MCR89-130D-1.27DSA

MCR89-130D-1.27DSA HIROSE | Alldatasheet

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Technical content

Socket for Memory Module Board MCR89 Series I Features 1. High Reliability This socket achieves high reliability in the horizontal contact spring system. 2. Low Insertion Force This socket prevents mis-insertion force in the preload structure. 3. Easy Pattern Design The dip contact through-hole diameter is only Ø0.5, and simplifies the pattern design. 4. Miniature Type and High Density Mounting The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density. 5. Wide Effective Mounting Area This socket is capable of widening the effective mounting area on the module printed board, and secures retention function by easy locking. 6. Easy Board Mounting The fixing pins are arranged in the same alignment as the contact, so as to easily install the connector in the board. 7. Accessories Dust covers and jigs to remove the board are available. Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Designed in Miniature 2 Contacts with High Precision Spring FEM Design Simulation 500A DC 500V DC / 1 minute 100mA Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions. 96 hours at temperature of 40ç and humidity of 90% to 95% 5 cycles under following condition; Temperature : -55: 30 minutes¡ +5 to 35ç: 5 minutes max.¡ 85ç : 30 minutes¡ 15- to 30ç 5 minutes max.) 200 cycles Manual soldering: 300ç for 3 seconds Rating Operating Temperature Range: -30 to +85ç (Note 1) Operating Humidity Range: 40 to 80% Current rating: 0.5A Voltage rating: 125V AC Storage Temperature Range: -10 to +60ç (Note 2) Storage Temperature Range: 40 to 70% (Note 2) 1000M ohms min. No flashover or insulation breakdown. 20m ohms max. No electrical discontinuity of 10 µs or more Insulation Resistance:1000Mohms min. No damage, cracks, or parts looseness. Contact resistance: 20mohms max. No deformation of components affecting performance. 1. Contact Resistance 2. Withstanding voltage 3. Insulation Resistance 4. Vibration 5. Humidity (Steady state) 6. Temperature Cycle 7. Durability (Insertion/withdrawal) 8. Resistance to Soldering heat Item Specification Conditions I Product Specifications

MaterialPart Finish Remarks Beryllium copperContact PPSInsulator Copper alloyLock pin Color : Brown Solder plating Selective gold plating Solder plating Contact area Lead area UL94V-0 I Material Series Name: MCR89 Number of Contacts: 130 D: Double row Contacts Pitch: 1.27mm Board installation type DSA: Straight dip type, board thickness 1.6mm DSC: Straight dip type, board thickness 2.6mm 1 5 I Ordering Information MCR89 - 130 D - 1.27 DSA 1 2 4 53 BMounting Dimensions

Part Number CL No. Number of Contacts A B Unit: mm MCR89-130D-1.27DSA(01) MCR89-130D-1.27DSC(01) 2.8 3.8 2.3 3.4 Note: 25 pieces are packaged in one set for sale. The above table indicates a packaging of 25 pieces.

Note: 100 pieces are packaged in one set for sale. The above table indicates a packaging of 100 pieces. I Dust Cover BRecommended Module Board Dimensions ABS548-0180-5-01 Part Number CL No. Material Finish MCR89-130D-DC(01) Black Polyamid resin548-0183-3 Part Number CL No. Material Finish MCR89-130D-EJ Black I Module Board Extraction Jig (1) Insert the jig protrusion in the board hole. Grasping the handle, pull the board up. Operating Instruction (2) By loosing force, the board is removed from the jig.