MCP9700A

MCP970X MICROCHIP | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 26

Technical content

Features

• Tiny Analog Temperature Sensor
• Available Packages: - SC70-5, SOT-23-3, TO-92-3 (not available with the MCP9700B)
• Wide Temperature Measurement Range: - -40°C to +125°C (Extended Temperature) - -40°C to +150°C (High Temperature) (MCP9700 and MCP9700B, SOT-23-3 and SC70-5 only)
• Accuracy: - ±1°C (max.), +20°C to +70°C (MCP9700B) - ±2°C (max.), 0°C to +70°C (MCP9700A/9701A) - ±4°C (max.), 0°C to +70°C (MCP9700/9701)
• Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/°C (typical) (MCP9700/9700A/ 9700B) - 19.5 mV/°C (typical) (MCP9701/9701A)
• Wide Operating Voltage Range: -V DD = 2.3V to 5.5V (MCP9700/9700A/ 9700B) -V DD = 3.1V to 5.5V (MCP9701/9701A)
• Low Operating Current: 6 µA (typical)
• Optimized to Drive Large Capacitive Loads Typical Applications
• Automotive
• Hard Disk Drives and Other PC Peripherals
• Entertainment Systems
• Home Appliance
• Office Equipment
• Battery Packs and Portable Equipment
• General Purpose Temperature Monitoring General Description MCP9700/9700A/9700B and MCP9701/9701A sen- sors with Linear Active Thermistor Integrated Circuit (IC) comprise a family of analog temperature sensors that convert temperature to analog voltage. The low-cost, low-power sensors feature an accuracy of ±1°C from +20°C to +70°C (MCP9700B), ±2°C from 0°C to +70°C (MCP9700A/9701A) and ±4°C from 0°C to +70°C (MCP9700/9701) while consuming 6 µA (typ- ical) of operating current. Unlike resistive sensors, e. g., thermistors, the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing a sensor from these low-cost devices. The Voltage Output pin (V OUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A/9700B and MCP9701/9701A temperature coefficients are scaled to provide a 1°C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/9700A/ 9700B output 0.1°C/bit fo r a 12-bit ADC with 4.096V reference. The MCP9700/9700A/9700B and MCP9701/9701A provide a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typical) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. The MCP9700B can measure temperature with ±1°C from +20°C to +70°C without any system calibration. In addition, this family of devices is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides printed circuit board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for the stability of sensor output. Low-Power Linear Active Thermistor ICs

DS20001942J-page 2  2005-2022 Microchip Technology Inc. and its subsidiaries Package Types 3-Pin SOT-23 MCP9700/9700A/9700B MCP9701/9701A 3-Pin TO-92 12 3 GNDVOUTVDD Bottom View MCP9700/9700A MCP9701/9701A GND VDDVOUT NC 5-Pin SC70 NC MCP9700/9700A/9700B MCP9701/9701A GND VDD VOUT

 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 3 MCP970X

1.0 ELECTRICAL

Absolute Maximum Ratings † Ambient Temp. with Power Applied... -40°C to +150°C † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A/9700B: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load Parameter Sym. Min. Typ. Max. Unit Conditions Power Supply Operating Voltage Range V DD VDD 2.3 3.1 5.5 5.5 V V MCP9700/9700A/9700B MCP9701/9701A Operating Current I DD —6 1 2 µ A IDD —— 1 5 µ A T A = +150°C (Note 1) Line Regulation °C/VDD —0 . 1— ° C / V Sensor Accuracy (Notes 2, 3) TA = +25°C T ACY —± 1—° C TA = +20°C to +70°C T ACY -1.0 ±0.5 +1.0 °C MCP9700B TA = -40°C to +125°C T ACY -2.0 ±0.5 +4.0 °C MCP9700B TA = 0°C to +70°C T ACY -2.0 ±1 +2.0 °C MCP9700A/9701A TA = -40°C to +125°C T ACY -2.0 ±1 +4.0 °C MCP9700A TA = -10°C to +125°C T ACY -2.0 ±1 +4.0 °C MCP9701A TA = 0°C to +70°C T ACY -4.0 ±2 +4.0 °C MCP9700/9701 TA = -40°C to +125°C T ACY -4.0 ±2 +6.0 °C MCP9700 TA = -10°C to +125°C T ACY -4.0 ±2 +6.0 °C MCP9701 TA = -40°C to +150°C T ACY -4.0 ±2 +6.0 °C MCP9700 HighTemperature (Note 1) TA = -40°C to +150°C T ACY -4.0 ±2 +4.0 °C MCP9700B HighTemperature (Note 1) Sensor Output Output Voltage, TA = 0°C V 0°C —5 0 0—m V MCP9700/9700A/9700B Note 1: MCP9700 and MCP9700B with SC70-5 and SOT-23-3 packages only. The MCP9700 High Temperature is not available with TO-92 package. 2: The MCP9700/9700A/9700B family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accu- racy is tested with VDD = 5.0V. 3: The MCP9700/9700A/9700B and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-17. 4: The MCP9700/9700A/9700B and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. 5: SC70-5 package thermal response with 1x1 inch, du al-sided copper clad, TO-92-3 package thermal response without PCB (leaded).

DS20001942J-page 4  2005-2022 Microchip Technology Inc. and its subsidiaries Output Voltage, TA = 0°C V 0°C —4 0 0—m V MCP9701/9701A Temperature Coefficient T C —1 0 . 0— m V / ° C MCP9700/9700A/9700B TC —1 9 . 5— m V / ° C MCP9701/9701A Output Nonlinearity V ONL —± 0 . 5— ° C T A = 0°C to +70°C (Note 3) Output Current I OUT — — 100 µA Output Impedance Z OUT —2 0—  IOUT = 100 µA, f = 500 Hz Output Load Regulation VOUT/ IOUT —2—  TA = 0°C to +70°C IOUT = 100 µA Turn-On Time t ON —8 0 0— µ s Typical Load Capacitance C LOAD — — 1000 pF Note 4 SC-70 Thermal Response to 63% t RES — 1.3 — s 30°C (Air) to +125°C (Fluid Bath) (Note 5)TO-92 Thermal Response to 63% t RES —1 . 6 5— s DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A/9700B: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load Parameter Sym. Min. Typ. Max. Unit Conditions Note 1: MCP9700 and MCP9700B with SC70-5 and SOT-23-3 packages only. The MCP9700 High Temperature is not available with TO-92 package. 2: The MCP9700/9700A/9700B family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accu- racy is tested with VDD = 5.0V. 3: The MCP9700/9700A/9700B and MCP970 1/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-17. 4: The MCP9700/9700A/9700B and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. 5: SC70-5 package thermal response with 1x1 inch, du al-sided copper clad, TO-92-3 package thermal response without PCB (leaded). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A/9700B: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range (Note 1) TA -40 — +125 °C MCP9700/9700A/9700B TA -10 — +125 °C MCP9701/9701A TA -40 — +150 °C High Temperature (MCP9700 and MCP9700B SOT23-3 and SC70-5 only) Operating Temperature Range T A -40 — +125 °C Extended Temperature TA -40 — +150 °C High Temperature Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances Thermal Resistance, 5LD SC70 JA —3 3 1—° C / W Thermal Resistance, 3LD SOT-23 JA —3 0 8—° C / W Thermal Resistance, 3LD TO-92 JA —1 4 6—° C / W Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).

