MEM2085 GCT | Alldatasheet
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Technical content
Number MEM2085 Rev 0.2 Date 25/11/22 Product
Description
Micro SD Memory Card Connector, Push-Pull, SMT, 1.15mm Profile Page 1 Doc Number MEM2085 Prepared CC Checked VJ Approved PH www.gct.co
Number MEM2085 Rev 0.2 Date 25/11/22 Product Micro SD Memory Card Connector, Push-Pull, SMT, 1.15mm Profile Page 2 Doc Number MEM2085 Prepared CC Checked VJ Approved PH www.gct.co 1.0 SCOPE. This specification covers performance, test and quality requirements for the Micro SD Memory Card Connector Normally open MEM2085 (Push-Pull Type, SMT, 1.15mm Profile.). 2.0 PRODUCT NAME AND PART NUMBER. Memory Card Connector, Push-Pull Type: MEM2085. 3.0 PRODUCTSHAPE, DIMENSIONS AND MATERIAL. Please refer to drawings. 4.0 RATINGS. 4.3. Operating Temperature Range …… -25°C TO +85°C 5.0 TEST AND MEASUREMENT CONDITIONS. Product is designed to meet electrical, mechanical and environmental performance requirements specified in Paragraph 6.0. All tests are performed in ambient conditions unless otherwise specified. 6.0 PERFORMANCE. Item Test Condition Requirement Examination of Product Visual, dimensional and functional inspection as per quality plan. Product shall meet requirements of product drawing and specification.
Number MEM2085 Rev 0.2 Date 25/11/22 Product Micro SD Memory Card Connector, Push-Pull, SMT, 1.15mm Profile Page 3 Doc Number MEM2085 Prepared CC Checked VJ Approved PH www.gct.co 6.1 Electrical Performance. Item Test Condition Requirement Contact Resistance Measure and record contact resistance of mated connector using test current of 10mA max and 20 mV open circuit voltage in accordance with EIA-364-6B. 100mΩ max. Insulation Resistance Apply 500Volts DC between adjacent contacts of mated connectors for one minute in accordance with EIA-364-21C 1000MΩ min. Dielectric Strength Mate connectors and apply 500 V AC for 1 minute between adjacent terminal ground, in accordance with EIA-364-20B. No Breakdown 6.2 Mechanical Performance. Item Test Condition Requirement Durability The connector should be mated and unmated for 5000 cycles with 0.6mm travel at a rate of 25mm/min. In accordance with EIA-364-09. No evidence of physical damage. Contact Resistance 140mΩ max. Vibration Subject mated connectors to 10 to 55 to
10 Hz frequency span over 1 minute at a
1.5mm amplitude. Test to be conducted on 3 mutually perpendicular planes for 15minutes each with 100mA applied and in accordance with EIA-364-28D. No electrical discontinuity greater than 1 μsec. shall occur. No damage to product. Contact Resistance 140mΩ max. Mechanical Shock Subject the part to a 294m/s2 half sine wave acceleration for 11 ms. Three shocks to be applied in each of the X, Y and Z planes and in both directions. A total of 18 shocks. Apply DC 1 mA current during test in accordance with EIA-364-27B. No electrical discontinuity greater than 1 μsec. shall occur. No damage to product. Contact Resistance 140mΩ max.
Number MEM2085 Rev 0.2 Date 25/11/22 Product Micro SD Memory Card Connector, Push-Pull, SMT, 1.15mm Profile Page 4 Doc Number MEM2085 Prepared CC Checked VJ Approved PH www.gct.co 6.3 Environmental Performance and Others. Item Test Condition Requirement Thermal Shock Mate Connector and perform the following thermal cycle: -55+/-3°C for 30 minutes. +85+/-2°C for 30 minutes. Repeat for 5 cycles in accordance with EIA-364-32C. No evidence of physical damage, discharge, flashes or corrosion in contact areas. Contact Resistance 140mΩ max. Insulation Resistance 100MΩ min. Humidity Test Mate connector and expose to temperature of 40±2°C with 95% RH for 96 hours then place in ambient temperature for 1 to 2 hrs. In accordance with EIA-364-31 method III test condition A. Salt Spray Subject mated connectors to 35±2°Cand 5±1% salt condition for 48hours. Test in accordance with EIA-364-26B. Temperature Life (High) Subject product to 85±2°C for 96 hours continuously in accordance with EIA-364- 17, method A. Solderability Dip solders tails into molten solder, held at a temperature of 245±5°C for 5±0.5 seconds, in accordance with EIA-364-52. 95% of immersed area must show no voids of pin holes. Resistance to Reflow Soldering Heat. Mount connector, place in reflow oven and expose to the temperature profile shown in fig 1.0 No evidence of physical damage or abnormalities adversely affecting performance. Fig.1. Recommended Reflow Temp. Profile
Number MEM2085 Rev 0.2 Date 25/11/22 Product Micro SD Memory Card Connector, Push-Pull, SMT, 1.15mm Profile Page 5 Doc Number MEM2085 Prepared CC Checked VJ Approved PH www.gct.co
7.0 PRODUCT QUALIFICATION AND TEST SEQUENCE
Examination of Product 1,5 1,10 1,10 1,5 1,5 1,3 1,3 Contact Resistance 2,4 2,7 2,7 2,4 2,4 Insulation Resistance 3,8 3,8 Dielectric Withstanding Voltage 4,9 4,9 Mechanical shock 6 Durability 3 Vibration 5 Humidity 6 Salt Spray 3 Temperature Life 3 Thermal Shock 5 Solderability 2 Resistance to Reflow Soldering heat 2 Sample QTY. 5 5 5 5 5 5 5
Number MEM2085 Rev 0.2 Date 25/11/22 Product Micro SD Memory Card Connector, Push-Pull, SMT, 1.15mm Profile Page 6 Doc Number MEM2085 Prepared CC Checked VJ Approved PH www.gct.co Revision details: Revision Information Page Release Date
0.1 First draft 19/10/22
0.2 Updated operating temp. range 2 25/11/22