MCST18B104K500CT

MCST18B104K500CT MULTICOMP | Alldatasheet

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Page <1> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro The outline of MLCC External Dimensions: Size Inch (mm) L (mm) W (mm) T (mm)/Symbol Remark MB min (mm) 0603 (1608) 0.4 ±0.15 # Reflow soldering only is recommended. Description: This soft termination series MLCC is designed and with a polymer layer within end terminations of product, which can absorb mechanical stress caused by PCB handling in SMT line and reduce the mechanical impact for product. It will offer more robust and reliable performance in applications. Features:

• MLCC’s termination are with a soft & flexible polymer layer to withstand high bending stress in SMT line. Applications:
• Power supply and related industries.
• Lighting industry.
• The other mechanical stress concerned products. General Electrical Data: Dielectric X7R Size 0603, 1210 Capacitance range* 270pF to 10μF Capacitance tolerance** J (±5%), K (±10%), M (±20%) Rated voltage (WVDC) 50V Operating temperature -55 to +125°C Capacitance characteristic ±15% Termination Ni/Sn (lead-free termination) * Measured at the condition of 30~70% related humidity. Measured at 1.0±0.2Vrms, 30~70% related humidity, 25°C ambient temperature for X7R. ** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10°C for 1 hour, then leave in ambient condition for 24±2 hours before measurement.

Page <2> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Capacitance Range The letter in cell is expressed the symbol of product thickness. X7R Dielectric Dielectric X7R Size 0603 1210 Rated Voltage 16 25 50 50 100 Capacitance 270pF (271) 330pF (331) 390pF (391) 470pF (471) 560pF (561) 680pF (681) 820pF (821) 1,000pF (102) D D D 1,200pF (122) D D D 1,500pF (152) D D D 1,800pF (182) D D D 2,200pF (222) D D D 2,700pF (272) D D D 3,300pF (332) D D D 3,900pF (392) D D D 4,700pF (472) D D D 5,600pF (562) D D D 6,800pF (682) D D D 8,200pF (822) D D D 0.010μF (103) D D D 0.012μF (123) D D D 0.015μF (153) D D D 0.018μF (183) D D D 0.022μF (223) D D D 0.027μF (273) D D D 0.033μF (333) D D D 0.039μF (393) D D D 0.047μF (473) D D D Dielectric X7R Size 0603 1210 Rated Voltage 16 25 50 50 100 Capacitance 0.056μF (563) D D D 0.068μF (683) D D D 0.082μF (823) D D D 0.10μF (104) D D D 0.12μF (124) D D D 0.15μF (154) D D D 0.18μF (184) D D D 0.22μF (224) D D D 0.27μF (274) I I I 0.33μF (334) I I I 0.39μF (394) I I I 0.47μF (474) I I I 0.56μF (564) I I 0.68μF (684) I I I 0.82μF (824) I I 1.0μF (105) I I I 1.2μF (125) 1.5μF (155) 1.8μF (185) 2.2μF (225) M 2.7μF (275) 3.3μF (335) 3.9μF (395) 4.7μF (475) M M 5.6μF (565) 6.8μF (685) 8.2μF (825) 10μF (106) M

Page <3> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Reliability Test Conditions And Requirements No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements Pre-and Post-Stress Electrical Test - * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. High Temperature Exposure (Storage) MIL-STD-202 Method 108 * Test temp.: 150±3°C * Unpowered. * Test time: 1000+24/-0 hrs. * Measurement to be made after keeping at room temp. for 24±2 hrs. * Shall not exceed the limits given in the detailed spec. * No remarkable damage. * Cap change: X7R: within ±10%. * Q/D.F. value:. X7R: Rated 50V ≤3% 1206≥2.2µF;1210≥10µF Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 1GΩ or R × C ≥10Ω-F whichever is smaller. 3. Temperature Cycling JESD22 Method JA-104 * Conduct 1000 cycles according to the temperatures and time. Step Temp. (°C) Time (min.) 1 -55°C +0/-3 5±1 2 +125°C +3/-0 5±1 * Before initial measurement (X7R only): Perform 150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp. *Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±10%. * Q/D.F. value:. X7R: Rated 50V ≤3% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 1GΩ or R × C ≥10Ω-F whichever is smaller. * "Room condition" Temperature: 15 to 35°C, Relativ e humidity: 25 to 75%, Atmospheric pressure: 86 to 106kPa.

Page <4> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements

4 Destructive

Per EIA-469 No defects or abnormalities

5 Moisture

• Test temp.: 25~65°C * Humidity: 80~100% RH * Test time: 10 cycles, t=24hrs/cycle. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±12.5%. * Q/D.F. value:. X7R: Rated 50V ≤3% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 1GΩ or R × C ≥10Ω-F whichever is smaller. 6. Biased Humidity MIL-STD-202 Method 103 * Test temp.: 85±3°C * Humidity: 85%RH * Test time: 1000+24/-0 hrs. * To apply voltage: rated voltage(Max.500V) and 1.3~1.5Vdc. (add 100k ohm resistor) * Before initial measurement (Class II only) : To apply test voltage for 1hr at test temp. and then set for 24±2 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±12.5%. * Q/D.F. value:. X7R: Rated 50V ≤3% 1206≥2.2µF;1210≥10µF * I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 500MΩ or R × C ≥5Ω-F whichever is smaller. Class II (X7R) for 1.3~1.5Vdc Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 1GΩ or R × C ≥10Ω-F whichever is smaller.

Page <5> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements 7. Operational Life MIL-STD-202 Method 108 * Test temp.: Maximum Operating Temperature ±3°C * To apply voltage: (1) 10VUr250V:200% of rated voltage. (2) 150% of rated voltage: a) 500V b) 0603/X7R/50V/ Cap.>0.1μF c) 0805/X7R/50V/ Cap.0.68μF d) 1206/X7R/100V/ Cap.1.0μF e) 1210/X7R/50V&100V/ Cap.2.2μF (3) 630VUr1000V:120% of rated voltage. * Test time: 1000+24/-0 hrs. * Before initial measure- ment (X7R only): Apply test voltage for 1 hr at 125°C. Remove and let set for 24±2 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±12.5%. * Q/D.F. value:. X7R: Rated 50V ≤3% 1206≥2.2µF;1210≥10µF * I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 1GΩ or R × C ≥10Ω-F whichever is smaller. 8. External Visual MIL-STD-883 Method 2009 Visual inspection No remarkable defect. 9. Physical Dimension JESD22 Method JB-100 Using by calipers Within the specified dimensions

Page <6> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements 10. Resistance to Solvents MIL-STD-202 Method 215 * Temperature: 25±5°C * Time: 3+0.5/-0 min. * Solvent: Iso-propyl alcohol. * No remarkable damage. * Cap: within the specified tolerance.. * Q/D.F. value:. X7R Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 10GΩ or R × C ≥100Ω-F whichever is smaller. Rated voltage Insulation Resistance 50V: 0402>0.1μF;0603≥2.2μF;0805≥1μF;1206≥10μF R × C ≥50Ω-F

11 Mechanical

• Peak value: 1500g’s. * Wave: 1/2 sine. * Velocity: 15.4 ft/sec * Three shocks in each direction should be applied along 3 mutually perpendicular axes of the test specimen (18 shocks) * No remarkable damage. * Cap: within the specified tolerance.. * Q/D.F. value:. X7R Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 10GΩ or R × C ≥100Ω-F whichever is smaller. Rated voltage Insulation Resistance 50V: 0402≥0.1μF;0603≥2.2μF;0805≥1μF;1206≥10μF R × C ≥50Ω-F

Page <7> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements 12. Vibration MIL-STD-202 Method 204 * Vibration frequency: 10~2000 Hz/min. (5g’s for 20 min) * Total amplitude: 1.5mm * 12 cycles each of 3 orientations (36 times) * No remarkable damage. * Cap: within the specified tolerance.. * Q/D.F. value:. X7R Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 10GΩ or R × C ≥100Ω-F whichever is smaller. Rated voltage Insulation Resistance 50V: 0402≥0.1μF;0603≥2.2μF;0805≥10μF;1206≥10μF R × C ≥50 Ω-F

13 Resistance to

• Solder temperature: 260±5°C * Dipping time: 10±1 sec * Before initial measure- ment (X7R only): Perform 150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±7.5%. * Q/D.F. value:. X7R: Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 10GΩ or R × C ≥100Ω-F whichever is smaller. Rated voltage Insulation Resistance 50V: 0402>0.1μF;0603≥2.2μF;0805≥10μF;1206≥10μF RxC≥50 Ω-F.

Page <8> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements

14 Thermal Shock

• Conduct 300 cycles according to the temperatures and time. Step Temp. (°C) Time (min.) 1 -55°C +0/-3 5±3 2 +125°C +3/-0 5±3 * Max. transfer time: 20 sec. * Before initial measure- ment (X7R only): Perform 150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±10%. * Q/D.F. value:. Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 1GΩ or R × C ≥10Ω-F whichever is smaller.

15 ESD

Per AEC-Q200-002v * No remarkable damage. * Cap.: within the specified tolerance. * Q/D.F. value:. X7R Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 10GΩ or R × C ≥100Ω-F whichever is smaller. Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥2.2μF;0805≥10μF;1206≥10μF RxC≥50 Ω-F.

Page <9> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements

16 Solderability

• Condition A Un-mounted chips 4hrs / 155°C*dry then completely immersed for 5±0.5 sec in solder bath at 235±5°C. * Condition B Un-mounted chips steam 8 hrs then completely immersed for 10±1sec in solder bath at 215+5/-0°C. * Condition C Un-mounted chips steam 8 hrs then completely immersed for 10±1 sec. in solder bath at 260+0/-5°C. All terminations shall exhibit a continuous solder coating free from defects from a minimum of 75% of the critical surface area of any individual termination. Characterization * Capacitance * Q/ D.F. (Dissipation Factor) * Test temp.: Room Temperature. Class II: (X7R) Cap 10μF, 1 ±0.2Vrms, 1KHz±10% Cap, 10μF, 0.5±0.2Vrms, 120Hz±20% * Insulation Resistance * Test temp.: Room Temperature. * Test voltage: 100V:To apply rated voltage for max. 120 sec. 200V:To apply rated voltage (Max.500V) for 60 sec. * Dielectric Strength To apply voltage: ≤100 ≥2.5 times VDC 200V~300V ≥2 times VDC 400V~450V ≥1.2 times VDC 500V~999V ≥1.5 times VDC 1000V~3000V ≥1.2 times VDC duration 1~5 sec, charge and discharge current less than 50mA. * Temperature Coefficient (with no electrical load) Operation temperature: -55~125°C at 25°C * Capacitance within the specified tolerance. * Q/D.F. value: X7R Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller. Class II (X7R) Rated voltage Insulation Resistance 50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF 10GΩ or R × C ≥100Ω-F whichever is smaller. Rated voltage Insulation Resistance 50V: 0402>0.1μF;0603≥2.2μF;0805≥10μF;1206≥10μF RxC≥50 Ω-F. * Dielectric strength No evidence of damage or flash over during test. * Temperature Coefficient Capacitance Change: X7R: Within ±15%

Page <10> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro No AEC-Q200 Test Item AEC-Q200 Test Condition Requirements 18. Board Flex AEC-Q200-005 * The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 5 mm and then the pressure shall be maintained for 60±1 sec. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±12.5% (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.)

19 Terminal Strength

• Pressurizing force:2N (0201 & 0402), * Test time: 60±1 sec. * No remarkable damage or removal of the terminations. * Capacitance within the specified tolerance. * Q/D.F. value:. X7R: Rated 50V ≤2.5% 1206≥2.2µF;1210≥10µF 20. Beam Load Test AEC-Q200-003 * Break strength test * Beam speed: 2.5±0.25 mm/sec The chip endure following force * Chip length ≤2.5mm: Thickness >0.5mm (20N), ≤0.5mm (8N) * Chip length ≥3.2mm: Thickness ≥1.25mm (54.5N), <1.25mm (15N) Tape & reel dimensions APPENDIXES

Page <11> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Size 0603 1210 Thickness S,H,X T C,D,G,K M 1.05 1.8 Size 0603, 0805, 1206 Reel size 7” 10” 13” C 13 ±0.5 13 ±0.5 13 ±0.5 W1 10 ±1.5 10 ±1.5 10 ±1.5 A 178 ±2 250 ±2 330 ±2 N 60 +1.0/-0 50 min 50 min Appendixes No. Name X7R

1 Ceramic material BaTiO3 based

2 Inner electrode Ni

Inner layer Cu + Cu Polymer

4 Middle layer Ni

5 Outer layer Sn (Matt)

Page <12> V1.006/09/24 SMD Multilayer Ceramic Capacitors Automotive Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Storage and handling conditions (1) To store products at 5°C to 40°C ambient temperature and 20 to 70%. related humidity conditions; MSL Level 1. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. Important Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019. Part Number Table Description Part Number SMD Multilayer Ceramic Capacitors, Soft Termination, Automotive, 0603, X7R, 100nF, 10%, 50V MCST18B104K500CT SMD Multilayer Ceramic Capacitors, Soft Termination, Automotive, 1210, X7R, 4.7uF, 10%, 50V MCST32B475K500CT Fig. 6 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Fig. 7 Recommended wave soldering profile for SMT process with SnAgCu series solder.