 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 5 MCP970X

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, MCP9700/9700A/9700B: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700B). FIGURE 2-2: Accuracy vs. Ambient Temperature (MCP9700A/9701A). FIGURE 2-3: Accuracy vs. Ambient Temperature (MCP9700/9701). FIGURE 2-4: Supply Current vs. Temperature. FIGURE 2-5: Accuracy vs. Ambient Temperature, with VDD. FIGURE 2-6: Changes in Accuracy vs. Ambient Temperature (Due to Load). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tabl es, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. $FFXUDF\\ 0&3 9'' 9 6SHF/LPLWV -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 - 5 0 - 2 50 2 55 07 5 1 0 0 1 2 5 1 5 0 Accuracy (°C) TA (°C) MCP9700A VDD = 3.3V MCP9701A VDD = 5.0V Spec. Limits -4.0 -2.0 0.0 2.0 4.0 6.0 - 5 0 - 2 50 2 55 07 5 1 0 0 1 2 5 1 5 0 Accuracy (°C) TA (°C) MCP9700 VDD = 3.3V MCP9701 V DD = 5.0V Spec. Limits ,'' 0&3 0&3 $0&3 0&3 0&3 $FFXUDF\\ 0&3 0&3 0&3 9'' 9 9'' 9 0&3 0&3 '' 9 9'' 9 ǻ$FFXUDF\\'XHWR/RDG 0&3 0&3 9'' 9 ,/2$' —$ 0&3 0&3 $0&3 9'' 9

DS20001942J-page 6  2005-2022 Microchip Technology Inc. and its subsidiaries FIGURE 2-7: Load Regulation vs. Ambient Temperature. /RDG5HJXODWLRQ ǻ9ǻ, ȍ 0&3 0&3 $0&3 0&3 0&3 9'' 9 ,287 ȝ$ ,287 ȝ$ ,287 ȝ$

 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 9 MCP970X

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE

3.1 Power Ground Pin (GND)

GND is the system ground pin.

3.2 Output Voltage Pin (V OUT)

The sensor output c an be measured at V OUT. The voltage range over the operating temperature range for the MCP9700/9700A/9700B is 100 mV to 1.75V. The voltage range over the operating temperature range for the MCP9701/9701A is 200 mV to 3V.

3.3 Power Supply Input (V DD)

The operating voltage as specified in the DC Electrical Characteristics table is applied to VDD.

3.4 No Connect Pin (NC)

This pin is not connected to the die. It can be used to improve thermal conduction to the package by connecting it to a printed circuit board (PCB) trace from the thermal source. Pin No. SC70 Pin No. SOT-23 Pin No. TO-92 Symbol Function 1 — — NC No Connect (this pin is not connected to the die.) 2 3 3 GND Power Ground Pin 322 V OUT Output Voltage Pin

411 V DD Power Supply Input

5 — — NC No Connect (this pin is not connected to the die.)

DS20001942J-page 10  2005-2022 Microchip Technology Inc. and its subsidiaries

4.0 APPLICATIONS INFORMATION

The Linear Active Thermistor™ IC uses an internal diode to measure temperature. The diode electrical characteristics have a te mperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 150°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typical) for the MCP9700/9700A/9700B and 19.5 mV/°C (typical) for the MCP9701/9701A. The output voltage at 0°C is also scaled to 500 mV (typical) and 400 mV (typical) for the MCP9700/9700A/9700B and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1 and Figure 2-17. EQUATION 4-1: SENSOR TRANSFER FUNCTION FIGURE 4-1: Typical Application Circuit.

4.1 Improving Accuracy

The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. Fo r example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typical) from 0°C to +70°C, as shown in Figure 4-2. Therefore, when measuring relative temperature change, this family of devices measures temperature with higher accuracy. FIGURE 4-2: Relative Accuracy to +25°C vs. Temperature. The change in accuracy from the calibration tempera- ture is due to the output nonlinearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output nonlinearity. For higher accuracy using a sensor compensation technique, refer to Application Note AN1001, “IC Temperature Sensor Accuracy Compensation with a PIC ® Microcontroller” (DS00001001). The application note shows that if the device is compensated in addition to room temperat ure calibration, the sensor accuracy can be improved to ±0.5°C (typical) accuracy over the operating temperature (Figure 4-3). FIGURE 4-3: MCP9700/9700A Calibrated Sensor Accuracy. The compensation technique provides a linear temperature reading. The application note includes compensation firmware so that a look-up table can be generated to compensate for the sensor error. Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C (see DC Electrical Characteristics table) TC = Temperature Coefficient (see DC Electrical Characteristics table) VOUT TC TA V0°C+= VDD GND GND ANI VDD GND VOUT MCP9700 PIC® MCU -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 T A (°C) Accuracy (°C) VDD= 3.3V

