MCP9509 MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

  • Resistor-Programmable Temperature Switch
  • Wide Operating Voltage Range: 2.7V to 5.5V
  • Low Supply Current: 30 µA (typical)
  • Temperature Switch Accuracy: - ±0.5°C (typical) at +25°C, +45°C - ±1°C (typical) 0°C to +70°C - ±3.5°C (maximum) 0°C to +125°C - ±4.5°C (maximum) -20°C to +125°C - ±2°C (typical) -40°C to +125°C
  • Sensor Options available: - Switch for rising temperature: Cold to Hot (H) - Switch for falling temperature: Hot to Cold (C)
  • Output Configurations: - Open-Drain: – External Pull-up Resistor: MCP9509 – Internal Pull-up Resistor: MCP9510 - Active-Low, Push-Pull: MCP9510 - Active-High, Push-Pull: MCP9510
  • User Selectable Hysteresis: 2°C or 10°C (typical)
  • Space-Saving SOT-23-5, SOT-23-6 Packages

Applications

  • Power Supply Thermal Shutdown
  • Temperature Alarm
  • Thermostat Control
  • Fan Control
  • Base-Stations
  • Automotive Typical Performance

Description

Microchip Technology’s MCP9509/10 devices are pro- grammable logic output te mperature switches. The temperature switch threshold can be programmed with a single external resistor, which provides high design flexibility and simplicity. In addition, this family of devices provide user progr ammable features such as 2°C and 10°C (typical) switch hysteresis and output structure configuration. The MCP9509 provides an open drain output, whereas the MCP9510 is offered in three different user selectab le output configurations: Active-low/Active-high push pull and Active-Low Open-Drain output with an internal 100 k Ω pull-up resistor. The MCP9509/10 operate from 2.7V to 5.5V. This family is capable of triggering for temperatures -40°C to +125°C with high accuracy. Package Types 12% 16% 20% -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 Temperature Accuracy (°C) Occurrences TA = +45°C VDD = 4.1V

9087 Units

6 Lots

5 OUTSET

Resistor-Programmable Temperature Switches

DS22114A-page 2 © 2008 Microchip Technology Inc. NOTES:

© 2008 Microchip Technology Inc. DS22114A-page 3 MCP9509/10

1.0 ELECTRICAL

Absolute Maximum Ratings † Junction Temperature (T †Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, and GND = Ground. Parameters Sym Min Typ Max Unit Conditions Sensor Accuracy TA = +25°C, +45°C T ACY —± 0 . 5 — ° C Note 1 Power Supply Operating Voltage V DD 2.7 — 5.5 V Operating Current (MCP9509) I DD —3 0 5 0 µ A Operating Current (MCP9510) I DD — 50 80 µA OUTSET = GND or V DD — 100 165 µA OUTSET = Unconnected Hysteresis Trip Point Hysteresis T HYST — +2 — °C HYST = GND — +10 — °C HYST = V DD Hysteresis Select: Input (HYST) Thresholds VIH VDD -0 . 4 — — V VIL —— 0 . 4 V Hysteresis Input (HYST) Leakage I Leak —1 — µ A MCP9510 Output Control Input (OUTSET Input) OUTSET Input Voltage Threshold and Output Configuration Push-Pull, Active Low V OSET GND — 0.2V DD V Open-Drain with R OUT, Active Low 0.45VDD —0 . 7 V DD V or OUTSET Unconnected Push-Pull, Active High 0.85V DD —V DD V OUTSET Input Leakage and Output Configuration Push-Pull, Active Low I Leak —1 0 — µ A G N D ≤ VOSET ≤ 0.2VDD Open-Drain, Active Low — 0 — µA Unconnected (i.e. open) —7 — µ A 0 . 4 V DD ≤ VOSET ≤ 0.7VDD Push-Pull, Active High — -10 — µA 0.85 ≤ VOSET ≤ VDD OUTSET Input Impedance Z OUTSET —5 0 0 — k Ω Note 1: This specification is tested at mid supply of 4.1V for optimum operation across the supply voltage range of 2.7V to 5.5V.

