ME8608-N MICRONETICS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 13

Technical content

Features

 Over temperature protection  Ultra-fast LED start up  Internal 450V MOSFET  Output current can be set by RSET, range from 5mA to 100mA(ME8608K3G-N2:10mA~200mA)  Simple external circuit  Sharing PCB with LED  No magnetic elements and EMI issues  Support silicon controlled dimming Application  LED bulb lamp  LED fluorescent lamp  LED street lighting Package  3-pin TO252 -2、SOT89-3  4-pin CPC4  8-pin ESOP8

V06 www.microne.com.cn Page 2 of 13 ME8608-N Selection Guide ME 86 08 X XX G - N Environment mark Package K3:TO252-2 P:SOT89-3 V4:CPC4 SP:ESOP8 Function Product Type Product Series Microne New Version Product Series Product Description ME860 8BK3G -N OTP: 130℃; Package:TO252-2(single die) ME8608BK3G -N2 OTP: 130℃; Package:TO252-2( double dies) ME8608BPG -N OTP: 130℃; Package:SOT89-3(single die) ME8608BV4G -N OTP: 130℃; Package:CPC4(single die) ME860 8BSPG -N OTP: 130℃; Package:ESOP8 ( double dies) ME860 8BDSPG -N OTP: 130℃; Package:ESOP8 (single die) ME8608CK3G -N OTP: 150℃; Package:TO252-2(single die) ME8608CK3G -N2 OTP: 150℃; Package:TO252-2( double dies) ME8608C PG-N OTP: 150℃; Package:SOT89-3(single die) ME8608CV4G -N OTP: 150℃; Package:CPC4(single die) ME8608C DS PG-N OTP: 150℃; Package:ESOP8(single die)

V06 www.microne.com.cn Page 3 of 13 ME8608-N Pin Configuration OUT GND RSET 1 2 3 4 5 GND1 RSET1 GND2 RSET2 NC OUT1 NC OUT2 4 5 GND1 RSET1 NC NC NC OUT1 NC NC TO252-2 ESOP8(double dies) ESOP8(single die) 1 2 3 OUT GND RSET OUT RSET GND GND SOT89-3 CPC4 Pin Assignment Number (TO252-2) Number (SOT89-3) Number (CPC4) Symbol Function 1 1 1 OUT Connect to LED lamps, voltage input and constant current output 2 2 3、4 GND Ground 3 3 2 RSET Output current setting pin, connect to Ground with a resistor Number (ESOP8 double dies) Number (ESOP8 single die) Symbol Function 1 1 GND1 Ground 2 2 RSET1 Output current setting pin, connect to Ground with a resistor

3 GND2 Ground

4 RSET2 Output current setting pin, connect to

5 OUT2 Connect to LED lamps, voltage input and

7 7 OUT1 Connect to LED lamps, voltage input and constant current output

Figure 1. Functional Block Diagram of ME8608-N the device. These values must therefore not be exceeded under any conditions.

V06 www.microne.com.cn Page 5 of 13 ME8608-N Electrical Characteristics(TA=25℃, unless otherwise specified) Symbol Parameter Condition Min. Typ. Max. Unit VOUT Input voltage of OUT IOUT =6mA 7.5 - - V VOUT-BV Break Down Voltage RSET is opened - 450 - V IOUT Output Current(1) VOUT =10V 5 - 100 mA VOUT =20V(ME8608K3G-N2) 10 - 200 mA IDD Quiescent Current RSET is opened(single die) - 0.1 - mA RSET is opened(double dies) - 0.2 - mA VRSET Voltage of RSET VOUT =20V,IOUT =6mA - 0.6 - V DIOUT Deviation of IOUT among chips IOUT =6mA - ±4 - % Tsc Initial point of negative Temperature compensation IOUT =6mA(ME8608B-N) - 130 - ºC IOUT =6mA(ME8608C-N) - 150 - ºC Note:(1)Pmax is the maximum power under good heat dissipation condition. Typical Performance Characteristic

decrease automatically to lower down the internal temperature of LED lamp. Figure 2. The Principle of Application VSET is the voltage between RSET and GND. optimize the efficiency performance by adjust the voltage of OUT.

Figure 5. Double Chip Application: 16W (1)Aluminum base board is preferred to achieve better thermal performance. parasitic resistor, which will decrease the error of output current. 200mm² cooling copper foil, the thickness of the copper foil is 35μm. the ME8608K3G-N2 series can reach 120mA current.