10 Samples

-4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 Temperature (°C) Accuracy (°C) + s Average - s Spec. Limits

100 Samples

 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 11 MCP970X

4.2 Shutdown Using Microcontroller

The 6 µA (typical) low operating current of the MCP9700/9700A/9700B and MCP9701/9701A family makes it ideal for battery-powered applications. How- ever, for applications that require a tighter current bud- get, this device can be powered using a microcontroller Input/Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the micro- controller internal digital switching noise is emitted to the MCP9700/9700A/9700B and MCP9701/9701A as power supply noise. However, this switching noise compromises measurement accuracy, therefore a decoupling capacitor and series resistor will be neces- sary to filter out the system noise.

4.3 Layout Considerations

The MCP9700/9700A/9700B and MCP9701/9701A family of sensors does not require any additional com- ponents to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applica- tions, connect the power supply voltage to the VDD pin using a 200 resistor with a 1 µF decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary that the capacitor is located as close as possible to the V DD and GND pins in order to provide effective noise protection. In addition, avoid tracing dig- ital lines in close proximity to the sensor.

4.4 Thermal Considerations

The MCP9700/9700A/9700B and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires the measurement of ambien t air, the TO-92 package should be considered. The MCP9700/9700A/9700B and MCP9701/9701A sensors are designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described by Equation 4-2. EQUATION 4-2: EFFECT OF SELF- HEATING At T A = +25°C (V OUT = 0.75V) and maximum specification of I DD =1 2µ A , V DD =5 . 5 V a n d IOUT = +100 µA, the self-heating due to power dissipation (TJ –T A) is 0.179°C. TJ TA– JA VDD IDD VDD VOUT–+ IOUT= Where: TJ = Junction Temperature TA = Ambient Temperature JA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage

DS20001942J-page 12  2005-2022 Microchip Technology Inc. and its subsidiaries

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Note: Applies to 5-Lead SC70. BC25 3-Lead TO-92 3-Lead SOT-23 Example Device Code MCP9700T-E/TT AENN MCP9700AT-E/TT AFNN MCP9700T-H/TT AGNN MCP9701T-E/TT AMNN MCP9701AT-E/TT APNN MCP9700BT-E/TT KBNN MCP9700BT-H/TT KCNN Note: Applies to 3-Lead SOT-23. XXNN AE25 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, th us limiting the number of available characters for customer-specific information. XXXXXX XXXXXX XXXXXX YWWNNN Example MCP 9700E TO 614256 Device MCP9700-E/TO MCP9700A-E/TO MCP9701-E/TO MCP9701A-E/TO Note: Applies to 3-Lead TO-92.

 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 13 MCP970X 0.15 C 0.15 C

0.10 C A B

C SEATING PLANE TOP VIEW SIDE VIEW Microchip Technology Drawing C04-061-LT Rev E Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 5-Lead Plastic Small Outline Transistor (LT) [SC70] D EE1 e e 5X b 0.30 C 5X TIPS END VIEW B A N A L c NOTE 1

DS20001942J-page 14  2005-2022 Microchip Technology Inc. and its subsidiaries Microchip Technology Drawing C04-061-LT Rev E Sheet 2 of 2 Number of Pins Overall Height Terminal Width Overall Width Terminal Length Molded Package Width Molded Package Thickness Pitch Standoff Units Dimension Limits A b e L E N

0.65 BSC

0.10 0.15 0.80 0.00 0.20

1.25 BSC

2.10 BSC

0.46 0.40 1.10 0.10 MAX c -0.08 0.26 REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Lead Thickness 5-Lead Plastic Small Outline Transistor (LT) [SC70] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Overall Length D 2.00 BSC 0.80 - 1.00 Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M

 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 15 MCP970X RECOMMENDED LAND PATTERN Microchip Technology Drawing No. C04-2061-LT Rev E 5-Lead Plastic Small Outline Transistor (LT) [SC70] BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units CContact Pad Spacing Contact Pad Width Contact Pitch X MILLIMETERS E MAX Distance Between Pads Contact Pad Length G Y0 . 9 5 GxDistance Between Pads 0.20 NOM 0.45 2.20 1.25 X Y E C Gx G SILK SCREEN

