MEC1-120-02-F-D-RA1-SL SAMTEC | Alldatasheet
Document overview
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Technical content
(1,00mm) .03937" MEC1 SERIES MEC1–140–02–L–D Mates with (1,60mm) .062" card (1,00mm) .03937" pitch WWW.SAMTEC.COM (No. of Positions + 2) x (No. of Positions + 2) x (1,00) .03937 (0,36) .014 (1,00) .03937 (8,89) .350 (6,99) .275 139 140 (9,04) .356 (0,15) .006 (8,51) .335 (1,40) .055 (1,83) .072 (0,89) .035 DIA MEC1 POSITIONS PER ROW OTHER OPTION PLATING OPTION D = Gold fl ash on contact, Matte tin on tail = 10µ" (0,25µm) Gold on contact, Matte Tin on tail F-210-1 = Alignment Pin metal or plastic at Samtec discretion. = (7,87mm) .310" DIA Polyimide fi lm Pick & Place Pad –TR = Tape & Reel OPTION For complete specifi cations and recommended PCB layouts see www.samtec.com?MEC1 Insulator Material: Black LCP Contact Material: BeCu Plating: Sn or Au over 50µ" (1,27µm) Ni Operating Temp Range: -55°C to +125°C Current Rating: 2A @ 80°C ambient (See website for details) Voltage Rating:
300 VAC
Insertion Depth: (5,84mm) .230" to (8,13mm) .320" RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: 05, 08, 20, 30, 40, 50, 60, 70 Note: Some sizes, styles and options are non-standard, non-returnable. Mates with: (1,60mm) .062" card APPLICATION SPECIFIC OPTION
- Locking Clip (Manual placement required).
- Non-polarized Call Samtec. POSITIONS PER ROW POLARIZED POSITIONS (No Contact) 3, 4 5, 6 15, 16 21, 22 31, 32 41, 42 31, 32, 63 & 64 53, 54, 115 & 116 SPECIFICATIONS 1mm MEC1 Rated @ -3dB Insertion Loss 9,19mm Stack Height Single-Ended Signaling 5.5 GHz / 11 Gbps Differential Pair Signaling 6.5 GHz / 13 Gbps Performance data for other stack heights and complete test data available at www.samtec.com?MEC1 or contact sig@samtec.com APPLICATION MINI EDGE CARD SOCKET Note: Other Gold plating options available. Contact Samtec.