DS22114A-page 4 © 2008 Microchip Technology Inc. Outputs (OUT, OUT) Output Voltage High, MCP9510 V OH VDD - 0.55 — VDD VI OUT = 5 mA OUTSET = VDD or GNDOutput Voltage Low, MCP9510 V OL GND — 0.3 V Output Voltage Low, MCP9509 V OL GND — 0.3 V I OUT = 5 mA Internal Output Pull-up (MCP9510) R OUT 60 100 140 k Ω OUTSET Unconnected Open-Drain Output Leakage I Leak — 1 — µA MCP9509/10 Power Supply Rejection PSR — 0.05 — °C/V Thermal Response SOT23-5, SOT23-6 t RES — 1.7 — s Time to 63% (88°C). +25°C (Air) to +125°C (oil bath) DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, and GND = Ground. Parameters Sym Min Typ Max Unit Conditions Note 1: This specification is tested at mid supply of 4.1V for optimum operation across the supply voltage range of 2.7V to 5.5V. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, and GND = Ground. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range T A -40 — +125 °C (Note 1) Operating Temperature Range T A -40 — +125 °C Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances Thermal Resistance, 5L-SOT23 θ JA — 220.7 — °C/ Ω Thermal Resistance, 6L-SOT23 θJA — 190.5 — °C/ Ω Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).

© 2008 Microchip Technology Inc. DS22114A-page 5 MCP9509/10

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, V DD = 2.7V to 5.5V, T A = -40°C to +125°C, GND = Ground, R PULL-UP = 10 k Ω (MCP9509 only) and 0.1 µf bypass capacitor. FIGURE 2-1: Temperature Accuracy. FIGURE 2-2: Output Hysteresis vs. Temperature. FIGURE 2-3: Output Hysteresis vs. Temperature. FIGURE 2-4: Supply Current vs. Temperature (MCP9509). FIGURE 2-5: Supply Current vs. Temperature OUTSET = VDD, VSS (MCP9510). FIGURE 2-6: Supply Current vs. Temperature OUTSET = Unconnected, Open (MCP9510). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. The performance characteristics listed herein are not tested or guaranteed. In so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -5.0 -2.5 0.0 2.5 5.0 - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Temperature (°C) Temperature Accuracy (°C) Spec. Limit MCP9509C MCP9509H MCP9510C MCP9510H + σ Average - σ 0.0 1.0 2.0 3.0 4.0 5.0 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Hysteresis (°C) 0.0 1.0 2.0 3.0 4.0 5.0 Hysteresis (kΩ) Hysteresis (kΩ) Hysteresis (°C) HYST = GND 5.0 7.0 9.0 11.0 13.0 15.0 -40 -20 0 20 40 60 80 100 120 TA (°C) Hysteresis (°C) 5.0 6.0 7.0 8.0 9.0 10.0 Hysteresis (kΩ) Hysteresis (kΩ) Hysteresis (°C) HYST = VDD -40 -20 0 20 40 60 80 100 120 Temperature (°C) Supply Current, I DD (µA) VDD = 5.5V VDD = 4.1V VDD = 2.7V MCP9509C MCP9509H -40 -20 0 20 40 60 80 100 120 Temperature (°C) Supply Current, I DD (µA) VDD = 5.5V VDD = 4.1V VDD = 2.7V MCP9510C MCP9510H OUTSET = VDD, VSS - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Temperature (°C) IDD (µA), De-Asserted 100 105 110 IDD (µA), Asserted MCP9510C MCP9510H VDD = 4.0V Asserted, Internal Pull-Up Current De-Asserted OUTSET = Open OUT = Open-Drain Output with Internal Pull-

