MCR100_07 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 7
Technical content
Features
- Sensitive Gate Allows Triggering by Microcontrollers and Other Logic Circuits
- Blocking V oltage to 600 V
- On−State Current Rating of 0.8 A RMS at 80°C
- High Surge Current Capability − 10 A
- Minimum and Maximum Values of IGT, VGT and IH Specified for Ease of Design
- Immunity to dV/dt − 20 V//C0109sec Minimum at 110°C
- Glass-Passivated Surface for Reliability and Uniformity
- Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SCRs
0.8 A RMS
Preferred devices are recommended choices for future use and best overall value. TO−92 CASE 29 STYLE 10 PIN ASSIGNMENT Gate Anode Cathode K G A See detailed ordering and shipping information on page 5 of this data sheet.
ORDERING INFORMATION
http://onsemi.com x = Specific Device Code A = Assembly Location Y = Year WW = Work Week /C0071 = Pb−Free Package MARKING DIAGRAM MCR 100−x AYWW/C0071 /C0071 1 2 3 1 2 BENT LEAD TAPE & REEL AMMO PACK STRAIGHT LEAD BULK PACK (Note: Microdot may be in either location)
http://onsemi.com MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Peak Repetitive Off−State Voltage (Notes 1 and 2) (TJ = /C004240 to 110°C, Sine Wave, 50 to 60 Hz; Gate Open) MCR100−3 MCR100−4 MCR100−6 MCR100−8 VDRM, VRRM 100 200 400 600 V On-State RMS Current, (TC = 80°C) 180° Conduction Angles IT(RMS) 0.8 A Peak Non-Repetitive Surge Current, (1/2 Cycle, Sine Wave, 60 Hz, T J = 25°C) ITSM 10 A Circuit Fusing Consideration, (t = 8.3 ms) I2t 0.415 A2s Forward Peak Gate Power, (TA = 25°C, Pulse Width /C0118 1.0 /C0109s) PGM 0.1 W Forward Average Gate Power, (TA = 25°C, t = 8.3 ms) PG(AV) 0.10 W Forward Peak Gate Current, (T A = 25°C, Pulse Width /C0118 1.0 /C0109s) IGM 1.0 A Reverse Peak Gate Voltage, (TA = 25°C, Pulse Width /C0118 1.0 /C0109s) VGRM 5.0 V Operating Junction Temperature Range @ Rate VRRM and VDRM TJ −40 to 110 °C Storage Temperature Range Tstg −40 to 150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. V DRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. 2. See ordering information for exact device number options. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance,Junction−to−Case Junction−to−Ambient R/C0113JC R/C0113JA 200 °C/W Lead Solder Temperature (/C01161/16″ from case, 10 secs max) TL 260 °C ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (Note 2) TC = 25°C (VD = Rated VDRM and VRRM; RGK = 1 k/C0087)T C = 110°C IDRM, IRRM 100 /C0109A ON CHARACTERISTICS Peak Forward On−State Voltage * (ITM = 1.0 A Peak @ TA = 25°C) VTM − − 1.7 V Gate Trigger Current (Continuous dc) (Note 3) T C = 25°C (VAK = 7.0 Vdc, RL = 100 /C0087) IGT − 40 200 /C0109A Holding Current (2) TC = 25°C (VAK = 7.0 Vdc, Initiating Current = 20 mA) T C = −40°C IH − 0.5 5.0 mA Latch Current T C = 25°C (VAK = 7.0 V, Ig = 200 /C0109A) T C = −40°C IL − 0.6 mA Gate Trigger Voltage (Continuous dc) (Note 3) T C = 25°C (VAK = 7.0 Vdc, RL = 100 /C0087)T C = −40°C VGT − 0.62 0.8 1.2 V DYNAMIC CHARACTERISTICS Critical Rate of Rise of Off−State Voltage (VD = Rated VDRM, Exponential Waveform, RGK = 1000 /C0087,TJ = 110°C) dV/dt 20 35 − V//C0109s Critical Rate of Rise of On−State Current (IPK = 20 A; Pw = 10 /C0109sec; diG/dt = 1 A//C0109sec, Igt = 20 mA) di/dt − − 50 A//C0109s *Indicates Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 1%. 3. R GK = 1000 /C0087 included in measurement. 4. Does not include R GK in measurement.
http://onsemi.com Device Package Code Shipping† MCR100−003 TO−92 (TO−226)
5000 Units / Box
MCR100−004 MCR100−006 MCR100−008 MCR100−3RL 2000 / Tape & ReelMCR100−6RL MCR100−6RLRA MCR100−6RLRM 2000 / Tape & Ammo Pack MCR100−6ZL1 MCR100−8RL 2000 / Tape & Reel MCR100−3G TO−92 (TO−226) (Pb−Free) MCR100−4G MCR100−6G MCR100−8G MCR100−3RLG 2000 / Tape & ReelMCR100−6RLG MCR100−6RLRAG MCR100−6RLRMG 2000 / Tape & Ammo Pack MCR100−6ZL1G MCR100−8RLG 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Figure 7. Device Positioning on Tape
- Maximum alignment deviation between leads not to be greater than 0.2 mm.
- Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
- Component lead to tape adhesion must meet the pull test requirements.
- Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
- Hold down tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
- No more than 1 consecutive missing component is permitted.
- A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
- Splices will not interfere with the sprocket feed holes.
http://onsemi.com PACKAGE DIMENSIONS TO−92 (TO−226) CASE 29−11 ISSUE AM NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J L B K G H SECTION X−X CV D N N XX SEATING PLANE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 N 0.080 0.105 2.04 2.66 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J B K G SECTION X−X CV D N XX SEATING PLANE DIM MIN MAX MILLIMETERS A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80 J 0.39 0.50 K 12.70 −−− N 2.04 2.66 P 1.50 4.00 R 2.93 −−− V 3.43 −−− T STRAIGHT LEAD BULK PACK BENT LEAD TAPE & REEL AMMO PACK STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MCR100/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative