MF194 ZARLINK | Alldatasheet
Document overview
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Technical content
Features
860 nm Surface-Emitting LED
70 MHz Bandwidth
Designed for 50/125 µm fiber
Applications
Description
This device is designed for Ethernet and general applications and offers an excellent price/performance ratio for cost-effective solutions. Its double-lens optical system results in optimum coupling of power into the fiber. September 2004
Ordering Information
-40°C to +85°C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less. MF194 860 nm - 70 MHz High Performance LED Data Sheet Figure 1 - Pin Diagram Figure 2 - Functional Schematic ANODE CASE Bottom View CATHODE The diode chip is isolated from the case. ANODE CATHODE
Zarlink Semiconductor Inc. Note 1: Measured at the exit of 100 meters of fiber. Optical and Electrical Characteristics - Case Temperature 25°C Parameter Symbol Min Typ Max Unit Test Condition Fiber-Coupled Power (Figures 3, 4, and 5) (Table 1) Pfiber µW IF=60 mA (Note 1) Fiber: 50/125 µm Graded Index NA=0.20 Rise and Fall Time (10-90%) tr,tf ns IF=60 mA (no bias) Bandwidth (3dBel) fc MHz IF=60 mA Peak Wavelength λp 840 860 880 nm IF=60mA Spectral Width (FWHM) nm IF=60 mA Forward Voltage (Figure 7) VF 1.7 1.9 V IF=60 mA Reverse Current IR µA VR=1 V Capacitance C 250 pF VR-0 V, f=1 MHz Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125°C Operating Temperature (derating: Figure 6) Top -40 to +85°C Electrical Power Dissipation (derating: Figure 6) Ptot 160 mW Continuous Forward Current (f<10 kHz) IF 80 mA Peak Forward Current (duty cycle<50%,f>1 MHz IFRM 130 mA Reverse Voltage VR 1.5 V Soldering Temperature (2 mm from the case for 10 sec.) Tsld 260°C
Zarlink Semiconductor Inc. Thermal Characteristics Parameter Symbol Min. Typ. Max. Unit Thermal Resistance - Infinite Heat Sink Rthjc 200 °C/W Thermal Resistance - No Heat Sink Rthja 500 °C/W Temperature Coefficient - Optical Power dP/dTj -0.5 %/°C Temperature Coefficient - Wavelength dλ/dTj 0.3 nm/°C Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/12 5µm 0.20 62.5/125 µm 0.275 100/140 µm 0.29 200/230 µm 0.37 45 µW 95 µW 210 µW 440 µW
Zarlink Semiconductor Inc. Figure 7 - Forward Current vs. Forward Voltage 100 150 200 0.5 1.5 2.5 Forward Voltage (V) Forward Current (mA)
BOTTOM VIEW ( 10 : 1 ) SIDE VIEW © Zarlink Semiconductor 2002. All rights reserved. ISSUE ACN DATE APPRD. Previous package codes Title Drawing type Package code JS004076R1A 22-MAR-03 TD/BE JS004076 Package drawing, TO-46 with lens TB 2,54 0,45 n - 0,04 0,03 (3x) 1,17 n - 0 0,05 (3x) 1,02\0,3 3,6 45° R0,2 max (4x) R2,7 4,7 n 0,6 3,8 13,46\0,76 Lens n1.5\`0.05 R0,4 max 0,3 max glass overmould (2x) NOTES:- 1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm.
www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE For more information about all Zarlink products visit our Web Site at