DS22114A-page 6 © 2008 Microchip Technology Inc. Note: Unless otherwise indicated, V DD = 2.7V to 5.5V, T A = -40°C to +125°C, GND = Ground, R PULL-UP = 10 k Ω (MCP9509 only) and 0.1 µf bypass capacitor. FIGURE 2-7: Temperature Accuracy Histogram at +45°C. FIGURE 2-8: Temperature Accuracy Histogram at +70°C. FIGURE 2-9: Temperature Accuracy Histogram at +125°C. FIGURE 2-10: Temperature Accuracy Histogram at 0°C. FIGURE 2-11: Temperature Accuracy Histogram at -20°C. FIGURE 2-12: Temperature Accuracy Histogram at -40°C. 12% 16% 20% -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 Temperature Accuracy (°C) Occurrences TA = +45°C VDD = 4.1V 12% 16% 20% -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 Temperature Accuracy (°C) Occurrences TA = +70°C VDD = 4.1V

9280 Units

12% 16% 20% -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 Temperature Accuracy (°C) Occurrences TA = +125°C VDD = 4.1V

9083 Units

12% 16% 20% -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 Temperature Accuracy (°C) Occurrences TA = 0°C VDD = 4.1V

8936 Units

12% 16% 20% -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 Temperature Accuracy (°C) Occurrences TA = -20°C VDD = 4.1V

8304 Units

12% 16% 20% -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Temperature Accuracy (°C) Occurrences TA = -40°C VDD = 4.1V

9412 Units

DS22114A-page 8 © 2008 Microchip Technology Inc. NOTES:

© 2008 Microchip Technology Inc. DS22114A-page 9 MCP9509/10

3.0 PIN DESCRIPTIONS

TABLE 3-1: PIN FUNCTION TABLE

3.1 External Resistor Input (SET)

This pin is used to connect a resistor between the SET and GND pins to select the temperature trip point (TSET). The resistor value can be determined either from Equation 4-2 or the lookup table shown in Table 4-2.

3.2 Ground (GND)

The GND pin is the system ground pin.

3.3 Hysteresis Input (HYS)

This is an input pin which can be connected to V DD or GND to select output hysteresis. Either 2°C (HYS = GND) or 10°C (HYS = V DD) of hysteresis can be selected.

3.4 Power Pin (V DD)

The operating voltage range, as specified in the DC electrical specification table, is applied on this pin.

3.5 Open-Drain Output (OUT )

(MCP9509) This output is triggered when temperature exceeds the programmed trip temperatur e. This pin requires a pull-up resistor.

3.6 Selectable Output (OUT, OUT )

(MCP9510) The output pin can be configured as either a Push-Pull Active-High, Push-Pull Active-Low, or an Open-drain Output with an internal pull-up resistor. The three output options of the MCP9510 are selected by the OUTSET pin.

3.7 Output Control (OUTSET)

(MCP9510) The OUTSET pin is used to select the desired configuration of the OUT or OUT pin. TABLE 3-1: OUTSET SELECTABLE OUTPUTS MCP9509 MCP9510 Symbol Description SOT-23-5 SOT-23-6 1 1 SET External Trip Temperature Resistor (R SET) input 2 2 GND Ground 3— O U T Open-drain output —3 O U T , OUT Selectable Output pin, function set by OUTSET pin 4 4 HYS Hysteresis Input HYS = GND, hysteresis is 2°C HYS = V DD, hysteresis is 10°C

56 V DD Power pin

— 5 OUTSET Output Control OUTSET = GND, Active-Low, Push-Pull OUTSET = V DD, Active-High, Push-Pull OUTSET = Unconnected, Active-Low, Open-Drain with an internal pull-up OUTSET Pin OUT / OUT Pin GND Push-Pull, Active-Low VDD Push-Pull, Active-High unconnected (i.e. open) Open-Drain output with an internal pull-up resistor of 100 kΩ (typical)

DS22114A-page 10 © 2008 Microchip Technology Inc. NOTES:

