5 MIC20XX

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † Continuous Output Current ESD (HBM) Note 1 ESD (MM) Note 1 Operating Ratings †† Continuous Output Current † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. †† Notice: The device is not guaranteed to function outside its operating ratings. Note 1: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with 100pF.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: VIN = 5V; CIN = 1 µF; TA = +25°C, unless otherwise noted. Bold indicates specifications over the full operating temperature range of –40°C to +85°C. (Note 1) Parameter Symbol Min. Typ. Max. Units Conditions Switch Input Voltage VIN 2.5 — 5.5 V — Output Leakage Current (Note 2) ILEAK — 12 100 µA Switch = OFF, VOUT = 0V Active-Low Enable, VEN = 1.5V Active-High Enable, VEN = 0V MIC2005A, MIC2009A, MIC2019A Supply Current (Note 2) IIN — 80 300 µA Switch = ON Active-Low Enable, VEN = 0V Active-High Enable, VEN = 1.5V — 8 15 Switch = OFF Active-Low Enable, VEN = 1.5V — 1 5 Switch = OFF Active-High Enable, VEN = 0V Power Switch Resistance R DS(ON) — 170 220 mΩ VIN = 5V, IOUT = 100 mA — — 275 MIC2005A Fixed Current Limit ILIMIT 0.5 0.7 0.9 A V OUT = 0.8 × VIN

DS20006486C-page 6  2021 - 2022 Microchip Technology Inc. and its subsidiaries MIC2009A, MIC2019A Variable Current Limit Factors C LF 172 211 263 V IOUT = 0.9A, VOUT = 0.8 × VIN 152 206 263 IOUT = 0.5A, VOUT = 0.8 × VIN 138 200 263 IOUT = 0.2A, VOUT = 0.8 × VIN 121 192 263 IOUT = 0.1A, VOUT = 0.8 × VIN MIC2019A Secondary Current Limit I LIMIT_2nd 1 2 3 A V IN = 2.5V, VOUT = 0V MIC2003-MIC2009, MIC2013-MIC2019, MIC2005-X.XL Supply Current (Note 2) IIN — 80 330 µA Switch = ON Active-Low Enable, VEN = 0V Active-High Enable, VEN = 1.5V — 8 15 Switch = OFF Active-Low Enable, VEN = 1.5V — 1 5 Switch = OFF Active-High Enable, VEN = 0V Power Switch Resistance R DS(ON) — 70 100 mΩ V IN = 5V, IOUT = 100 mA — 125 MIC2015-X.X MIC2016-X.X Fixed Current Limit ILIMIT 0.5 0.7 0.9 A –0.5, VOUT = 0.8 × VIN MIC2005-0.5 Fixed Current Limit ILIMIT 0.5 0.7 0.9 A V OUT = 0.8 × VIN MIC2007, MIC2008, MIC2009, MIC2017, MIC2018, MIC2019 Variable Current Limit Factors C LF 210 250 286 V IOUT = 2.0A, VOUT = 0.8 × VIN 190 243 293 IOUT = 1.0A, VOUT = 0.8 × VIN 168 235 298 IOUT = 0.5A, VOUT = 0.8 × VIN 144 225 299 IOUT = 0.2A, VOUT = 0.8 × VIN MIC2013, MIC2014, MIC2015, MIC2016, MIC2017, MIC2018, MIC2019 Secondary Current Limit I LIMIT_2nd 2.2 4 6 A V IN = 2.5V, VOUT = 0V MIC2006, MIC2016 Variable UVLO Threshold V UVLO_TH 225 250 275 mV — MIC20x4, MIC20x7 Load Discharge Resistance R DSCHG 70 126 200 Ω V IN = 5V, ISINK = 5 mA MIC20X5, MIC20X6, MIC20X7, MIC20X8 CSLEW Input Current ICSLEW — 0.175 — µA 0V ≤ V OUT ≤ 0.8 VIN ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = 5V; CIN = 1 µF; TA = +25°C, unless otherwise noted. Bold indicates specifications over the full operating temperature range of –40°C to +85°C. (Note 1) Parameter Symbol Min. Typ. Max. Units Conditions

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 7 MIC20XX All Parts Enable Input Voltage (Note 3) V EN — — 0.5 V VIL (MAX) 1.5 — — VIH (MIN) Enable Input Current IEN — 1 5 µA 0V ≤ V EN ≤ 5V Undervoltage Lock-Out Threshold UVLO_TH 2 2.25 2.5 V VIN Rising 1.9 2.15 2.4 VIN Falling Undervoltage Lock-Out Hysteresis UVLO_HYS — 0.1 — V — Fault Status Output Voltage V FAULT — 0.25 0.4 V I OL = 10 mA Overtemperature Threshold OT_TH — 145 — TJ Increasing — 135 — TJ Decreasing Note 1: Specification for packaged product only. 2: Check the Ordering Information section to determine which parts are Active-High or Active-Low. 3: VIL(MAX) = Maximum positive voltage applied to the input which will be accepted by the device as a logic low. VIH(MAX) = Maximum positive voltage applied to the input which will be accepted by the device as a logic high. ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = 5V; CIN = 1 µF; TA = +25°C, unless otherwise noted. Bold indicates specifications over the full operating temperature range of –40°C to +85°C. (Note 1) Parameter Symbol Min. Typ. Max. Units Conditions

DS20006486C-page 8  2021 - 2022 Microchip Technology Inc. and its subsidiaries AC ELECTRICAL CHARACTERISTICS Parameters Symbol Min. Typ. Max. Units Conditions Output Turn-On Rise Time t RISE 500 1000 1500 µs RL = 10Ω, CLOAD = 1 µF, VOUT = 10% to 90% CSLEW = Open (Note 1) Delay before asserting or releasing FAULT/ MIC2003 - MIC2009 MIC2009A, MIC2005A tD_FAULT 20 32 49 ms Time from current limiting to FAULT/ state change Delay before asserting or releasing FAULT/ MIC2013 - MIC2019 MIC2019A 77 128 192 Time from IOUT continuously exceeding primary current limit condition to FAULT/ state change Delay before current limiting MIC2013 - MIC2019 MIC2019A tD_LIMIT 77 128 192 ms — Delay before resetting Kickstart current limit delay, tD_LIMIT MIC2013 - MIC2019 MIC2019A tRESET 77 128 192 ms Out of current limit following a current limit event. Output Turn-On Delay t ON_DLY — 1000 1500 µs RL = 43Ω, CL = 120 µF, VEN = 50% to VOUT = 10% *CSLEW = Open Output Turn-Off Delay t OFF_DLY — — 700 µs RL = 43Ω, CL = 120 µF, VEN = 50% to VOUT = 90% *CSLEW = Open Note 1: Whenever CSLEW is present. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges Maximum Junction Temperature TJ — — +150 °C — Storage Temperature TS –65 — +150 °C — Ambient Temperature Range TA –40 — +85 °C — Lead Temperature — — — +260 °C Soldering, 10 sec. Package Thermal Resistances (Note 2) Thermal Resistance, SOT-23-5/6 JA 230 — °C/W —Thermal Resistance, 6-Lead DFN JA 90 JC 45 Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. 2: Requires proper thermal mounting to achieve this performance.

DS20006486C-page 10  2021 - 2022 Microchip Technology Inc. and its subsidiaries

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: Supply Current Output Enabled (MIC20XX). FIGURE 2-2: Supply Current Output Disnabled (MIC20XX). FIGURE 2-3: Switch Leakage Current (MIC20XX). FIGURE 2-4: ILIMT vs. Temperature (MIC20XX-0.5). FIGURE 2-5: ILIMT vs. Temperature (MIC20XX-0.8). FIGURE 2-6: ILIMT vs. Temperature (MIC20XX-1.2). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 100 SUPPLY CURRENT (μA) VIN (V) -40°C 85°C 25°C 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 SUPPLY CURRENT (μA) VIN (V) -40°C 85°C 25°C 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 -40 -15 10 35 60 85 LEAKAGE CURRENT (μA) TEMPERATURE (°C) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -40 -15 10 35 60 85 ILIMIT (A) TEMPERATURE (°C) 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 -40 -15 10 35 60 85 ILIMIT (A) TEMPERATURE (°C) 1.00 1.10 1.20 1.30 1.40 1.50 1.60 1.70 1.80 1.90 2.00 -40 -15 10 35 60 85 ILIMIT (A) TEMPERATURE (°C)

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 17 MIC20XX

3.0 PIN DESCRIPTIONS

These pin and signal descriptions aid in the differentiation of a pin from electrical signals and components connected to that pin. For example, VOUT is the switch’s output pin, while VOUT is the electrical signal output voltage present at the VOUT pin. The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Name Type Description VIN Input Supply input. This pin provides power to both the output switch and the switch’s internal control circuitry. GND — Ground EN Input Switch Enable (Input): FAULT/ Output Fault status. A logic low on this pin indicates the switch is in current limiting, or has been shut down by the thermal protection circuit. This is an open-drain output allowing logical OR’ing of multiple switches. CSLEW Input Slew rate control. Adding a small value capacitor between this pin and VIN slows turn-on of the power FET. VOUT Output Switch output. The load being driven by the switch is connected to this pin. VUVLO Input Variable Under Voltage Lockout (VUVLO): Monitors the input voltage through a resistor divider between VIN and GND. Shuts the switch off if voltage falls below the threshold set by the resistor divider. Previously called VUVLO. ILIMIT Input Set current limit threshold via a resistor connected from ILIMIT to GND. EP Thermal On DFN packages connect EP to GND. TABLE 3-2: SIGNAL DESCRIPTION TABLE Signal Name Type Description VIN Input Electrical signal input voltage present at the VIN pin. GND — Ground VEN Input Electrical signal input voltage present at the ENABLE pin. VFAULT/ Output Electrical signal output voltage present at the FAULT/ pin. CSLEW Component Capacitance value connected to the CSLEW pin. VOUT Output Electrical signal output voltage present at the VOUT pin. VVUVLO_TH Internal VUVLO internal reference threshold voltage. This voltage is compared to the VUVLO pin input voltage to determine if the switch should be disabled. Reference threshold voltage has a typical value of 250 mV. CLOAD Component Capacitance value connected in parallel with the load. Load capacitance. IOUT Output Electrical signal output current present at the VOUT pin. ILIMIT Internal Switch’s current limit. Fixed at factory or user adjustable.

