MCT6 FAIRCHILD | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

© 2003 Fairchild Semiconductor Corporation DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT6 MCT61 MCT62

DESCRIPTION

The MCT6X Optocouplers have two channels for density applications. For four channel applications, two-packages fit into a standard 16-pin DIP socket. Each channel is an NPN silicon planar phototransistor optically coupled to a gallium arsenide infrared emitting diode.

FEATURES

  • T wo isolated channels per package
  • T wo packages fit into a 16 lead DIP socket
  • Choice of three current transfer ratios
  • Underwriters Laboratory (U.L.) recognized File E90700

APPLICATIONS

  • A C Line/Digital Logic - isolate high voltage transients
  • Digital Logic/Digital Logic - Eliminate spurious grounds
  • Digital Logic/AC Triac Control - isolate high voltage transients
  • T wisted pair line receiver - Eliminate ground loop feedthrough
  • T elephone/Telegraph line receiver - isolate high voltage transients
  • High Frequency Power Supply Feedback Control - Maintain floating grounds and transients
  • Relay contact monitor - isolate floating grounds and transients
  • P ower supply monitor - Isolate transients ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit EMITTER (Each channel) Forward Current - Continuous I F 60 mA Forward Current - Peak (PW = 1µs, 300pps) I F (pk) 3 A Reverse Voltage V R 3.0 V LED Power Dissipation @ T A = 25°C Derate above 25°C (Total Input) P D 100 1.3 mW mW/°C DETECTOR (Each channel) Collector Current - Continuous I C 30 mA Detector Power Dissipation @ T A = 25°C Derate above 25°C P D 150 2.0 mW mW/°C TOTAL DEVICE Storage Temperature T STG -55 to +150 °C Operating Temperature T OPR -55 to +100 °C Lead Solder Temperature (wave solder) T SOL 250 for 10 sec °C Total Device Power Dissipation @ T A = 25°C Derate above 25°C P D 400 5.33 mW mW/°C EMITTER COLLECTOR ANODE CATHODE 4 5 EMITTER COLLECTOR ANODE CATHODE Equivalent Circuit SCHEMATIC

© 2003 Fairchild Semiconductor Corporation ** All typicals at TA = 25°C

ELECTRICAL CHARACTERISTICS

A = 25°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Min Typ Max Unit EMITTER Input Forward Voltage (I F = 20 mA) V F 1.2 1.5 V Reverse Voltage (I R = 10 µA) V R 3.0 25 V Reverse Current (V R = 5 V) I R 0.001 10 µA Junction Capacitance (V F = 0 V, f = 1 MHz) C J 50 pF DETECTOR Collector-Emitter Breakdown Voltage (I C = 1.0 mA, I F = 0) BV CEO 30 85 V Emitter-Collector Breakdown Voltage (I E = 100 µA, I F = 0) BV ECO 61 3 V Collector-Emitter Dark Current (V CE = 10 V, I F = 0) I CEO 5 100 nA Capacitance (V CE = 0 V, f = 1 MHz) C CE 8p F TRANSFER CHARACTERISTICS AC Characteristic Test Conditions Symbol Min Typ Max Units SWITCHING TIMES Non-Saturated Turn-on Time (R L = 100 Ω , I C = 2 mA, V CC = 10 V) t on 2.4 µs Non-Saturated Turn-off Time (R L = 100 Ω , I C = 2 mA, V CC = 10 V) t off 2.4 µs TRANSFER CHARACTERISTICS DC Characteristic Test Conditions Symbol Min Typ Max Units Current Transfer Ratio, Collector-Emitter CTR MCT6 (I F = 10 mA, V CE = 10 V) 20 % MCT61 F = 5 mA, V CE = 5 V) MCT62 100 Saturation Voltage (I F = 16 mA, I C = 2 mA) V CE(sat) 0.15 0.40 V ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ Max Units Input-Output Isolation Voltage (I I-O 1 µA, t = 1 min.) V ISO

5300 Vac(rms)

Isolation Resistance (V I-O = 500 VDC) R ISO Ω Isolation Capacitance (f = 1 MHz) C ISO 0.5 pf

© 2003 Fairchild Semiconductor Corporation DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT6 MCT61 MCT62 Normalized CTR vs. Forward Current IF - FORWARD CURRENT (mA) 05 1 0 15 20 NORMALIZED CTR 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VCE = 5.0V TA = 25˚C Normalized to IF = 10 mA Normalized CTR vs. Ambient Temperature -75 -50 -25 0 25 50 75 100 125 NORMALIZE D CTR 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Normalized to IF = 10 mA TA = 25˚C IF = 10 mA IF = 20 mA TA - AMBIENT TEMPERATURE (˚C) TA - AMBIENT TEMPERATURE (˚C) IF = 5 mA Dark Current vs. Ambient Temperature 02 5 5 0 7 5 100 125 ICEO - COLLECT OR-EMITTER DARK CURRE NT ( µA) 10-6 10-5 10-4 10-3 10-2 10-1 100 101 VCE = 10 V