V06 www.microne.com.cn Page 9 of 13 ME8608-N

Package Information

 Package Type: TO252-2 DIM Millimeters Inches Min Max Min Max A 2.2 2.4 0.0866 0.0945 A1 0 0.127 0 0.005 b 0.66 0.86 0.026 0.0339 c 0.46 0.58 0.0181 0.0228 c1 0.498 0.6 0.0196 0.0236 D 6.5 6.7 0.2559 0.2638 D1 5.33(TYP) 0.2098(TYP) D2 4.83(TYP) 0.1902(TYP) E 6 6.2 0.2362 0.2441 e 2.286(TYP) 0.09(TYP) L 9.8 10.4 0.3858 0.4094 L1 2.9(TYP) 0.1142(TYP) L2 1.4 1.7 0.0551 0.0669 L3 1.8(TYP) 0.0708(TYP) L4 0.6 1 0.0236 0.0394 h 0 0.3 0 0.0118 Φ 1.1 1.3 0.0433 0.0512 V 5.3(TYP) 0.2087(TYP) θ 0 8° 0 8°

V06 www.microne.com.cn Page 10 of 13 ME8608-N  Package Type: SOT89-3 DIM Millimeters Inches Min Max Min Max A 1.4 1.6 0.0551 0.0630 b 0.32 0.52 0.0126 0.0205 b1 0.4 0.58 0.0157 0.0228 c 0.35 0.45 0.0138 0.0177 D 4.4 4.6 0.1732 0.1811 D1 1.55(TYP) 0.061(TYP) D2 1.75(TYP) 0.0689(TYP) e1 3.0(TYP) 0.1181(TYP) E 2.3 2.6 0.0906 0.1023 E1 3.94 4.4 0.1551 0.1732 E2 1.9(TYP) 0.0748(TYP) e 1.5(TYP) 0.0591(TYP) L 0.8 1.2 0.0315 0.0472 θ 45° 45°

V06 www.microne.com.cn Page 11 of 13 ME8608-N  Package Type: CPC4 DIM Millimeters Inches Min Max Min Max A 2.5 2.7 0.0984 0.1063 A1 0.35 0.45 0.01378 0.0177 e 1.06 (TYP) 0.0417 (TYP) e1 1.59 (TYP) 0.0626 (TYP) B 2.5 2.7 0.0984 0.1063 B1 3.8 4.2 0.1496 0.1654 b 0.16 0.26 0.0063 0.0102 b1 0.69 0.8 0.0272 0.0315 C 0.8 1.1 0.0315 0.0433 C1 0 0.15 0 0.0059 C2 0.15 0.18 0.0059 0.0071 C3 0.25(TYP) 0.0098(TYP) L 0.4 0.6 0.0157 0.0236 θ 0° 8° 0° 8°

V06 www.microne.com.cn Page 12 of 13 ME8608-N  Package Type: ESOP8 DIM Millimeters Inches Min Max Min Max A 1.3 1.75 0.0512 0.0689 A1 0 0.2 0.0000 0.0079 A2 1.25 1.65 0.0492 0.0650 A3 0.5 0.7 0.0197 0.0276 b 0.33 0.51 0.0130 0.0201 c 0.17 0.25 0.0067 0.0098 D 4.7 5.1 0.1850 0.2008 E 5.8 6.2 0.2283 0.2441 E1 3.8 4 0.1496 0.1575 e 1.27(TYP) 0.05(TYP) h 0.25 0.5 0.0098 0.0197 L 0.4 1.27 0.0157 0.0500 L1 1.04(TYP) 0.0409(TYP) θ 0 8° 0.0000 8° c1 0.25(TYP) 0.0098(TYP) D1 3.1(TYP) 0.122(TYP) E2 2.21(TYP) 0.087(TYP)

V06 www.microne.com.cn Page 13 of 13 ME8608-N  The contents of this document will be updated with the product's improvement without prior notice. Please consult our sales staff before using this document to ensure that you are using  The application circuit examples described in this d ocument are only used to indicate the  Please use this product within the limits stated in this document. We will not be responsible for any damage caused by improper us  The products described in this document are not allowed to be used in equipment or devices that affect the human body without the written permission of our company, including but not limited to: health equipment, medical equipment, disaster prevention equipment, fuel control equipment, automobile equipment, a  Although our company has always been committed to improving product quality and reliability, semiconductor products have a certain probability of malfunct ion or wrong work. To prevent personal injury or property damage caused by such accidents, please pay full attention to safety design, for example: Alternate design, fire protection design, and prevention of wrong  When exporting this product or this document overseas, you should abide by applicable import  Copying or reprinting part or all of this document in any form without the permission of our company is strictly prohibited.