MC145010 FREESCALE | Alldatasheet
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Circuit is designed to operate in sm oke detector systems that comply with UL217 and UL268 Specifications Operating Voltage Range: 6 to 12 V Operating Temperature Range: - 10 to 60 °C Average Supply Current: 12 µA Power-On Reset Places IC in Standby Mode (Non-Alarm State) Electrostatic Discharge (ESD) and Lat ch Up Protection Circuitry on All Pins Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors Ideal for battery powered applications.
ORDERING INFORMATION
Device Temp. Range Case No. Package MC145010P -55 to +125°C 648-08 16 Lead Plastic Dip MC145010ED MC145010DW 751G-04 16 Lead SOICW MCZ145010EG/EGR2 MC145010 PHOTOELECTRIC SMOKE DETECTOR IC WITH I/O P SUFFIX ED SUFFIX (PB-FREE) PLASTIC DIP CASE 648-08 DW SUFFIX EG SUFFIX (PB-FREE) SOICW CASE 751G-04 Figure 1. Pin Connections
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Figure 2. Block Diagram Table 1. Maximum Ratings (1)
- Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits
in the Electrical Characteristics tables.
5 Seconds
- Derating: -12 mW/°C from 25° to 60°C.
- Derating -3.5 mW/°C from 25° to 60°C.
operation, it is recommended VIN and VOUT be constrained to the range VSS ≤ (VIN or VOUT) ≤ VDD.
Table 2. Electrical Characteristics
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Table 3. AC Electrical Characteristics
1 Oscillator Period(1)
- Oscillator Period T (= T r + Tf) is determined by the external components R1, R2, and C3 where Tr = (0.6931) R2 x C3 and
The other timing characteristics are some multiple of the oscillator timing shown in the table.
5 LED Pulse Width and Strobe Pulse Width tw(LED),
9 IRED Pulse Width tw(IRED) Tf
10 IRED Rise Time
11 Silver and Brass Modulation Period
13 Silver and Brass Chirp Pulse Period
14 Silver and Brass Chirp Pulse Width
15 Rising Edge on I/O to Smoke Alarm Response Time
Table 4. Pin Description reflections in the chamber during push button test. Av ª 1 + (C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000. IRED pulse, after two consecutive local smoke detections. Resistor R14 must be installed in series with C2. R14 ≈ [1/(12√C2)] - 680 where R14 is in ohms and C2 is in farads. low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero bias. must be minimized, also. See Figure 9. °C maximum from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V. Strobe is tied to external resistor string R8, R9, and R10. battery-powered applications, reverse-polarity protection must be provided externally. for Smoke Tests, Chamber Sensitivity Test, and Push button Test. from a sending unit at a higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto-dialers. remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity.
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resistor and capacitor through current-limiting resistor R4. If unused, this pin must be tied to VSS or VDD. chamber sensitivity test, push button test, or any alarm signals. form an oscillator with a nominal period of 10.5 ms. the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. 14 VSS This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground.
15 LOW-
(5R7/R6) + 5 where R6 and R7 are in the same units.
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Figure 3. AC Characteristics vs. Supply Figure 4. AC Characteristics vs. Temperature Figure 5. RC Component Variation Overtemperature second, the IC exits the alarm mode and returns to standby timing. Table 4. Pin Description (Continued)
10 MΩ Carbon composition
25 C Value)°
Figure 6. Standby Timing Diagram Notes: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale.
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Figure 7. Smoke Timing Diagram Notes: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale.
Figure 8. Typical Battery-Powered Application floated for at least one OSC cycle. Battery and supervisory tests are disabled in this mode.
4.7 TO 22
!Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used.
- C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.
† R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated. When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required. **C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used.
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Figure 9. Recommended PCB Layout Table 5. Configuration of Pins in the Calibration Mode Low-Supply Trip. The amp's output appears as pulses and is referenced to VDD. Low-Supply Trip 15 If the I/O pin is high, pin 15 cont rols which gain capacitor is used. Low: normal gain, amp output on pin 1. High: supervisory gain, amp output on pin 2. Feedback 10 Driving this input high enables hy steresis (10% gain increase) in the photo amp; pin 15 must be low. smoke has been detected. A static low level indicates no smoke. ON (static high level) and two consecutive no-detections for off (static low level). Illustration is bottom view of layout using a Dip. Top view for SOIC layout is mirror image. Optional potentionmeter R9 is not illustrated. Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick-up. Pin 3 must be decoupled from all other traces.
Freescale Semiconductor 11 MC145010 CASE 648-08 ISSUE R 16-LEAD PLASTIC DIP NOTES: DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. DATUMS A AND B TO BE DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURRS. MOLD FLASH, PROTRUSTION OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. THIS DIMENSION DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS SHALL NOT EXCEED 0.25mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. THIS DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.62mm. SEATING PLANE 0.4916X BM0.25 A T 0.35 2.65 2.35 0.25 0.10 6 T 16X 0.1 T 1.27 14X 1 16 8X 10.55 10.05 M0.25 B 4 10.45 10.15 A 7.6 7.4 B PIN 1 INDEX PIN'S NUMBER AA 0.75 X45˚0.25 7˚1.0 0.4 0˚ 0.32 0.23 SECTION A-A CASE 751G-04 ISSUE D 16-LEAD SOIC NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. DIMENSION B DOES NOT INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. -A- B F C S H G D 16 PL J L M SEATING PLANE 916 K -T- MAM0.25 (0.010) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 01 0 0 1 0 S 0.020 0.040 0.51 1.01 STYLE 1: PIN 1. CA THODE 2. CA THODE 3. CA THODE 4. CA THODE 5. CA THODE 6. CA THODE 7. CA THODE 8. CA THODE 9. ANODE 10. ANODE 11. ANODE 12. ANODE 13. ANODE 14. ANODE 15. ANODE 16. ANODE STYLE 2: PIN 1. COMMON DRAIN 2. COMMON DRAIN 3. COMMON DRAIN 4. COMMON DRAIN 5. COMMON DRAIN 6. COMMON DRAIN 7. COMMON DRAIN 8. COMMON DRAIN 9. GA TE 10. SOURCE 11. GA TE 12. SOURCE 13. GA TE 14. SOURCE 15. GA TE 16. SOURCE PACKAGE DIMENSIONS
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