MI3050H48 ETC1 | Alldatasheet
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Technical content
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- • TTaappee aanndd RReeeell PPaacckkaaggiinngg MMIIHH SSeerriieess 5mm X 7mm Ceramic SMD www.mmdcomp.com phone: 949-709-5075 / fax: 949-709-3536 Specifications subject to change without notice Electrical Specifications Frequency Range 5V and 3.3V 1.500MHz to 156.250MHz 2.5V 1.500MHz to 70.000MHz 1.8V 1.544MHz to 40.000MHz Frequency Stability (Inclusive of Temperature, Load, Voltage and Aging) ±100ppm to ±10ppm Operating Temperature Range 0°C - 70°C to -40°C - 85°C Storage Temperature Range -55°C - 125°C Supply Voltage (Vdd) ±5% 5.0Vdc, 3.3Vdc, 2.5Vdc, or 1.8Vdc Supply Current Vdd = 5V 70mA max. Vdd = 3.3V 40mA max. Vdd = 2.5V 35mA max. Vdd = 1.8V 15mA max. Output Voltage HCMOS Logic 0 10% Vdd max. Logic 1 90% Vdd min. Duty Cycle 50% of waveform 40%/60% max. or 45%/55% max. Load Drive Capability 5V(less than 50MHz) 10 TTL Gates or 50pF 5V(greater than 50MHz) 10 TTL Gates or 15pF 3.3V(less than 50MHz) 10 TTL Gates or 30pF 3.3V(greater than 50MHz) 10 TTL Gates or 15pF 2.5V 10 TTL Gates or 15pF 1.8V 10 TTL Gates or 15pF Rise / Fall Time 4nSec max. Start Up Time 10mSec max. Jitter RMS 10pSec max.* *Please contact your MMD representative for up-to-date typical jitter information
www.mmdcomp.com phone: 949-709-5075 / fax: 949-709-3536 Specifications subject to change without notice Part Numbering Guide *See page VA4 for Tape Specifications Not available in 2.5V and 1.8V * Available to 70MHz only ** Available to 40MHz only Mechanical Dimensions Markings Line 1: MMD “Date Code” Line 2: Frequency Environmental / Mechanical Shock: MIL-STD-883, Method 2002, Condition B Solderability: MIL-STD-883, Method 2003 Solvent Resistance: MIL-STD-202, Method 215 Vibration: MIL-STD-883, Method 2007, Condition A Gross Leak Test: MIL-STD-883, Method 1014, Condition C Fine Leak Test: MIL-STD-883, Method 1014, Condition A2 Pad Connections Suggested Solder Pad Layout Pin 1: Tri-State Pin 2: Ground / Case Pin 3: Output Pin 4: Supply Voltage 1.7 max .067 max Markings 1 2 7.0 ±0.2 .278 ±.008 5.0 ±0.2 .197 ±.008 5.08 ±0.15 .200 ±.006 2.6 ±0.15 .102 ±.006 1.2 ±0.2 .047 ±.008 3.68 ±0.15 .145 ±.006 1.4 ±0.1 .055 ±.004 Solder Pad (X4) 2.88 .113 1.81 .071 2.0 .079 2.2 .087 Tri-state Operation Logic 1 or NC = Oscillation Logic 0 or GND = High Impedance FrequencyMI Frequency Stability 100 = ±100ppm 050 = ±50ppm 025 = ±25ppm 020 = ±20ppm 015 = ±15ppm 010 = ±10ppm Supply Voltage Blank = 5 Volt 3 = 3.3 Volt 2 = 2.5 Volt* 1 = 1.8 Volt** Output H = HCMOS T&R Operating Temperature Blank = 0°C to 70°C Packaging* Blank = Bulk T&R = Tape and Reel Pin 1 Connection H = Tri-state 5X7 Ceramic SMD Symmetry Blank = 40%/60% A = 45%/55% HH