DS20006486C-page 18  2021 - 2022 Microchip Technology Inc. and its subsidiaries

4.0 FUNCTIONAL DESCRIPTION

4.1 V IN and VOUT

VIN is both the power supply connection for the internal circuitry driving the switch and the input (Source connection) of the power MOSFET switch. VOUT is the Drain connection of the power MOSFET and supplies power to the load. In a typical circuit, current flows from VIN to V OUT toward the load. Because the switch is bi-directional when enabled, if VOUT is greater than VIN, current will flow from VOUT to VIN. When the switch is disabled, current will not flow to the load, except for a small unavoidable leakage current of a few microamps. However, should V OUT exceed V IN by more than a diode drop (~0.6V), while the switch is disabled, current will flow from output to input via the power MOSFET’s body diode. If discharging C LOAD is required by your application, consider using MIC20X4 or MIC20X7; these MIC20XX family members are equipped with a discharge FET to be ensured complete discharge of CLOAD.

4.2 Current Sensing and Limiting

MIC20XX protects the system power supply and load from damage by continuously monitoring current through the on-chip power MOSFET. Load current is monitored by means of a current mirror in parallel with the power MOSFET switch. Current limiting is invoked when the load exceeds the set over current threshold. When current limiting is activated the output current is constrained to the limit value, and remains at this level until either the load/fault is removed, the load’s current requirement drops below the limiting value, or the switch goes into thermal shutdown.

4.3 Kickstart

Note: Only parts in bold have Kickstart (Not available in 5-lead SOT-23 packages). The MIC201X is designed to allow momentary current surges (Kickstart) before the onset of current limiting, which permits dynamic loads, such as small disk drives or portable printers to draw the energy needed to overcome inertial loads without sacrificing system safety. In this respect, the Kickstart parts (MIC201X) differs markedly from the non-Kickstart parts (MIC200X) which immediately limit load current, potentially starving the motor and causing the appliance to stall or stutter. During this delay period, typically 128 ms, a secondary current limit is in effect. If the load demands a current in excess the secondary limit, MIC201X acts immediately to restrict output current to the secondary limit for the duration of the Kickstart period. After this time the MIC201X reverts to its normal current limit. An example of Kickstart operation is shown in Figure 4-1: FIGURE 4-1: Kickstart Operation. Figure 4-1 Label Key: A. MIC201X is enabled into an excessive load (slew rate limiting not visible at this time scale). The initial current surge is limited by either the overall circuit resistance and power supply compliance, or the secondary current limit, whichever is less. B. R ON of the power FET increases due to internal heating (effect exaggerated for emphasis). C. Kickstart period. D. Current limiting initiated. FAULT/ goes LOW. E. VOUT is non-zero (load is heavy, but not a dead short where VOUT = 0V. Limiting response will be the same for dead shorts). F. Thermal shutdown followed by thermal cycling. G. Excessive load released, normal load remains. MIC201X drops out of current limiting. H. FAULT/ delay period followed by FAULT/ going HIGH.

4.4 Undervoltage Lockout

Undervoltage lockout ensures no anomalous operation occurs before the device’s minimum input voltage of UVLOTHRESHOLD, which is 2V minimum, 2.25V typical, and 2.5V maximum, has been achieved. Prior to reaching this voltage, the output switch (power MOSFET) is OFF and no circuit functions, such as FAULT/ or ENABLE, are considered to be valid or operative. TABLE 4-1: KICKSTART 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 19 MIC20XX

4.5 Variable Undervoltage Lockout

Note: Only parts in bold have UVLO. VUVLO functions as an input voltage monitor when the switch in enabled. The VIN pin is monitored for a drop in voltage, indicating excessive loading of the V IN supply. When V IN is less than the V ULVO threshold voltage (VVUVLO_TH) for 32 ms or more, the MIC20XX disables the switch to protect the supply and allow VIN to recover. After 128 ms has elapsed, the MIC20X6 enables switch. This disable and enable cycling will continue as long as V IN deceases below the V UVLO threshold voltage (V VUVLO_TH) which has a typical value of 250 mV. The V UVLO voltage is commonly established by a voltage divider from VIN-to-GND.

4.6 Enable

Note: Only parts in bold have ENABLE pin. ENABLE pin is a logic compatible input that activates the main MOSFET switch thereby providing power to the VOUT pin. ENABLE is either an active HIGH or active LOW control signal. The MIC20XX can operate with logic running from supply voltages as low as 1.5 V. ENABLE may be driven higher than VIN, but no higher than 5.5V and not less than –0.3V.

4.7 Fault/

Note: Only parts in bold have FAULT/ pin. FAULT/ is an N-channel open-drain output that is asserted (LOW true) when switch either begins current limiting or enters thermal shutdown. FAULT/ asserts after a brief delay when events occur that may be considered possible faults. This delay insures that FAULT/ is asserted only upon valid, enduring, over-current conditions and that transitory event error reports are filtered out. In MIC200X FAULT/ asserts after a brief delay period, of 32 ms typical. After a fault clears, FAULT/ remains asserted for the delay period of 32 ms. MIC201X’s FAULT/ asserts at the end of the Kickstart period which is 128 ms typical. This masks initial current surges, such as would be seen by a motor load starting up. If the load current remains above the current limit threshold after the Kickstart has timed out, then the FAULT/ will be asserted. After a fault clears, FAULT/ remains asserted for the delay of 128 ms. Because FAULT/ is an open-drain it must be pulled HIGH with an external resistor and it may be wire-OR’d with other similar outputs, sharing a single pull-up resistor. FAULT/ may be tied to a pull-up voltage source which is higher than VIN, but no greater than 5.5V.

4.8 Soft-Start Control

Large capacitive loads can create significant inrush current surges when charged through the switch. For this reason, the MIC20XX family of switches provides a built-in soft-start control to limit the initial inrush currents. Soft-start is accomplished by controlling the power MOSFET when the ENABLE pin enables the switch.

4.9 C SLEW

Note: Only parts in bold have CSLEW pin. (Not available in 5-pin SOT-23 packages). The CSLEW pin is provided to increase control of the output voltage ramp at turn-on. This input allows designers the option of decreasing the output’s slew rate (slowing the voltage rise) by adding an external capacitance between the CSLEW and VIN pins.

4.10 Thermal Shutdown

Thermal shutdown is employed to protect the MIC20XX family of switches from damage should the die temperature exceed safe operating levels. Thermal shutdown shuts off the output MOSFET and asserts the FAULT/ output if the die temperature reaches 145°C. The switch will automatically resume operation when the die temperature cools down to 135°C. If resumed operation results in reheating of the die, another shutdown cycle will occur and the switch will continue cycling between ON and OFF states until the overcurrent condition has been resolved. Depending on PCB layout, package type, ambient temperature, etc., hundreds of milliseconds may elapse from the incidence of a fault to the output MOSFET being shut off. This delay is due to thermal time constants within the system itself. In no event will the device be damaged due to thermal overload because die temperature is monitored continuously by on-chip circuitry. TABLE 4-2: VARIABLE UNDERVOLTAGE LOCKOUT (VUVLO) 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X TABLE 4-3: ENABLE 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X TABLE 4-4: FAULT/ 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X TABLE 4-5: C SLEW 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X

DS20006486C-page 20  2021 - 2022 Microchip Technology Inc. and its subsidiaries

5.0 APPLICATION INFORMATION

5.1 Setting I LIMIT

The MIC2009/2019’s current limit is user programmable and controlled by a resistor connected between the ILIMIT pin and GND. The value of this resistor is determined by Equation 5-1: EQUATION 5-1: or EQUATION 5-2: For example: Set ILIMIT = 1.25A Please see the Electrical Characteristics table to find CLF at ILIMIT = 1A. For the sake of this example, we will say the typical value of CLF at an I OUT of 1A is 243V. Applying Equation 5-2: EQUATION 5-3: Designers should be aware that variations in the measured ILIMIT for a given R SET resistor, will occur because of small differences between individual ICs (inherent in silicon processing) resulting in a spread of ILIMIT values. In the example above we used the typical value of CLF to calculate R SET. We can determine ILIMIT’s spread by using the minimum and maximum values of CLF and the calculated value of RSET. EQUATION 5-4: Giving us a maximum ILIMIT variation over temperature of:

  • ILIMIT_MIN = 0.97A (−22%)
  • ILIMIT_TYP =1.25A
  • ILIMIT_MAX = 1.5A (+20%) TABLE 5-1: CLF AT I LIMIT = 1A Min Typ. Max Units 190 243 293 V ILIMIT CurrentLimitFactor CLF  RSET RSET CurrentLimitFactor CLF  RSET   243V Where: RSET = 196Ω (the closest standard 1% value) TABLE 5-2: MIC20X9A R SET TABLE IOUT RSET ILIMIT_MIN ILIMIT_MAX 0.1A 1928Ω 0.063A 0.136A 0.2A 993Ω 0.137A 0.265A 0.3A 673Ω 0.216A 0.391A 0.4A 511Ω 0.296A 0.515A 0.5A 413Ω 0.379A 0.637A 0.6A 346Ω 0.463A 0.759A 0.7A 299Ω 0.548A 0.880A 0.8A 263Ω 0.634A 1.001A 0.9A 235Ω 0.722A 1.121A TABLE 5-3: MIC20X9 R SET TABLE IOUT RSET ILIMIT_MIN ILIMIT_MAX 0.2A 1125Ω 0.127A 0.267A 0.3A 765Ω 0.202A 0.390A 0.4A 582Ω 0.281A 0.510A 0.5A 470Ω 0.361A 0.629A 0.6A 395Ω 0.443A 0.746A 0.7A 341Ω 0.526A 0.861A 0.8A 300Ω 0.610A 0.976A 0.9A 268Ω 0.695A 1.089A 1A 243Ω 0.781A 1.202A 1.1A 222Ω 0.868A 1.314A 1.2A 204Ω 0.956A 1.426A 1.3A 189Ω 1.044A 1.537A 1.4A 176Ω 1.133A 1.647A 1.5A 165Ω 1.222A 1.757A ILIMIT MIN  190V ILIMIT MAX  293V

DS20006486C-page 22  2021 - 2022 Microchip Technology Inc. and its subsidiaries

5.3 CSLEW

Note: Only parts in bold have CSLEW pin. (Not available in 5-pin SOT-23 packages). The CSLEW pin is provided to increase control of the output voltage ramp at turn-on. This input allows designers the option of decreasing the output’s slew rate (slowing the voltage rise) by adding an external capacitance between the CSLEW and VIN pins. This capacitance slows the rate at which the pass FET gate voltage increases and thus, slows both the response to an enable command as well as V OUT’s ascent to its final value. Figure 5-5 illustrates effect of CSLEW on turn-on delay and output rise time. FIGURE 5-5: CSLEW vs. Turn-On, Delay and Rise Times.

5.3.1 C SLEW’S EFFECT ON ILIMIT

An unavoidable consequence of adding C SLEW capacitance is a reduction in the MIC20X5 - 20X8’s ability to quickly limit current transients or surges. A sufficiently large capacitance can prevent both the primary and secondary current limits from acting in time to prevent damage to the MIC20X5 - 20X8 or the system from a short circuit fault. For this reason, the upper limit on the value of CSLEW is 4 nF.

5.4 Variable Undervoltage Lockout

(VUVLO) Note: Only parts in bold have VUVLO pin and functionality. Power-conscious systems, such as those implementing ACPI, will remain active even in their low-power states and may require the support of external devices through both phases of operation. Under these conditions, the current allowed these external devices may vary according to the system’s operating state and as such require dual current limits on their peripheral ports. The MIC20X6 is designed for systems demanding two primary current limiting levels but without the use of a control signal to select between current limits. To better understand how the MIC20X6 provides this, imagine a system whose main power supply supports heavy loads during normal operation, but in sleep mode is reduced to only few hundred milliamps of output current. In addition, this system has several USB ports which must remain active during sleep. During normal operation, each port can support a 500 mA peripheral, but in sleep mode their combined output current is limited to what the power supply can deliver minus whatever the system itself is drawing. If a peripheral device is plugged in which demands more current than is available, the system power supply will sag, or crash. The MIC20X6 prevents this by monitoring both the load current and V IN. During normal operation, when the power supply can source plenty of current, the MIC20X6 will support any load up to its factory programmed current limit. When the weaker, standby supply is in operation, the MIC20X6 monitors VIN and will shut off its output should V IN dip below a predetermined value. This predetermined voltage is user programmable and set by the selection of the resistor divider driving the VUVLO pin. To prevent false triggering of the VUVLO feature, the MIC20X6 includes a delay timer to blank out momentary excursions below the VUVLO trip point. If VIN stays below the VUVLO trip point for longer than 32 ms (typical), then the load is disengaged and the MIC20X6 will wait 128 ms before reapplying power to the load. If V IN remains below the VUVLO trip point, then the load will be powered for the 32 ms blanking period and then again disengaged. This is illustrated in the scope plot below. If VIN remains above the VUVLO trip point MIC20X6 resumes normal operation. FIGURE 5-6: VUVLO Operation. TABLE 5-4: CSLEW 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X TABLE 5-5: VARIABLE UNDERVOLTAGE LOCKOUT (VUVLO) 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X 0.002 0.004 0.006 0.008 0.01 0.012 0.014 TIME (mS) CSLEW (nF) TRISE TDELAY TON

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 23 MIC20XX VUVLO and Kickstart operate independently in the MIC2016. If the high current surge allowed by Kickstart causes VIN to dip below the VUVLO trip point for more than 32 ms, VUVLO will disengage the load, even though the Kickstart timer has not timed out. FIGURE 5-7: VUVLO Application Circuit.