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 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 19 MCP970X /g22/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g55/g85/g68/g81/g86/g76/g86/g87/g82/g85/g3/g50/g88/g87/g79/g76/g81/g72/g3/g11/g55/g50/g12/g3/g62/g55/g50/g16/g28/g21/g64 /g49/g82/g87/g72/g86/g29 /g20/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g86/g3/g36/g3/g68/g81/g71/g3/g40/g3/g71/g82/g3/g81/g82/g87/g3/g76/g81/g70/g79/g88/g71/g72/g3/g80/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g17/g3/g48/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g3/g86/g75/g68/g79/g79/g3/g81/g82/g87/g3/g72/g91/g70/g72/g72/g71/g3/g17/g19/g19/g24/g5/g3/g83/g72/g85/g3/g86/g76/g71/g72/g17 /g21/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86 /g44/g49/g38/g43/g40/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g51/g76/g81/g86 /g49 /g22 /g51/g76/g87/g70/g75 /g72 /g17/g19/g24/g19/g3/g37/g54/g38 /g37/g82/g87/g87/g82/g80/g3/g87/g82/g3/g51/g68/g70/g78/g68/g74/g72/g3/g41/g79/g68/g87 /g39 /g17/g20/g21/g24 /g17/g20/g25/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g40 /g17/g20/g26/g24 /g17/g21/g19/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g36 /g17/g20/g26/g19 /g17/g21/g20/g19 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g53/g68/g71/g76/g88/g86 /g53 /g17/g19/g27/g19 /g17/g20/g19/g24 /g55/g76/g83/g3/g87/g82/g3/g54/g72/g68/g87/g76/g81/g74/g3/g51/g79/g68/g81/g72 /g47 /g17/g24/g19/g19 /g177 /g47/g72/g68/g71/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g70 /g17/g19/g20/g23 /g17/g19/g21/g20 /g47/g72/g68/g71/g3/g58/g76/g71/g87/g75 /g69 /g17/g19/g20/g23 /g17/g19/g21/g21 E A L b e c R D 1 2 3 /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g20/g19/g20/g37

DS20001942J-page 20  2005-2022 Microchip Technology Inc. and its subsidiaries NOTES:

 2005-2022 Microchip Technology Inc. DS20001942J-page 21 MCP970X APPENDIX A: REVISION HISTORY Revision J (November 2022) The following is the list of modifications: 1. Added MCP9700B Device. 2. Changed Typical Load Regulation from 1  to 2 and fixed the Load Regulation Plot (Figure 2-7). Revision H (August 2022) The following is the list of modifications: 1. Updated Absolute Maximum Ratings. 2. Updated the packaging diagrams for TO-92. Revision G (June 2016) The following is the list of modifications: 3. Added the MCP9700T-H/TT package version. 4. Minor typographical changes. Revision F (July 2014) The following is the list of modifications: 5. Updated the Package Type information. 6. Note 4 in the DC Electrical Characteristics table was added. 7. Updated the Temperature Range in the Product Identification System section. 8. Added maximum IDD specification for the High Temperature device. Revision E (April 2009) The following is the list of modifications: 1. Added High Temperature option throughout document. 2. Updated plots to reflect the high temperature performance. 3. Updated Package Outline drawings. 4. Updated Revision history. Revision D (October 2007) The following is the list of modifications: 1. Added the 3-lead SOT-23 devices to data sheet. 2. Replaced Figure 2-16. 3. Updated Package Outline Drawings. Revision C (June 2006) The following is the list of modifications: 1. Added the MCP9700A and MCP9701A devices to data sheet. 2. Added TO92 package for the MCP9700/MCP9701. Revision B (October 2005) The following is the list of modifications: 1. Added Section 3.0, Pin Descriptions 2. Added the Linear Active Thermistor™ IC trademark. 3. Removed the 2 nd order temperature equation and the temperature coefficient histogram. 4. Added a reference to AN1001 and correspond- ing verbiage. 5. Added Figure 4-2 and corresponding verbiage. Revision A (November 2005)

• Original release of this document.

