MCP9700-E/LT | DigiCamel IC Datasheet

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Technical content

Features

Tiny Analog Temperature Sensor
Available Packages: - SC70-5, SOT-23-5, TO-92-3
Wide Temperature Measurement Range: - -40°C to +125°C (Extended Temperature) - -40°C to +150°C (High Temperature) (MCP9700/9700A)
Accuracy: - ±2°C (max.), 0°C to +70°C ( MCP9700A/9701A) - ±4°C (max.), 0°C to +70°C ( MCP9700/9701)
Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/°C (typical) MCP9700/9700A - 19.5 mV/°C (typical) MCP9701/9701A
Wide Operating Voltage Range: -V DD = 2.3V to 5.5V MCP9700/9700A -V DD = 3.1V to 5.5V MCP9701/9701A
Low Operating Current: 6 µA (typical)
Optimized to Drive Large Capacitive Loads Typical Applications
Hard Disk Drives and Other PC Peripherals
Entertainment Systems
Home Appliance
Office Equipment
Battery Packs and Portable Equipment
General Purpose Temperature Monitoring

Description

The MCP9700/9700A and MCP9701/9701A family of Linear Active Thermistor™ Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It’s a low-cost, low-power sensor with an accuracy of ±2°C from 0°C to +70°C (MCP9700A/9701A) ±4°C from 0°C to +70°C (MCP9700/9701) while consuming 6 µA (typical) of operating current. Unlike resistive sensors (s uch as thermistors), the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. The voltage output pin (V OUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A and MCP9701/9701A temperature coefficients are scaled to provide a 1°C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/9700A and MCP9701/9701A provide a low-cost solution for applications that require measure- ment of a relative cha nge of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typical) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. Package Type 3-Pin SOT-23 MCP9700/9700A MCP9701/9701A 3-Pin TO-92 12 3 GNDVOUTVDD Bottom View MCP9700/9701 Only GND VDDVOUT NC 5-Pin SC70 NC MCP9700/9700A MCP9701/9701A GND VDD VOUT Low-Power Linear Active Thermistor™ ICs

1.0 ELECTRICAL

Absolute Maximum Ratings † Ambient Temp. with Power Applied:.. -40°C to +150°C ESD Protection On All Pins (HBM:MM): ....(4 kV:200V) †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Power Supply Operating Voltage Range V DD VDD 2.3 3.1 5.5 5.5 V V MCP9700/9700A MCP9701/9701A Operating Current I DD —6 1 2 µ A Power Supply Rejection Δ°C/ΔVDD —0 . 1— ° C / V Sensor Accuracy (Notes 1, 2) T A = +25°C T ACY —± 1—° C TA = 0°C to +70°C T ACY -2.0 ±1 +2.0 °C MCP9700A/9701A TA = -40°C to +125°C T ACY -2.0 ±1 +4.0 °C MCP9700A TA = -10°C to +125°C T ACY -2.0 ±1 +4.0 °C MCP9701A TA = 0°C to +70°C T ACY -4.0 ±2 +4.0 °C MCP9700/9701 TA = -40°C to +125°C T ACY -4.0 ±2 +6.0 °C MCP9700 TA = -10°C to +125°C T ACY -4.0 ±2 +6.0 °C MCP9701 TA = -40°C to +150°C T ACY -4.0 ±2 +6.0 °C High Temperature, MCP9700 only Sensor Output Output Voltage, TA = 0°C V 0°C —5 0 0—m V MCP9700/9700A Output Voltage, TA = 0°C V 0°C —4 0 0—m V MCP9701/9701A Temperature Coefficient T C —1 0 . 0— m V / ° C MCP9700/9700A TC —1 9 . 5— m V / ° C MCP9701/9701A Output Non-linearity V ONL —± 0 . 5— ° C T A = 0°C to +70°C (Note 2) Output Current I OUT — — 100 µA Output Impedance Z OUT —2 0— Ω IOUT = 100 µA, f = 500 Hz Output Load Regulation ΔVOUT/ ΔIOUT —1— Ω TA = 0°C to +70°C, IOUT = 100 µA Turn-on Time t ON —8 0 0— µ s Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. 2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. 3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded).

MCP9700/9700A and MCP9701/9701A DS21942E-page 4 © 2009 Microchip Technology Inc. M Typical Load Capacitance C LOAD — — 1000 pF The MCP9700/9700A and MCP9701/9701A family is characterized and produc- tion tested with a capacitive load of 1000 pF. SC-70 Thermal Response to 63% t RES — 1.3 — s 30°C (Air) to +125°C (Fluid Bath) (Note 3)TO-92 Thermal Response to 63% t RES —1 . 6 5— s DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. 2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. 3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (Note 1) T A -40 — +125 °C MCP9700/9700A TA -10 — +125 °C MCP9701/9701A TA -40 — +150 °C High Temperature, MCP9700 only Operating Temperature Range T A -40 — +125 °C Extended Temperature TA -40 — +150 °C High Temperature Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances Thermal Resistance, 5LD SC70 θJA —3 3 1—° C / W Thermal Resistance, 3LD SOT-23 θJA —3 0 8—° C / W Thermal Resistance, 3LD TO-92 θJA —1 4 6—° C / W Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700A/9701A). FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. FIGURE 2-3: Supply Current vs. Temperature. FIGURE 2-4: Accuracy vs. Ambient Temperature (MCP9700/9701). FIGURE 2-5: Changes in Accuracy vs. Ambient Temperature (Due to Load). FIGURE 2-6: Load Regulation vs. Ambient Temperature. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. The performance characteristics listed herein are not tested or guaranteed. In so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 -25 0 25 50 75 100 125 150 T A (°C) Accuracy (°C) MCP9700A VDD= 3.3V MCP9701A VDD= 5.0V Spec. Limits -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9701/ MCP9701A VDD= 5.5V VDD= 3.1V MCP9700 MCP9700A V DD = 5.5V VDD = 2.3V 0.0 2.0 4.0 6.0 8.0 10.0 12.0 -50 -25 0 25 50 75 100 125 150 TA (°C) IDD (µA) MCP9700/MCP9700A MCP9701 MCP9701A -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9700 VDD= 3.3V MCP9701 VDD= 5.0V Spec. Limits -0.2 -0.1 0.1 0.2 -50 -25 0 25 50 75 100 125 150 T A (°C) Δ Accuracy Due to Load (°C) MCP9701/MCP9701A VDD = 5.0V ILOAD = 100 µA MCP9700/MCP9700A VDD = 3.3V 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 TA (°C) Load Regulation ΔV/ΔI (Ω) MCP9700/MCP9700A MCP9701/MCP9701A VDD = 3.3V IOUT = 50 µA IOUT = 100 µA IOUT = 200 µA

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed Table 3-1. TABLE 3-1: PIN FUNCTION TABLE

3.1 Power Ground Pin (GND)

GND is the system ground pin.

3.2 Output Voltage Pin (V OUT)

The sensor output can be measured at V OUT. The voltage range over the operating temperature range for the MCP9700/9700A is 100 mV to 1.75V and for the MCP9701/9701A, 200 mV to 3V .

3.3 Power Supply Input (V DD)

The operating voltage as specified in the “DC Electrical Characteristics” table is applied to VDD.

3.4 No Connect Pin (NC)

This pin is not connected to the die. It can be used to improve thermal conduc tion to the package by connecting it to a Printed Circuit Board (PCB) trace from the thermal source. Pin No. SC70 Pin No. SOT-23 Pin No. TO-92 Symbol Function 1 — — NC No Connect (this pin is not connected to the die). 2 3 3 GND Power Ground Pin 322 V OUT Output Voltage Pin

411 V DD Power Supply Input

5 — — NC No Connect (this pin is not connected to the die).

4.0 APPLICATIONS INFORMATION

The Linear Active Thermistor™ IC uses an internal diode to measure temperat ure. The diode electrical characteristics have a te mperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 150°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typical) for the MCP9700/9700A and 19.5 mV/°C (typical) for the MCP9701/9701A. The out- put voltage at 0°C is also scaled to 500 mV (typical) and 400 mV (typical) for the MCP9700/9700A and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1 and Figure 2-16. EQUATION 4-1: SENSOR TRANSFER FUNCTION FIGURE 4-1: Typical Application Circuit.

4.1 Improving Accuracy

The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. Fo r example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typical) from 0°C to +70°C, as shown in Figure 4-2. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. FIGURE 4-2: Relative Accuracy to +25°C vs. Temperature. The change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output non-linearity. For higher accuracy using a sensor compensation technique, refer to AN1001 “IC Temperature Sensor Accuracy Compensation with a PICmicro ® Microcontroller” (DS01001). The application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to ±0.5°C (typical) accuracy over the operating temperature (Figure 4-3). FIGURE 4-3: MCP9700/9700A Calibrated Sensor Accuracy. The compensation technique provides a linear temperature reading. A firmware look-up table can be generated to compensate for the sensor error. VOUT TC TA V0°C+•= Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C (See DC Electrical Characteristics table) TC = Temperature Coefficient (See DC Electrical Characteristics table) VDD VSS GND ANI VDD VSS VOUT MCP9700 PICmicro® MCU -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 T A (°C) Accuracy (°C) VDD= 3.3V

10 Samples

-4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 Temperature (°C) Accuracy (°C) + s Average - s Spec. Limits

100 Samples

4.2 Shutdown Using Microcontroller

The MCP9700/9700A and MCP9701/9701A family of low operating current of 6 µA (typical) makes it ideal for battery-powered applications. However, for applications that require ti ghter current budget, this device can be powered using a microcontroller Input/ Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/9700A and MCP9701/9701A as power supply noise. This switching noise compro- mises measurement accuracy. Therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise.

4.3 Layout Considerations

The MCP9700/9700A and MCP9701/9701A family does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the V DD and GND pins. In high-noise applications, connect the power supply voltage to the V DD pin using a 200 Ω resistor with a 1 µF decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the V DD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor.

4.4 Thermal Considerations

The MCP9700/9700A and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, consider using the TO-92 package. The MCP9700/9700A and MCP9701/9701A is designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2. EQUATION 4-2: EFFECT OF SELF- HEATING At T A = +25°C (V OUT = 0.75V) and maximum specification of I DD =1 2µ A , V DD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ –T A) is 0.179°C. TJ TA– θJA VDD IDD VDD VOUT–()+ IOUT()= Where: TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

5-Lead SC70 Example: XXNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Device Code MCP9700T AUNN MCP9700AT AXNN MCP9701T AVNN MCP9701AT AYNN Note: Applies to 5-Lead SC70. AU25 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP 9700E TO^^ 916256 3-Lead SOT-23 Example: XXNN Device Code MCP9700T AENN MCP9700AT AFNN MCP9701T AMNN MCP9701AT APNN Note: Applies to 3-Lead SOT-23 AE25

© 2009 Microchip Technology Inc. DS21942E-page 19 MCP9700/9700A and MCP9701/9701A APPENDIX A: REVISION HISTORY Revision E (April 2009) The following is the list of modifications: 1. Added High Temperature option throughout document. 2. Updated plots to reflect the high temperature performance. 3. Updated Package Outline drawings. 4. Updated Revision history. Revision D (October 2007) The following is the list of modifications: 1. Added the 3-lead SOT-23 devices to data sheet. 2. Replaced Figure 2-15. 3. Updated Package Outline Drawings. Revision C (June 2006) The following is the list of modifications: 1. Added the MCP9700A and MCP9701A devices to data sheet. 2. Added TO92 package for the MCP9700/ MCP9701. Revision B (October 2005) The following is the list of modifications: 1. Added Section 3.0 “Pin Descriptions”. 2. Added the Linear Active Thermistor™ IC trademark. 3. Removed the 2 nd order temperature equation and the temperature coeficient histogram. 4. Added a reference to AN1001 and correspond- ing verbiage. 5. Added Figure 4-2 and corresponding verbiage. Revision A (November 2005)

Original Release of this Document.

© 2009 Microchip Technology Inc. DS21942E-page 21 MCP9700/9700A and MCP9701/9701A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP9700T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9700AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free Temperature Range: E = -40 °C to +125°C H= - 4 0 °C to +150°C (MCP9700 only) Package: LT = Plastic Small Outline Transistor, 5-lead TO = Plastic Small Outline Transistor, 3-lead TT = Plastic Small Outline Transistor, 3-lead PART NO. X /XX PackageTemperature Range Device Examples: a) MCP9700T-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9700-E/TO: Linear Active Thermistor™ IC, 3LD TO-92 package. c) MCP9700T-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. d) MCP9700T-H/LT: Linear Active Thermistor™ IC, Tape and Reel, High Temperature, 5LD SC70 package. a) MCP9700AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9700AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. a) MCP9701T-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9701-E/TO: Linear Active Thermistor™ IC, 3LD TO-92 package. c) MCP9701T-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. a) MCP9701AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9701AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package.

© 2009 Microchip Technology Inc. DS21942E-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC 32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices:

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Product Information

MCP9700-E/LT specifications and overview.

Summary

Low-Power Linear Active Thermistor??ICs 2009

Description

Low-Power Linear Active Thermistor??ICs 2009

Source title MCP9700-E/LT Datasheet(PDF) - Microchip Technology

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