AP02001 DIODES | Alldatasheet
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 1 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC Z X C GY Dimensions DFN1006-2 / DFN1006H4-2 MiniMELF MELF SOD-123 SOD-323 SOD-523 SMA SMB SMC DFN1006-3 / DFN1006H4-3 Y C G2X Z Dimensions Value (in mm) Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7 DFN1411-3 C Y Z X Dimensions Value (in mm) Z 1.38 G1 0.15 G2 0.15 X 0.95 X1 0.75 X2 0.40 Y 0.75 C 0.76
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 2 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN1612-6 / DFN1310H4-6 b a G2 X2 Dimensions DFN1612-6 DFN1310H4-6 G1 0.15 0.16 G2 0.175 0.17 G3 0.15 0.15 X1 0.60 0.52 X2 0.25 0.20 Y1 0.65 0.52 Y2 0.45 0.375 a 0.10 0.09 b 0.15 0.06 DFN1616-6 DFN1616-8 G Z C Y Dimensions Value (in mm) Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50 CX1 a Dimensions Value (in mm) G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10 DFN2018-6 Y XC G Dimensions Value (in mm) C 0.50 G 0.20 X 0.25 X1 1.60 Y 0.35 Y1 1.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 3 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN2020-3 DFN2020B-3 C X YY2 G Dimensions Value (in mm) C 1.00 G 0.15 X 1.40 X1 0.35 X2 0.45 X3 0.322 Y 1.10 Y1 0.60 Y2 0.45 Y3 0.45 Y4 0.698 R1 0.225 R2 0.05 R3 0.20 X Y C G Dimensions Value (in mm) C 1.30 G 0.24 X 0.35 X1 1.52 Y 1.09 Y1 0.47 Y2 0.50 DFN2020-6 DFN2020B-6 G G YC Z Y Dimensions Value (in mm) Z 1.67 G 0.15 X1 0.90 X2 0.45 Y 0.37 C 0.65 G G Y C Z Dimensions Value (in mm) Z 1.67 G 0.20 G1 0.40 X1 1.0 X2 0.45 Y 0.37 Y1 0.70 C 0.65 DFN3020B-8 C X Y G Dimensions Value (in mm) C 0.650 G 0.285 G1 0.090 X 0.400 X1 1.120 Y 0.730 Y1 0.500 Y2 0.365
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 4 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN3030-4 DFN3030-8 Y X (4x) C Y3 (2x) G1 G3 R G7 G8 Dimensions Value (in mm) C 1.300 G1 0.100 G2 0.150 G3 0.830 G4 0.115 G5 0.135 G6 0.170 G7 0.500 G8 0.500 R 0.150 X 0.500 X1 1.375 X2 1.225 X3 1.175 Y 1.980 Y1 1.015 Y2 0.715 Y3 0.650 Z G YC Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65 DFN3030E-8 Y (x8) X (x8) C Y1 Y2 Dimensions Value (in mm) C 0.65 C1 2.35 X 0.30 Y 0.65 Y1 1.60 Y2 2.75 DFN3030-10 DFN3030-12 CY Z X G G Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50 CY Z X G G Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.28 C 0.45
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 5 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN5020-6 X1 Y2 XC Y G Dimensions Value (in mm) C 0.50 G 0.35 X 0.35 X1 0.90 X2 1.80 Y 0.70 Y2 1.60 Y3 3.20 DF-S / MiniDIP MSOP-8L X C Y Z Dimensions DF-S MiniDIP Z 10.26 6.91 X 1.2 0.60 Y 1.52 0.76 C 5.2 2.67 X Y Dimensions Value (in mm) X 0.45 Y 1.4 C1 4.4 C2 0.65 MSOP-8L-EP MSOP-10L X Y Dimensions Value (in mm) C1 4.2 C2 0.65 X 0.32 X1 1.95 Y 0.8 Y1 1.65 X Y Dimensions Value (in mm) X 0.30 Y 1.4 C1 4.4 C2 0.50
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 6 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated PowerDI PowerDI 123 / PowerDI 323 G X C (2x) Y (2x) X1 GX 2 Y2 Y1 Dimensions Value (in mm) C 1.840 G 0.852 X 3.360 X1 1.390 Y 4.860 Y1 1.400 Dimensions PowerDI
123 PowerDI