DS20001942J-page 22  2005-2022 Microchip Technology Inc. NOTES:

 2005-2022 Microchip Technology Inc. DS20001942J-page 23 MCP970X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP9700: Linear Active Thermistor™ IC MCP9700A: Linear Active Thermistor™ IC MCP9700B: Linear Active Thermistor™ IC MCP9701: Linear Active Thermistor™ IC MCP9701A: Linear Active Thermistor™ IC Tape and Reel: T = Tape and Reel (1) Blank = Tube Temperature Range: E = -40 C to +125C (Extended Temperature) H= - 4 0 C to +150C (High Temperature) (MCP9700 and MCP9700B, SOT-23-3 and SC70-5 only) Package: LT = Plastic Small Outline Transistor, 5-lead TO = Plastic Transistor Outline, 3-lead TT = Plastic Small Outline Transistor, 3-lead PART NO. X /XX PackageTemperature Range Device Examples: a) MCP9700T-E/LT: Linear Active Thermistor IC Tape and Reel Extended temperature 5LD SC70 package b) MCP9700-E/TO: Linear Active Thermistor IC Extended temperature 3LD TO-92 package c) MCP9700T-E/TT: Linear Active Thermistor IC Tape and Reel Extended temperature 3LD SOT-23 package d) MCP9700T-H/LT: Linear Active Thermistor IC Tape and Reel High temperature 5LD SC70 package a) MCP9700AT-E/LT: Linear Active Thermistor IC Tape and Reel Extended temperature 5LD SC70 package b) MCP9700A-E/TO: Linear Active Thermistor IC Extended temperature 3LD TO-92 package c) MCP9700AT-E/TT: Linear Active Thermistor IC Tape and Reel Extended temperature 3LD SOT-23 package a) MCP9701T-E/LT: Linear Active Thermistor IC Tape and Reel Extended temperature 5LD SC70 package b) MCP9701-E/TO: Linear Active Thermistor IC Extended temperature 3LD TO-92 package c) MCP9701T-E/TT: Linear Active Thermistor IC Tape and Reel Extended temperature 3LD SOT-23 package a) MCP9701AT-E/LT: Linear Active Thermistor IC Tape and Reel Extended temperature 5LD SC70 package b) MCP9701A-E/TO: Linear Active Thermistor IC Extended temperature 3LD TO-92 package c) MCP9701AT-E/TT: Linear Active Thermistor IC Tape and Reel Extended Temperature 3LD SOT-23 package a) MCP9700T-H/TT: Linear Active Thermistor IC Tape and Reel High Temperature 3LD SOT-23 package b) MCP9700T-H/LT: Linear Active Thermistor IC Tape and Reel High Temperature 5LD SC70 package –X (1) Tape and Reel Option Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.

DS20001942J-page 24  2005-2022 Microchip Technology Inc. NOTES:

 2005-2022 Microchip Technology Inc. and its subsidiaries DS20001942J-page 25 This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this informa- tion in any other manner violates these terms. Information regarding device applications is provided only for your conve- nience and may be superseded by updates. It is your responsi- bility to ensure t hat your applicatio n meets with your specifications. Contact your lo cal Microchip sales office for additional support or, obtai n additional support at https:// www.microchip.com/en-us/support/design-help/client-support- services. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON- INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- RECT, SPECIAL, PUNITIVE , INCIDENTAL, OR CONSE- QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applica- tions is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses ar e conveyed, implicitly or otherwise, under any Microchip intellectual pr operty rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, Clockstudio, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In- Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, KoD, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, Trusted Time, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2005-2022, Microchip Technology Incorporated and its subsidiar- ies. All Rights Reserved. ISBN: 978-1-6683-1567-5 Note the following details of the code protection feature on Microchip products:

• Microchip products meet the specifications c ontained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is secure w hen used in the intended manner, within operating specifications, and under normal conditions.
• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
• Neither Microchip nor any other semic onductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable" Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

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