MGSF1N03L ONSEMI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • Low RDS(on) Provides Higher Efficiency and Extends Battery Life
  • Miniature SOT−23 Surface Mount Package Saves Board Space
  • MV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free and are RoHS Compliant MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit Drain−to−Source Voltage VDSS 30 V Gate−to−Source Voltage VGS ±20 V Continuous Drain Current R/C0113JL Steady State TA = 25°C ID 2.1 A TA = 85°C 1.5 Power Dissipation R/C0113JL Steady State TA = 25°C PD 0.69 W Continuous Drain Current (Note 1) Steady State TA = 25°C ID 1.6 A TA = 85°C 1.2 Power Dissipation (Note 1) TA = 25°C PD 0.42 W Pulsed Drain Current tp =1 0 /C0109s IDM 6.0 A ESD Capability (Note 3) C = 100 pF, RS = 1500 /C0087 ESD 125 V Operating Junction and Storage Temperature TJ, TSTG −55 to 150 °C Source Current (Body Diode) IS 2.1 A Lead Temperature for Soldering Purposes (1/8” from case for 10 sec) TL 260 °C THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit Junction−to−Foot − Steady State R/C0113JL 180 °C/W Junction−to−Ambient − Steady State (Note 1) R/C0113JA 300 Junction−to−Ambient − t < 10 s (Note 1) R/C0113JA 250 Junction−to−Ambient − Steady State (Note 2) R/C0113JA 400 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Surface −mounted on FR4 board using 650 mm 2, 1 oz. Cu pad size. 2. Surface −mounted on FR4 board using 50 mm2, 1 oz. Cu pad size. 3. ESD Rating Information: HBM Class 0. G D S Device Package Shipping †

ORDERING INFORMATION

125 m/C0087 @ 4.5 V 80 m/C0087 @ 10 V RDS(on) TYP 2.1 A ID MAXV(BR)DSS SOT−23 CASE 318 STYLE 21 MARKING DIAGRAM/ PIN ASSIGNMENT N3 = Specific Device Code M = Date Code* /C0071= Pb−Free Package Drain Gate Source N−Channel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. MGSF1N03LT3G SOT −23 (Pb−Free) N3 M /C0071 /C0071 (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. MGSF1N03LT1G SOT −23 Pb−Free 3000 / Tape & Reel 10000 / Tape & Reel MVGSF1N03LT1G SOT −23 (Pb−Free) 3000 / Tape & Reel www.onsemi.com

MGSF1N03L, MVGSF1N03L www.onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage (VGS = 0 Vdc, ID = 10 /C0109Adc) V(BR)DSS 30 − − Vdc Zero Gate Voltage Drain Current (VDS = 30 Vdc, VGS = 0 Vdc) (VDS = 30 Vdc, VGS = 0 Vdc, TJ = 125°C) IDSS 1.0 /C0109Adc Gate−Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc) IGSS − − ±100 nAdc ON CHARACTERISTICS (Note 4) Gate Threshold Voltage (VDS = VGS, ID = 250 /C0109Adc) VGS(th) 1.0 1.7 2.4 Vdc Static Drain−to−Source On−Resistance (VGS = 10 Vdc, ID = 1.2 Adc) (VGS = 4.5 Vdc, ID = 1.0 Adc) rDS(on) 0.08 0.125 0.10 0.145 /C0087 DYNAMIC CHARACTERISTICS Input Capacitance (VDS = 5.0 Vdc) Ciss − 140 − pF Output Capacitance (VDS = 5.0 Vdc) Coss − 100 − Transfer Capacitance (VDG = 5.0 Vdc) Crss − 40 − SWITCHING CHARACTERISTICS (Note 5) Turn−On Delay Time (VDD = 15 Vdc, ID = 1.0 Adc, RL = 50 /C0087) td(on) − 2.5 − ns Rise Time tr − 1.0 − Turn−Off Delay Time td(off) − 16 − Fall Time tf − 8.0 − Gate Charge (See Figure 6) QT − 6000 − pC SOURCE−DRAIN DIODE CHARACTERISTICS Continuous Current IS − − 0.6 A Pulsed Current ISM − − 0.75 Forward Voltage (Note 5) VSD − 0.8 − V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: Pulse Width ≤ 300 /C0109s, Duty Cycle ≤ 2%. 5. Switching characteristics are independent of operating junction temperature.

Figure 9. Maximum Rated Forward Biased

0 V < VGS < 10 V

Figure 10. Thermal Response

MGSF1N03L, MVGSF1N03L www.onsemi.com PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AR D 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. SOLDERING FOOTPRINT* VIEW C L 0.25 e E E b A SEE VIEW C DIM A MIN NOM MAX MIN MILLIMETERS 0.89 1.00 1.11 0.035 INCHES A1 0.01 0.06 0.10 0.000 b 0.37 0.44 0.50 0.015 c 0.08 0.14 0.20 0.003 D 2.80 2.90 3.04 0.110 E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.30 0.43 0.55 0.012 0.039 0.044 0.002 0.004 0.017 0.020 0.006 0.008 0.114 0.120 0.051 0.055 0.075 0.080 0.017 0.022 NOM MAX H c 0 −−− 10 0 −−− 10T /C0095/C0095/C0095/C0095 T TOP VIEW SIDE VIEW END VIEW 2.90 0.80 DIMENSIONS: MILLIMETERS 0.90 PITCH 3X 0.95 RECOMMENDED STYLE 21: PIN 1. GATE 2. SOURCE 3. DRAIN *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MGSF1N03LT1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative