MCP73831-2ATI/MC

Microchip Technology

Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers 2008

Manufacturer: Microchip Technology

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PDF pages: 28

Technical content

Features

Linear Charge Management Controller: - Integrated Pass Transistor - Integrated Current Sense - Reverse Discharge Protection
High Accuracy Preset Voltage Regulation: + 0.75%
Four Voltage Regulation Options:
Programmable Charge Current: 15 mA to 500 mA
Selectable Preconditioning: - 10%, 20%, 40%, or Disable
Selectable End-of-Charge Control:
Charge Status Output - Tri-State Output - MCP73831 - Open-Drain Output - MCP73832
Automatic Power-Down
Thermal Regulation
Temperature Range: -40°C to +85°C
Packaging: - 8-Lead, 2 mm x 3 mm DFN - 5-Lead, SOT-23

Applications

Lithium-Ion/Lithium-Pol ymer Battery Chargers
Personal Data Assistants
Cellular Telephones
Digital Cameras
MP3 Players
Bluetooth Headsets
USB Chargers Typical Application Description: The MCP73831/2 devices are highly advanced linear charge management controlle rs for use in space-lim- ited, cost-sensitive applications. The MCP73831/2 are available in an 8-Lead, 2 mm x 3 mm DFN package or a 5-Lead, SOT-23 package. Along with their small physical size, the low number of external components required make the MCP73831/2 ideally suited for portable applications. For applications charging from a USB port, the MCP73831/2 adhere to all the specifications governing the USB power bus. The MCP73831/2 employ a constant-current/constant- voltage charge algorithm with selectable precondition- ing and charge termination. The constant voltage regulation is fixed with fo ur available options: 4.20V, 4.35V, 4.40V or 4.50V, to accommodate new, emerging battery charging requirements. The constant current value is set with one external resistor. The MCP73831/ 2 devices limit the charge current based on die temper- ature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. Several options are available for the preconditioning threshold, preconditioning current value, charge termination value and automatic recharge threshold. The preconditioning value and charge termination value are set as a ratio, or percentage, of the programmed constant current value. Preconditioning can be disabled. Refer to Section 1.0 “Electrical Characteristics” for available options and the “Prod- uct Identification System” for standard options. The MCP73831/2 devices are fully specified over the ambient temperature range of -40°C to +85°C. Package Types STAT VDD VSS PROG VBAT + Single Li-Ion Cell MCP73831 500 mA Li-Ion Battery Charger VIN 4.7 μF 470Ω 2k Ω 4.7 μF VBAT VSS VDD PROGSTAT MCP73831/2 2×3 DFN* VBAT VDD VBAT NC VSS

5 STAT

Includes Exposed Thermal Pad (EP); see Table 3-1. EP MCP73831/2 SOT-23-5 Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers

DS21984E-page 2 © 2008 Microchip Technology Inc. Functional Block Diagram REFERENCE GENERATOR VREF(1.22V) VBAT VDD STAT PROG VBAT G=0.001 VSS DIRECTION CONTROL 477 kΩ 255 kΩ UVLO SHDN DIRECTION CONTROL 0.5 mA PRECONDITION 6m A 6m A TERMINATION 43.6 kΩ CA 3.9 kΩ 111 kΩ 190 kΩ 7k Ω 15 kΩ 182.3 kΩ 111 kΩ CHARGE VA 89 kΩ 361 kΩ 100 kΩ 0.5 mA VDD MCP73831 ONLY

1.0 ELECTRICAL

Absolute Maximum Ratings† ESD protection on all pins: † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Supply Input Supply Voltage V DD 3.75 — 6 V Supply Current I SS — 510 1500 µA Charging — 53 200 µA Charge Complete, No Battery — 25 50 µA PROG Floating —1 5 µ A V DD < (VBAT - 50 mV) —0 . 1 2 µ A V DD < VSTOP UVLO Start Threshold V START 3.3 3.45 3.6 V V DD Low-to-High UVLO Stop Threshold V STOP 3.2 3.38 3.5 V V DD High-to-Low UVLO Hysteresis V HYS —7 0— m V Voltage Regulation (Constant-Voltage Mode) Regulated Output Voltage V REG 4.168 4.20 4.232 V MCP7383X-2 4.317 4.35 4.383 V MCP7383X-3 4.367 4.40 4.433 V MCP7383X-4 4.466 4.50 4.534 V MCP7383X-5 V DD = [VREG(typical)+1V] IOUT = 10 mA TA = -5°C to +55°C Line Regulation |(ΔVBAT/ VBAT)/ΔVDD| — 0.09 0.30 %/V V DD = [VREG(typical)+1V] to 6V, IOUT = 10 mA Load Regulation |ΔVBAT/VBAT| — 0.05 0.30 % I OUT = 10 mA to 50 mA VDD = [VREG(typical)+1V] Supply Ripple Attenuation PSRR — 52 —- dB I OUT=10 mA, 10Hz to 1 kHz —4 7— d B I OUT=10 mA, 10Hz to 10 kHz —2 2— d B I OUT=10 mA, 10Hz to 1 MHz Current Regulation (Fast Charge Constant-Current Mode) Fast Charge Current Regulation IREG 90 100 110 mA PROG = 10 k Ω 450 505 550 mA PROG = 2.0 k Ω, Note 1 12.5 14.5 16.5 mA PROG = 67 k Ω TA = -5°C to +55°C Note 1: Not production tested. Ensured by design.

DS21984E-page 4 © 2008 Microchip Technology Inc. Preconditioning Current Regulation (Trickle Charge Constant-Current Mode) Precondition Current Ratio IPREG / IREG 7.5 10 12.5 % PROG = 2.0 k Ω to 10 kΩ 15 20 25 % PROG = 2.0 k Ω to 10 kΩ 30 40 50 % PROG = 2.0 k Ω to 10 kΩ — 100 — % No Preconditioning TA = -5°C to +55°C Precondition Voltage Threshold Ratio VPTH / VREG 64 66.5 69 % V BAT Low-to-High 69 71.5 74 % V BAT Low-to-High Precondition Hysteresis V PHYS —1 1 0— m V V BAT High-to-Low Charge Termination Charge Termination Current Ratio ITERM / IREG 3.75 5 6.25 % PROG = 2.0 k Ω to 10 kΩ 5.6 7.5 9.4 % PROG = 2.0 k Ω to 10 kΩ 8.5 10 11.5 % PROG = 2.0 k Ω to 10 kΩ 15 20 25 % PROG = 2.0 k Ω to 10 kΩ TA = -5°C to +55°C Automatic Recharge Recharge Voltage Threshold Ratio V RTH / VREG 91.5 94.0 96.5 % V BAT High-to-Low 94 96.5 99 % V BAT High-to-Low Pass Transistor ON-Resistance ON-Resistance R DSON — 350 — m Ω VDD = 3.75V, TJ = 105°C Battery Discharge Current Output Reverse Leakage Current IDISCHARGE — 0.15 2 µA PROG Floating —0 . 2 5 2 µ A V DD Floating —0 . 1 5 2 µ A V DD < VSTOP — -5.5 -15 µA Charge Complete Status Indicator – STAT Sink Current I SINK ——2 5 m A Low Output Voltage V OL —0 . 4 1 V I SINK = 4 mA Source Current I SOURCE ——3 5 m A High Output Voltage V OH —V DD-0.4 V DD - 1 V I SOURCE = 4 mA (MCP73831) Input Leakage Current I LK — 0.03 1 µA High-Impedance PROG Input Charge Impedance Range RPROG 2— 6 7 k Ω Minimum Shutdown Impedance RPROG 70 — 200 k Ω Automatic Power Down Automatic Power Down Entry Threshold VPDENTER VDD<(VBAT +20 mV) VDD<(VBAT +50 mV) —3 . 5 V ≤ VBAT ≤ VREG VDD Falling Automatic Power Down Exit Threshold VPDEXIT —V DD<(VBAT +150 mV) VDD<(VBAT +200 mV) 3.5V ≤ VBAT ≤ VREG VDD Rising Thermal Shutdown Die Temperature T SD — 150 — °C Die Temperature Hysteresis TSDHYS —1 0— °C DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Note 1: Not production tested. Ensured by design.

© 2008 Microchip Technology Inc. DS21984E-page 5 MCP73831/2 TEMPERATURE SPECIFICATIONS AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typical) + 0.3V] to 12V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions UVLO Start Delay t START —— 5 m s V DD Low-to-High Constant-Current Regulation Transition Time Out of Preconditioning tDELAY —— 1 m s V BAT < VPTH to VBAT > VPTH Current Rise Time Out of Preconditioning tRISE —— 1 m s I OUT Rising to 90% of IREG Termination Comparator Filter tTERM 0.4 1.3 3.2 ms Average I OUT Falling Charge Comparator Filter t CHARGE 0.4 1.3 3.2 ms Average V BAT Status Indicator Status Output turn-off t OFF —— 2 0 0 µsI SINK = 1 mA to 0 mA Status Output turn-on t ON —— 2 0 0 µsI SINK = 0 mA to 1 mA Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typical) + 0.3V] to 12V. Typical values are at +25°C, VDD = [VREG (typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range T A -40 — +85 °C Operating Temperature Range T J -40 — +125 °C Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances 5-Lead, SOT-23 θJA — 230 — °C/W 4-Layer JC51-7 Standard Board, Natural Convection (Note 2) 8-Lead, 2 mm x 3 mm, DFN θ JA — 76 — °C/W 4-Layer JC51-7 Standard Board, Natural Convection (Note 1) Note 1: This represents the minimum copper condition on the PCB (Printed Circuit Board). 2: With large copper area on the PCB, the SOT-23-5 thermal resistance ( θ JA ) can reach a typical value of 130°C/W or better.

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-Voltage mode. FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). FIGURE 2-3: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT). FIGURE 2-4: Charge Current (IOUT) vs. Programming Resistor (RPROG). FIGURE 2-5: Charge Current (IOUT) vs. Supply Voltage (VDD). FIGURE 2-6: Charge Current (IOUT) vs. Supply Voltage (VDD). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. The performance characteristics listed herein are not tested or guaranteed. In so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 4.170 4.175 4.180 4.185 4.190 4.195 4.200 4.205 4.210 Supply Voltage (V) Battery Regulation Voltage (V) MCP73831-2 IOUT = 10 mA IOUT = 100 mA IOUT = 450 mA 4.170 4.175 4.180 4.185 4.190 4.195 4.200 4.205 4.210 -40 -30 -20 -10 Ambient Temperature (°C) Battery Regulation Voltage (V) MCP73831-2 IOUT = 10 mA IOUT = 100 mA IOUT = 450 mA 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 Battery Regulation Voltage (V) Output Leakage Current (µA) +85°C -40°C +25°C 100 150 200 250 300 350 400 450 500 2 7 12 17 22 27 32 37 42 47 52 57 62 67 Programming Resistor (k Ω) Charge Current (mA) 100 101 102 103 104 Supply Voltage (V) Charge Current (mA) RPROG = 10 kΩ 500 502 504 506 508 510 512 514 516 Supply Voltage (V) Charge Current (mA) RPROG = 2 kΩ

3.0 PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLES

3.1 Battery Management Input Supply

(VDD) A supply voltage of [V REG (typical) + 0.3V] to 6V is recommended. Bypass to V SS with a minimum of 4.7 µF.

3.2 Battery Charge Control Output

(VBAT) Connect to positive terminal of battery. Drain terminal of internal P-channel MOSFET pass transistor. Bypass to VSS with a minimum of 4.7 µF to ensure loop stability when the battery is disconnected.

3.3 Charge Status Output (STAT)

STAT is an output for connection to an LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. STAT is a tri-state logic output on the MCP73831 and an open-drain output on the MCP73832.

3.4 Battery Management 0V Reference

(VSS) Connect to negative terminal of battery and input supply.

3.5 Current Regulation Set (PROG)

Preconditioning, fast charge and termination currents are scaled by placing a resistor from PROG to VSS. The charge management controller can be disabled by allowing the PROG input to float.

3.6 Exposed Thermal Pad (EP)

There is an internal electrical connection between the Exposed Thermal Pad (EP) and the V SS pin; they must be connected to the same potential on the Printed Circuit Board (PCB). Vias are recommended to add from land area of EP to a copper layer on the other side of the PCB for better thermal performance. Pin No. Symbol Function DFN SOT-23-5

14 V DD Battery Management Input Supply

2— V DD Battery Management Input Supply

33 V BAT Battery Charge Control Output

4— V BAT Battery Charge Control Output 5 1 STAT Charge Status Output

62 V SS Battery Management 0V Reference

7 — NC No Connection 8 5 PROG Current Regulation Set and Charge Control Enable 9— E P Exposed Thermal Pad (EP); must be connected to VSS.

4.0 DEVICE OVERVIEW

The MCP73831/2 are highly advanced linear charge management controllers. Figure 4-1 depicts the operational flow algorithm from charge initiation to completion and automatic recharge. FIGURE 4-1: Flowchart.

4.1 Undervoltage Lockout (UVLO)

An internal UVLO circuit monitors the input voltage and keeps the charger in Shutdown mode until the input supply rises above the UVLO threshold. The UVLO circuitry has a built in hysteresis of 100 mV. In the event a battery is present when the input power is applied, the input supply must rise 150 mV above the battery voltage before the MCP73831/2 becomes oper- ational. The UVLO circuit places the device in Shutdown mode if the input supply falls to within +50 mV of the battery voltage. Again, the input supply must rise to a level 150 mV above the battery voltage before the MCP73831/2 become operational. The UVLO circuit is always active. Whenever the input supply is below the UVLO threshold or within +50 mV of the voltage at the V BAT pin, the MCP73831/2 are placed in a Shutdown mode. During any UVLO conditi on, the battery reverse discharge current will be less than 2 µA.

4.2 Charge Qualification

For a charge cycle to begin, all UVLO conditions must be met and a battery or output load must be present. A charge current programming resistor must be connected from PROG to V SS. If the PROG pin is open or floating, the MCP73831/2 are disabled and the battery reverse discharge current is less than 2 µA. In this manner, the PROG pin acts as a charge enable and can be used as a manual shutdown.

4.3 Preconditioning

If the voltage at the VBAT pin is less than the precondi- tioning threshold, the MCP 73831/2 enter a precondi- tioning or Trickle Charge mode. The preconditioning threshold is factory set. Refer to Section 1.0 “Electri- cal Characteristics” for preconditioning threshold options and the Product Id entification System for standard options. In this mode, the MCP73831/2 supply a percentage of the charge current (established with the value of the resistor connected to the PROG pin) to the battery. The percentage or ratio of the current is factory set. Refer to Section 1.0 “Electri cal Characteristics” for preconditioning current options and the ”Product Identification System” for standard options. When the voltage at the V BAT pin rises above the preconditioning threshold, the MCP73831/2 enter the Constant-Current or Fast Charge mode.

4.4 Fast Charge Constant-Current

During the Constant-Current mode, the programmed charge current is supplied to the battery or load. The charge current is established using a single resistor from PROG to V SS. Constant-Current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG. SHUTDOWN MODE VDD < VUVLO VDD < VBAT or PROG > 200 kΩ STAT = Hi-Z PRECONDITIONING MODE Charge Current = IPREG STAT = LOW FAST CHARGE MODE Charge Current = IREG STAT = LOW CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT = LOW VBAT < VPTH VBAT > VPTH VBAT = VREG VBAT < VRTH VBAT > VPTH IBAT < ITERM CHARGE COMPLETE MODE No Charge Current STAT = HIGH (MCP73831) STAT = Hi-Z (MCP73832)

4.5 Constant-Voltage Mode

When the voltage at the V BAT pin reaches the regula- tion voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 4.2V, 4.35V, 4.40V, or 4.50V with a tolerance of ±0.75%.

4.6 Charge Termination

The charge cycle is terminated when, during Constant- Voltage mode, the average charge current diminishes below a percentage of the programmed charge current (established with the value of the resistor connected to the PROG pin). A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature ch arge cycle termination. The percentage or ratio of the current is factory set. Refer to Section 1.0 “Electrical Characteristics” for charge termination current options and the ”Product Identification System” for standard options. The charge current is latched off and the MCP73831/2 enter a Charge Complete mode.

4.7 Automatic Recharge

The MCP73831/2 continuously monitor the voltage at the V BAT pin in the Charge Complete mode. If the voltage drops below the recharge threshold, another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for recharge threshold options and the ”Product Identification System” for standard options.

4.8 Thermal Regulation

The MCP73831/2 limit the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while main taining device reliability. Figure 4-2 depicts the thermal regulation for the MCP73831/2. FIGURE 4-2: Thermal Regulation.

4.9 Thermal Shutdown

The MCP73831/2 suspend ch arge if the die tempera- ture exceeds 150°C. Charging will resume when the die temperature has cooled by approximately 10°C. 150 225 300 375 450 525 105 115 125 135 145 155 Junction Temperature (°C) Charge Current (mA) RPROG = 2 kΩ

5.0 DETAILED DESCRIPTION

5.1 Analog Circuitry

5.1.1 BATTERY MANAGEMENT INPUT

SUPPLY (VDD) The VDD input is the input su pply to the MCP73831/2. The MCP73831/2 automatically enter a Power-Down mode if the voltage on the V DD input falls below the UVLO voltage (VSTOP). This feature prevents draining the battery pack when the VDD supply is not present.

5.1.2 CURRENT REGULATION SET

(PROG) Fast charge current regulation can be scaled by placing a programming resistor (RPROG) from the PROG input to VSS. The program resistor and the charge current are calculated using the following equation: The preconditioning trickle charge current and the charge termination current are ratiometric to the fast charge current based on the selected device options.

