MCP9600TE/MX

MCP960X MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

• Thermocouple Electromotive Force (EMF) to °C Converter: - Integrated cold-junction compensation - Integrated thermocouple open-circuit and short-circuit detection (MCP9601/L01/RL01)
• Supported Types (designated by NIST ITS-90): - Type K, J, T, N, S, E, B and R
• Sensor Accuracy for Thermocouple Hot-Junction: - MCP9600/01 ±0.5°C/±1.5°C (typ./max.) - MCP96L00/L01 ±2.0°C/±4.0°C (typ./max.) - MCP96RL00/RL01 ±4.0°C/±8.0°C (typ./max.)
• Measurement Resolution: - Hot and cold-junctions: +0.0625°C (typical)
• Four Programmable Temperature Alert Outputs: - Monitor hot or cold-junction temperatures - Detect rising or falling temperatures - Up to 255°C of programmable hysteresis
• Programmable Digital Filter for Temperature
• L o w P o w e r : - Shutdown mode - Burst mode: 1 to 128 temperature samples
• Two-Wire Interface: I 2C Compatible, 100 kHz: - Supports eight devices per I 2C Bus
• Operating Voltage Range: 2.7V to 5.5V
• Operating Current: 300 µA (typical)
• Shutdown Current: 2 µA (typical)
• Package: 20-Lead MQFN Typical Applications
• Petrochemical Thermal Management
• Hand-Held Measurement Equipment
• Industrial Equipment Thermal Management
• Commercial and Industrial Ovens
• Industrial Engine Thermal Monitor
• Temperature Detection Racks

Description

The Microchip Technology Inc. MCP960X/L0X/RL0X converts thermocouple EMF to degree Celsius with integrated cold-junction compensation. The temperature correction coefficients are derived from the National Institute of Standards and Technology (NIST) ITS-90 Thermocouple Database. The MCP9600/01 corrects the thermocouple nonlinear error characteristics of eight thermocouple types and The MCP960X/L0X/RL0X digital Thermocouple temperature converter comes with user-programmable registers which provide design flexibility for various temperature sensing applications. The registers allow user-selectable settings, such as Low-Power modes for battery powered applications, adjustable digital filter for fast transient temperatures and four individually programmable temperature alert outputs which can be used to detect multiple temperature zones. In addition, the MCP9601/L01/RL01 family provides integrated thermocouple open-circuit and short-circuit detection features. An alert signal is asserted when the thermocouple wire is broken or disconnected. Similarly, alert signal is asserted when the thermocouple is shorted to ground or power. The temperature alert limits have multiple user-programmable configurations, such as alert polarity as either an active-low or active-high push-pull output, and output function as a Comparator mode (useful for thermostat-type operation) or Interrupt mode for microprocessor-based systems. In addition, the alerts can detect either a rising or a falling temperature with up to +255°C hysteresis. This sensor uses an industry standard two-wire, I compatible serial interface and supports up to eight devices per bus by setting the device address using the ADDR pin. MCP9600/L00/RL00 VDD MCU I2C Alert GND Types K, J, T, N, E, B, S, R VIN+ VIN- TC+ TC- ADDR Thermocouple EMF to Temperature Converter, ±1.5°C Maximum Accuracy

 2015-2021 Microchip Technology Inc. DS20005426G-page 2 MCP960X/L0X/RL0X Package Types MCP960X/L0X/RL0X Block Diagram MCP9600/L00/RL00 5 mm × 5 mm MQFN* * Includes Exposed Thermal Pad (EP); see Table 3-1. GND VIN- GND Alert 4 Alert 3 GND GND GND VDD GND Alert 2 SDA SCL GND GND VIN+ EP 19 18 17 6789 GND GND Alert 1 ADDR GND VIN- GND Alert 4 Alert 3 VSENSE GND SC Alert VDD OC Alert Alert 2 SDA SCL GND GND VIN+ EP 19 18 17 6789 GND GND Alert 1 ADDR MCP9601/L01/RL01 5 mm × 5 mm MQFN* ADC Core Del Sig + VIN+ VIN- Error Correction User Registers Resolution & Power Modes Thermocouple Hot-Junction TH Alert Limits Alert 1 Output Alert 2 Output Alert 3 Output Alert 4 Output Hysteresis Device ID SCL SDA ADDR Open-Circuit Alert Short-Circuit Alert VSENSE MCP9601/L01/RL01 Only Open-Circuit & Short-Circuit Detection Thermocouple Type Selection Digital Filter Alert Configuration Sensor 6WDWXV Sensor Configuration Junctions Delta Temperature T' Thermocouple Cold-Junction TC I2C Module

 2015-2021 Microchip Technology Inc. DS20005426G-page 3 MCP960X/L0X/RL0X

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † †N o t i c e : Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA =T C, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit Conditions Thermocouple Sensor Measurement Accuracy – MCP9600/01 TH Hot-Junction Accuracy (VDD =3 . 3 V ) TH =T C +T Δ (Note 1) TH_ACY -1.5 ±0.5 +1.5 °C TA = 0°C to +85°C TC Cold-Junction Accuracy (VDD =3 . 3 V ) T C_ACY -1.0 ±0.5 +1.0 °C TA = 0°C to +85°C TΔ Junctions Temperature Delta Accuracy – MCP9600/01 Type K: TΔ = -200°C to +1372°C VEMF Range: -5.907 mV to 54.886 mV TΔ_ACY -0.5 ±0.25 +0.5 °C T A = 0°C to +85°C, VDD =3 . 3 V (Note 2) Type J: TΔ = -150°C to +1200°C VEMF Range: -3.336 mV to 47.476 mV Type T: TΔ = -200°C to +400°C VEMF Range: -5.603 mV to 20.81 mV Type N: TΔ = -150°C to +1300°C VEMF Range: -3.336 mV to 47.476 mV Type E: TΔ = -200°C to +1000°C VEMF Range: -8.825 mV to 76.298 mV Type S: TΔ = 250°C to +1664°C VEMF Range: -1.875 mV to 17.529 mV TA = 0°C to +85°C, VDD =3 . 3 V (Notes 2, 3)Type B: TΔ = 1000°C to +1800°C VEMF Range: -4.834 mV to 13.591 mV Type R: TΔ = 250°C to +1664°C VEMF Range: -1.923 mV to 19.732 mV Note 1: The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. 2: The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C. 3: The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see 4: Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested. 5: The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc. DS20005426G-page 4 MCP960X/L0X/RL0X Thermocouple Sensor Measurement Accuracy – MCP96L00/L01 TH Hot-Junction Accuracy (VDD =3 . 3 V ) TH =T C +T Δ (Note 1) TH_ACY -4.0 ±2 +4.0 °C TA = 0°C to +85°C TC Cold-Junction Accuracy (VDD =3 . 3 V ) T C_ACY -1.0 ±0.5 +1.0 °C TA = 0°C to +85°C TΔ Junctions Temperature Delta Accuracy – MCP96L00/L01 Type K: TΔ = -200°C to +1372°C VEMF Range: -5.907 mV to 54.886 mV TΔ_ACY -3.0 ±1.5 +3.0 °C T A = 0°C to +85°C, VDD =3 . 3 V (Note 2) Type J: TΔ = -150°C to +1200°C VEMF Range: -3.336 mV to 47.476 mV Type T: TΔ = -200°C to +400°C VEMF Range: -5.603 mV to 20.81 mV Type N: TΔ = -150°C to +1300°C VEMF Range: -3.336 mV to 47.476 mV Type E: TΔ = -200°C to +1000°C VEMF Range: -8.825 mV to 76.298 mV Type S: TΔ = 250°C to +1664°C VEMF Range: -1.875 mV to 17.529 mV TA = 0°C to +85°C VDD =3 . 3 V (Notes 2, 3)Type B: TΔ = 1000°C to +1800°C VEMF Range: -4.834 mV to 13.591 mV Type R: TΔ = 250°C to +1664°C VEMF Range: -1.923 mV to 19.732 mV DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA =T C, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit Conditions Note 1: The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. 2: The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C. 3: The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see 4: Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested. 5: The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc. DS20005426G-page 5 MCP960X/L0X/RL0X Thermocouple Sensor Measurement Accuracy – MCP96RL00/01 TH Hot-Junction Accuracy (VDD =3 . 3 V ) TH =T C +T Δ (Note 1) TH_ACY -8.0 ±4 +8.0 °C TA = 0°C to +85°C TC Cold-Junction Accuracy (VDD =3 . 3 V ) T C_ACY -2.0 ±1 +2.0 °C T A = -40°C to +125°C TΔ Junctions Temperature Delta Accuracy – MCP96RL00/01 Type K: TΔ = -200°C to +1372°C VEMF Range: -5.907 mV to 54.886 mV TΔ_ACY -6.0 ±3.0 +6.0 °C T A = 0°C to +85°C, VDD =3 . 3 V (Note 2) Type J: TΔ = -150°C to +1200°C VEMF Range: -3.336 mV to 47.476 mV Type T: TΔ = -200°C to +400°C VEMF Range: -5.603 mV to 20.81 mV Type N: TΔ = -150°C to +1300°C VEMF Range: -3.336 mV to 47.476 mV Type E: TΔ = -200°C to +1000°C VEMF Range: -8.825 mV to 76.298 mV Type S: TΔ = 250°C to +1664°C VEMF Range: -1.875 mV to 17.529 mV TA = 0°C to +85°C, VDD =3 . 3 V (Notes 2, 3)Type B: TΔ = 1000°C to +1800°C VEMF Range: -4.834 mV to 13.591 mV Type R: TΔ = 250°C to +1664°C VEMF Range: -1.923 mV to 19.732 mV DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA =T C, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit Conditions Note 1: The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. 2: The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C. 3: The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see 4: Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested. 5: The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc. DS20005426G-page 6 MCP960X/L0X/RL0X Sensor Characteristics TC and TH Temperature Resolution T RES — ±0.0625 — °C With max. resolution Sampling Rate (TA =+ 2 5 ° C ) t CONV — 320 — ms 18-bit resolution — 80 — 16-bit resolution — 20 — 14-bit resolution — 5 — 12-bit resolution Temperature Calculation Time t CALC —1 2— m s T A =+ 2 5 ° C Thermocouple Input Offset Error VOERR —± 2— µ V Offset Error Drift VOE_DR —5 0— n V / ° C Full-Scale Gain Error — MCP9600/01 GERR —— ± 0 . 0 4 %FS TA = 0°C to +85°C Full-Scale Gain Error — MCP96L00/L01 — ±0.12 — T A = -40°C to +125°C Full-Scale Gain Error —MCP96RL00/RL01 — ±0.24 — Full-Scale Gain Error Drift GER_DR —± 0 . 0 1— % F S Full-Scale Integral Nonlinearity INL — 10 — ppm Voltage Resolution V RES — 2 — µV 18-bit resolution Differential Mode Range V IN_DF -250 — +250 mV ADC input range Differential Mode Impedance Z IN_DF — 300 — k  Common-Mode Range V IN_CM VDD – 0.3 — V DD + 0.3 V Note 4 Common-Mode Impedance Z IN_CM —2 5— M  Common-Mode Rejection Ratio CMRR — 105 — dB Power Supply Rejection Ratio PSRR — 60 — dB Line Regulation V Line_R —0 . 2— ° C / V Voltage Sense Input (VSENSE) for Thermocouple Open and Short-Circuit Detection (MCP9601/L01/RL01) VSENSE Input Range (Note 5) VSiRNG 0— 1 0 0 %VDD (see Figure 1-1) - Short Circuit to V DD VSiSC 90 — 100 SC Alert Asserts - Short Circuit to GND 0 — 10 - Open-Circuit V SiOC 19 — 50 OC Alert Asserts - Normal Operation V SiNOR 10 — 19 OC Alert Deasserts VSENSE Input Leakage I SiLEAK —0 . 1 1 µ A DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA =T C, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit Conditions Note 1: The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. 2: The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C. 3: The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see 4: Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested. 5: The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc. DS20005426G-page 7 MCP960X/L0X/RL0X FIGURE 1-1: Open and Short-Circuit Detection Configuration. Alert 1, 2, 3, 4 Outputs, SC Alert and OC Alert Outputs (MCP9601/L01/RL01) Low-Level Voltage V OL —— 0 . 4 V I OL= 3 mA High-Level Voltage V OH VDD – 0.5 —— V I OH= 3 mA Operating Voltage and Current Operating Voltage V DD 2.7 — 5.5 V I2C Inactive Current I DD —0 . 3 0 . 5 m A V DD = 3.3V, TA = +85°CI2C Active Current or During tCALC —1 . 5 2 . 5 m A Shutdown Current I SHDN —2 5 µ A I 2C inactive, TA = +85°C Power-on Reset (POR) Thresholds V POR 1.0 2.1 2.6 V Rising/Falling V DD Power-up Time t POR —2 0— m s Thermal Response Package Thermal Response (Time to 63% of Final Temperature) t RSP — 3 — s +25°C (air) to +125°C (oil bath), 2x2” PCB DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA =T C, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit Conditions Note 1: The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. 2: The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C. 3: The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see 4: Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested. 5: The Minimum and Maximum %VDD thresholds are characterized but not production tested. Del Sig VIN+ VIN- MCP9601/L01/RL01 Thermocouple RA RB VDD VSENSE C :KHUH 1RWH 7KHH[DFW5$5%DQG5&UHVLVWRU YDOXHVPXVWEHXVHGIRUDSURSHUIXQFWLRQRI WKH2SHQ&LUFXLWGHWHFWLRQ7KH2SHQDQG 6KRUW&LUFXLW'HWHFWLRQIHDWXUHLV FKDUDFWHUL]HGEXWQRWSURGXFWLRQWHVWHG XVLQJWKH5 $5%DQG5&UHVLVWRUV 5$ 0Ÿ“7ROHUDQFH 0D[ 0Ÿ“7ROHUDQFH 5& .Ÿ“7ROHUDQFH & —) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%Detection Range, VSENSE /VDD (%) VSENSE (V) Range for Thermocouple Short-to-VDD Detection Range for Thermocouple Short-to-GND Detection Dead Zone Range for Thermocouple Open Circuit Detection Range for Normal Operation