5.4.1 CALCULATING VUVLO RESISTOR

The VUVLO feature is designed to keep the internal switch off until the voltage on the VUVLO pin is greater than 0.25V. A resistor divider network connected to the VUVLO and VIN pins is used to set the input trip voltage V TRIP (see Figure 5-7). The value of R2 is chosen to minimize the load on the input supply IDIV and the value of R1 sets the trip voltage VTRIP. The value of R2 is calculated using: EQUATION 5-5: The value of R1 is calculated using: EQUATION 5-6: Where for Equation 5-5 and Equation 5-6: VVUVLO = 0.25V When working with large value resistors, a small amount of leakage current from the VUVLO terminal can cause voltage offsets that degrade system accuracy. Therefore, the maximum recommended resistor value for R2 is 100 kΩ. Using the divider loading current I DIV of 100 µA, the value of R2 can be estimated by: EQUATION 5-7: Now the value of R1 can be calculated by: EQUATION 5-8: The VUVLO comparator uses no hysteresis. This is because the VUVLO blanking timer prevents any chattering that might otherwise occur if VIN varies about the trigger point. The timer is reset by upward crossings of the trip point such that VIN must remain below the trip point for the full 32 ms period for load disengagement to occur. In selecting a VTRIP voltage, the designer is cautioned to not make this value less than 2.5V. A minimum of 2.5V is required for the MIC20X6’s internal circuitry to operate properly. VUVLO trip points below 2.5V will result in erratic or unpredictable operation.

5.5 Kickstart

Note: Only parts in bold have Kickstart (Not available in 5-pin SOT-23 packages). Kickstart allows brief current surges to pass to the load before the onset of normal current limiting, which permits dynamic loads to draw bursts of energy without sacrificing system safety. Functionally, Kickstart is a forced override of the normal current limiting function provided by the switch. The Kickstart period is governed by an internal timer which allows current to pass up to the secondary current limit (ILIMIT_2nd) to the load for 128 ms and then normal (primary) current limiting goes into action. During Kickstart, a secondary current-limiting circuit is monitoring output current to prevent damage to the switch, as a hard short combined with a robust power supply can result in currents of many tens of amperes. This secondary current limit is nominally set at 4A and reacts immediately and independently of the Kickstart VIN MIC20X6 VOUT VUVLO Input Supply IIN_LOAD R2 VVUVLO IDIV R1 R2 VTRIP VVUVLO  = TABLE 5-6: KICKSTART 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X R2 0.25V R1 2.5 k 4.75V   45k== Where: VTRIP = 4.75V (for a 5V supply) VVUVLO = 0.25V

DS20006486C-page 24  2021 - 2022 Microchip Technology Inc. and its subsidiaries period. Once the Kickstart timer has finished its count the primary current limiting circuit takes over and holds IOUT to its programmed limit for as long as the excessive load persists. Once the switch drops out of current limiting the Kickstart timer initiates a lock-out period of 128 ms such that no further bursts of current above the primary current limit, will be allowed until the lock-out period has expired. Kickstart may be over-ridden by the thermal protection circuit and if sufficient internal heating occurs, Kickstart will be terminated and IOUT → 0A. Upon cooling, if the load is still present IOUT → ILIMIT, not ILIMIT_2nd. FIGURE 5-8: Kickstart.

5.6 Automatic Load Discharge

Note: Only parts in bold have automatic load dis- charge. Automatic discharge is a valuable feature when it is desirable to quickly remove charge from the VOUT pin. This allows for a quicker power-down of the load. This also prevents any charge from being presented to a device being connected to the VOUT pin, for example, USB, 1394, PCMCIA, and CableCARD. Automatic discharge is performed by a shunt MOSFET from VOUT pin to GND. When the switch is disabled, a break before make action is performed turning off the main power MOSFET and then enabling the shunt MOSFET. The total resistance of the MOSFET and internal resistances is typically 126Ω.

5.7 Supply Filtering

A minimum 1 μF bypass capacitor positioned close to the VIN and GND pins of the switch is both good design practice and required for proper operation of the switch. This will control supply transients and ringing. Without a bypass capacitor, large current surges or a short may cause sufficient ringing on V IN (from supply lead inductance) to cause erratic operation of the switch’s control circuitry. For best-performance good quality, low-ESR capacitors are recommended, preferably ceramic. When bypassing with capacitors of 10 μF and up, it is good practice to place a smaller value capacitor in parallel with the larger to handle the high frequency components of any line transients. Values in the range of 0.01 μF to 0.1 μF are recommended. Again, good quality, low-ESR capacitors should be chosen.

5.8 Power Dissipation

Power dissipation depends on several factors such as the load, PCB layout, ambient temperature, and supply voltage. Calculation of power dissipation can be accomplished by the following equation: EQUATION 5-9: To relate this to junction temperature, the following equation can be used: EQUATION 5-10: In normal operation the switch’s RON is low enough that no significant I 2R heating occurs. Device heating is most often caused by a short circuit, or very heavy load, when a significant portion of the input supply voltage appears across the switch’s power MOSFET. Under these conditions the heat generated will exceed the package and PCB’s ability to cool the device and thermal limiting will be invoked. TABLE 5-7: AUTOMATIC LOAD DISCHARGE 2003 2004 2005X 2006 2007 2008 2009X 2013 2014 2015 2016 2017 2018 2019X TJ PD R J-A  TA+= Where: TJ = Junction temperature TA = Ambient temperature Rθ(J-A) = The thermal resistance of the package