© 2008 Microchip Technology Inc. DS22114A-page 11 MCP9509/10

4.0 FUNCTIONAL DESCRIPTION

The MCP9509/10 integrates a temperature switch with a user programmable threshold. The temperature switch threshold or alert limit is programmed using an external resistor RSET. A logic signal is asserted when the die temperature crosses the programmed alert limit. The MCP9509 has an Open-Drain output which requires an external pull-up resistor for operation. The MCP9510 output can be configured to three user selectable output configurations. The OUTSET pin is used to select Active-Low Push-Pull, Active-Low Open-Drain (with internal 100 k Ω pull-up resistor), Active-High Push-Pull output configurations. In addi- tion, this device provides user selectable hysteresis of 2°C and 10°C (typical).

4.1 SET Input Pin

The SET input pin is used to connect an external resistor RSET. The resistor sets the alert threshold. The SET pin outputs a constant current ISET (~5 µA) to bias RSET (Shown in Figure 4-1). The voltage across RSET, VSET, is compared to an internal thermal diode. FIGURE 4-1: SET input. When the thermal diode voltage exceeds V SET, the sensor output asserts. The assert polarity is determined by the state of the OUTSET pin.

4.2 MCP9510 OUTSET Input Pin

This pin is used to select the device output configura- tion. This feature enables in-circuit device output con- figuration by driving this pin with a microcontroller I/O pin to Output-HIGH, Out put-LOW, or High-Impedance input. Figure 4-4 shows the configuration and output conditions. The input structure of this pin consists of a resistor lad- der and comparators to determine OUTSET level threshold. Figure 4-2 shows the circuit configuration. The OUTSET input resistance must be carefully considered for leakage current when connecting volt- age source to change output configuration. FIGURE 4-2: MCP9510 OUTSET Input Structure. The OUTSET pin input impedance Z OUTSET is set by the internal resistance R A = 1 M Ω (typical). The input structure is a voltage divider network from V DD. Therefore, the leakage current on the OUTSET pin is a function of change in V DD and the VOSET.

4.3 HYST Input Pin (Hysteresis Select)

The MCP9509/10 family has a user selectable hysteresis input pin HYST. Hysteresis can be externally selected to either 2°C (HYST = GND) or 10°C (HYST = V DD). Figure 4-3 shows graphical description of change in hysteresis. For example, if the alert temperature threshold is set to TSET = 100°C (RSET = 16.1 kΩ) with an Active-Low out- put configuration, the output asserts Low when temper- ature exceeds 100°C ± T ACY. The output remains asserted Low until temperautre falls below THYST, 98°C (HYST = GND) or 90°C (HYST = VDD). FIGURE 4-3: Output Hysteresis. SET RSET VSET ISET Rx OUT/ OUT Thermal Diode VDD OUTSET Pin RA RA MCP9510 Cold Hot TSETTHYST Temperature VOUT 10°C Typical Hysteresis 2°C Typical Hysteresis

DS22114A-page 12 © 2008 Microchip Technology Inc.

4.4 Sensor Hot/Cold Options

MCP9509/10 is available with Hot (H) and Cold (C) options. The MCP9509/10 Hot option detects rising temperature while the Cold option detects falling tem- perature. The output of the Hot option asserts when temperature rises above T SET and de-asserts when temperature falls below THYST. The output of the Cold option asserts when temperature falls below TSET and de-asserts when temperature rises above THYST. For example, if T SET = 100°C for Hot option (Active-Low Configuration, HYST = V DD), output asserts Low when temperature is greater than 100°C ± TACY. The output de-asserts High when temperature is below 90°C. For the Cold option, output asserts Low when temperature is less than 100°C ± TACY, and de-asserts when temperature is greater than 110°C. This operation is shown graphically in Figure 4-4. 4.5 R SET vs. Temperature The relation between the user selectable external resistor RSET and the output trigger threshold limit TSET is described as shown in EQUATION 4-1: “T SET to Rset conversion” and EQUATION 4-2: “RSET to Tset conversion”. The equation coeffcients vary depending on the device output options, H or C. Table 4-1 shows the corresponding coefficients. TABLE 4-1: COEFFICIENTS/VARIABLES EQUATION 4-1: T SET TO RSET CONVERSION EQUATION 4-2: R SET TO TSET CONVERSION The equations can be used to determine the external resistance value for a specified temperature threshold or threshold value for a specified resistance. Table 4-2 and Table 4-3 show a look-up table which can be used to easily identify the TSET to RSET relation for Hot and Cold options. Coef. MCP9509/10H MCP9509/10C Units CR1 -9.84 -10.00 10 -6kΩ/°C3 CR2 3.355 3.345 10 -3kΩ/°C2 CR3 -0.8648 -0.8610 k Ω/°C CT2 4.136 4.179 10-3°C/kΩ2 CT3 -1.1564 -1.1617 °C/kΩ R1 94.1 95.1 k Ω R2 145.5 146.3 k Ω R3 2.77 4.25 k Ω T1 -40.0 °C T2 125.0 °C Where: CR1,2,3 = 1st, 2nd and 3rd order Temperature to Resistance Conversion Coefficients (Table 4-1) R2 = Resistance ( Table 4-1) T1,2 = Temperature ( Table 4-1) RSET CR1TSET TSET T1–() TSET T2–() += CR2 TSET T1–() TSET T2–() + CR3 TSET T1–() R2+ Where: CC1,2,3 = 1st, 2nd and 3rd order Resistance to Temperature Conversion Coefficients (Table 4-1) R1,2,3 = Resistance ( Table 4-1) T1 = Temperature ( Table 4-1) TSET CT1 RSET R1–() RSET R2–() RSET R3–() += CT2 RSET R3–() RSET R2–() + CT3 RSET R2–() T1+

© 2008 Microchip Technology Inc. DS22114A-page 13 MCP9509/10 FIGURE 4-4: MCP9509/10 OUT/OUT Output Configuration. Cold Hot Hysteresis TSETTHYST Temperature V OUT MCP9510H Output OUTSET −> VOSET < 0.2VDD Output −> Push-Pull OUT −> Active-Low Cold Hot Hysteresis TSETTHYST Temperature V OUT OUTSET −> VDD Output −> Push-Pull OUT −> Active-High OUTSET −> Open/Unconnected or OUTSET −> 0.45VDD≤VOUTSET≤ 0.7VDD Output −> Open-Drain with ROUT OUT −> Active-Low Cold Hot Hysteresis TSETTHYST Temperature VOUT MCP9510C Output Cold Hot Hysteresis Cold Hot Hysteresis TSETTHYST TSET THYST Temperature Temperature V V OUT OUT Output −> Open-Drain with external Pull-up OUT −> Active-Low Cold Hot Hysteresis TSET THYST Temperature VOUT Cold Hot Hysteresis TSET THYST Temperature VOUT Cold Hot Hysteresis TSET THYST Temperature VOUT MCP9510H Output MCP9510C Output MCP9510H Output MCP9510C Output MCP9509H Output MCP9509C Output

DS22114A-page 14 © 2008 Microchip Technology Inc. TABLE 4-2: T SET TO RSET CONVERSION TABLE FOR MCP9509/MCP9510H (HOT) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ)

© 2008 Microchip Technology Inc. DS22114A-page 15 MCP9509/10 TABLE 4-3: T SET TO RSET CONVERSION TABLE FOR MCP9509/MCP9510C (COLD) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ) TSET (°C) RSET (kΩ)

DS22114A-page 16 © 2008 Microchip Technology Inc.