© 2003 Fairchild Semiconductor Corporation Switching Speed vs. Load Resistor R-LOAD RESISTOR (kΩ) 0.1 1 10 100 SWITCHIN G SPEED - ( µs) V F - FORWARD VOL TATGE (V) 0.1 100 1000 Toff Ton Tf IF = 10 mA VCC = 10 V TA = 25˚C Collector-Emitter Saturation Voltage vs Collector Current VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 0.01 0.1 1 10 0.001 0.01 0.1 100 IF = 20 mA IF = 2.5 mA IF = 10 mA IF = 5 mA TA = 25˚C IF - LED FORWARD CURRENT (mA) IC - COLLECTOR CURRENT (mA) LED Forward Voltage vs. Forward Current 11 0 100 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 TA = 25˚C TA = 55˚C TA = 100˚C Tr

© 2003 Fairchild Semiconductor Corporation DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT6 MCT61 MCT62 Package Dimensions (Through Hole) 0.200 (5.08) 0.140 (3.55) 0.100 (2.54) TYP 0.022 (0.56) 0.016 (0.41) 0.020 (0.51) MIN 0.390 (9.91) 0.370 (9.40) 0.270 (6.86) 0.250 (6.35) 0.070 (1.78) 0.045 (1.14) 241 56 7 8 0.300 (7.62) TYP 0.154 (3.90) 0.120 (3.05) 0.016 (0.40) 0.008 (0.20) 15° MAX PIN 1 ID. SEATING PLANE Package Dimensions (Surface Mount) Lead Coplanarity : 0.004 (0.10) MAX 0.270 (6.86) 0.250 (6.35) 0.390 (9.91) 0.370 (9.40) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.020 (0.51) MIN 0.070 (1.78) 0.045 (1.14) 0.300 (7.62) TYP 0.405 (10.30) MIN 0.315 (8.00) MIN 0.045 [1.14] 32 14 56 7 8 0.016 (0.41) 0.008 (0.20) PIN 1 ID. Package Dimensions (0.4"Lead Spacing) 0.200 (5.08) 0.140 (3.55) 0.100 (2.54) TYP 0.022 (0.56) 0.016 (0.41) 0.004 (0.10) MIN 0.390 (9.91) 0.370 (9.40) 0.270 (6.86) 0.250 (6.35) 0.070 (1.78) 0.045 (1.14) 241 56 7 8 0.400 (10.16) TYP 0.154 (3.90) 0.120 (3.05) 0.016 (0.40) 0.008 (0.20) 0° to 15° PIN 1 ID. SEATING PLANE Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.060 (1.52) 0.030 (0.76) 0.100 (2.54) 0.295 (7.49) 0.415 (10.54) NOTE All dimensions are in inches (millimeters)

© 2003 Fairchild Semiconductor Corporation

ORDERING INFORMATION

Identifier S. S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W. W 0.4” Lead Spacing 43 5 Definitions 1F airchild logo 2D evice number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table) 4T wo digit year code, e.g., ‘03’ 5T wo digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

© 2003 Fairchild Semiconductor Corporation DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT6 MCT61 MCT62 NOTE All dimensions are in inches (millimeters) Reflow Profile Carrier Tape Specifications 4.0 ± 0.1 Ø1.55 ± 0.05 User Direction of Feed 4.0 ± 0.1 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 12.0 ± 0.1 0.30 ± 0.05 13.2 ± 0.2 4.90 ± 0.20 0.1 MAX 10.30 ± 0.20 10.30 ± 0.20 Ø1.6 ± 0.1

  • Peak reflow temperature: 225 C (package surface temperature)
  • Time of temperature higher than 183 C for 60–150 seconds
  • One time soldering reflow is recommended

215 C, 10–30 s

225 C peak

Time (Minute) 300 250 200 150 100 Temperature (°C) Time above 183 C, 60–150 sec Ramp up = 3 C/sec

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ POP™ FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ i-Lo™ ImpliedDisconnect™ Rev. I13 ACEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT ™ DOME™ EcoSPARK™ E 2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ Power247™ PowerEdge™ PowerSaver™ PowerTrench QFET  QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET VCX™Across the board. Around the world.™ The Power Franchise Programmable Active Droop™