MCP809 TI | Alldatasheet
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 MCP809/MCP8103-PinMicroprocessorResetCircuits Check forSamples: MCP809 ,MCP810 1FEATURES DESCRIPTION The MCP809/810 microprocessorsupervisorycircuits 2• PreciseMonitoringof3V,3.3V,and 5V Supply can be used to monitor the power suppliesinVoltages microprocessorand digitalsystems.They providea• Fullyspecifiedover temperature resettothemicroprocessorduringpower-up,power-
- 140ms min.Power-On Reset Pulse Width, down and brown-outconditions. 240ms Typical The functionoftheMCP809/810 istomonitortheVCC – Active-lowRESET Output (MCP809) supplyvoltage,and asserta resetsignalwhenever thisvoltagedeclinesbelow the factory-programmed– Active-highRESET Output (MCP810) resetthreshold.The resetsignalremainsassertedfor• SpecifiedRESET Output ValidforVCC ≥1V 240ms afterVCC risesabove the threshold.The
- Low Supply Current,15µA typical MCP809 has an active-lowRESET output,whilethe MCP810 has an active-highRESET output.• Power supply transientimmunity Seven standardresetvoltageoptionsare available,APPLICATIONS suitablefor monitoring5V, 3.3V, and 3V supply voltages.• MicroprocessorSystems
- Computers With a low supply currentof only 15µA, the MCP809/810 areidealforuse inportableequipment.• Controllers The MCP809/MCP810 are availablein the 3-pin• IntelligentInstruments SOT23 package.
- Portable/Battery-PoweredEquipment
- Automotive TypicalApplicationCircuit Figure1. TypicalApplicationCircuit Connection Diagram Figure2. ()areforMCP810 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2001–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
MCP809,MCP810 SNVS165A –JUNE 2001–REVISED MAY 2013 www.ti.com Pin Description PIN NAME FUNCTION
3 GND Ground reference
Active-lowoutput.RESET remainslowwhileVCC isbelowtheresetthreshold,and for240ms afterRESET (MCP809) VCC risesabove theresetthreshold. Active-highoutput.RESET remainshighwhileVCC isbelowtheresetthreshold,and for240ms afterRESET (MCP810) VCC risesabove theresetthreshold. 2 VCC SupplyVoltage(+5V,+3.3V,or+3.0V) These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1) VCC −0.3Vto6.0V RESET, RESET −0.3Vto(VCC + 0.3V) InputCurrent,VCC Pin 20mA OutputCurrent,RESET, RESET Pin 20mA Rate ofRise,VCC 100V/µs ESD Rating(2) 2kV ContinuousPower Dissipation(TA = +70°C) SOT-23 (3) 320mW AmbientTemperatureRange −40°C to+105°C Maximum JunctionTemperature 125°C StorageTemperatureRange −65°C to+160°C Lead Temperature(soldering,10sec) +300°C (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhichthe deviceoperatescorrectly.Operatingratingsdo notimplyspecifiedperformancelimits.Forspecifiedperformancelimitsand associated testconditions,see theElectricalCharacteristics. (2) The human body model isa 100pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. (3) Productiontestingdone atTA = +25°C, overtemperaturelimitsspecifiedby designonly.
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 ElectricalCharacteristics VCC = fullrange,TA = −40°C to+105°C, unlessotherwisenoted.TypicalvaluesareatTA = +25°C, VCC = 5V for Symbol Parameter Conditions Min Typ Max Units TA = 0°C to+70°C 1.0 5.5 VCC Range V TA = −40°C to VCC <5.5V,MCP8_ _ - 18 60 VCC <3.6V,MCP8_ _ - 15 50 3.08/2.93/2.63 ICC SupplyCurrent µA TA = +85°C to VCC <5.5V,MCP8_ _ - 100 VCC <3.6V,MCP8_ _ - 100 3.08/2.93/2.63 TA = +25°C 4.56 4.63 4.70 TA = +85°C to+105°C 4.40 4.86 TA = +25°C 4.31 4.38 4.45 TA = +85°C to+105°C 4.16 4.56 TA = +25°C 3.93 4.00 4.06 TA = +85°C to+105°C 3.80 4.20 VTH ResetThreshold(2) V TA = +25°C 3.04 3.08 3.11 TA = +85°C to+105°C 2.92 3.23 TA = +25°C 2.89 2.93 2.96 TA = +85°C to+105°C 2.78 3.08 TA = +25°C 2.59 2.63 2.66 TA = +85°C to+105°C 2.50 2.76 ResetThresholdTemperature 30 ppm/°CCoefficient VCC toResetDelay (2) VCC = VTH to(VTH − 100mV) 20 µs TA = −40°C to+85°C 140 240 560 ResetActiveTimeoutPeriod ms TA = +85°C to+105°C 100 840 (1) Atelevatedtemperatures,devicesmust be deratedbased on package thermalresistance.The deviceintheSOT23-3 package must be deratedat4mW/ °C atambienttemperaturesabove 70°C. The devicehas internalthermalprotection. (2) RESET OutputforMCP809, RESET outputforMCP810. Copyright© 2001–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:MCP809 MCP810
