MF359 ZARLINK | Alldatasheet

Document overview

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Technical content

Features

  • 780nm Surface-Emitting LED
  • 55MHz Bandwidth
  • Designed for 62.5/125µm fiber
  • Low thermal droop

Applications

  • Baseband Video
  • Sensors
  • General Purpose

Description

The low thermal droop of this device allows baseband video transmission with minimum distortion. The double-lens optical system provides for optimum coupling of power into the fiber. It matches with the MF446 PIN Photodiode. August 2003 MF359 780nm - 55MHz High Performance LED Data Sheet

Ordering Information

-40°C to +85 °C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less. Figure 1 - Pin Diagram Figure 2 - Functional Schematic CATHODE CASE Bottom View ANODE ANODE CATHODE

Zarlink Semiconductor Inc. Note 1: Measured at the exit of 100 meters of fiber. Note 2: Transient decline in optical power due to self-heating. Optical and Electrical Characteristics - Case Temperature 25°C Parameter Symbol Min Typ Max Unit Test Condition Fiber-Coupled Power P fiber 80 120 µWI F=80mA (Note 1) Fiber: 62.5/ 125µm Graded Index NA=0.275 Rise and Fall Time (10-90%) t r,tf 68 n s I F=80mA (no bias) Bandwidth (3dBel)f c 55 MHz I F=80mA Thermal Droop (non linearity) (Note 2) I∆PI 2 % I F=80mA Peak Wavelength λp 760 780 800 nm I F=80mA Spectral Width (FWHM) ∆λ 50 nm I F=80mA Forward Voltage (Figure 7) V F 2.2 2.6 V I F=80mA Reverse Current I R 20 µAV R=1V Capacitance C 250 pF V R-0V, f=1MHz Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125°C Operating Temperature (derating: Figure 6) Top -40 to +85°C Electrical Power Dissipation (derating: Figure 6) Ptot 300 mW Continuous Forward Current (f<10kHz) IF 110 mA Peak Forward Current (duty cycle<50%,f>1MHz IFRM 180 mA Reverse Voltage VR 1.5 V Soldering Temperature (2mm from the case for 10 sec.) Tsld 260°C Thermal Characteristics Parameter Symbol Min Typ Max Unit Thermal Resistance - Infinite Heat Sink Rthjc 100 °C/W Thermal Resistance - No Heat Sink Rthja 400 °C/W Temperature Coefficient - Optical Power d P/dTj -0.5 %/ °C Temperature Coefficient - Wavelength d λ/dTj 0.3 nm/ °C

Zarlink Semiconductor Inc. Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/125µm 0.20 62.5/125µm 0.275 100/140µm 0.29 200/230µm 0.37 60µW1 2 0 µW2 5 0 µW 400 µW 100 z - Axial Displacement of Fiber (mm) Relative Fiber-coupled Power (%) z r r - optimal ØC = 62.5 µm

BOTTOM VIEW ( 10 : 1 ) SIDE VIEW © Zarlink Semiconductor 2002. All rights reserved. ISSUE ACN DATE APPRD. Previous package codes Title Drawing type Package code JS004076R1A 22-MAR-03 TD/BE JS004076 Package drawing, TO-46 with lens TB 2,54 0,45n - 0,04 0,05+ (3x) 1,02\0,3 3,6 45° R0,2 max (4x) R2,7 4,7 n 0,6 3,8 13,46\0,76 Lens n1.5\`0.05 R0,4 max 0,3 max glass overmould (2x) NOTES:- 1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm.

www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from t he application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, u nder patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility t o fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I 2C Patent rights to use these components in and I 2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE For more information about all Zarlink products visit our Web Site at