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 25 MIC20XX In Figure 5-9, die temperature is plotted against I OUT assuming a constant case temperature of 85°C. The plots also assume a worst case RON of 140 mΩ at a die temperature of 135°C. Under these conditions it is clear that an SOT-23 packaged device will be on the verge of thermal shutdown, typically 140°C die temperature, when operating at a load current of 1.25A. For this reason we recommend using DFN packaged switches for any design intending to supply continuous currents of 1A or more. FIGURE 5-9: Die Temperature vs. IOUT (TCASE = 85°C). 100 120 140 160 0.2 OUTPUT CURRENT (A) SOT-23 DFN

DS20006486C-page 26  2021 - 2022 Microchip Technology Inc. and its subsidiaries

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space:

6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;

2 Characters = NN; 1 Character = N

5-Lead SOT-23* (Front) Example XXXX 6-Lead DFN* Example XXX NNN QAA 6D8 FD08 5-Lead SOT-23* (Back) Example NNN 6SC 6-Lead SOT-23* (Front) Example XXXX FA54 5-Lead SOT-23* (Back) Example NNN WS7 Legend: XX...X Product code or customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package.

  • , ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 27 MIC20XX 5-Lead SOT-23 (M5) Package Outline & Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

DS20006486C-page 28  2021 - 2022 Microchip Technology Inc. and its subsidiaries 6-Lead SOT-23 (M6) Package Outline & Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 29 MIC20XX 6-Lead DFN 2 mm x 2 mm Package Outline & Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

DS20006486C-page 30  2021 - 2022 Microchip Technology Inc. and its subsidiaries Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 31 MIC20XX APPENDIX A: REVISION HISTORY Revision A (January 2021)

  • Converted Micrel document MIC20XX to Micro- chip data sheet template DS20006486A.
  • Minor grammatical text changes throughout. Revision B (February 2021)
  • Figure 2-23 (VIN = 3.3V) was a repeat of Figure 2- 22 (VIN = 5.0) by mistake and is the corrected graph now. Revision C (February 2022)
  • Updated Pin Diagram for MIC20X5 (6-Pin DFN version) in the MIC20XX Family Package Types section.
  • Updated the Package Marking Information draw- ing to reflect the most current information.
  • Minor grammatical and stylistic corrections throughout.

DS20006486C-page 32  2021 - 2022 Microchip Technology Inc. and its subsidiaries NOTES:

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 33 MIC20XX PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. MIC2003/MIC2013 Full Part No. (Note 1) Marking (Note 2) Current Limit Kickstart Package Media Type MIC2003-0.5YM5-TR FD 05 0.5A No 5-Lead SOT-23 3,000/ReelMIC2003-0.8YM5-TR FD 08 0.8A MIC2003-1.2YM5-TR FD 12 1.2A MIC2003-0.5YML-TR D0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2003-0.8YML-TR D0 8 0.8A MIC2003-1.2YML-TR D1 2 1.2A MIC2013-0.5YM5-TR FL 05 0.5A Yes 5-Lead SOT-23 3,000/ReelMIC2013-0.8YM5-TR FL 08 0.8A MIC2013-1.2YM5-TR FL 12 1.2A MIC2013-0.5YML-TR L0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2013-0.8YML-TR L0 8 0.8A MIC2013-1.2YML-TR L1 2 1.2A MIC2004/MIC2014 MIC2004-0.5YM5-TR FE 05 0.5A No 5-Lead SOT-23 3,000/ReelMIC2004-0.8YM5-TR FE 08 0.8A MIC2004-1.2YM5-TR FE 12 1.2A MIC2004-0.5YML-TR E0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2004-0.8YML-TR E0 8 0.8A MIC2004-1.2YML-TR E1 2 1.2A MIC2014-0.5YM5-TR FM 05 0.5A Yes 5-Lead SOT-23 3,000/ReelMIC2014-0.8YM5-TR FM 08 0.8A MIC2014-1.2YM5-TR FM 12 1.2A MIC2014-0.5YML-TR M0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2014-0.8YML-TR M0 8 0.8A MIC2014-1.2YML-TR M1 2 1.2A MIC2005/MIC2015 MIC2005-0.5YM6-TR FF 05 0.5A No 6-Lead SOT-23 3,000/ReelMIC2005-0.8YM6-TR FF 08 0.8A MIC2005-1.2YM6-TR FF 12 1.2A MIC2005-0.5YML-TR F0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2005-0.8YML-TR F0 8 0.8A MIC2005-1.2YML-TR F1 2 1.2A MIC2015-0.5YM6-TR FN 05 0.5A Yes 6-Lead SOT-23 3,000/ReelMIC2015-0.8YM6-TR FN 08 0.8A MIC2015-1.2YM6-TR FN 12 1.2A MIC2015-0.5YML-TR N0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2015-0.8YML-TR N0 8 0.8A MIC2015-1.2YML-TR N1 2 1.2A