MCP809,MCP810 SNVS165A –JUNE 2001–REVISED MAY 2013 www.ti.com ElectricalCharacteristics(continued) VCC = fullrange,TA = −40°C to+105°C, unlessotherwisenoted.TypicalvaluesareatTA = +25°C, VCC = 5V for Symbol Parameter Conditions Min Typ Max Units VCC = VTH min,ISINK = 1.2mA, 0.3 VCC > 1.0V,ISINK = 50µA 0.3 VCC > VTH max, ISOURCE = 500µA, 0.8VCC MCP809-2.63/2.93/3.08RESET OutputVoltageHighVOH V(MCP809) VCC > VTH max, ISOURCE = 800µA, VCC −1.5 VCC = VTH max, ISINK = 1.2mA, 0.3 VOH RESET OutputVoltageHigh 0.8VCC V1.8V< VCC < VTH min,ISOURCE = 150μA(MCP810)
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 TYPICAL PERFORMANCE CHARACTERISTICS Supply Current Supply Current vs vs Temperature Temperature Figure3. Figure4. Power-Down Reset Delay Power-Down Reset Delay vs vs Figure5. Figure6. Power-Up Reset Timeout NormalizedReset Threshold vs vs Temperature Temperature Figure7. Figure8. Copyright© 2001–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:MCP809 MCP810
MCP809,MCP810 SNVS165A –JUNE 2001–REVISED MAY 2013 www.ti.com
APPLICATION INFORMATION
BenefitsofPrecisionReset Thresholds A microprocessorsupplysupervisormust providea resetoutputwithina predictablerangeofthesupplyvoltage. A common thresholdrange isbetween 5% and 10% below thenominalsupplyvoltage.The 4.63V and 3.08V optionsoftheMCP809/810 use highlyaccuratecircuitrytoensurethattheresetthresholdoccursonlywithinthis range (for5V and 3.3V supplies).The othervoltageoptionshave the same tighttoleranceto ensure a reset signalforothernarrowmonitorranges.See Table1 forexamples ofhow thestandardresetthresholdsapplyto 3V,3.3V,and 5V nominalsupplyvoltages. Table1.Reset ThresholdsRelatedtoCommon Supply Voltages Reset Threshold 3.0V 3.3V 5.0V 4.63± 3% 90 -95% 4.38± 3% 85 -90% 4.00± 3% 78 -82% 3.08± 3% 90 -95% 2.93± 3% 86 -90% Ensuring a ValidReset Output Down toVCC = 0V When VCC fallsbelow 1V, theMCP809 RESET outputno longersinkscurrent.A high-impedanceCMOS logic inputconnectedto RESET can thereforedriftto undeterminedvoltages.To preventthissituation,a 100kΩ resistorshouldbe connectedfromtheRESET outputtoground,as shown inFigure9. A 100kΩ pull-upresistortoVCC isalsorecommended fortheMCP810, ifRESET isrequiredtoremainvalidfor VCC < 1V. Figure9. RESET ValidtoVCC = Ground Circuit Negative-GoingVCC Transients The MCP809/810 are relativelyimmune toshortnegative-goingtransientsor glitcheson VCC .Figure10 shows themaximum pulsewidtha negative-goingVCC transientcan have withoutcausinga resetpulse.Ingeneral,as themagnitudeofthetransientincreases,goingfurtherbelow thethreshold,themaximum allowablepulsewidth decreases.Typically,forthe 4.63V and 4.38V versionof the MCP809/810, a VCC transientthatgoes 100mV below theresetthresholdand lasts20µs orlesswillnotcause a resetpulse.A 0.1µF bypass capacitormounted as closeas possibletotheVCC pinwillprovideadditionaltransientrejection.
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 Figure10. Maximum TransientDurationwithoutCausing a Reset Pulse vs.Reset Comparator Overdrive InterfacingtoµPs withBidirectionalReset Pins Microprocessorswithbidirectionalresetpins,such as the Motorola68HC11 series,can be connectedto the MCP809 RESET output.To ensurea correctoutputon theMCP809 even when themicroprocessorresetpinis inthe oppositestate,connecta 4.7kΩ resistorbetween the MCP809 RESET outputand theµP resetpin,as shown inFigure11.BuffertheMCP809 RESET outputtoothersystemcomponents. Figure11. InterfacingtoMicroprocessorswithBidirectionalReset I/O Copyright© 2001–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:MCP809 MCP810
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REVISION HISTORY
Changes from Original(May 2013)toRevisionA Page
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) MCP809M3-2.93/NOPB Active Production SOT-23 (DBZ) | 3 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 SRB MCP809M3-2.93/NOPB.A Active Production SOT-23 (DBZ) | 3 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 SRB (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2022 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MCP809M3-2.93/NOPB SOT-23 DBZ 3 1000 208.0 191.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.20
0.08 TYP
0.25 2.64 2.10
1.12 MAX
0.10
0.01 TYP
3X 0.5 0.3 0.6
0.2 TYP
1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG
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