MCP809 TI1 | Alldatasheet
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 MCP809/MCP8103-PinMicroprocessorResetCircuits Check forSamples: MCP809 ,MCP810 1FEATURES DESCRIPTION The MCP809/810 microprocessorsupervisorycircuits 2• PreciseMonitoringof3V,3.3V,and 5V Supply can be used to monitor the power suppliesinVoltages microprocessorand digitalsystems.They providea• Fullyspecifiedover temperature resettothemicroprocessorduringpower-up,power-
- 140ms min.Power-On Reset Pulse Width, down and brown-outconditions. 240ms Typical The functionoftheMCP809/810 istomonitortheVCC – Active-lowRESET Output (MCP809) supplyvoltage,and asserta resetsignalwhenever thisvoltagedeclinesbelow the factory-programmed– Active-highRESET Output (MCP810) resetthreshold.The resetsignalremainsassertedfor• SpecifiedRESET Output ValidforVCC ≥1V 240ms afterVCC risesabove the threshold.The
- Low Supply Current,15µA typical MCP809 has an active-lowRESET output,whilethe MCP810 has an active-highRESET output.• Power supply transientimmunity Seven standardresetvoltageoptionsare available,APPLICATIONS suitablefor monitoring5V, 3.3V, and 3V supply voltages.• MicroprocessorSystems
- Computers With a low supply currentof only 15µA, the MCP809/810 areidealforuse inportableequipment.• Controllers The MCP809/MCP810 are availablein the 3-pin• IntelligentInstruments SOT23 package.
- Portable/Battery-PoweredEquipment
- Automotive TypicalApplicationCircuit Figure1. TypicalApplicationCircuit Connection Diagram Figure2. ()areforMCP810 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2001–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
MCP809,MCP810 SNVS165A –JUNE 2001–REVISED MAY 2013 www.ti.com Pin Description PIN NAME FUNCTION
3 GND Ground reference
Active-lowoutput.RESET remainslowwhileVCC isbelowtheresetthreshold,and for240ms afterRESET (MCP809) VCC risesabove theresetthreshold. Active-highoutput.RESET remainshighwhileVCC isbelowtheresetthreshold,and for240ms afterRESET (MCP810) VCC risesabove theresetthreshold. 2 VCC SupplyVoltage(+5V,+3.3V,or+3.0V) These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1) VCC −0.3Vto6.0V RESET, RESET −0.3Vto(VCC + 0.3V) InputCurrent,VCC Pin 20mA OutputCurrent,RESET, RESET Pin 20mA Rate ofRise,VCC 100V/µs ESD Rating(2) 2kV ContinuousPower Dissipation(TA = +70°C) SOT-23 (3) 320mW AmbientTemperatureRange −40°C to+105°C Maximum JunctionTemperature 125°C StorageTemperatureRange −65°C to+160°C Lead Temperature(soldering,10sec) +300°C (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhichthe deviceoperatescorrectly.Operatingratingsdo notimplyspecifiedperformancelimits.Forspecifiedperformancelimitsand associated testconditions,see theElectricalCharacteristics. (2) The human body model isa 100pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. (3) Productiontestingdone atTA = +25°C, overtemperaturelimitsspecifiedby designonly.
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 ElectricalCharacteristics VCC = fullrange,TA = −40°C to+105°C, unlessotherwisenoted.TypicalvaluesareatTA = +25°C, VCC = 5V for Symbol Parameter Conditions Min Typ Max Units TA = 0°C to+70°C 1.0 5.5 VCC Range V TA = −40°C to VCC <5.5V,MCP8_ _ - 18 60 VCC <3.6V,MCP8_ _ - 15 50 3.08/2.93/2.63 ICC SupplyCurrent µA TA = +85°C to VCC <5.5V,MCP8_ _ - 100 VCC <3.6V,MCP8_ _ - 100 3.08/2.93/2.63 TA = +25°C 4.56 4.63 4.70 TA = +85°C to+105°C 4.40 4.86 TA = +25°C 4.31 4.38 4.45 TA = +85°C to+105°C 4.16 4.56 TA = +25°C 3.93 4.00 4.06 TA = +85°C to+105°C 3.80 4.20 VTH ResetThreshold(2) V TA = +25°C 3.04 3.08 3.11 TA = +85°C to+105°C 2.92 3.23 TA = +25°C 2.89 2.93 2.96 TA = +85°C to+105°C 2.78 3.08 TA = +25°C 2.59 2.63 2.66 TA = +85°C to+105°C 2.50 2.76 ResetThresholdTemperature 30 ppm/°CCoefficient VCC toResetDelay (2) VCC = VTH to(VTH − 100mV) 20 µs TA = −40°C to+85°C 140 240 560 ResetActiveTimeoutPeriod ms TA = +85°C to+105°C 100 840 (1) Atelevatedtemperatures,devicesmust be deratedbased on package thermalresistance.The deviceintheSOT23-3 package must be deratedat4mW/ °C atambienttemperaturesabove 70°C. The devicehas internalthermalprotection. (2) RESET OutputforMCP809, RESET outputforMCP810. Copyright© 2001–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:MCP809 MCP810
MCP809,MCP810 SNVS165A –JUNE 2001–REVISED MAY 2013 www.ti.com ElectricalCharacteristics(continued) VCC = fullrange,TA = −40°C to+105°C, unlessotherwisenoted.TypicalvaluesareatTA = +25°C, VCC = 5V for Symbol Parameter Conditions Min Typ Max Units VCC = VTH min,ISINK = 1.2mA, 0.3 VCC > 1.0V,ISINK = 50µA 0.3 VCC > VTH max, ISOURCE = 500µA, 0.8VCC MCP809-2.63/2.93/3.08RESET OutputVoltageHighVOH V(MCP809) VCC > VTH max, ISOURCE = 800µA, VCC −1.5 VCC = VTH max, ISINK = 1.2mA, 0.3 VOH RESET OutputVoltageHigh 0.8VCC V1.8V< VCC < VTH min,ISOURCE = 150μA(MCP810)
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 TYPICAL PERFORMANCE CHARACTERISTICS Supply Current Supply Current vs vs Temperature Temperature Figure3. Figure4. Power-Down Reset Delay Power-Down Reset Delay vs vs Figure5. Figure6. Power-Up Reset Timeout NormalizedReset Threshold vs vs Temperature Temperature Figure7. Figure8. Copyright© 2001–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:MCP809 MCP810
MCP809,MCP810 SNVS165A –JUNE 2001–REVISED MAY 2013 www.ti.com
APPLICATION INFORMATION
BenefitsofPrecisionReset Thresholds A microprocessorsupplysupervisormust providea resetoutputwithina predictablerangeofthesupplyvoltage. A common thresholdrange isbetween 5% and 10% below thenominalsupplyvoltage.The 4.63V and 3.08V optionsoftheMCP809/810 use highlyaccuratecircuitrytoensurethattheresetthresholdoccursonlywithinthis range (for5V and 3.3V supplies).The othervoltageoptionshave the same tighttoleranceto ensure a reset signalforothernarrowmonitorranges.See Table1 forexamples ofhow thestandardresetthresholdsapplyto 3V,3.3V,and 5V nominalsupplyvoltages. Table1.Reset ThresholdsRelatedtoCommon Supply Voltages Reset Threshold 3.0V 3.3V 5.0V 4.63± 3% 90 -95% 4.38± 3% 85 -90% 4.00± 3% 78 -82% 3.08± 3% 90 -95% 2.93± 3% 86 -90% Ensuring a ValidReset Output Down toVCC = 0V When VCC fallsbelow 1V, theMCP809 RESET outputno longersinkscurrent.A high-impedanceCMOS logic inputconnectedto RESET can thereforedriftto undeterminedvoltages.To preventthissituation,a 100kΩ resistorshouldbe connectedfromtheRESET outputtoground,as shown inFigure9. A 100kΩ pull-upresistortoVCC isalsorecommended fortheMCP810, ifRESET isrequiredtoremainvalidfor VCC < 1V. Figure9. RESET ValidtoVCC = Ground Circuit Negative-GoingVCC Transients The MCP809/810 are relativelyimmune toshortnegative-goingtransientsor glitcheson VCC .Figure10 shows themaximum pulsewidtha negative-goingVCC transientcan have withoutcausinga resetpulse.Ingeneral,as themagnitudeofthetransientincreases,goingfurtherbelow thethreshold,themaximum allowablepulsewidth decreases.Typically,forthe 4.63V and 4.38V versionof the MCP809/810, a VCC transientthatgoes 100mV below theresetthresholdand lasts20µs orlesswillnotcause a resetpulse.A 0.1µF bypass capacitormounted as closeas possibletotheVCC pinwillprovideadditionaltransientrejection.
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MCP809,MCP810 www.ti.com SNVS165A –JUNE 2001–REVISED MAY 2013 Figure10. Maximum TransientDurationwithoutCausing a Reset Pulse vs.Reset Comparator Overdrive InterfacingtoµPs withBidirectionalReset Pins Microprocessorswithbidirectionalresetpins,such as the Motorola68HC11 series,can be connectedto the MCP809 RESET output.To ensurea correctoutputon theMCP809 even when themicroprocessorresetpinis inthe oppositestate,connecta 4.7kΩ resistorbetween the MCP809 RESET outputand theµP resetpin,as shown inFigure11.BuffertheMCP809 RESET outputtoothersystemcomponents. Figure11. InterfacingtoMicroprocessorswithBidirectionalReset I/O Copyright© 2001–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:MCP809 MCP810
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REVISION HISTORY
Changes from Original(May 2013)toRevisionA Page
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www.ti.com 7-Oct-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples MCP809M3-2.93/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SRB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MCP809M3-2.93/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2
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