 2015-2021 Microchip Technology Inc. DS20005426G-page 8 MCP960X/L0X/RL0X INPUT/OUTPUT PIN DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA =T C, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Units Conditions Serial Input/Output and I2C Address Input (ADDR) Input (SCL, SDA, ADDR) High-Level Voltage V IH 0.7 × VDD —— V Low-Level Voltage V IL —— 0 . 3 × V DD V Input Current I LEAK —— ± 2 µ A Hysteresis V HYST — 0.05 × V DD —V V DD > 2V Spike Suppression T SP —5 0 — n s Output (SDA) Low-Level Voltage V OL ——0 . 4 V I OL= 3 mA High-Level Current (leakage) I OH —— 1 µ A V OH = VDD Low-Level Current I OL 6—— m A V OL = 0.6V Capacitance C IN —5 — p F I2C Address Selection Levels (Note 1) Command Byte [1100 000x]V ADDR GND — — V Address = 0 Command Byte [1100 001x]V ADDR_L (Note 2) VADDR_TYP (Note 2) VADDR_H (Note 2) Address = 1 Command Byte [1100 010x]A d d r e s s = 2 Command Byte [1100 011x]A d d r e s s = 3 Command Byte [1100 100x]A d d r e s s = 4 Command Byte [1100 101x]A d d r e s s = 5 Command Byte [1100 110x]A d d r e s s = 6 Command Byte [1100 111x]— — V DD Address = 7 Note 1 The ADDR pin can be tied to VDD or VSS. For additional addresses, a resistive divider network can be used to set voltage levels that are rationed to VDD. The device supports up to eight levels (see Section 6.3.1 “I2C Addressing” for recommended resistor values).

2 VADDR_TYP =A d d r e s s * VDD/8 + VDD/16,

VADDR_L =V ADDR_TYP –V DD/32 and VADDR_H =V ADDR_TYP +V DD/32 (where: Address = 1, 2, 3, 4, 5, 6). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground. Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range T A -40 — +125 °C Note 1 Operating Temperature Range T A -40 — +125 °C Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances Thermal Resistance, MQFN JA — 38.8 — °C/W Note 1 Operation in this range must not cause TJ to exceed the Maximum Junction Temperature (+150°C).

 2015-2021 Microchip Technology Inc. DS20005426G-page 9 MCP960X/L0X/RL0X FIGURE 1-2: Timing Diagram. SENSOR SERIAL INTERFACE TIMING SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, GND = Ground, TA = -40°C to +125°C, VDD = 2.7V to 5.5V and CL =8 0p F (Note 1). Parameters Sym. Min. Max. Units Two-Wire I2C Interface Serial Port Frequency f SCL 10 100 kHz Low Clock (Note 2) tLOW 4700 — ns High Clock t HIGH 4000 — ns Rise Time (Note 3) tR — 1000 ns Fall Time (Note 3) tF 20 300 ns Data in Setup Time (Note 2) t SU:DAT 250 — ns Data in Hold Time t HD:DAT 0— n s Start Condition Setup Time t SU:STA 4700 — ns Start Condition Hold Time t HD:STA 4000 — ns Stop Condition Setup Time t SU:STO 4000 — ns Bus Idle/Free t B-FREE 10 — µs Bus Capacitive Load C b —4 0 0 p f Clock Stretching (Note 4) tSTRETCH 60 — µs Note 1 All values referred to VIL MAX and VIH MIN levels. 2 This device can be used in a Standard mode I2C bus system, but the requirement, tSU:DAT  250 ns, must be met. 3 Characterized, but not production tested. 4 Host controllers without features to detect clock stretching by device should increase the tLOW period for Read Commands to a minimum of tSTRETCH (60 us) for a proper I2C communication. See Figure 2-29 for a typical tSTRETCH performance. tSU-STA RT tHD -STA RT tSU-DATA tSU-S TOP tB-FREE SCL SD A tHIGH tLO W tR, tF Start Condition Data Transmission Stop Condition tHD-DI tSTRE TCH AC K

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2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and TA = -40°C to +125°C. FIGURE 2-1: Typical Temperature Accuracy from NIST ITS-90 Database, Type K. FIGURE 2-2: Typical Temperature Accuracy from NIST ITS-90 Database, Type J. FIGURE 2-3: Typical Temperature Accuracy from NIST ITS-90 Database, Type N. FIGURE 2-4: Temperature Sensitivity with 18-Bit Resolution, Type K. FIGURE 2-5: Temperature Sensitivity with 18-Bit Resolution, Type J. FIGURE 2-6: Temperature Sensitivity with 18-Bit Resolution, Type N. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. -0.50 -0.25 0.00 0.25 0.50 -200 300 800 1300 1800 Temperature Accuracy (°C) TA (°C) Type K MCP9600 7HPSHUDWXUH$FFXUDF\\ 7\\SH- 0&3 7HPSHUDWXUH$FFXUDF\\ 7\\SH1 0&3 0.000 0.250 0.500 -200 300 800 1300 1800 Sensitivity (/g39/g39°C/LSb) TA (°C) Type K MCP9600/L00/RL00 0.000 0.250 0.500 -200 300 800 1300 1800 Sensitivity (/g39/g39°C/LSb) TA (°C) Type J MCP9600/L00/RL00 0.000 0.250 0.500 -200 300 800 1300 1800 Sensitivity (/g39/g39°C/LSb) TA (°C) Type N MCP9600/L00/RL00

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3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

3.1 Ground Pin (GND)

The GND pin is the system ground pin. Pins 1, 3, 5, 13 and 17 are system ground pins and they are at the same potential. However, pins 6, 7, 9, 10 and 18 must be connected to ground for normal operation.

3.2 Thermocouple Input (V IN+, VIN-)

The thermocouple wires are directly connected to these inputs. The positive node is connected to the VIN+ pin, while the negative node connects to the V IN- node. The thermocouple voltage is converted to degree Celsius.

3.3 Power Pin (V DD)

VDD is the power pin. The operating voltage range, as specified in the DC Characteristics table, is applied on this pin.