4.6 Application Information

The MCP9509/10 temperature switch integrates a temperature sensor and a comparator circuit which out- puts an alert signal when the user programmed tem- perature threshold is exceeded. The external resistor value to set the output threshold can be determined using Table 4-2. A constant current source I SET = 5 µA (typical) biases the external resistor R SET. A thermal diode is used to measure ambient temperature. When the voltage across the thermal diode exceeds the volt- age across RSET, VSET, the sensor output asserts. The sensor output de-asserts when the diode voltage drops below V SET and the user selected hysteresis level. The MCP9509/10 provide Open-drain output where multiple sensors from mu ltiple PCB hot-spots can be connected to a single processor I/O input with a wired-Or Configuration. The MCP9509 requires an external pull-up resistor which can be used to level-shift the alert signal. For example, if the sensors are powered with 5V DD and the controller or processor is powered with 3V DD, the external resistor can be level-shifted by connecting 3VDD to the pull-up resistor as shown in Figure 4-5. The MCP9510 elliminates the need for an external resistor while providing wired-Or function ( Figure 4-6). The MCP9510 also provides push-pull output configuration for a direct connection to the processor with Active-Low or Active-High assert polarities. FIGURE 4-5: MCP9509 Wired-Or Output Configuration with Level-shift. FIGURE 4-6: MCP9510 Wired-Or Output Configuration with Internal Pull-up Resistor.

4.6.1 LAYOUT CONSIDERATION AND

This family of sensors me asure temperature by moni- toring the voltage level of a thermal diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors PCB temperature. For efficient performance, it is recommended to layout the device as close to the heat source as possible. It is also recommended to use a de-coupling capacitor of 0.1 µF to 1 µF between V DD and GND pins for stability. When connecting an external resistor to the MCP9509 device, the current through the pull-up resistor must be considered to prevent self-heat due to power. This can be determined using Equation 4-3. EQUATION 4-3: EFFECT OF SELF-HEATING SET OUT HYST 5VDD SET RSET OUT HYST 5VDD I/O 3VDD RPULL_UP Micro- controller RSET MCP9509 MCP9509 3VDD SET OUT HYST 5VDD SET RSET OUT HYST 5VDD I/O Micro- controller RSET MCP9510 MCP9510 OUTSET OUTSET 5VDD Where: TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (220.7 °C/W) VOL = Sensor Output Low Voltage IOUT = Output Current TJ TA– θJA VDD IDD× VOL IOUT×+()=

© 2008 Microchip Technology Inc. DS22114A-page 17 MCP9509/10 For example, at room temperature, when output asserts Active-Low and maximum I DD = 50 µA, VDD =5 . 5 V , VOL = 0.3V and IOUT = 5 mA (see specifi- cation table), the self heating due to power dissipation (TJ - TA) is ~0.4°C.

4.6.2 DRIVING OUTSET WITH A

The OUTSET pin can be controlled using a Microcon- troller input/output (I/O) pin. I/O levels HIGH and LOW provide push-pull configuration with Active-High and Active-Low outputs, respectively. The Open-Drain output with internal pull-up resistor can be selected by configuring the I/O pin as a High-Impedance Input. The Open-Drain output can also be selected by forcing volt- age level V OSET from a low impedance source. With this configuration, there maybe some leakage current due to impedance mismatch, (See Figure 4-2).

4.6.3 POWER SUPPLY REJECTION

The MCP9509/10 family of sensors are designed to prevent false output trigger due to high frequency power supply or system noise. Figure 4-7 shows device performance with a high frequency signal added on VDD. The output is not triggered due to the signal added on V DD. With some applications, it is recommended to add a bypass capacitor of 0.1 µF to 1µ F . FIGURE 4-7: Power Supply Rejection (PSR). 10 100 10 00 10 000 10 000 0 10 000 00 10 000 000 Frequency (Hz) Output Voltage (V) MCP9509/10 Power Supply Rejection No False Trigger 100 10M 100 VDD = 5V + 400mVAC VDD = 5V + 400mVSQR

DS22114A-page 18 © 2008 Microchip Technology Inc. NOTES:

© 2008 Microchip Technology Inc. DS22114A-page 19 MCP9509/10

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

5-Lead SOT-23 Example: XXNN 1 23 5 4 AQ25 Device Code MCP9509CT-E/OT AQNN MCP9509HT-E/OT BPNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 6-Lead SOT-23 XXNN Example AK25 Part Number Code MCP9510CT-E/CH AKNN MCP9510HT-E/CH ALNN

DS22114A-page 20 © 2008 Microchip Technology Inc. /g24/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g54/g80/g68/g79/g79/g3/g50/g88/g87/g79/g76/g81/g72/g3/g55/g85/g68/g81/g86/g76/g86/g87/g82/g85/g3/g11/g50/g55/g12/g3/g62/g54/g50/g55/g16/g21/g22/g64 /g49/g82/g87/g72/g86/g29 /g20/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g86/g3/g39/g3/g68/g81/g71/g3/g40/g20/g3/g71/g82/g3/g81/g82/g87/g3/g76/g81/g70/g79/g88/g71/g72/g3/g80/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g17/g3/g48/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g3/g86/g75/g68/g79/g79/g3/g81/g82/g87/g3/g72/g91/g70/g72/g72/g71/g3/g19/g17/g20/g21/g26/g3/g80/g80/g3/g83/g72/g85/g3/g86/g76/g71/g72/g17 /g21/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86 /g48/g44/g47/g47/g44/g48/g40/g55/g40/g53/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g49/g50/g48 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g51/g76/g81/g86 /g49 /g24 /g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72 /g19/g17/g28/g24/g3/g37/g54/g38 /g50/g88/g87/g86/g76/g71/g72/g3/g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72/g20 /g20/g17/g28/g19/g3/g37/g54/g38 /g50/g89/g72/g85/g68/g79/g79/g3/g43/g72/g76/g74/g75/g87 /g36 /g19/g17/g28/g19 /g177 /g20/g17/g23/g24 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g36/g21 /g19/g17/g27/g28 /g177 /g20/g17/g22/g19 /g54/g87/g68/g81/g71/g82/g73/g73 /g36/g20 /g19/g17/g19/g19 /g177 /g19/g17/g20/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g40 /g21/g17/g21/g19 /g177 /g22/g17/g21/g19 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g58/g76/g71/g87/g75 /g40/g20 /g20/g17/g22/g19 /g177 /g20/g17/g27/g19 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g39 /g21/g17/g26/g19 /g177 /g22/g17/g20/g19 /g41/g82/g82/g87/g3/g47/g72/g81/g74/g87/g75 /g47 /g19/g17/g20/g19 /g177 /g19/g17/g25/g19 /g41/g82/g82/g87/g83/g85/g76/g81/g87 /g47/g20 /g19/g17/g22/g24 /g177 /g19/g17/g27/g19 /g41/g82/g82/g87/g3/g36/g81/g74/g79/g72/g73 /g19/g131 /g177 /g22/g19/g131 /g47/g72/g68/g71/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g70 /g19/g17/g19/g27 /g177 /g19/g17/g21/g25 /g47/g72/g68/g71/g3/g58/g76/g71/g87/g75 /g69 /g19/g17/g21/g19 /g177 /g19/g17/g24/g20 φ N b E D 1 2 3 e A A2 c L /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g19/g28/g20/g37