DS20006486C-page 34  2021 - 2022 Microchip Technology Inc. and its subsidiaries PRODUCT IDENTIFICATION SYSTEM (CONTINUED) To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Full Part No. Marking Current Limit Kickstart Package Media Type MIC2005A MIC2005A-1YM5-TR FA 51 0.5A No 5-Lead SOT-23 3,000/Reel MIC2005A-2YM5-TR FA 52 0.5A MIC2005A-1YM6-TR FA 53 0.5A 6-Lead SOT-23 MIC2005A-2YM6-TR FA 54 0.5A MIC2005L MIC2005-0.5LYM5 5LFF 0.5A No 5-Lead SOT-23 3,000/ReelMIC2005-0.8LYM5 8LFF 0.8A MIC2005-1.2LYM5 4LFF 1.2A MIC2006/MIC2016 MIC2006-0.5YM6-TR FG 05 0.5A No 6-Lead SOT-23 3,000/ReelMIC2006-0.8YM6-TR FG 08 0.8A MIC2006-1.2YM6-TR FG 12 1.2A MIC2006-0.5YML-TR G0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2006-0.8YML-TR G0 8 0.8A MIC2006-1.2YML-TR G1 2 1.2A MIC2016-0.5YM6-TR FP 05 0.5A Yes 6-Lead SOT-23 3,000/ReelMIC2016-0.8YM6-TR FP 08 0.8A MIC2016-1.2YM6-TR FP 12 1.2A MIC2016-0.5YML-TR P0 5 0.5A 6-Lead 2 mm x 2 mm DFN 5,000/ReelMIC2016-0.8YML-TR P0 8 0.8A MIC2016-1.2YML-TR P1 2 1.2A MIC2007/MIC2017 MIC2007YM6-TR FHAA 0.2A - 2.0A No 6-Lead SOT-23 3,000/Reel MIC2007YML-TR HAA 6-Lead 2 mm x 2 mm DFN 5,000/Reel MIC2017YM6-TR FQAA Yes 6-Lead SOT-23 3,000/Reel MIC2017YML-TR QAA 6-Lead 2 mm x 2 mm DFN 5,000/Reel MIC2008/MIC2018 MIC2008YM6-TR FJAA 0.2A - 2.0A No 6-Lead SOT-23 3,000/Reel MIC2008YML-TR JAA 6-Lead 2 mm x 2 mm DFN 5,000/Reel MIC2018YM6-TR FRAA Yes 6-Lead SOT-23 3,000/Reel MIC2018YML-TR RAA 6-Lead 2 mm x 2 mm DFN 5,000/Reel MIC2009/MIC2019 MIC2009YM6-TR FKAA 0.2A - 2.0A No 6-Lead SOT-23 3,000/Reel MIC2009YML-TR KAA 6-Lead 2 mm x 2 mm DFN 5,000/Reel MIC2019YM6-TR FSAA Yes 6-Lead SOT-23 3,000/Reel MIC2019YML-TR SAA 6-Lead 2 mm x 2 mm DFN 5,000/Reel

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 35 MIC20XX PRODUCT IDENTIFICATION SYSTEM (CONTINUED) To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Full Part No. Marking Current Limit Kickstart Package Media Type MIC2009A/MIC2019A MIC2009A-1YM6-TR FK1 0.1A - 0.9A No 6-Lead SOT-23 3,000/Reel MIC2009A-2YM6-TR FK2 3,000/Reel MIC2019A-1YM6-TR FS1 Yes 3,000/Reel MIC2019A-2YM6-TR FS2 3,000/Reel Note 1: All MIC20XX Family parts are RoHS-compliant lead . 2: Over/Underbar symbol ( ¯ / _ ) may not be to scale. On the package the over/under symbol begins above/below the first character of the marking. MIC20XX FAMILY MEMBER FUNCTIONALITY Part Number Pin Function Normal Limiting Kickstart Note 1 ILIMIT ILIMIT ENABLE High ENABLE Low CSLEW FAULT/ VUVLO Note 4 Load Discharge 2003 2013 Fixed Note 2 2007 2017 Adj. Note 3 Note 1: Kickstart provides an alternate start-up behavior; however, pinouts are identical. 2: Fixed = Factory programmed current limit. 3: Adjustable = User adjustable current limit. 4: VUVLO = Variable UVLO (previously called DML). 5: CSLEW, while available in 6-pin package, not available in 5-pin package.

DS20006486C-page 36  2021 - 2022 Microchip Technology Inc. and its subsidiaries NOTES:

 2021 - 2022 Microchip Technology Inc. and its subsidiaries DS20006486C-page 37 This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this informa- tion in any other manner violates these terms. Information regarding device applications is provided only for your conve- nience and may be superseded by updates. It is your responsi- bility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-support- services. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON- INFRINGEMENT, MERCHANTABILITY , AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY , OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE - QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY , THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applica- tions is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2021 - 2022, Microchip Technology Incorporated and its subsidiar- ies. All Rights Reserved. ISBN: 978-1-5224-9820-9 Note the following details of the code protection feature on Microchip products:

  • Microchip products meet the specifications contained in their particular Microchip Data Sheet.
  • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions.
  • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
  • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

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