G 1.0 0.5 X1 2.2 2.0 X2 0.9 0.8 Y1 1.4 0.8 Y2 1.4 1.1 PowerDI3333-8 PowerDI5060-8 X Y X2 C G X Y Y3 (4x) X2 (8x) G C Dimensions Value (in mm) C 0.650 G 0.230 G1 0.420 Y 3.700 Y1 2.250 Y2 1.850 Y3 0.700 X 2.370 X2 0.420 Dimensions Value (in mm) C 1.270 G 0.660 G1 0.820 X 4.420 X1 4.100 X2 0.610 Y 6.610 Y1 3.810 Y2 1.020 Y3 1.270
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 7 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SM-8 SO-8 Y (8x) X (8x) C Dimensions Value (in mm) C 1.52 C1 4.6 X 0.95 Y 2.80 Y1 6.80 X Y Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27 SOD-323F Y (2x) X (2x) Dimensions Value (in mm) X 0.710 X1 2.700 Y 0.403 SOP-14L X Y Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27 SOP-16L X Y Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 8 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SOT-143 SOT-223 X1 X2 GZ Y C XX2 Dimensions Value (in mm) Z 2.70 G 1.30 X 2.50 X1 1.0 X2 0.60 Y 0.70 C 2.0 Dimensions Value (in mm) X1 3.3 X2 1.2 Y1 1.6 Y2 1.6 C1 6.4 C2 2.3 SOT-523 / SOT-323 / SOT23 / SC-59 X E Y CZ Dimensions SOT-523 SOT-323 SOT23 SC-59 Z 1.8 2.8 2.9 3.4 X 0.4 0.7 0.8 0.8 Y 0.51 0.9 0.9 1.0 C 1.3 1.9 2.0 2.4 E 0.7 1.0 1.35 1.35 SOT-23F C Y (3x) X (3x) Dimensions Value (in mm) C 0.95 X 0.60 Y 0.80 Y1 1.80
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 9 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SC-74R / SOT-26 / SOT-363 / SOT-563 SOT-25 / SOT-353 X Z Y C2C2 G X Z Y C2C2 G Dimensions SC-74R / SOT-26 SOT-363 SOT-563 Z 3.20 2.5 2.2 G 1.60 1.3 1.2 X 0.55 0.42 0.375 Y 0.80 0.6 0.5 C1 2.40 1.9 1.7 C2 0.95 0.65 0.5 Dimensions SOT-25 SOT-353 Z 3.20 2.5 G 1.60 1.3 X 0.55 0.42 Y 0.80 0.6 C1 2.40 1.9 C2 0.95 0.65 SOT-666 X (6x) Y (6x) C G Dimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50 SOT-953 Y (5X) CC X (5X) Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 10 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SOT-963 Y (6X) CC X (6X) Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100 SOT89-3L SOT89-5L Y2Y C X (3x) Y3 Y4 X2 (2x) Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500 Y3Y2 C Dimensions Value (in mm) X1 1.7 X2 0.55 X3 0.4 Y1 4.6 Y2 1.2 Y3 0.5 Y4 1.1 C 3.0 TO252-3L (DPAK) / TO263-3L (D PAK) C Z Dimensions TO252-3L / DPAK TO263-3L / D PAK Z 11.6 16.9 X1 1.5 1.1 X2 7.0 10.8 Y1 2.5 3.5 Y2 7.0 11.4 C 6.9 9.5 E1 2.3 2.5 TO252-4L Y X (4x) c Dimensions Value (in mm) c 1.27 c1 2.54 X 1.00 X1 5.73 Y 2.00 Y1 6.17 Y2 1.64 Y3 2.66
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 11 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated TO252-5L TO263-5L Y X Y X C Dimensions Value (in mm) X 5.6 X1 0.6 Y 11.0 Y1 5.6 Y2 2.0 C1 7.2 C2 1.27 Dimensions Value (in mm) X 10.9 X1 1.05 Y 15.7 Y1 9.1 Y2 2.5 C 1.7 TSOT23-5 C C X (5x) Y (5x) Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 TSOT23-6 C C X (6x) Y (6x) Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criter ia. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A , Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 12 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated TSSOP-14L X Y Dimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65 WL-CSD1010H6-4 C C ØD Dimensions Value (in mm) C 0.50 D 0.25