MGA-81563 HP | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Features

  • +14.8 dBm P 1dB at 2.0 GHz +17 dBm Psat at 2.0 GHz
  • Single +3V Supply
  • 2.8 dB Noise Figure at 2.0␣ GHz
  • 12.4 dB Gain at 2.0 GHz
  • Ultra-miniature Package
  • Unconditionally Stable

Applications

  • Buffer or Driver Amp for PCS, PHS, ISM, SATCOM and WLL Applications
  • High Dynamic Range LNA MGA-81563

Description

Hewlett-Packard’s MGA-81563 is an economical, easy-to-use GaAs MMIC amplifier that offers excellent power and low noise figure for applications from 0.1 to 6 GHz. Packaged in an ultra- miniature SOT-363 package, it requires half the board space of a SOT-143 package. The output of the amplifier is matched to 50 Ω (better than 2.1:1␣ VSWR) across the entire bandwidth. The input is partially matched to 50 Ω (better than 2.5:1␣ VSWR) below 4 GHz and fully matched to 50 Ω (better than 2:1 VSWR) above. A simple series inductor can be added to the input to improve the input match below 4 GHz. The amplifier allows a wide dynamic range by offering a 2.7 dB NF coupled with a +27 dBm Output IP The circuit uses state-of-the-art PHEMT technology with proven reliability. On-chip bias circuitry allows operation from a single +3␣ V power supply, while resistive feedback ensures stability (K>1) over all frequencies and temperatures. Surface Mount Package SOT-363 (SC-70) Pin Connections and Package Marking OUTPUT and Vd GND 81GND GND INPUT

4 GND

Note: Package marking provides orientation and identification. Simplified Schematic INPUT OUTPUT and Vd GND BIAS 1, 2, 4, 5 BIAS 5965-9684E

Thermal Resistance[2]: θch-c = 220°C/W Notes: 1. Permanent damage may occur if any of these limits are exceeded. 2. T C = 25°C (TC is defined to be the temperature at the package pins where contact is made to the circuit board.) Symbol Parameters and Test Conditions Units Min. Typ. Max. Std Dev [2] Gtest Gain in test circuit[1] f = 2.0 GHz 10.5 12.4 0.44 NFtest Noise Figure in test circuit[1] f = 2.0 GHz 2.8 3.8 0.21 NF50 Noise Figure in 50 Ω system f = 0.5 GHz dB 3.1 f = 1.0 GHz 3.0 f = 2.0 GHz 2.7 0.21 f = 3.0 GHz 2.7 f = 4.0 GHz 2.8 f = 6.0 GHz 3.5 |S21|2 Gain in 50 Ω system f = 0.5 GHz dB 12.5 f = 1.0 GHz 12.5 f = 2.0 GHz 12.3 0.44 f = 3.0 GHz 11.8 f = 4.0 GHz 11.4 f = 6.0 GHz 10.2 P1 dB Output Power at 1 dB Gain Compression f = 0.5 GHz dBm 15.1 f = 1.0 GHz 14.8 f = 2.0 GHz 14.8 0.86 f = 3.0 GHz 14.8 f = 4.0 GHz 14.8 f = 6.0 GHz 14.7 IP3 Output Third Order Intercept Point f = 2.0 GHz dBm + 2 7 1.0 VSWRin Input VSWR f = 2.0 GHz 2.7:1 VSWRout Output VSWR f = 2.0 GHz 2.0:1 Id Device Current mA 31 42 51 Notes: 1. Guaranteed specifications are 100% tested in the circuit in Figure 10 in the Applications Information section. 2. Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during the initial characterization of this product, and is intended to be used as an estimate for distribution of the typical specification. Absolute Symbol Parameter Units Maximum[1] Vd Device Voltage, RF Output V 6.0 to Ground Vgd Device Voltage, Gate V -6.0 to Drain Vin Range of RF Input Voltage V +0.5 to -1.0 to Ground Pin CW RF Input Power dBm + 1 3 Tch Channel Temperature °C 165 TSTG Storage Temperature °C -65 to 150

MGA-81563 Typical Scattering Parameters[1], TC = 25°C, ZO = 50 Ω , Vd = 3 V Freq. S11 S21 S12 S22 K GHz Mag Ang dB Mag Ang dB Mag Ang Mag Ang Factor MGA-81563 Typical Noise Parameters[1] TC = 25°C, ZO = 50 Ω , Vd = 3 V Frequency NF O Γopt Rn /50 Ω GHz dB Mag. Ang. — 0.5 2.90 0.16 1 1.57 1.0 2.80 0.15 17 0.96 1.5 2.70 0.14 28 0.75 2.0 2.69 0.14 37 0.41 2.5 2.68 0.13 44 0.39 3.0 2.68 0.11 50 0.38 3.5 2.68 0.09 56 0.36 4.0 2.69 0.06 65 0.34 4.5 2.69 0.03 76 0.33 5.0 2.68 0.01 137 0.32 5.5 2.67 0.02 -135 0.32 6.0 2.67 0.05 -109 0.32 6.5 2.71 0.07 -95 0.33 7.0 2.77 0.09 -78 0.36 Note: 1. Reference plane per Figure 11 in Applications Information section.

Figure 23. Surface Mount Assembly Profile. ing solvents from the solder paste. produce a reflow of the solder.

Outline 63 (SOT-363/SC-70) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) REF. 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 REF. 10° 0.425 (0.017) TYP. DIMENSIONS ARE IN MILLIMETERS (INCHES) MGA-81563 Part Number Ordering Information Part Number No. of Devices Container MGA-81563-TR1 3000 7" Reel MGA-81563-BLK 100 antistatic bag

Tape Dimensions and Product Orientation For Outline 63 Device Orientation P F W C D 1 D E A 0 8° MAX. t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 5° MAX. B 0 K 0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A B 0 K 0 P D 1 2.24 – 0.10 2.34 – 0.10 1.22 – 0.10 4.00 – 0.10 1.00 + 0.25 0.088 – 0.004 0.092 – 0.004 0.048 – 0.004 0.157 – 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D P E 1.55 – 0.05 4.00 – 0.10 1.75 – 0.10 0.061 – 0.002 0.157 – 0.004 0.069 – 0.004 PERFORATION WIDTH THICKNESS W 8.00 – 0.30 0.255 – 0.013 0.315 – 0.012 0.010 – 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 – 0.05 2.00 – 0.05 0.138 – 0.002 0.079 – 0.002 DISTANCE WIDTH TAPE THICKNESS C Tt 5.4 – 0.10 0.062 – 0.001 0.205 – 0.004 0.0025 – 0.00004 COVER TAPE USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL END VIEW 8 mm 4 mm TOP VIEW 81 81 81 81