3.4 Push-Pull Alert Outputs

(Alert 1, 2, 3, 4 and OC/SC Alert) The Alert pins are user-programmable push-pull outputs which can be used to detect rising or falling temperatures. The device outputs signal when the ambient temperature exceeds the user-programmed temperature alert limit. The Open-Circuit (OC) Alert and the Short-Circuit (SC) Alert output are also active-high push-pull outputs (MCP9601/L01/RL01). These outputs are asserted when Open-Circuit and Short-Circuit conditions are detected on the V SENSE pin. TABLE 3-1: PIN FUNCTION TABLE MCP9600/L00/RL00 MCP9601/L01/RL01 Symbol Pin Function

22 V IN+ Thermocouple Positive Terminal Input

44 V IN- Thermocouple Negative Terminal Input

6, 7, 9, 10, 18 10, 18 GND Not Electrical Ground; must be tied to Ground —6 V SENSE Thermocouple Open and Short-Circuit detection input — 7 SC Alert Thermocouple Short-Circuit Alert Output

88 V DD Power

— 9 OC Alert Thermocouple Open-Circuit Alert Output 11 11 Alert 1 Alert Output 1 12 12 Alert 2 Alert Output 2 14 14 Alert 3 Alert Output 3 15 15 Alert 4 Alert Output 4 16 16 ADDR I 2C Device Address Selection Voltage Input 19 19 SCL I 2C Clock Input 20 20 SDA I 2C Data Input 21 21 EP Exposed Thermal Pad (EP); must be connected to GND

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3.5 I 2C Address Pin (ADDR)

This pin is used to set the I2C address. This pin can be tied to VDD, GND, or a ratio of V DD can be selected to set up to eight address levels using a resistive voltage divider network.

3.6 Serial Clock Line (SCL)

The SCL is a clock input pin. All communication and timing is relative to the signal on this pin. The clock is generated by the host controller on the bus (see Section 4.0 “Serial Communication”).

3.7 Serial Data Line (SDA)

SDA is a bidirectional input/output pin used to serially transmit data to/from the host controller. This pin requires a pull-up resistor (see Section 4.0 “Serial Communication”).

3.8 Thermocouple Open/Short

Detection Input (VSENSE) The VSENSE pin is a thermocouple detection input pin (MCP9601/L01/RL01) and the voltage level on this pin is used to determine whether the thermocouple is oper- ating normally, shorted to V DD/VSS, or it is discon- nected from the VIN+ and VIN- pins (see Figure 1-1).

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4.0 SERIAL COMMUNICATION

4.1 Two-Wire Standard Mode I 2C

Protocol-Compatible Interface The MCP960X/L0X/RL0X Serial Clock Input (SCL) and the bidirectional Serial Data Line (SDA) form a two-wire bidirectional data communication line (refer to the Input/Output Pin DC Characteristics table and Sensor Serial Interface Timing Specifications table). The following bus protocol has been defined:

4.1.1 DATA TRANSFER

Data transfers are initiated by a Start condition (START), followed by a 7-bit device address and a read/write bit. An Acknowledge (ACK) from the device confirms the reception of each byte. Each access must be terminated by a Stop condition (STOP). Repeated communication is initiated after t B-FREE. This device supports the Receive Protocol. The register can be specified using the pointer for the initial read. Each repeated read or receive begins with a Start condition and address byte. The MCP960X/L0X/RL0X retains the previously selected register. Therefore, it outputs data from the previously-specified register (repeated pointer specification is not necessary).

4.1.2 HOST/DEVICE

The bus is controlled by a host device (typically a microcontroller) that controls the bus access, and generates the Start and Stop conditions. The MCP960X/L0X/RL0X is a device and does not control other devices in the bus. Both host and device can operate as either transmitter or receiver. However, the host device determines which mode is activated.

4.1.3 START/STOP CONDITION

A high-to-low transition of the SDA line (while SCL is high) is the Start condition. All data transfers must be preceded by a Start condition from the host. A low-to-high transition of the SDA line (while SCL is high) signifies a Stop condition. If a Start or Stop condition is introduced during data transmission, the MCP960X/L0X/RL0X releases the bus. All data transfers are ended by a Stop condition from the host.

4.1.4 ADDRESS BYTE

Following the Start condition, the host must transmit an 8-bit address byte to the MCP960X/L0X/RL0X. The address for the MCP960X/L0X/RL0X temperature sensor is ‘11,0,0,A2,A1,A0’ in binary, where the A2, A1 and A0 bits are set externally by connecting the corresponding V ADDR voltage levels on the ADDR pin (see the “Input/Output Pin DC Characteristics” section). The 7-bit address transmitted in the serial bit stream must match the selected address for the MCP960X/L0X/RL0X to respond with an ACK. Bit 8 in the address byte is a read/write bit. Setting this bit to ‘1’ commands a read oper- ation, while ‘ 0’ commands a write operation (see Figure 4-1). FIGURE 4-1: Device Addressing. TABLE 4-1: MCP960X/L0X/RL0X SERIAL BUS PROTOCOL DESCRIPTIONS Term Description Host The device that controls the serial bus, typically a microcontroller Device The device addressed by the host, such as the MCP960X/L0X/RL0X Transmitter Device sending data to the bus Receiver Device receiving data from the bus START A unique signal from host to initiate serial interface with a device STOP A unique signal from the host to terminate serial interface from a device Read/Write A read or write to the MCP960X/L0X/RL0X registers ACK A receiver Acknowledges (ACK) the reception of each byte by polling the bus NAK A receiver Not Acknowledges (NAK) or releases the bus to show End-of-Data (EOD) Busy Communication is not possible because the bus is in use Not Busy The bus is in the Idle state, both SDA and SCL remain high Data Valid SDA must remain stable before SCL becomes high in order for a data bit to be considered valid. During normal data transfers, SDA only changes state while SCL is low. 123456789SCL SDA 11 00 A2 A1 A0 Start Command Byte Address R/W MCP960X/L0X/RL0X Response A C K

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4.1.5 DATA VALID

After the Start condition, each bit of data in transmission needs to be settled for a time specified by t SU-DATA before SCL toggles from low-to-high (see the “Sensor Serial Interface Timing Specifications” section).

4.1.6 ACKNOWLEDGE (ACK/NAK)

Each receiving device, when addressed, is expected to generate an ACK bit after the reception of each byte. The host device must generate an extra clock pulse for ACK to be recognized. The Acknowledging device pulls down the SDA line for t SU-DATA before the low-to-high transition of SCL from the host. SDA also needs to remain pulled down for tHD-DAT after a high-to-low transition of SCL. During read, the host must signal an End-of-Data (EOD) to the device by not generating an ACK bit (NAK) once the last bit has been clocked out of the device. In this case, the device will leave the data line released to enable the host to generate the Stop condi- tion.

4.1.7 CLOCK STRETCHING

During the I2C read operation, this device will hold the I2C clock line low for t STRECH after the falling edge of the ACK signal. In order to prevent bus contention, the host controller must release or hold the SCL line low during this period. In addition, the host controller must provide eight con- secutive clock cycles after generating the ACK bit from a read command. This allows the device to push out data from the SDA Output Shift registers. Missing clock cycles could result in bus contention. At the end of one or more data transmission, the host controller must pro- vide the NAK bit, followed by a Stop Condition to terminate communication (see Figure 4-3).FIGURE 4-2: Clock Stretching.

4.1.8 SEQUENTIAL READ

During a sequential read, the device transmits data bytes starting from the previously set Register Pointer. The MCP960X/L0X/RL0X increments an internal address pointer each time a byte transmission is suc- cessfully completed with an ACK bit from the host con- troller. Therefore, the device can sequentially output the entire register values shown in Table 5-1 (see Figure 4-6). A Stop Condition terminates the sequential read. Note: If the host controller does not provide the adequate delay as specified by t STRECH, then the device will output the previously transmitted data. Note: The MCP960X/L0X/RL0X does not support Sequential Write function. A C K xxxx A C K A 78 12345678 xR MCP960X/L0X/RL0X Host xxx MCP960X/L0X/RL0X Clock Stretching – tSTRETCH TH MSB Data

 2015-2021 Microchip Technology Inc. DS20005426G-page 22 MCP960X/L0X/RL0X FIGURE 4-3: Timing Diagram to Set a Register Pointer and Read a Two-Byte Data. SDA A C K

1100 A 0000

A C K S 2 A A 12345678 12345678 SCL Address Byte Device* W 000 P A C K 1100 A MSB Data A C K N A K S P2 A A 12345678 12345678 12345678 Address Byte LSB Data R Host SDA SCL 00000001 10010100 TABLE 4-2: POINTERS Read-Only Registers Pointer TH 0000 0000 TΔ 0000 0001 TC 0000 0010 Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); // WRITE Command // also, make sure bit 0 is cleared ‘0’ i2c_write(b’0000 00XX’); // Write TH, TΔ, or TC registers i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); // READ Command // also, make sure bit 0 is set ‘1’ UpperByte = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay) // and Send ACK bit LowerByte = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay) // and Send NAK bit i2c_stop(); // send STOP command //Convert the temperature data if ((UpperByte & 0x80) == 0x80){ //Temperature  0°C Temperature = (UpperByte x 16 + LowerByte / 16) - 4096; }else //Temperature  0°C Temperature = (UpperByte x 16 + LowerByte / 16); //TH, TD, or TC Temperature (°C) depending on the register pointer value shown in Table 4-2. MCP960X/L0X/RL0X Clock Stretching, tSTRETCH Device* Host Pointer (Table 4-2) Device* *MCP960X/L0X/RL0X

 2015-2021 Microchip Technology Inc. DS20005426G-page 23 MCP960X/L0X/RL0X FIGURE 4-4: Timing Diagram to Set a Register Pointer, Write One Byte, and Read the Data. SDA A C K A C K S 2 A A 12345678 12345678 SCL Address Byte W 101 P AC K

1100 A NAK

A A 12345678 12345678 Address Byte LSB Data R Host SDA SCL xxxxxxxx TABLE 4-3: POINTERS Read/Write Registers Pointer STATUS 0000 0100 Configuration 0000 0101 0000 0110 xxxx A C K 12345678 xxxx Register Data Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); // WRITE Command // also, make sure bit 0 is cleared ‘0’ i2c_write(b’0000 0101’); // Write Status or Configuration registers i2c_write(b’XXXX XXXX’); // Write register data i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); // READ Command // also, make sure bit 0 is set ‘1’ Data = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay) // and Send NAK bit i2c_stop(); // send STOP command Device* Device* MCP960X/L0X/RL0X Clock Stretching, tSTRETCH Device* Configuration (Table 4-3) *MCP960X/L0X/RL0X

 2015-2021 Microchip Technology Inc. DS20005426G-page 24 MCP960X/L0X/RL0X FIGURE 4-5: Timing Diagram to Set a Register Pointer, Write Two Bytes, and Read the Data. SDA A C K 1100 A Alert 1 MSB 0001 A C K S 2 A A 12345678 12345678 SCL Address Byte W 000 xxxx A C K 12345678 x xx x xxxx A C K 12345678 xxxx P TABLE 4-4: POINTERS Alert Limit Registers Pointer Alert 1 0001 0000 Alert 2 0001 0001 Alert 3 0001 0010 Alert 4 0001 0011 Alert 1 LSB Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); //WRITE Command //also, make sure bit 0 is cleared ‘0’ i2c_write(b’0001 00XX’); // Write Alert registers i2c_write(b’XXXX XXXX’); // Write register Upper Byte i2c_write(b’XXXX XXXX’); // Write register Lower Byte i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); //READ Command //also, make sure bit 0 is set ‘1’ UpperByte = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay) //and Send ACK bit LowerByte = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay) //and Send NAK bit i2c_stop(); // send STOP command Alert Limit 1 (Table 4-4) Device* A C K 1100 A Alert 1 MSB A C K N A K S P2 A A 12345678 12345678 12345678 Address Byte Alert 1 LSB R Host SDA SCL xxxxxxxx xxxxxxxx MCP960X/L0X/RL0X Clock Stretching, tSTRETCH Device* Host *MCP960X/L0X/RL0X Device* Device* Device*

 2015-2021 Microchip Technology Inc. DS20005426G-page 25 MCP960X/L0X/RL0X FIGURE 4-6: Timing Diagram to Sequential Read All Registers Starting from TH Register. A C K 12345678 12345678 xxxxxxxx xxxxxxxx xxx xxx A C K N A K P TC MSB Data TC LSB Data T MSB Data Device ID LSB Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); // WRITE Command // also, make sure bit 0 is cleared ‘0’ i2c_write(b’0000 0000’); // Write TH register to set the starting register for sequential read i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); // READ Command // also, make sure bit 0 is set ‘1’ for (i=0; i<29, i++){ Data_Buffer[i] = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay) // and Send ACK bit Data_Buffer[i] = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay) // and Send NAK bit i2c_stop(); // send STOP command SDA A C K A C K S 2 A A 12345678 12345678 SCL Address Byte Device* W 000 P Pointer to TH Register A C K 1100 A TH MSB Data A C K A C K S 2 A A 12345678 12345678 12345678 Address Byte TH LSB Data R Host SDA SCL xxxxxxxx xxxxxxxx MCP960X/L0X/RL0X Clock Stretching, tSTRETCH Device* Host Device* MCP960X/L0X/RL0X Clock Stretching, tSTRETCH Host Host Host *MCP960X/L0X/RL0X

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5.0 FUNCTIONAL DESCRIPTION

The MCP960X/L0X/RL0X Thermocouple temperature converter consists of an 18-bit Delta-Sigma Analog-to-Digital Converter (ADC), which is used to measure the thermocouple voltage or EMF, a digital temperature sensor used to measure cold-junction or ambient temperature and a processor core which is used to compute the EMF to degree Celsius conversion using coefficients derived from the NIST ITS-90 coefficients. Figure 5-1 shows a block diagram of how these functions are structured in the device. FIGURE 5-1: Functional Block Diagram. Del Sig VIN+ ADC Core Error Correction  Thermocouple Hot-Junction, TH Thermocouple Thermocouple Junctions Delta, TΔ Thermocouple Cold-Junction, TC User Registers: Sensor Configuration Digital Filter Thermocouple Type Selection Device Resolution and Power Modes Sensor Status Alert 1 Limit Hysteresis Configuration Alert 2 Limit Hysteresis Configuration Alert 3 Limit Hysteresis Configuration Alert 4 Limit Hysteresis Configuration Device ID Alert 1 Output Alert 2 Output Alert 3 Output Alert 4 Output SCL SDA ADDR I2C Module Open-Circuit and Short-Circuit Detection OC Alert SC Alert VSENSE MCP9601/L01/RL01 Only VIN-

 2015-2021 Microchip Technology Inc. DS20005426G-page 27 MCP960X/L0X/RL0X The MCP960X/L0X/RL0X device has several registers that are user-accessible. These registers include the Thermocouple Temperature (cold-junction compen- sated), Hot-Junction Temperature, Cold-Junction Tem- perature, Raw ADC Data, user-programmable Alert Limit registers, and STATUS and Configuration regis- ters. The Temperature and the Raw ADC Data registers are read-only registers, used to access the thermocouple and the ambient temperature data. In addition, the four Alert Temperature registers are individually controlled, and can be used to detect a rising and/or a falling temperature change. If the ambient temperature drifts beyond the user-specified limits, the MCP960X/L0X/RL0X device outputs an alert flag at the corresponding pin (refer to Section 5.3.3 “Alert Con- figuration Registers”). The alert limits can also be used to detect critical temperature events. The MCP960X/L0X/RL0X also provides STATUS and Configuration registers, which allow users to detect device statuses. The Configuration registers provide various features, such as adjustable temperature measurement resolution and Shutdown modes. The thermocouple types can also be selected using the Configuration registers. The registers are accessed by sending a Register Pointer to the MCP960X/L0X/RL0X using the serial interface. This is an 8-bit write-only pointer. Register 5-1 describes the pointer definitions. REGISTER 5-1: REGISTER POINTER U-0 U-0 W-0 W-0 W-0 W-0 W-0 W-0 —— P [ 5 : 0 ] bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 P[5:0]: Pointer bits 0000 0000 = Thermocouple Hot-Junction register, TH 0000 0001 = Junctions Temperature Delta register, TΔ 0000 0010 = Cold-Junction Temperature register, TC 0000 0011 = Raw ADC Data register 0000 0100 = STATUS register 0000 0101 = Thermocouple Sensor Configuration register 0000 0110 = Device Configuration register 0000 1000 = Alert 1 Configuration register 0000 1001 = Alert 2 Configuration register 0000 1010 = Alert 3 Configuration register 0000 1011 = Alert 4 Configuration register 0000 1100 = Alert 1 Hysteresis register, THYST1 0000 1101 = Alert 2 Hysteresis register, THYST2 0000 1110 = Alert 3 Hysteresis register, THYST3 0000 1111 = Alert 4 Hysteresis register, THYST4 0001 0000 = Temperature Alert 1 Limit register, TALERT1 0001 0001 = Temperature Alert 2 Limit register, TALERT2 0001 0010 = Temperature Alert 3 Limit register, TALERT3 0001 0011 = Temperature Alert 4 Limit register, TALERT4 0010 0000 = Device ID/Revision register

 2015-2021 Microchip Technology Inc. DS20005426G-page 28 MCP960X/L0X/RL0X TABLE 5-1: SUMMARY OF REGISTERS AND BIT ASSIGNMENTS Register Pointer bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Hot-Junction Temperature – TH

00000000 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C

Delta – TΔ

00000001 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C

Temperature – TC

00000010 SIGN 128°C 64°C 32°C 16°C

Raw Data ADC 00000011 SIGN bit 17 bit 16 STATUS MCP9600/L00/RL00

00000100 Burst

— Input Range Alert 4 Status Alert 3 Status Alert 2 Status Alert 1 Status STATUS MCP9601/L01/RL01 Short-Circuit (SC) Open-Circuit (OC)/Input Range Thermocouple Sensor Configuration 00000101 — Thermocouple Type Select Type K, J, T, N, S, E, B, R — Filter Coefficients Device Configuration 00000110 Cold-Junc. Resolution ADC Resolution Burst Mode Temperature Samples Shutdown Modes Unimplemented bits, Read as '0' Alert 1 Configuration 00001000 Interrupt Clear — — Monitor TH or TC Detect Ris- ing or Fall- ing Temps Active- High or Active-Low Output Comparator or Interrupt Mode Enable Alert OutputAlert 2 Configuration 00001001 Alert 3 Configuration 00001010 Alert 4 Configuration 00001011 Alert 1 Hysteresis 00001100 128°C 64°C 32°C 16°C 8°C 4°C 2°C 1°C Alert 2 Hysteresis 00001101 Alert 3 Hysteresis 00001110 Alert 4 Hysteresis 00001111 Alert 1 Limit 00010000 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C Alert 2 Limit 00010001 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C Alert 3 Limit 00010010 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C Alert 4 Limit 00010011 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C Device ID/Revision MCP9600/L00/RL00 00100000 0 1 0 0 0 0 0 0 Revision-Major Revision-Minor Device ID/Revision MCP9601/L01/RL01 0 1 0 0 0 0 0 1 Revision-Major Revision-Minor

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5.1 Thermocouple Temperature

This device integrates three Temperature registers that are used to read the cold and hot-junction temperatures, and the sum of the two junctions to output the absolute thermocouple temperature. In addition, the Raw ADC Data register, which is used to derive the thermocouple temperature, is available. The following sections describe each register in detail.

5.1.1 THERMOCOUPLE TEMPERATURE

REGISTER (TH) This register contains the cold-junction compensated and error-corrected thermocouple temperature in degree Celsius. The temperature data from this register is the absolute Thermocouple Hot-Junction temperature, TH, to the specified accuracy (see Section 1.0 “Electrical Characteristics”. TH is the sum of the values in the TΔ and TC registers, as shown in Figure 5-2. EQUATION 5-1: TEMPERATURE CONVERSION The temperature bits are in two’s complement format; therefore, positive temperature data and negative temperature data are computed differently. Equation 5-1 shows how to convert the binary data to temperature in degree Celsius. FIGURE 5-2: Thermocouple Temperature Register Block Diagram. Temperature  0°C TH = (UpperByte x 16 + LowerByte/16) Temperature  0°C TH = (UpperByte x 16 + LowerByte/16) – 4096 VIN+ VIN- Temperature Sensor Core ADC Core Delta-Sigma 18-Bit Error Corrected Temperature ADC Thermocouple Temperature TC TH TΔ REGISTER 5-2: THERMOCOUPLE TEMPERATURE REGISTER - T H (READ-ONLY) R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 TH: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the temperature data is less than 0°C. This register contains the error corrected and cold-junction compensated thermocouple temperature.

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5.1.2 THERMOCOUPLE JUNCTIONS

REGISTER (T This register contains the error corrected Thermocouple Hot-Junction temperature without the Cold-Junction compensation. The error correction methodology uses several coefficients to convert the digitized Thermocouple EMF voltage to degree Celsius. Each Thermocouple type has a unique set of coefficients as specified by NIST, and these coefficients are available in the configuration register for user selection as shown in Figure 5-3. EQUATION 5-2: TEMPERATURE CONVERSION The temperature bits are in two’s complement format, therefore, positive temperature data and negative temperature data are computed differently, as shown in Equation 5-2. FIGURE 5-3: Thermocouple Hot-Junction Register (TΔ) Block Diagram. Temperature  0°C TΔ = (UpperByte x 16 + LowerByte / 16) Temperature  0°C TΔ = (UpperByte x 16 + LowerByte / 16) - 4096 VIN+ VIN- ADC code to degree Celsius conversion using coefficients derived from NIST look-up table database User-Selectable, Thermocouple Types: - T y p e K - T y p e J - T y p e T - T y p e N - T y p e S - T y p e E - T y p e B - T y p e R (see Register 5-6) Thermocouple Junctions Delta Temperature – T Δ Check if the ADC code is within range for the selected thermocouple type TΔ Delta-Sigma 18-Bit ADC Core ADC REGISTER 5-3: HOT-JUNCTION TEMPERATURE REGISTER -T Δ (READ-ONLY) R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 TΔ: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the temperature data is less than 0°C. This register contains Thermocouple Hot-Junction temperature data without the cold-junction compensation.

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5.1.3 COLD-JUNCTION/AMBIENT

TEMPERATURE REGISTER (TC) The MCP960X/L0X/RL0X integrates an ambient temperature sensor which can be used to measure the thermocouple cold-junction temperature. For accurate measurement, the device will have to be placed at close proximity to the thermocouple cold-junction to detect the junction ambient temperature. This is a 16-bit double-buffered, read-only register. The temperature resolution is user-selectable to 0.0625°C/LSb or 0.25°C/LSb resolutions and setting the resolution determines the temperature update rate, as shown in Table 5-2. EQUATION 5-3: TEMPERATURE CONVERSION The temperature bits are in two’s complement format; therefore, positive temperature data and negative temperature data are computed differently, as shown in Equation 5-3. FIGURE 5-4: Thermocouple Cold-Junction Register (TC) Block Diagram. Temperature  0°C TC = (UpperByte x 16 + LowerByte/16) Temperature  0°C TC = (UpperByte x 16 + LowerByte/16) – 4096 TABLE 5-2: RESOLUTION vs. CONVERSION TIME Resolution Conversion Time (typical) Register Bits (Note 1) 0.0625°C 250 ms ssss xxxx xxxx xxxx 0.25°C 63 ms ssss xxxx xxxx xx00 Note 1: ‘s’ is Sign and ‘x’ is unknown bit. Ambient Temperature Sensor Core TC Selectable Resolution: - 0.0625°C -0 . 2 5 ° C (see Register 5-8) Thermocouple Cold-Junction Temperature –TC REGISTER 5-4: COLD-JUNCTION TEMPERATURE REGISTER - T C (READ ONLY) R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 SIGN 128°C 64°C 32°C 16°C bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 TC: Data in Two’s Complement Format . Bits 15-12 are sign bits and the bits are set when the temperature data is less than 0°C. This register contains the thermocouple cold-junction temperature or the device ambient temperature data. Bits 1 and 0 may remain clear (‘ 0’) depending on the status of the Resolution setting, bit 7 of Register 5-8.

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5.1.4 ANALOG-TO-DIGITAL

CONVERTER (ADC) The MCP960X/L0X/RL0X uses an 18-bit Delta-Sigma Analog-to-Digital Converter to digitize the Thermocouple EMF voltage and the data is available in the ADC register. The ADC measurement resolution is selectable, which enables the user to choose faster conversion times with reduced resolution. This feature is useful to detect fast transient temperatures. FIGURE 5-5: Delta-Sigma Analog-to-Digital Converter, ADC Core Block Diagram. TABLE 5-3: ADC RESOLUTION (32) Resolution/ Sensitivity (typical) Conversion Time (typical) Raw ADC Register Bit Format (Note 1) 18-bit/2 µV 320 ms ssss sssx xxxx xxxx xxxx xxxx 16-bit/8 µV 80 ms ssss sssx xxxx xxxx xxxx xx00 1 4 - b i t / 3 2µ V 2 0m s ssss sssx xxxx xxxx xxxx 0000 12-bit/128 µV 5 ms ssss sssx xxxx xxxx xx00 0000 Note 1: ‘s’ is the Sign bit and ‘x’ is the ADC data bit. 2: See Section 6.2.2 “Conversion Time vs. Self-Heat”. VIN+ VIN- Selectable Resolutions: - 18-bit - 16-bit - 14-bit - 12-bit (see Register 5-7) Raw ADC Code Register ADC Core ADCDelta-Sigma REGISTER 5-5: 24-BIT ADC REGISTER (READ-ONLY) R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 SIGN ADC Data bit 23 bit 16 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 ADC Data bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 ADC Data bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 23-0 ADC Data: Raw ADC Raw ADC data in Two's Compliment Format. Bits 23-18 are sign bits and the bits are set when the ADC data is less than 0 micro-volt.

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5.2 Sensor STATUS and Configuration

This device provides various temperature and measurement Status bits which can be monitored regularly by the host controller. In addition, this device integrates various user-programmable features which can be useful to develop complex thermal management applications. The following sections describe each feature in detail.

5.2.1 STATUS REGISTER

The STATUS register contains several flag bits that indicate statuses, such as temperature alert, the ADC input range status for the selected thermocouple type and the Temperature register update status for both single conversion or Burst mode conversions. REGISTER 5-6: STATUS REGISTER R/W-0 R/W-0 U-0 R-0 R-0 R-0 R-0 R-0 Burst Complete TH Update — Input Range Alert 4 Status Alert 3 Status Alert 2 Status Alert 1 Status Short-Circuit (SC) (1) Open-Circuit (OC)/Input Range (1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Burst Complete: Burst Mode Conversions Status Flag bit 1 =T Δ register Burst mode conversions complete 0 = Writing ‘0’ has no effect Once Burst mode is enabled, this bit is normally set after the first burst is complete. User can clear it and poll the bit periodically until the next burst of temperature conversions is complete (see Register 5-8). bit 6 T H Update: Temperature Update Flag bit 1 = Temperature conversion complete 0 = Writing ‘0’ has no effect This bit is normally set. User can clear it and poll the bit until the next temperature conversion is complete. bit 5 Unimplemented: Read as ‘0’ for the MCP9600/L00/RL00 only. Short-Circuit (SC): Short-Circuit Detection bit for the MCP9601/L01/RL01 only (read-only) 1 = Thermocouple Shorted to V DD or VSS 0 = Normal operation The VSENSE pin must be connected to the Thermocouple as indicated in Figure 1-1, using RA and RB resistors. Note 1: MCP9601/L01/RL01 only.

 2015-2021 Microchip Technology Inc. DS20005426G-page 34 MCP960X/L0X/RL0X bit 4 Input Range: Temperature Range Detection bit (read-only) 1 = The ADC input Voltage (EMF) or the temperature data from the TH register exceeds the measure- ment range for the selected thermocouple type 0 = The ADC input Voltage (EMF) or the temperature data from the TH register is within the measure- ment range for the selected thermocouple type If this bit is set, then the MCP9600/L00/RL00 input vo ltage (EMF) to Degree Celsius conversion may be bypassed under these conditions: - If the thermocouple EMF exceeds the specified range, then the T H and T registers are not updated, but the TC register is updated with valid temperature data at the specified interval, or tCONV. - If the thermocouple EMF is within the specified range, but the sum with the Cold-Junction EMF exceeds the specified range, then the TH register is not updated, but the T and TC registers are updated with valid temperature data at the specified interval, or tCONV. In this case, the value of the T and TC registers can be used to calculate valid Hot-Junction Temperature data using the NIST ITS-90 conversion look-up table or polynomial equation. - To identify date code for devices with this feature, refer to “MCP9600 Rev. A Silicon Errata and Data Sheet Clarification”, DS80000741. For the MCP9601/L01/RL01, this bit indicates whether the Thermocouple is disconnected from the inputs. The VSENSE pin must be connected to the Thermocouple as indicated in Figure 1-1, using RA and RB resistors. When the Thermocouple is disconnected, the voltage at the inputs exceeds the voltage range for the selected Thermocouple due to the RA and RB resistors. bit 3 Alert 4: Status bit (read-only) 1 =T X TALERT4 0 =T X ≤TALERT4 Where: TX is either TH or TC (user-selectable, see Register 5-10). bit 2 Alert 3: Status bit (read-only) 1 =T X TALERT3 0 =T X ≤TALERT3 Where: TX is either TH or TC (user-selectable, see Register 5-10). bit 1 Alert 2: Status bit (read-only) 1 =T X TALERT2 0 =T X ≤TALERT2 Where: TX is either TH or TC (user-selectable, see Register 5-10). bit 0 Alert 1: Status bit (read-only) 1 =T X TALERT1 0 =T X ≤TALERT1 Where: TX is either TH or TC (user-selectable, see Register 5-10). Note 1: MCP9601/L01/RL01 only. REGISTER 5-6: STATUS REGISTER (CONTINUED)

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5.2.2 THERMOCOUPLE SENSOR

The MCP960X/L0X/RL0X Sensor Configuration register is used to select the thermocouple sensor types and to select the digital filter options. This device supports eight thermocouple types. Each type has a unique set of error correction coefficients that are derived from the NIST Thermocouple EMF Voltage Conversion database. In addition, this device integrates a first order. recursive Infinite Impulse Response (IIR) filter, also known as Exponential Moving Average (EMA). The filter uses the current new temperature sample and the previous filter output to calculate the next filter output. It also adds more weight to the current temperature data, allowing a faster filter response to the immediate change in temperature. This feature can be used to filter out fast thermal transients or thermal instability at the thermocouple hot-junction temperature. Writing this register resets the filter. The filter equation is shown in Equation 5-4 and the Filter Coefficient n is user-selectable, from Level 0 to 7. A coefficient of 0 disables the filter function and a 7 coefficient provides a maximum digital filter. Figure 5-6 shows the filter response to a step function, which can be used to extrapolate the filter performance to various temperature changes. EQUATION 5-4: DIGITAL FILTER FIGURE 5-6: Filter Step Response. Where: Y = New filtered temperature in TΔ X = Current, unfiltered hot-junction temperatures Y-1 =P r e v i o u s filtered temperature n = User-selectable filter coefficient k2 2 n 1+= 0.0 0.5 1.0 Filter Output (°C) Number of Temperature Samples n=0 n=1 n=2 n=3 n=4 n=5 n=6 n=7 REGISTER 5-7: SENSOR CONFIGURATION REGISTER U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 — Thermocouple Type Select, Type K, J, T, N, S, E, B, R — Filter Coefficients bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-4 Thermocouple Type: Thermocouple Type Select bits 000 = Type K 001 = Type J 010 = Type T 011 = Type N 100 = Type S 101 = Type E 110 = Type B 111 = Type R bit 3 Unimplemented: Read as ‘0’ bit 2-0 Filter Coefficient – n: Filter Coefficient bits 000 = n = 0: Filter off 001 = n = 1: Minimum filter 010 = n = 2 011 = n = 3 100 = n = 4: Mid filter 101 = n = 5 110 = n = 6 111 = n = 7: Maximum filter

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5.2.3 DEVICE CONFIGURATION

The device Configuration register allows the user to configure various functions, such as sensor measurement resolutions and Power modes. The Resolution register is used to select the sensor resolution for the desired temperature conversion time. When resolutions are changed, the change takes effect when the next measurement cycle begins. This device integrates two Low-Power Operating modes: Shutdown mode and Burst mode, which can be selected using bit 0 and bit 1. When the Shutdown mode is executed, all power consuming activities are disabled and the operating current remains at I SHDN. During the Shutdown mode, all registers are accessible; however, I2C activity on the bus increases the current. The Burst mode enables users to execute a given number of temperature samples (defined by bits[4-2]) before entering Shutdown mode. Each temperature sample is compared to the user-settable alert temperature limits, and if the alert conditions are true, then the device asserts the corresponding alert output. In addition, if the filter option is enabled, then the filter engine is applied to each temperature sample. The alert thresholds are also compared to the filtered temperature data. This feature is useful for battery power applications, where temperature is sampled upon request from the host controller. FIGURE 5-7: Burst Mode Operation. 1←Samples→128 Burst Mode Command Shutdown ModeShutdown Mode Normal Operation REGISTER 5-8: DEVICE CONFIGURATION REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 Cold-Junction Resolution ADC Measurement Resolution Burst Mode Temperature Samples Shutdown Modes bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Cold-Junction/Ambient Sensor Resolution: Cold-Junction Resolution bit (see Table 5-2): 0 = 0.0625°C 1 = 0.25°C bit 6-5 ADC Measurement Resolution: ADC Resolution bits (see Table 5-3): 00 =18-bit Resolution 01 =16-bit Resolution 10 =14-bit Resolution 11=12-bit Resolution bit 4-2 Burst Mode Temperature Samples: Number of Temperature Samples bits 000 = 1 sample 001 = 2 samples 010 = 4 samples 011 = 8 samples 100 = 16 samples 101 = 32 samples 110 = 64 samples 111 = 128 samples bit 1-0 Shutdown Modes: Shutdown Mode bits 00 = Normal operation 01 = Shutdown mode 10 = Burst mode 11 = Unimplemented: this setting has no effect

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5.3 Temperature Alert Registers

This device provides four Temperature Alert registers that are individually configured, which allow users to monitor multiple temperature zones with a single device. The following sections describe each alert feature in detail.

5.3.1 ALERT LIMIT REGISTERS

This device integrates four individually controlled Temperature Alert Limit registers. Each alert limit is individually set to detect a rising or falling temperature, or either the Thermocouple Temperature (T H) register or the Cold-Junction (T C) register. The corresponding alert limit outputs can also be enabled for temperature status indicators. All alert functions are configured using the Alert Limit Configuration registers ( Register 5-11) and the alert output hysteresis function is set using the Alert Hysteresis registers (Register 5-10). FIGURE 5-8: Alert Limits Set to Detect TH and TC. TABLE 5-4: ALERT LIMIT REGISTERS Register Register Pointer Alert 1 Limit – TALERT1 0001 0000 Alert 2 Limit – TALERT2 0001 0001 Alert 3 Limit – TALERT3 0001 0010 Alert 4 Limit – TALERT4 0001 0011 REGISTER 5-9: ALERT LIMITS 1, 2, 3 AND 4 REGISTERS R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SIGN 1024°C 512°C 255°C 128°C 64°C 32°C 16°C bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 Alert 1, 2, 3 and 4: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the temperature data is less than 0°C. Bits 1 and 0 are unimplemented, therefore, writing these bits has no effect. TH TC Alert Limit Alert Hysteresis TH/TC +/– Rise/Fall Digital Comparator Output Mode Control Comparator/Interrupt Mode Int. Clear

1 Alert Output

 2015-2021 Microchip Technology Inc. DS20005426G-page 38 MCP960X/L0X/RL0X FIGURE 5-9: Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH. TALERT2 TALERT3 TALERT1 TH  TALERT1 – THYST1  TALERT3 + THYST3 TALERT4  TALERT4 + THYST4  TALERT1  TALERT2 Alert 1 Output (Active-Low) Alert 4 Output (Active-Low) Alert 2 Output (Active-Low) Alert 3 Output (Active-Low)  TALERT4  TALERT3  TALERT2 – THYST2 Comparator Interrupt Interrupt Clear Comparator Interrupt Interrupt Clear Comparator Interrupt Interrupt Clear Comparator Interrupt Interrupt Clear

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5.3.2 ALERT HYSTERESIS REGISTER

This device integrates four individually controlled temperature Alert Hysteresis registers for each alert output, with a range of 0°C to +255°C. The alert hysteresis directions are set using bit 3 of the corresponding Alert Configuration registers (Register 5-10) to detect rising or falling temperatures. For rising temperatures, the hysteresis range is below the alert limit where, as for falling temperatures, the hysteresis range is above the alert limit, as shown in Figure 5-10. FIGURE 5-10: Graphical Description of Alert Output Hysteresis Direction. TABLE 5-5: ALERT HYSTERESIS REGISTERS Register Register Pointer Alert 1 Hysteresis – THYST1 0000 1100 Alert 2 Hysteresis – THYST2 0000 1101 Alert 3 Hysteresis – THYST3 0000 1110 Alert 4 Hysteresis – THYST4 0000 1111 REGISTER 5-10: T HYSTx: ALERT 1, 2, 3 AND 4 HYSTERESIS REGISTERS R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 128°C 64°C 32°C 16°C 8°C 4°C 2°C 1°C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 Alert Hysteresis: Alert Hysteresis Range 0x00 to 0xFF bits (which represents +1°C to +255°C) Cold Hot Hysteresis Cold Hot Hysteresis TALERTTHYST TALERT THYST Rising Temperature Falling Temperature Alert Output Cold Hot Hysteresis TALERTTHYST Rising Temperature Cold Hot Hysteresis TALERT THYST Falling Temperature Alert Output Alert Output Alert Output Active-Low Active-Low Active-High Active-High

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5.3.3 ALERT CONFIGURATION

This device integrates four individually controlled temperature alert outputs. Each output is configured for the corresponding alert output using the Alert Output Configuration registers. The Configuration registers are used to enable each output, select the Alert Function mode as Comparator or Interrupt mode, active-high or active-low output, detect rising or falling temperatures and detect T H or TC Temperature registers. The Comparator mode is useful for thermostat-type applications, such as on/off switches for fan controllers, buzzer or LED indicators. The alert output asserts and deasserts when the temperature exceeds the user-specified limit, and the user-specified hysteresis limit. The Interrupt mode is useful for interrupt driven microcontroller-based systems. The alert outputs are asserted each time the temperature exceeds the user-specified alert limit and hysteresis limits. The microcontroller will have Acknowledged the interrupt signal from the corresponding alert output by clearing the interrupt using bit 7 of the corresponding Configuration register. The Rise/Fall bit (bit 3) and the Monitor T H/TC bit (bit 4) can be used to detect and maintain the thermocouple temperature or the cold-junction temperature to the desired temperature window. TABLE 5-6: ALERT CONFIGURATION REGISTERS Register Register Pointer Alert 1 Configuration 0000 1000 Alert 2 Configuration 0000 1001 Alert 3 Configuration 0000 1010 Alert 4 Configuration 0000 1011 REGISTER 5-11: ALERT 1, 2, 3 AND 4 CONFIGURATION REGISTER R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 Interrupt Clear — — Monitor T H/TC Rise/Fall Active-High/Low Comp/Int. Alert Enable bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Interrupt Clear: Interrupt Clear bit 1 = Clears Interrupt flag (forced ‘0’ by device) 0 = Normal state or cleared state bit 6-5 Unimplemented: Read as ‘0’ bit 4 Monitor T H or TC: Temperature Maintain/Detect bit 1 = Alert monitor for T C cold-junction sensor 0 = Alert monitor for T H thermocouple temperature bit 3 Rise/Fall: Alert Temperature Direction bit 1 = Alert limit for falling or cooling temperatures 0 = Alert limit for rising or heating temperatures bit 2 Active-High/Low: Alert State bit 1 = Active-high 0 = Active-low bit 1 Comp./Int.: Alert Mode bit 1 = Interrupt mode: Interrupt clears bit (bit 7) – must be set to deassert the alert output 0 = Comparator mode bit 0 Alert Enable: Alert Output Enable bit 1 = Alert output is enabled 0 = Alert output is disabled

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5.3.4 DEVICE ID AND REVISION ID

The Device ID (Identification) and Revision ID register is a 16-bit read-only register, which can be used to identify this device among other devices on the I bus. The upper 8 bits indicate the Device ID of 0x40 for the MCP9600/L00/RL00 and 0x41 for the MCP9601/L01/RL01 respectively, while the lower 8 bits indicate the device revision. The device revision byte is divided into nibbles, where the upper nibble indicates the major revision and the lower nibble indicates minor revisions. The initial release is indicated by a major revision of ‘1’ and a minor revision of ‘0’ or 0x4010 for the MCP9600/L00/RL00 and 0x4110 for the MCP9601/L01/RL01. (Refer to “MCP9600 Silicon Errata and Data Sheet Clarification”, DS80000741, for changes and revision IDs). REGISTER 5-12: MCP9600/L00/RL00 DEVICE ID AND REVISION ID REGISTER R-0 R-1 R-0 R-0 R-0 R-0 R-0 R-0 Device ID bit 15 bit 8 R-0 R-0 R-0 R-1 R-0 R-0 R-0 R-0 Revision-Major Revision-Minor bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Device ID: Device ID bits (0x40) bit 7-0 Revision: Major/Minor Revision ID bits (0x10) for the initial Release, or Revision 1.0 (Refer to the Silicon Errata, DS80000741, for change date codes and revision IDs). REGISTER 5-13: MCP9601/L01/RL01 DEVICE ID AND REVISION ID REGISTER R-0 R-1 R-0 R-0 R-0 R-0 R-0 R-1 Device ID bit 15 bit 8 R-0 R-0 R-0 R-1 R-0 R-0 R-0 R-0 Revision-Major Revision-Minor bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Device ID: Device ID bits (0x41) bit 7-0 Revision: Major/Minor Revision ID bits (0x10) for the initial Release, or Revision 1.0 (Refer to the Silicon Errata, DS80000741, for change date codes and revision IDs).

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6.0 APPLICATION INFORMATION

6.1 Layout Considerations

The MCP960X/L0X/RL0X does not require any additional components to digitize thermocouples. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the V DD and GND pins. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the V DD and ground pins of the device in order to provide effective noise protection. In addition, good PCB layout is key for better thermal conduction from the PCB temperature to the sensor die. The PCB provides thermal conduction from the die to the thermocouple cold-junction; therefore, the component placement positioning and the copper layout techniques are key for optimum cold-junction compensation. The recommended implementation for optimum temperature sensitivity is to extend a copper ground pad around the device pins, as shown in Figure 6-1. FIGURE 6-1: Recommended PCB Layout.

6.1.1 COLD-JUNCTION COMPENSATION

Copper provides better thermal conductivity than PCB FR4 to the ambient temperature. It also provides better thermal conduction than the 5 mm x 5 mm MQFN plastic package, which houses the temperature sensor die. Therefore, when connecting the thermocouple wire to the PCB, it is recommended to place the ground copper between the thermocouple connector footprint, where dissimilar conductive material is attached to the PCB and the MCP960X/L0X/RL0X exposed pad. This allows temperature to stabilize to the local ambient temperature (between the thermocouple connector junction and the PCB copper) and the copper trace conducts the temperature to the package exposed pad where the temperature sensor die is placed. The placement of the sensor exposed pad to the thermocouple connector junction greatly determines the temperature sensor’s sensitivity to the local junction temperature changes. Figure 6-2 demonstrates the recommended techniques. FIGURE 6-2: Recommended Component Placement.

6.2 Thermal Considerations

The potential for self-heating errors exist if the MCP960X/L0X/RL0X SDA, SCL and alert outputs are heavily loaded (high current) with pull-up resistors and circuits, such as high-current LEDs or buzzer loads. The temperature rise due to self-heat increases the ambient temperature sensor output, resulting in an increased temperature offset error compared to the thermocouple cold-junction ambient temperature.

6.2.1 SELF-HEAT DURING OPERATION

During normal operation, the typical self-heating error is negligible due to the relatively small current consumption of the MCP960X/L0X/RL0X. However, this device integrates a processor to compute the equations necessary to convert the thermocouple EMF voltage to degrees Celsius. The processor also maintains the I 2C bus. During I2C communication, the device operating current increases to I DD = 1.5 mA (typical), I 2C Active specification. If the bus is continually polled for data at frequent intervals, then the processor power dissipates heat to the temperature sensor and the effect of self-heat can be detected. Therefore, the recommended implementation is to maintain polling to no more than three times per temperature conversion period of 320 ms or use the Burst mode feature to manage self-heat (refer to Section 6.2.3 “Using Burst Mode to Manage Self-Heat”). Equation 6-1 can also be used to determine the effect of self-heat. Thermal Pad VIN+/VIN-

 2015-2021 Microchip Technology Inc. DS20005426G-page 43 MCP960X/L0X/RL0X EQUATION 6-1: EFFECT OF SELF-HEATING At room temperature (T A = +25°C) with I DD = 2.5 mA (maximum) and V DD = 3.3V, the self-heating due to power dissipation, T, is 0.32°C for the MQFN package. 6.2.2 CONVERSION TIME vs. SELF-HEAT Once the ADC completes digitization, the processor initiates the data computation routine for t CALC, which also increases IDD. During the 18-bit ADC conversion time (3 SPS, Samples per Second), the increased current lasts for approximately 5% of the one-second period. The effect of self-heat for the total power consumed per second, including the 5% t CALC period, is negligible. However, as the ADC resolution is reduced from 18-bit to 16-bit, the power consuming t CALC period increases to 20% per second. This change in resolution adds approximately 0.04°C (typical) temperature error due to self-heat. Table 6-1 provides an estimate for self-heat for all resolutions using Equation 6-1. In order to reduce the effects of self-heat for lower resolution settings, the Burst mode feature is recommended to manage the effects of self-heat.

6.2.3 USING BURST MODE TO MANAGE

The Burst mode feature is useful to manage power dissipation while maintaining the device sensitivity to changes in temperature (see Section 5.2.3 “Device Configuration Register” ). While the device is in Low-Power or Shutdown mode, the host controller exe- cutes Burst mode to sample temperature. The number of temperature samples and the measurement resolu- tion settings are selected while executing the command. While in Burst mode, if the temperature data exceeds the alert limits, the device asserts the corresponding alert output. The alert outputs are used so the host con- troller does not need to continually poll the latest temperature data and potentially increase the temperature error. In addition, with some applications monitoring several hundred degrees of temperature changes, 18-bit resolution may not be necessary. In this case, a fewer number of burst samples reducing the resolution enables the user to monitor fast transient temperatures at the burst intervals. The 12-bit ADC resolution provides approximately 3°C resolution (for Type K) and a new sample of temperature data is computed at approximately 20 ms intervals. Therefore, the number of Burst mode Samples per Second can be selected to manage the effects of self-heat using these estimates. The temperature conversion status during Burst mode can also be momentarily polled (using bit 7 of Register 5-6) to detect whether the on-going sample bursts are completed. The host controller may terminate an on-going burst by executing a shutdown command or resetting the Burst mode by sending another burst command.

6.2.4 ALERT OUTPUTS

The alert outputs are intended to drive high-impedance loads. Typically, the outputs are connected to a microcontroller input pin. However, if the outputs are used to drive indicators, such as LEDs or buzzers, then a buffer circuit is recommended in order to minimize the effects of self-heat due to the applied load (see Figure 6-3). FIGURE 6-3: Alert Output Buffer for LED Indicator. TABLE 6-1: ADC RESOLUTION vs. SELF-HEAT Resolution SPS (typ.) tCALC Duration per Second T 18-bit 3 5% 0.0096°C 16-bit 15 20% 0.0384°C 14-bit 60 80% 0.1536°C 12-bit 240 100% 0.1920°C Note: VDD = 3.3V and IDD = 1.5 mA (typical). Where: TJ = Junction Temperature TA = Ambient Temperature JA = Package Thermal Resistance: - Junction to Ambient JC = Package Thermal Resistance: Junction to Case T TJ TA–= Alert Output NPN Active-High VDD

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6.3 Device Features

6.3.1 I 2C ADDRESSING

The MCP960X/L0X/RL0X supports up to eight devices on the I 2C bus. Applications, such as large thermal management racks with several thermocouple sensor interfaces, are able to monitor various temperature zones with minimal pin count microcontrollers. This reduces the total solution cost, while providing a highly accurate thermal management solution using the MCP960X/L0X/RL0X. FIGURE 6-4: I2C Address Selection Implementation.

6.3.2 INPUT IMPEDANCE

The MCP960X/L0X/RL0X us es a switched capacitor amplifier input stage to gain the input signal to a maximum resolution of 2 µV/LSb at an 18-bit ADC setting. An internal input capacitor is used for charge storage. The differential input impedance, Z IN_DF, is dominated by the sampling capacitor and the switched capacitor amplifier sampling frequency. During a sampling period, the charging and discharging of the sampling capacitor creates dynamic input currents at the input pins. Adding a 10-100 nF capacitor between the inputs can improve stability. Since the sampling capacitor is only switching to the input pins during a conversion process, the input impedance is only valid during conversion periods. During Low-Power or Shutdown mode, the input amplifier stage is disabled; therefore, the input impedance is Z IN_CM, which is due to the leakage current from ESD protection diodes, as shown in Figure 6-5. FIGURE 6-5: Thermocouple Input Stage. MCP960X/L0X/RL0X PIC® I2C Alert GND Types K, J, T, N, E, B, S, R VDD Alert GND VDD MCP960X/L0X/RL0X R7A R7B R2A R2B TABLE 6-2: RECOMMENDED RESISTOR VALUES FOR I 2C ADDRESSING Device # Command Byte Values RXA (k)R XB (k) 1 1100 000x ADDR Pin Tied to GND 2 1100 001x R2A = 10 R 2B = 2.2 3 1100 010x R3A = 10 R 3B = 4.3 4 1100 011x R4A = 10 R 4B = 7.5 5 1100 100x R5A = 10 R 5B = 13 6 1100 101x R6A = 10 R 6B = 22 7 1100 110x R7A = 10 R 7B = 43 8 1100 111x ADDR Pin Tied to VDD Note: Standard 5% tolerance resistors are used in the table; however, 1% tolerance resistors provide better ratio matching. ADDR ADDR VIN+ VIN- VIN+ VIN- Microcontroller Unit 2/8 Unit 7/8 Types K, J, T, N, E, B, S, R Up to Eight Devices on the I2C Bus RSS VIN+,VIN- Sampling Switch SS RS CSAMPLE (3.2 pF) V

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6.3.3 OPEN AND SHORT DETECTION

For the MCP9600/L00/RL00, external circuits can be added to detect the thermocouple status as open (physically disconnected) or as short (thermocouple wire in contact with the system ground or V DD). If a passive circuit is added to the input stage, then the circuit loading effect to the MCP9600/L00/RL00 ADC inputs must be considered. System calibration is also required to ensure proper accuracy. In addition, external loads can degrade the device performance, such as input offset, gain and Integral Nonlinearity (INL) errors. If a low-impedance active circuit is added, then both offset and gain errors must be calibrated. The MCP9601/L01/RL01 has a Thermocouple open and short-circuit detection mechanism, which is imple- mented using a Sense-Input pin (V SENSE), as shown in Figure 1-1. The V SENSE pin and R A and R B resistors must be connected as indicated in Figure 1-1. For proper operation, the resistor values must also be within the specified tolerance range. When open-circuit or short-circuit conditions are detected, the OC Alert and SC Alert Active-High Push-Pull outputs are asserted, respectively.

6.3.3.1 Open-Circuit Detection Technique

For MCP9600/L00/RL00 open-circuit detection, the Input Range bit (bit 4) of the STATUS register (Register 5-6), can be used to detect open-circuit conditions. This would require a few external resistors, as shown in Figure 6-6. The passive circuit does not affect the MCP9600/L00/RL00 accuracy. When the thermocouple is connected, the input Common-mode voltage is 50% of V DD. When the thermocouple is disconnected, the voltage at the V IN+ input is 66% of VDD and the voltage at the V IN- input is pulled low to VSS. This change forces the Input Range bit to be set. The MCP9601/L01/RL01 open-circuit detection mechanism operates similarly (see Figure 6-7), and the detection thresholds are specified as V SiOC and VSiNOR (see DC Characteristics). The host controller can momentarily poll the Status bit to detect the Open-Circuit condition. For the MCP9601/L01/RL01, the OC Alert pin can are used as hardware indicator. FIGURE 6-6: Adding Open-Circuit Detection Resistors (MCP9600/L00/RL00). FIGURE 6-7: Adding Open-Circuit Detection Resistors (MCP9601/L01/RL01). Del Sig VIN+ VIN- MCP9600/L00/RL00 Thermocouple VDD RB RB 5$ 0ȍ“7ROHUDQFH 0D[ 0ȍ“7ROHUDQFH Del Sig VIN+ VIN-Thermocouple RA VDD RB VSENSE MCP9601/L01/RL01 5$ 0Ÿ“7ROHUDQFH 0D[ 0Ÿ“7ROHUDQFH 5& .Ÿ“7ROHUDQFH

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6.3.4 ALIASING AND ANTI-ALIASING

Aliasing occurs when the input signal contains time varying signals with frequency greater than half the sample rate. In the aliasing conditions, the ADC can output unexpected codes. The ADC integrates a first order sync filter; however, an external anti-aliasing filter can provide an added filter for high noise applications. This can be done with a simple RC low-pass filter at the inputs, as shown in Figure 6-8. Open-circuit detection resistors can also be added, as shown in Figure 6-9. FIGURE 6-8: Adding a Low-Pass Filter. FIGURE 6-9: Adding Open-Circuit Detection Resistors with an Input Low-Pass Filter (MCP9600/L00/RL00, see Section 6.3.3 “Open and Short Detection Circuits”). FIGURE 6-10: Adding Open-Circuit Detection Resistors with an Input Low-Pass Filter (MCP9601/L01/RL01).

6.3.5 ESD PROTECTION USING FERRITE

Ferrite beads and Transient Voltage Suppression (TVS) Diodes are highly recommended to protect the MCP960X/L0X/RL0X and other devices from a high frequency noise and ESD discharge through the thermocouple wire. These additional components can be added to the input channel as shown in Figure 6-11 and Figure 6-12. FIGURE 6-11: Adding Ferrite Beads (MCP9600/L00/RL00). FIGURE 6-12: Adding Ferrite Beads (MCP9601/L01/RL01). Del Sig VIN+ VIN-Thermocouple C RA RA ADC Core 5$ Ÿ & ȝ) Del Sig VIN+ VIN-Thermocouple C VDD RB MCP9600/L00/RL00 5$ 0Ÿ“7ROHUDQFH 0D[ 5% 0Ÿ“7ROHUDQFH 5' Ÿ & ȝ) Del Sig VIN+ VIN-Thermocouple C RA VDD RB VSENSE MCP9601/L01/RL01 5$ 0Ÿ“7ROHUDQFH 0D[ 0Ÿ“7ROHUDQFH 5& .Ÿ“7ROHUDQFH 5' Ÿ & ȝ) Del Sig VIN+ VIN-Thermocouple C RB R$ VDD L L VDD DD DD MCP9600/L00/RL00 5$ 0Ÿ“7ROHUDQFH 0D[ 5% 0Ÿ“7ROHUDQFH 5' Ÿ & ȝ) / )HUULWH%HDG ' 796'LRGH Del Sig VIN+ VIN-Thermocouple C RA VDDRB L L VDD DD DD MCP9601/L01/RL01 5$ 0Ÿ“7ROHUDQFH 0D[ 0Ÿ“7ROHUDQFH 5& .Ÿ“7ROHUDQFH 5' Ÿ & ȝ) / )HUULWH%HDG ' 796'LRGH VSENSE

 2015-2021 Microchip Technology Inc. DS20005426G-page 47 MCP960X/L0X/RL0X NOTES:

 2015-2021 Microchip Technology Inc. DS20005426G-page 48 MCP960X/L0X/RL0X

7.0 PACKAGING INFORMATION

7.1 Package Marking Information

Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 20-Lead MQFN (5 × 5 × 1.0 mm) Examples PIN 1 PIN 1 MCP9600 E/MX 1932256 PIN 1 96L00 1932256 PIN 1 96RL00 1932256 PIN 1 9601 1932256 PIN 1 96L01 1932256 PIN 1 96RL01 1932256

 2015-2021 Microchip Technology Inc. DS20005426G-page 49 MCP960X/L0X/RL0X BA 0.10 C 0.10 C

0.10 C A B

0.05 C (DATUM B) (DATUM A) C SEATING PLANE NOTE 1 N 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 1 N 0.10 C 0.08 C Microchip Technology Drawing C04-186B Sheet 1 of 2 20X For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body [MQFN] - (Also called VQFN) D E K 20X b e L (A3) A

 2015-2021 Microchip Technology Inc. DS20005426G-page 50 MCP960X/L0X/RL0X Microchip Technology Drawing C04-186B Sheet 2 of 2 Number of Pins Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A b e L E N

0.65 BSC

0.20 REF

0.35 0.25 0.90 0.00 0.30 0.40 0.95 0.02 MILLIMETERS MIN NOM 0.45 0.35 1.00 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Overall Length Exposed Pad Length D D2 3.15

5.00 BSC

3.25 3.35 20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body [MQFN] - (Also called VQFN) 3.15 3.25 3.35

 2015-2021 Microchip Technology Inc. DS20005426G-page 51 MCP960X/L0X/RL0X RECOMMENDED LAND PATTERN Microchip Technology Drawing C04-186B 20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body SILK SCREEN Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units Optional Center Pad Width Contact Pad Spacing Contact Pad Spacing Optional Center Pad Length Contact Pitch 3.35 3.35 MILLIMETERS E MAX 4.50 4.50 Contact Pad Length (X20) Contact Pad Width (X20) 0.55 0.40 GDistance Between Pads 0.20 NOM [MQFN] - (Also called VQFN) EV EV E ØV G

 2015-2021 Microchip Technology Inc. DS20005426G-page 52 MCP960X/L0X/RL0X APPENDIX A: REVISION HISTORY Revision G (April 2021) The following is the list of modifications: 1. Updated the “MCP960X/L0X/RL0X Block Diagram” 2. Updated bit 3 description of Register 5-11. 3. Minor typographical edits. 4. Changed V SENSE thresholds from the electrical specifications table (See Errata). 5. Added T POR specification. 6. Updated Figure 1-1. 7. Updated Figure 6-6, 7, 9, 10, 11, 12. Revision F (August 2019) The following is the list of modifications: 1. Added the MCP9601/L01/RL01 device family and related information throughout the document. Revision E (January 2019) The following is the list of modifications: 1. Added the MCP96RL00/RL01 device and related information throughout the document. Revision D (August 2018) The following is the list of modifications: 1. Added the MCP96L00 device and related information throughout the document. Revision C (September 2017) The following is the list of modifications: 1. Updated Figure 4-3, Equation 5-1, Equation 5-2 and Equation 5-3. 2. Updated Section 6.3.3.1 “Open-Circuit Detection Technique”. 3. Various typographical edits. Revision B (June 2016) The following is the list of modifications: 1. Corrected the pin description error for pins 19 and 20 on page 1. 2. Added the MCP9600 Evaluation Board picture on page 2. 3. Added Section 6.3.3.1 “Open-Circuit Detection Technique” and updated Section 6.3.4 “Aliasing and Anti-Aliasing Filter” and Section 6.3.5 “ESD Protection Using Ferrite Beads”. 4. Updated the Product Identification System section. Revision A (August 2015)

• Original release of this document.

 2015-2021 Microchip Technology Inc. DS20005426G-page 53 MCP960X/L0X/RL0X NOTES:

 2015-2021 Microchip Technology Inc. DS20005426G-page 54 MCP960X/L0X/RL0X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . Device: MCP9600: Signal Conditioning IC (1) MCP9600T: Signal Conditioning IC (1) (Tape and Reel) MCP96L00: Signal Conditioning IC (1) MCP96L00T: Signal Conditioning IC (1) (Tape and Reel) MCP96RL00: Signal Conditioning IC (1) MCP96RL00T: Signal Conditioning IC (1) (Tape and Reel) MCP9601: Signal Conditioning IC (1) MCP9601T: Signal Conditioning IC (1) (Tape and Reel) MCP96L01: Signal Conditioning IC (1) MCP96L01T: Signal Conditioning IC (1) (Tape and Reel) MCP96RL01: Signal Conditioning IC (1) MCP96RL01T: Signal Conditioning IC (1) (Tape and Reel) Tape and Reel Option: T = Tape and Reel (2) Temperature Range: E = -40°C to +125°C Package: MX = More Thin Plastic Quad Flat, MQFN, 20-Lead Note 1: For custom thermocouple types or custom features, please contact your local Microchip sales office. Minimum purchase volumes are required. 2: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. Examples: a) MCP9600-E/MX: Extended temperature, 20-lead MQFN package b) MCP9600T-E/MX: Tape and Reel, Extended temperature, 20-lead MQFN package c) MCP96L00-E/MX: Extended Temperature, 20-lead MQFN package d) MCP96L00T-E/MX: Tape and Reel, Extended temperature, 20-lead MQFN package e) MCP96RL00-E/MX: Extended temperature, 20-lead MQFN package f) MCP96RL00T-E/MX: Tape and Reel, Extended temperature, 20-lead MQFN package g) MCP9601-E/MX: Extended temperature, 20-lead MQFN package h) MCP9601T-E/MX: Tape and Reel, Extended temperature, 20-lead MQFN package i) MCP96L01-E/MX: Extended Temperature, 20-lead MQFN package j) MCP96L01T-E/MX: Tape and Reel, Extended temperature, 20-lead MQFN package k) MCP96RL01-E/MX: Extended temperature, 20-lead MQFN package l) MCP96RL01T-E/MX: Tape and Reel, Extended temperature, 20-lead MQFN package PART NO.(1) X /XX PackageTemperature Range Device X Tape and Reel Option

 2015-2021 Microchip Technology Inc. DS20005426G-page 55 MCP960X/L0X/RL0X NOTES:

 2015-2021 Microchip Technology Inc. DS20005426G-page 56 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-8109-6 Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the i ntended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

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