MFBA2V1608 EATON | Alldatasheet

Document overview

  • PDF pages: 5

Technical content

Automotive multilayer chip ferrite bead Product features

  • AEC-Q200 qualified
  • Multilayer monolithic construction yields high reliability
  • 0603 (1608 metric) surface mount package
  • Ultra-low direct current resistance (DCR)
  • Impedance range: 30 ohms to 600 ohms
  • Moisture sensitivity level (MSL): 1

Applications

  • Body electronics (keyless entry, ECU, antennas)
  • Advanced driver assistance systems (ADAS)
  • Infotainment and cluster electronics
  • Safety electronics systems
  • WLAN, WiFi, Bluetooth
  • Portable medical devices
  • Inventory management equipment
  • Displays/monitors
  • IoT , remote monitoring
  • Testing equipment
  • Automation equipment
  • Sensors Environmental compliance and general specifications
  • Operating temperature range: -55 °C to +150 °C (ambient plus self-temperature rise)
  • Storage temperature (component): -55 °C to +150 °C
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE

Automotive multilayer chip ferrite bead www.eaton.com/electronics Product specifications Part number2 Impedance (Ω)

100 MHz, ±25%,

@ +25°C DCR (Ω) maximum @ +25 °C Rated current1 (mA) maximum MFBA2V1608-300-R 30 0.04 3000 MFBA2V1608-800-R 80 0.04 3000 MFBA2V1608-121-R 120 0.10 2000 MFBA2V1608-151-R 150 0.10 2000 MFBA2V1608-221-R 220 0.10 2000 MFBA2V1608-301-R 300 0.20 1000 MFBA2V1608-471-R 470 0.20 1000 MFBA2V1608-601-R 600 0.20 1000 Part marking: No marking All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.1 millimeters unless stated otherwise Pad layout dimensions are reference only Traces or vias underneath the inductor is not recommended Mechanical parameters (mm) Part number A B C D E (ref.) F (ref.) G (ref.) 1. Rated current: Current rating for an approximate self-temperature rise of 40 °C or less. 2. Part number definition: MFBA2V1608-xxx-R MFBA2V1608 = Product code and size xxx = Impedance value in Ω, last character equals number of zeros -R suffix = RoHS compliant Recommended pad layout Schematic

Automotive multilayer chip ferrite bead www.eaton.com/electronics Packaging information (mm) Drawing not to scale Supplied in tape and reel packaging, 4000 parts per 7” diameter reel (EIA-481 compliant) Bo 1 .80 ± 0.05 Ko 0.95 ± 0.05 P 4.0 ± 0.10 t 0.95 ± 0.05

Automotive multilayer chip ferrite bead www.eaton.com/electronics Impedance vs frequency

1000 Eaton Boulevard

Cleveland, OH 44122 United States Eaton.com/electronics © 2021 Eaton All Rights Reserved Printed in USA Publication No. ELX1131 BU-ELX21139 December 2021 Technical Data ELX1 131 Effective December 2021 MFBA2V1608 Automotive multilayer chip ferrite bead Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) free solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Reference J-STD-020 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp up rate TL to Tp 3 °C/ second max. 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 °C of the specified classification temperature (T c) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.