MFFA EATON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 5

Technical content

4-terminal SMD current sensing resistor-metal strip Pb HALOGEN HFFREE T able 1. Part numbering configuration scheme MFF @ xxxx Rxxxx * ? M Family name MFF Grade option A = Automotive grade Footprint EIA option 0612 = 1206 wide terminal Resistance option Rxxxx = xxx.x mΩ ex: R0050 = 5.0 mΩ, R0008=0.75 mΩ Metal material option M = MnCuPower rating option C = 1 W Resistance tolerance option F = ±1% Product features

  • Low sensing resistance
  • Four-terminal design
  • 0612 (1630 metric) package
  • High power dissipation
  • AEC-Q200 compliant
  • Moisture sensitivity level (MSL): 1

Applications

  • Switched-mode power supply (SMPS)
  • Voltage regulator module
  • Power management
  • Stepper motor drives Environmental compliance See electrical specification table for option details

4-terminal SMD current sensing resistor-metal strip www.eaton.com/electronics Mechanical parameters- Inches [mm] Recommended pad layout Packaging information- mm Supplied in tape and reel on a 7 .0” diameter reel (EIA-481 compliant) Reel dimensions Family Size code L W H T A B MFFA0612 0612 [1630] 0.065 ± 0.008 [1.65 ± 0.20] 0.120 ± 0.010 [3.05 ± 0.25] 0.026 ± 0.008 [0.65 ± 0.20] 0.016 ± 0.010 [0.40 ± 0.25] 0.020 ± 0.005 [0.51 ± 0.13] 0.020 ± 0.005 [0.51 ± 0.13] Dimension millimeter E1 1.75 ± 0.1 F 3.5 ± 0.05 P2 2.0 ± 0.1 D0 1.50 ± 0.1 P0 4.0 ± 0.1 W 8.0 ± 0.1 P1 4.0 ± 0.1 A0 1.77 ± 0.1 B0 3.4 ± 0.1 K0 1.04 ± 0.1 T 0.22 ± 0.05 Dimension millimeter A 178 ± 2.0 B 3.5 ± 0.5 C 13 ± 1.0 D na N 60 ± 1.0 W1 9 ± 1.0 W2 11.5 ± 1.0 W3 na Size Tape Quantity 0612 7 inch embossed 4K Construction Family Resistance (mΩ) A B C L F 1. The copper foil minimum thickness of PCB is 3 oz. 2. PCB Dimension tolerance is +/-0.1 mm. 3. The resistance will change slightly after soldered; it is depending on PCB pad size deign and it’s necessary to consider the effect of the resistance increase or decrease. T ape carrier and dimensions

4-terminal SMD current sensing resistor-metal strip www.eaton.com/electronics T emperature derating curve Rated power in % T emperature (°C) @= Enter grade option from table above (A=Automotive) Rxxxx = Enter resitance code option from table above R= resistance, xxxx= resistance code (xxx.x mΩ ex: R0050 = 5.0 mΩ, 0008=0.75 mΩ) *= Enter resistance tolerance code from table above (F= ±1%) ?= Enter power rating code from table above (C= 1 W) M=MnCu (Metal material) Electrical specifications Part number Size Grade option Resistance value mΩ (Part number code) Resistance tolerance (Part number code) Power rating (Part number code) TCR (ppm/°C) Operating temperature MFF@0612Rxxxx*?M 0612 (1630 metric) A 0.5 (0005) ±1% (F) 1 W (C) ± 200 -55 °C to +170 °C MFF@0612Rxxxx*?M 0612 (1630 metric) A 0.75 (0008) ±1% (F) 1 W (C) ± 200 -55 °C to +170 °C MFF@0612Rxxxx*?M 0612 (1630 metric) A 1 (0010) ±1% (F) 1 W (C) ± 200 -55 °C to +170 °C MFF@0612Rxxxx*?M 0612 (1630 metric) A 1.5 (0015) ±1% (F) 1 W (C) ± 200 -55 °C to +170 °C MFF@0612Rxxxx*?M 0612 (1630 metric) A 2 (0020) ±1% (F) 1 W (C) ± 200 -55 °C to +170 °C MFF@0612Rxxxx*?M 0612 (1630 metric) A 3 (0030) ±1% (F) 1 W (C) ± 150 -55 °C to +170 °C MFF@0612Rxxxx*?M 0612 (1630 metric) A 5 (0050) ±1% (F) 1 W (C) ± 150 -55 °C to +170 °C Rated current & voltage The rated Current and Voltage are calculated by the following formula: I: Rated current (A) P: Rated power (W) V: Rated voltage (V) R: Resistance value (Ω)

4-terminal SMD current sensing resistor-metal strip www.eaton.com/electronics General specifications Insulation resistance: > 100 MΩ Temperature coefficient of resistance: IEC60115-1 4.8, +25 °C to +125 °C Short time overload: IEC60115-1 4.13, 5 X rated power for 5 s High temperature exposure (storage): AEC-Q200-REV D-test 3, MIL-STD202 Method 108, 1000 hours. @ +170 °C. Temperature cycling: AEC-Q200-REV D-Test 4, JESD22 Method JA-104, 1000 cycles (-55 °C to +125 °C), 30 minute maximum dwell time at each temperature extreme. 1 minute maximum transition time. Moisture resistance: AEC-Q200-REV D-Test 6 , MIL-STD-202 method 106, 24 hours per cycle, 10 cycles, Notes: Steps 7a& 7b not required. Unpowered Biased humidity: AEC-Q200-REV D-Test 7, MIL-STD-202 method 103, 1000 hours +85 °C/85% RH. Note: Specified conditions: 10% of operating power (not exceeding max working voltage). Operational life: AEC-Q200-REV D-Test 8, MIL-STD-202 method 108, 1000 hours, +125 °C at rated derating power. Resistance to solvents: AEC-Q200-REV D-Test 12, MIL-STD-202 method 215, a: Isopropyl alcohol : mineral spirits= 1 : 3, b: Terpene defluxer (Bioact EC-7R) c: Deionized water : Propylene glycol Monomethyl ether : monoethanolamine = 42 : 1 Mechanical shock: AEC-Q200-REV D-Test 13, MIL-STD-202 Method 213, half sine shock pulse, peak value is 100 g’s. Normal duration (D) is 6 (ms) Vibration: AEC-Q200-REV D-Test 14, MIL-STD-202 method 204, 5 g’s for 20 minutes, 12 cycles each of 3 orientations. Test from 10-2000 Hz Resistance to soldering heat: AEC-Q200-REV D-Test 15, MIL-STD-202 method 210, Condition B : Immerse in eutectic solder at +260 °C ± 5 °C for 10 ± 1 second Thermal shock: AEC-Q200-REV D-Test 16, MIL-STD-202 method 107, -55 °C/+155 °C. 300 cycles, Maximum transfer time 20 seconds, Dwell time 15 minutes. Air-Air ESD: AEC-Q200-REV D-Test 17, AEC-Q200-002 or ISO/DIS 10605, verify the voltage setting at 500 V Solderability: AEC-Q200-REV D-Test 18, J-STD-002, method B, aging 4 hours at +155 °C dry heat Lead-free solder bath at +235 °C ± 3 °C, Dipping time: 3 ± 0.5 seconds, > 95% area covered with tin Flammability: AEC-Q200-REV D-Test 20, UL-94, V-0 or V-1 are acceptable. Board flex (bending): AEC-Q200-REV D-Test 21, AEC-Q200-005, The duration of the applied forces shall be 60 (+ 5) seconds, 2 mm deflection Terminal strength (SMD): AEC-Q200-REV D-Test 22, AEC-Q200-006, Force of 1.8 kg for 60 seconds

1000 Eaton Boulevard

Cleveland, OH 44122 United States Eaton.com/electronics © 2022 Eaton All Rights Reserved Printed in USA Publication No. ELX1177 BU-ELX22037 June 2022 Technical Data ELX1 177 Effective April 2022 MFFA 4-terminal SMD current sensing resistor-metal strip Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Profile feature Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 150 °C

  • Temperature max. (Tsmax) 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-150 seconds Ramp up rate TL to Tp 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 217 °C 60-120 seconds Peak package body temperature (TP)* 260 °C Time (tp)* within 5 °C of the specified classification temperature (T c) 10 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. Time 25 °C to peak temperature 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Manual solder +350 °C ±10 °C , 3 +1/-0 seconds 1 time (by soldering iron), generally manual, hand soldering is not recommended