MCP73831-4DCI/OT

MCP73831 MICROCHIP | Alldatasheet

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Technical content

© 2006 Microchip Technology Inc. DS21984B-page 1 MCP73831/2 Features:

• Linear Charge Management Controller: - Integrated Pass Transistor - Integrated Current Sense - Reverse Discharge Protection
• High Accuracy Preset Voltage Regulation: + 0.75%
• Four Voltage Regulation Options:
• Programmable Charge Current
• Selectable Preconditioning
• Selectable End-of-Charge Control
• Charge Status Output - Tri-State Output - MCP73831 - Open-Drain Output - MCP73832
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to +85°C
• Packaging: - 8-Lead, 2 mm x 3 mm DFN - 5-Lead, SOT23 Applications:
• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants
• Cellular Telephones
• Digital Cameras
• MP3 Players
• Bluetooth Headsets
• USB Chargers Typical Application Description: The MCP73831/2 devices are highly advanced linear charge management controllers for use in space-lim- ited, cost-sensitive applications. The MCP73831/2 are available in an 8-Lead, 2 mm x 3 mm DFN package or a 5-Lead, SOT23 package. Along with their small physical size, the low number of external components required make the MCP73831/2 ideally suited for por- table applications. For applications charging from a USB port, the MCP73831/2 adhere to all the specifications governing the USB power bus. The MCP73831/2 employ a constant-current/constant- voltage charge algorithm with selectable precondition- ing and charge termination. The constant voltage regulation is fixed with four available options: 4.20V, 4.35V, 4.40V or 4.50V, to accommodate new, emerg- ing battery charging requirements. The constant cur- rent value is set with one external resistor. The MCP73831/2 devices limit the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. Several options are available for the preconditioning threshold, preconditioning current value, charge termi- nation value and automatic recharge threshold. The preconditioning value and charge termination value are set as a ratio, or percentage, of the programmed constant current value. Preconditioning can be dis- abled. Refer to Section 1.0 “Electrical Characteris- tics” for available options and the “Product Identification System” for standard options. The MCP73831/2 devices are fully specified over the ambient temperature range of -40°C to +85°C. Package Types STAT VDD VSS PROG VBAT Single Li-Ion Cell MCP73831 500 mA Li-Ion Battery Charger VIN 4.7 μF 470Ω 2 kΩ 4.7 μF SOT23-5 VBAT VSS VDD PROG STAT 8-Lead DFN VDD VBAT VBAT VDD NC PROG VSS STAT (2 mm x 3 mm) Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers

© 2006 Microchip Technology Inc. Functional Block Diagram REFERENCE GENERATOR VREF(1.22V) VBAT VDD STAT PROG VBAT G=0.001 VSS DIRECTION CONTROL 477 kΩ 255 kΩ UVLO SHDN DIRECTION CONTROL 0.5 mA PRECONDITION 6 mA 6 mA TERMINATION 43.6 kΩ CA 3.9 kΩ 111 kΩ 190 kΩ 7 kΩ 15 kΩ 182.3 kΩ 111 kΩ CHARGE VA 89 kΩ 361 kΩ 100 kΩ 0.5 mA VDD MCP73831 ONLY

© 2006 Microchip Technology Inc. DS21984B-page 3 MCP73831/2 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† ESD protection on all pins: † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Supply Input Supply Voltage VDD 3.75 V Supply Current ISS 510 1500 μA Charging 200 μA Charge Complete, No Battery μA PROG Floating μA VDD < (VBAT - 50 mV) 0.1 μA VDD < VSTOP UVLO Start Threshold VSTART 3.3 3.45 3.6 V VDD Low-to-High UVLO Stop Threshold VSTOP 3.2 3.38 3.5 V VDD High-to-Low UVLO Hysteresis VHYS mV Voltage Regulation (Constant-Voltage Mode) Regulated Output Voltage VREG 4.168 4.20 4.232 V MCP7383X-2 4.317 4.35 4.383 V MCP7383X-3 4.367 4.40 4.433 V MCP7383X-4 4.466 4.50 4.534 V MCP7383X-5 VDD = [VREG(Typ)+1V] IOUT = 10 mA TA = -5°C to +55°C Line Regulation |(ΔVBAT/VBAT )/ΔVDD| 0.09 0.30 %/V VDD = [VREG(Typ)+1V] to 6V IOUT = 10 mA Load Regulation |ΔVBAT/VBAT| 0.05 0.30 IOUT = 10 mA to 50 mA VDD = [VREG(Typ)+1V] Supply Ripple Attenuation PSRR dB IOUT=10 mA, 10Hz to 1 kHz dB IOUT=10 mA, 10Hz to 10 kHz dB IOUT=10 mA, 10Hz to 1 MHz Current Regulation (Fast Charge Constant-Current Mode) Fast Charge Current Regulation IREG 100 110 mA PROG = 10 kΩ 450 505 550 mA PROG = 2.0 kΩ, Note 1 TA = -5°C to +55°C Note Not production tested. Ensured by design.

© 2006 Microchip Technology Inc. Preconditioning Current Regulation (Trickle Charge Constant-Current Mode) Precondition Current Ratio IPREG / IREG 7.5 12.5 PROG = 2.0 kΩ to 10 kΩ PROG = 2.0 kΩ to 10 kΩ PROG = 2.0 kΩ to 10 kΩ 100 No Preconditioning TA = -5°C to +55°C Precondition Voltage Threshold Ratio VPTH / VREG 66.5 VBAT Low-to-High 71.5 VBAT Low-to-High Precondition Hysteresis VPHYS 110 mV VBAT High-to-Low Charge Termination Charge Termination Current Ratio ITERM / IREG 3.75 6.25 PROG = 2.0 kΩ to 10 kΩ 5.6 7.5 9.4 PROG = 2.0 kΩ to 10 kΩ 7.5 12.5 PROG = 2.0 kΩ to 10 kΩ PROG = 2.0 kΩ to 10 kΩ TA = -5°C to +55°C Automatic Recharge Recharge Voltage Threshold Ratio VRTH / VREG 91.5 94.0 96.5 VBAT High-to-Low 96.5 VBAT High-to-Low Pass Transistor ON-Resistance ON-Resistance RDSON 350 mΩ VDD = 3.75V, TJ = 105°C Battery Discharge Current Output Reverse Leakage Current IDISCHARGE 0.15 μA PROG Floating 0.25 μA VDD Floating 0.15 μA VDD < VSTOP -5.5 -15 μA Charge Complete Status Indicator – STAT Sink Current ISINK mA Low Output Voltage VOL 0.4 V ISINK = 4 mA Source Current ISOURCE mA High Output Voltage VOH VDD-0.4 VDD - 1 V ISOURCE = 4 mA (MCP73831) Input Leakage Current ILK 0.03 μA High-Impedance PROG Input Charge Impedance Range RPROG kΩ Minimum Shutdown Impedance RPROG 200 kΩ Automatic Power Down Automatic Power Down Entry Threshold VPDENTER VDD<(VBAT +20mV) VDD<(VBAT +50mV) 3.5V ≤ VBAT ≤ VREG VDD Falling Automatic Power Down Exit Threshold VPDEXIT VDD<(VBAT +150mV) VDD<(VBAT +200mV) 3.5V ≤ VBAT ≤ VREG VDD Rising Thermal Shutdown Die Temperature TSD 150 Die Temperature Hysteresis TSDHYS DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Note Not production tested. Ensured by design.

© 2006 Microchip Technology Inc. DS21984B-page 5 MCP73831/2 TEMPERATURE SPECIFICATIONS AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions UVLO Start Delay tSTART ms VDD Low-to-High Constant-Current Regulation Transition Time Out of Preconditioning tDELAY ms VBAT < VPTH to VBAT > VPTH Current Rise Time Out of Preconditioning tRISE ms IOUT Rising to 90% of IREG Termination Comparator Filter tTERM 0.4 1.3 3.2 ms Average IOUT Falling Charge Comparator Filter tCHARGE 0.4 1.3 3.2 ms Average VBAT Status Indicator Status Output turn-off tOFF 200 μs ISINK = 1 mA to 0 mA Status Output turn-on tON 200 μs ISINK = 0 mA to 1 mA Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V. Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range TA -40 +85 Operating Temperature Range TJ -40 +125 Storage Temperature Range TA -65 +150 Thermal Package Resistances 5-Lead, SOT23 θJA 230 °C/W 4-Layer JC51-7 Standard Board, Natural Convection 8-Lead, 2 mm x 3 mm, DFN θJA °C/W 4-Layer JC51-7 Standard Board, Natural Convection

© 2006 Microchip Technology Inc. DS21984B-page 9 MCP73831/2 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLES 3.1 Battery Management Input Supply (VDD) A supply voltage of [VREG (typ.) + 0.3V] to 6V is recommended. Bypass to VSS with a minimum of 4.7 μF. 3.2 Battery Charge Control Output (VBAT) Connect to positive terminal of battery. Drain terminal of internal P-channel MOSFET pass transistor. Bypass to VSS with a minimum of 4.7 μF to ensure loop stability when the battery is disconnected. 3.3 Charge Status Output (STAT) STAT is an output for connection to an LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. STAT is a tri-state logic output on the MCP73831 and an open-drain output on the MCP73832. 3.4 Battery Management 0V Reference (VSS) Connect to negative terminal of battery and input supply. 3.5 Current Regulation Set (PROG) Preconditioning, fast charge and termination currents are scaled by placing a resistor from PROG to VSS. The charge management controller can be disabled by allowing the PROG input to float. Pin No. Symbol Function DFN SOT23-5 VDD Battery Management Input Supply VDD Battery Management Input Supply VBAT Battery Charge Control Output VBAT Battery Charge Control Output STAT Charge Status Output VSS Battery Management 0V Reference NC No Connection PROG Current Regulation Set and Charge Control Enable

© 2006 Microchip Technology Inc. 4.0 DEVICE OVERVIEW The MCP73831/2 are highly advanced linear charge management controllers. Figure 4-1 depicts the operational flow algorithm from charge initiation to completion and automatic recharge. FIGURE 4-1: Flowchart. 4.1 Under Voltage Lockout (UVLO) An internal UVLO circuit monitors the input voltage and keeps the charger in Shutdown mode until the input supply rises above the UVLO threshold. The UVLO circuitry has a built in hysteresis of 100 mV. In the event a battery is present when the input power is applied, the input supply must rise 150 mV above the battery voltage before the MCP73831/2 becomes operational. The UVLO circuit places the device in Shutdown mode if the input supply falls to within +50 mV of the battery voltage. Again, the input supply must rise to a level 150 mV above the battery voltage before the MCP73831/2 become operational. The UVLO circuit is always active. At any time the input supply is below the UVLO threshold or within +50 mV of the voltage at the VBAT pin, the MCP73831/2 are placed in a Shutdown mode. During any UVLO condition, the battery reverse discharge current shall be less than 2 μA. 4.2 Charge Qualification For a charge cycle to begin, all UVLO conditions must be met and a battery or output load must be present. A charge current programming resistor must be connected from PROG to VSS. If the PROG pin is open or floating, the MCP73831/2 are disabled and the battery reverse discharge current is less than 2 μA. In this manner, the PROG pin acts as a charge enable and can be used as a manual shutdown. 4.3 Preconditioning If the voltage at the VBAT pin is less than the precondi- tioning threshold, the MCP73831/2 enter a precondi- tioning or Trickle Charge mode. The preconditioning threshold is factory set. Refer to Section 1.0 “Electri- cal Characteristics” for preconditioning threshold options and the Product Identification System for standard options. In this mode, the MCP73831/2 supply a percentage of the charge current (established with the value of the resistor connected to the PROG pin) to the battery. The percentage or ratio of the current is factory set. Refer to Section 1.0 “Electrical Characteristics” for preconditioning current options and the Product Identification System for standard options. When the voltage at the VBAT pin rises above the preconditioning threshold, the MCP73831/2 enter the Constant-Current or Fast Charge mode. 4.4 Fast Charge Constant-Current Mode During the Constant-Current mode, the programmed charge current is supplied to the battery or load. The charge current is established using a single resistor from PROG to VSS. Constant-Current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG. SHUTDOWN MODE VDD < VUVLO VDD < VBAT or PROG > 200 kΩ STAT = Hi-Z PRECONDITIONING MODE Charge Current = IPREG STAT = LOW FAST CHARGE MODE Charge Current = IREG STAT = LOW CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT = LOW VBAT < VPTH VBAT > VPTH VBAT = VREG VBAT < VRTH VBAT > VPTH IBAT < ITERM CHARGE COMPLETE MODE No Charge Current STAT = HIGH (MCP73831) STAT = Hi-Z (MCP73832)

© 2006 Microchip Technology Inc. DS21984B-page 11 MCP73831/2 4.5 Constant-Voltage Mode When the voltage at the VBAT pin reaches the regula- tion voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 4.2V, 4.35V, 4.40V, or 4.50V with a tolerance of ±0.75%. 4.6 Charge Termination The charge cycle is terminated when, during Constant- Voltage mode, the average charge current diminishes below a percentage of the programmed charge current (established with the value of the resistor connected to the PROG pin). A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature charge cycle termination. The percentage or ratio of the current is factory set. Refer to Section 1.0 “Electrical Characteristics” for charge termination current options and the “Product Identification System” for standard options. The charge current is latched off and the MCP73831/2 enter a Charge Complete mode. 4.7 Automatic Recharge The MCP73831/2 continuously monitor the voltage at the VBAT pin in the Charge Complete mode. If the volt- age drops below the recharge threshold, another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 “Electrical Char- acteristics” for recharge threshold options and the Product Identification System for standard options. 4.8 Thermal Regulation The MCP73831/2 limit the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 4-2 depicts the thermal regulation for the MCP73831/2. FIGURE 4-2: Thermal Regulation. 4.9 Thermal Shutdown The MCP73831/2 suspend charge if the die tempera- ture exceeds 150°C. Charging will resume when the die temperature has cooled by approximately 10°C. 150 225 300 375 450 525 105 115 125 135 145 155 Junction Temperature (°C) Charge Current (mA) RPROG = 2 kΩ

© 2006 Microchip Technology Inc. 5.0 DETAILED DESCRIPTION 5.1 Analog Circuitry 5.1.1 BATTERY MANAGEMENT INPUT SUPPLY (VDD) The VDD input is the input supply to the MCP73831/2. The MCP73831/2 automatically enter a Power-Down mode if the voltage on the VDD input falls below the UVLO voltage (VSTOP). This feature prevents draining the battery pack when the VDD supply is not present. 5.1.2 CURRENT REGULATION SET (PROG) Fast charge current regulation can be scaled by plac- ing a programming resistor (RPROG) from the PROG input to VSS. The program resistor and the charge current are calculated using the following equation: The preconditioning trickle charge current and the charge termination current are ratiometric to the fast charge current based on the selected device options. 5.1.3 BATTERY CHARGE CONTROL OUTPUT (VBAT) The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73831/2 provide constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack. 5.2 Digital Circuitry 5.2.1 STATUS INDICATOR (STAT) The charge status output of the MCP73831 has three different states: High (H), Low (L), and High-Imped- ance (Hi-Z). The charge status output of the MCP73832 is open-drain, and, as such, has two differ- ent states: Low (L), and High-Impedance (Hi-Z). The charge charge status output can be used to illuminate 1, 2, or tri-color LEDs. Optionally, the charge status output can be used as an interface to a host microcontroller. Table 5-1 summarize the state of the status output during a charge cycle.. 5.2.2 DEVICE DISABLE (PROG) The current regulation set input pin (PROG) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle. Placing a programming resistor from the PROG input to VSS enables the device. Allowing the PROG input to float or by applying a logic-high input signal, disables the device and terminates a charge cycle. When disabled, the device’s supply current is reduced to 25 μA, typically. IREG 1000V RPROG Where: RPROG kOhms IREG milliampere TABLE 5-1: STATUS OUTPUT Charge Cycle State STAT1 MCP73831 MCP73832 Shutdown Hi-Z Hi-Z No Battery Present Hi-Z Hi-Z Preconditioning L L Constant-Current Fast Charge L L Constant Voltage L L Charge Complete – Standby H Hi-Z

© 2006 Microchip Technology Inc. DS21984B-page 15 MCP73831/2 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 5-Lead SOT-23 Example: XXNN KD25 8-Lead DFN (2 mm x 3 mm) Example: XXX YWW NN AAE 610 Device Code MCP73831T-2ACI/MC AAE MCP73831T-2ATI/MC AAF MCP73831T-2DCI/MC AAG MCP73831T-3ACI/MC AAH MCP73831T-4ADI/MC AAJ MCP73831T-5ACI/MC AAK MCP73832T-2ACI/MC AAL MCP73832T-2ATI/MC AAM MCP73832T-2DCI/MC AAP MCP73832T-3ACI/MC AAQ MCP73832T-4ADI/MC AAR MCP73832T-5ACI/MC AAS Note: Applies to 8-Lead DFN Device Code MCP73831T-2ACI/OT KDNN MCP73831T-2ATI/OT KENN MCP73831T-2DCI/OT KFNN MCP73831T-3ACI/OT KGNN MCP73831T-4ADI/OT KHNN MCP73831T-5ACI/OT KJNN MCP73832T-2ACI/OT KKNN MCP73832T-2ATI/OT KLNN MCP73832T-2DCI/OT KMNN MCP73832T-3ACI/OT KPNN MCP73832T-4ADI/OT KQNN MCP73832T-5ACI/OT KRNN Note: Applies to 5-Lead SOT-23 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2006 Microchip Technology Inc. 8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated L A TOP VIEW D E EXPOSED PAD METAL BOTTOM VIEW b p n (NOTE 3) EXPOSED TIE BAR PIN 1 (NOTE 1) ID INDEX AREA (NOTE 2) CONFIGURATION CONTACT ALTERNATE DETAIL K 3. Package may have one or more exposed tie bars at ends. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. JEDEC Equivalent MO-229 VCED-2 See ASME Y14.5M See ASME Y14.5M MILLIMETERS*

0.50 BSC

2.00 BSC

0.20 REF.

3.00 BSC

1. Pin 1 visual index feature may vary, but must be located within the hatched area. .039 .035 .031 0.80 A Overall Height 2. Exposed pad may vary according to die attach paddle size. * Controlling Parameter Contact Length § Notes: Contact Width Standoff Overall Width Overall Length Contact Thickness Exposed Pad Width Exposed Pad Length .010 .008 L b .012 0.20 .001 .008 REF. .079 BSC .118 BSC D .051 .059 E .000 .069 .075 1.30 1.50 .002 0.00 Dimension Limits Pitch Number of Pins INCHES .020 BSC MIN n e NOM Units MAX MIN 1.00 0.90 0.25 0.30 1.75 1.90 0.02 0.05 NOM MAX Contact-to-Exposed Pad .012 K .016 0.40 .020 0.30 0.50 ** Not within JEDEC parameters § Significant Characteristic .008 0.20 DWG No. C04-123 Revised 09-12-05

© 2006 Microchip Technology Inc. DS21984B-page 17 MCP73831/2 5-Lead Plastic Small Outline Transistor (OT) (SOT-23) p D B n E L c β φ α A b Mold Draft Angle Bottom a Mold Draft Angle Top 0.50 0.43 0.35 .020 .017 .014 B Lead Width 0.20 0.15 0.09 .008 .006 .004 c Lead Thickness f Foot Angle 0.55 0.45 0.35 .022 .018 .014 L Foot Length 3.10 2.95 2.80 .122 .116 .110 D Overall Length 1.75 1.63 1.50 .069 .064 .059 Molded Package Width 3.00 2.80 2.60 .118 .110 .102 E Overall Width 0.15 0.08 0.00 .006 .003 .000 Standoff 1.30 1.10 0.90 .051 .043 .035 Molded Package Thickness 1.45 1.18 0.90 .057 .046 .035 A Overall Height 1.90 .075 Outside lead pitch (basic) 0.95 .038 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. Notes: EIAJ Equivalent: SC-74A Drawing No. C04-091 * Controlling Parameter Revised 09-12-05

© 2006 Microchip Technology Inc. NOTES:

© 2006 Microchip Technology Inc. DS21984B-page 19 MCP73831/2 APPENDIX A:

REVISION HISTORY

Revision B (March 2006)

• Added MCP73832 through document. Revision A (November 2005)
• Original Release of this Document.

© 2006 Microchip Technology Inc. NOTES:

© 2006 Microchip Technology Inc. DS21984B-page 21 MCP73831/2 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP73831: Single-Cell Charge Controller MCP73831T: Single-Cell Charge Controller (Tape and Reel) MCP73832 Single-Cell Charge Controller MCP73832T: Single-Cell Charge Controller (Tape and Reel) Regulation Voltage: Code VREG 4.20V 4.35V 4.40V 4.50V Options: * Code IPREG/IREG VPTH/VREG ITERM/IREG VRTH/VREG AC AD AT DC 100 66.5 66.5 71.5 x 7.5 7.5 7.5 96.5 96.5 * Consult Factory for Alternative Device Options Temperature Range: I = -40°C to +85°C (Industrial) Package: MC = Dual-Flat, No-Lead (2x3 mm body), 8-Lead OT = Small Outline Transistor (SOT23), 5-Lead Examples: * MCP73831-2ACI/OT: 4.20V VREG, Options AC, 5LD SOT23 Pkg MCP73831T-2ACI/OT: Tape and Reel, 4.20V VREG, Options AC, 5LD SOT23 Pkg MCP73832-2ACI/MC: 4.20V VREG, Options AC, 8LD DFN Package MCP73832T-2ACI/MC: Tape and Reel, 4.20V VREG, Options AC, 8LD DFN Package MCP73831-2ATI/OT: 4.20V VREG, Options AT, 5LD SOT23 Pkg MCP73831T-2ATI/OT: Tape and Reel, 4.20V VREG, Options AT, 5LD SOT23 Pkg MCP73832-2ATI/MC: 4.20V VREG, Options AT, 8LD DFN Package MCP73832T-2ATI/MC: Tape and Reel, 4.20V VREG, Options AT, 8LD DFN Package MCP73831-2DCI/OT: 4.20V VREG, Options DC, 5LD SOT23 Pkg MCP73831T-2DCI/OT: Tape and Reel, 4.20V VREG, Options DC, 5LD SOT23 Pkg MCP73832-2DCI/MC: 4.20V VREG, Options DC, 8LD DFN Package MCP73832T-2DCI/MC: Tape and Reel, 4.20V VREG, Options DC, 8LD DFN Package MCP73831-3ACI/OT: 4.35V VREG, Options AC, 5LD SOT23 Pkg MCP73831T-3ACI/OT: Tape and Reel, 4.35V VREG, Options AC, 5LD SOT23 Pkg MCP73832-3ACI/MC: 4.35V VREG, Options AC, 8LD DFN Package MCP73832T-3ACI/MC: Tape and Reel, 4.35V VREG, Options AC, 8LD DFN Package MCP73831-4ADI/OT: 4.40V VREG, Options AD, 5LD SOT23 Pkg MCP73831T-4ADI/OT: Tape and Reel, 4.40V VREG, Options AD, 5LD SOT23 Pkg MCP73832-4ADI/MC: 4.40V VREG, Options AD, 8LD DFN Package MCP73832T-4ADI/MC: Tape and Reel, 4.40V VREG, Options AD, 8LD DFN Package MCP73831-5ACI/OT: 4.50V VREG, Options AC, 5LD SOT23 Pkg MCP73831T-5ACI/OT: Tape and Reel, 4.50V VREG, Options AC, 5LD SOT23 Pkg MCP73832-5ACI/MC: 4.50V VREG, Options AC, 8LD DFN Package MCP73832T-5ACI/MC: Tape and Reel, 4.50V VREG, Options AC, 8LD DFN Package * Consult Factory for Alternate Device Options PART NO. Device X VREG /XX Package XX Options X Temperature Range

© 2006 Microchip Technology Inc. NOTES:

© 2006 Microchip Technology Inc. DS21984B-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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