MF388 ZARLINK | Alldatasheet
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Technical content
Optical and Electrical Characteristics - Case Temperature 25˚C Parameter Symbol Min. Typ. Max. Unit Test Condition Fiber-Coupled Power (Fig. 1,2 & 3) (Table 1) P fiber 40 50 µ W I F =50mA (Note 1) Fiber: 62.5/ 125 µ m Graded Index NA=0.275 Rise and Fall Time (10-90%) t t f 2n s I F =50mA (no bias) Bandwidth (3dB el f c 200 250 MHz I F =50mA Peak Wavelength λ p 800 820 840 nm I F =50mA Spectral Width (FWHM) λ 60 nm I F =50mA Forward Voltage (Fig. 5) V F 1.85 V I F =50mA Reverse Current I R µ A V R =1V Capacitance C 20 pF V R =0V, f=1MHz Note 1: Measured at the exit of 100 meters of fiber
Description
This device is designed for Ethernet 100 Mbps and Intra-Office Telecom applications and offers an excellent price/performance ratio for cost effective solutions. Its double-lens optical system results in optimum coupling of power into the fiber. DS5468 ISSUE 1 May 2001
Ordering Information
MF388 12940.11 TO-46 Package MF388 ST 13208.11 ST Housing Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less 0.6 Ø1 .5 Ø4.7 3.7 0.4 5.4 2.5 CASE ANODE CATHODE BOTTOM VIEW The diode chip is isolated from the case All dimensions in mm
Typical Fiber-Coupled Power Parameter Symbol Limit Storage Temperature T stg -55 to +125˚C Operating Temperature see (derating: Fig. 4) T op -40 to +85˚C Electrical Power Dissipation (derating: Fig. 4) P tot 250 mW Continuous Forward Current (f<10kHz) I F 110 mA Peak Forward Current (duty cycle<50%, f>1MHz) I FRM 180 mA Reverse Voltage V R 1.5V Soldering Temperature (2mm from the case for 10sec) T sld 260˚C Parameter Symbol Min. Typ. Max. Unit Thermal Resistance-Infinite Heat Sink R thjc 100 ˚C/W Thermal Resistance-No Heat Sink R thja 400 ˚C/W Temperature Coefficient - Optical Power dP/dT j -0.6 %/˚C Temperature Coefficient - Wavelength d λ /dT j 0.3 nm/˚C Core Diameter/Cladding Diameter Numberical Aperture µ m 0.20 62.5/125 µ m 0.275 µ m 0.29 µ m 0.37 µ W5 0 µ W 100 µ W 140 µ W
BOTTOM VIEW ( 10 : 1 ) SIDE VIEW © Zarlink Semiconductor 2002. All rights reserved. ISSUE ACN DATE APPRD. Previous package codes Title Drawing type Package code JS004076R1A 22-MAR-03 TD/BE JS004076 Package drawing, TO-46 with lens TB 2,54 0,45n - 0,04 0,05+ (3x) 1,02\0,3 3,6 45° R0,2 max (4x) R2,7 4,7 n 0,6 3,8 13,46\0,76 Lens n1.5\`0.05 R0,4 max 0,3 max glass overmould (2x) NOTES:- 1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm.
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