© 2008 Microchip Technology Inc. DS22114A-page 21 MCP9509/10 /g25/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g54/g80/g68/g79/g79/g3/g50/g88/g87/g79/g76/g81/g72/g3/g55/g85/g68/g81/g86/g76/g86/g87/g82/g85/g3/g11/g38/g43/g12/g3/g62/g54/g50/g55/g16/g21/g22/g64 /g49/g82/g87/g72/g86/g29 /g20/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g86/g3/g39/g3/g68/g81/g71/g3/g40/g20/g3/g71/g82/g3/g81/g82/g87/g3/g76/g81/g70/g79/g88/g71/g72/g3/g80/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g17/g3/g48/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g3/g86/g75/g68/g79/g79/g3/g81/g82/g87/g3/g72/g91/g70/g72/g72/g71/g3/g19/g17/g20/g21/g26/g3/g80/g80/g3/g83/g72/g85/g3/g86/g76/g71/g72/g17 /g21/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86 /g48/g44/g47/g47/g44/g48/g40/g55/g40/g53/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g49/g50/g48 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g51/g76/g81/g86 /g49 /g25 /g51/g76/g87/g70/g75 /g72 /g19/g17/g28/g24/g3/g37/g54/g38 /g50/g88/g87/g86/g76/g71/g72/g3/g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72/g20 /g20/g17/g28/g19/g3/g37/g54/g38 /g50/g89/g72/g85/g68/g79/g79/g3/g43/g72/g76/g74/g75/g87 /g36 /g19/g17/g28/g19 /g177 /g20/g17/g23/g24 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g36/g21 /g19/g17/g27/g28 /g177 /g20/g17/g22/g19 /g54/g87/g68/g81/g71/g82/g73/g73 /g36/g20 /g19/g17/g19/g19 /g177 /g19/g17/g20/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g40 /g21/g17/g21/g19 /g177 /g22/g17/g21/g19 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g58/g76/g71/g87/g75 /g40/g20 /g20/g17/g22/g19 /g177 /g20/g17/g27/g19 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g39 /g21/g17/g26/g19 /g177 /g22/g17/g20/g19 /g41/g82/g82/g87/g3/g47/g72/g81/g74/g87/g75 /g47 /g19/g17/g20/g19 /g177 /g19/g17/g25/g19 /g41/g82/g82/g87/g83/g85/g76/g81/g87 /g47/g20 /g19/g17/g22/g24 /g177 /g19/g17/g27/g19 /g41/g82/g82/g87/g3/g36/g81/g74/g79/g72/g73 /g19/g131 /g177 /g22/g19/g131 /g47/g72/g68/g71/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g70 /g19/g17/g19/g27 /g177 /g19/g17/g21/g25 /g47/g72/g68/g71/g3/g58/g76/g71/g87/g75 /g69 /g19/g17/g21/g19 /g177 /g19/g17/g24/g20 b E P I N1I DB Y LASER MARK D 1 2 3 e A A2 c L φ /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g19/g21/g27/g37

DS22114A-page 22 © 2008 Microchip Technology Inc. NOTES:

© 2008 Microchip Technology Inc. DS22114A-page 21 MCP9509/10 APPENDIX A: REVISION HISTORY Revision A (November 2008)

  • Original Release of this Document.

DS22114A-page 22 © 2008 Microchip Technology Inc. NOTES:

© 2008 Microchip Technology Inc. DS22114A-page 23 MCP9509/10 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP9509H: Resistor Programmable Temperature Switch, Hot Option MCP9509C Resistor Programmable Temperature Switch, Cold Option MCP9510H: Resistor Programmable Temperature Switch, Hot Option MCP9510C Resistor Programmable Temperature Switch, Cold Option Temperature Range: E = -40°C to +125°C Package: CH = Plastic Small Outline Transistor (SOT-23), 6-lead (MCP9510 only) OT = Plastic Small Outline Transistor (SOT-23), 5-lead (MCP9509) PART NO. -X /XX PackageTemperature Range Device Examples: a) MCP9509CT-E/OT: Cold option, Extended Temp., 5LD SOT-23 package. b) MCP9509HT-E/OT: Hot option, Extended Temp., 5LD SOT-23 package. a) MCP9510C-E/CH: Cold option, Extended Temp., 6LD SOT-23 package. b) MCP9510H-E/CH: Hot option, Extended Temp., 6LD SOT-23 package.

DS22114A-page 24 © 2008 Microchip Technology Inc. NOTES:

© 2008 Microchip Technology Inc. DS22114A-page 25 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC 32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2008, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices:

  • Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
  • Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
  • There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
  • Microchip is willing to work with the customer who is concerned about the integrity of their code.
  • Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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