5.1.3 BATTERY CHARGE CONTROL

OUTPUT (VBAT) The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73831/2 provide constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack.

5.2 Digital Circuitry

5.2.1 STATUS INDICATOR (STAT)

The charge status output of the MCP73831 has three different states: High (H), Low (L), and High-Imped- ance (Hi-Z). The charge status output of the MCP73832 is open-drain, and, as such, has two different states: Low (L), and High-Impedance (Hi-Z). The charge charge status output can be used to illuminate 1, 2, or tri-color LEDs. Optionally, the charge status output can be used as an interface to a host microcontroller. Table 5-1 summarize the state of the status output during a charge cycle..

5.2.2 DEVICE DISABLE (PROG)

The current regulation set input pin (PROG) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle. Placing a programming resistor from the PROG input to V SS enables the device. Allowing the PROG input to float or by applying a logic-high input signal, disables the device and terminates a charge cycle. When disabled, the device’s supply current is reduced to 25 µA, typically. IREG 1000V RPROG Where: RPROG =k O h m s IREG = milliampere TABLE 5-1: STATUS OUTPUT Charge Cycle State STAT1 MCP73831 MCP73832 Shutdown Hi-Z Hi-Z No Battery Present Hi-Z Hi-Z Preconditioning L L Constant-Current Fast Charge LL Constant Voltage L L Charge Complete – Standby HH i - Z

6.0 APPLICATIONS

The MCP73831/2 are designed to operate in conjunc- tion with a host microcontroller or in a stand-alone application. The MCP73831/2 provide the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells constant current followed by constant voltage. Figure 6-1 depicts a typical stand-alone application circuit, while Figures 6-2 and 6-3 depict the accompanying charge profile. FIGURE 6-1: Typical Application Circuit. FIGURE 6-2: Typical Charge Profile (180 mAh Battery). FIGURE 6-3: Typical Charge Profile in Thermal Regulation (1000 mAh Battery).

6.1 Application Circuit Design

Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to t he Constant-Current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger.

6.1.1 COMPONENT SELECTION

Selection of the external components in Figure 6-1 is crucial to the integrity an d reliability of the charging system. The following discussion is intended as a guide for the component selection process.

6.1.1.1 Current Programming Resistor

(RPROG) The preferred fast charge current for Lithium-Ion cells is at the 1C rate, with an absolute maximum current at the 2C rate. For example, a 500 mAh battery pack has a preferred fast charge current of 500 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life. STAT VDD VSS PROG VBAT + Single Li-Ion Cell MCP73831 CIN Li-Ion Battery Charger RPROG RLED COUT REGULATED WALL CUBE LED 0.0 1.0 2.0 3.0 4.0 5.0 6.0 100 120 140 160 180 Time (minutes) Battery Voltage (V) 100 120 Charge Current (mA) MCP73831-2AC/IOT VDD = 5.2V RPROG = 10 kΩ 0.0 1.0 2.0 3.0 4.0 5.0 6.0 120 150 180 210 240 Time (minutes) Battery Voltage (V) 100 200 300 400 500 600 Charge Current (mA) MCP73831-2AC/IOT VDD = 5.2V RPROG = 2 kΩ

6.1.1.2 Thermal Considerations

The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to t he Constant-Current mode. In this case, the power dissipation is: Power dissipation with a 5V, ±10% input voltage source is: This power dissipation with the battery charger in the SOT-23-5 package will cause thermal regulation to be entered as depicted in Figure 6-3. Alternatively, the 2mm x 3mm DFN package could be utilized to reduce charge cycle times.

6.1.1.3 External Capacitors

The MCP73831/2 are stable with or without a battery load. In order to maintain good AC stability in the Con- stant-Voltage mode, a minimum capacitance of 4.7 µF is recommended to bypass the V BAT pin to V SS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnec- tions appear inductive at high frequencies. These elements are in the control feedback loop during Constant-Voltage mode. Therefore, the bypass capac- itance may be necessary to compensate for the inductive nature of the battery pack. Virtually any good quality output filter capacitor can be used, independent of the capacitor’s minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 4.7 µF ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for output currents up to a 500 mA.

6.1.1.4 Reverse-Blocking Protection

The MCP73831/2 provide pr otection from a faulted or shorted input. Without t he protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor.

6.1.1.5 Charge Inhibit

6.1.1.6 Charge Status Interface

A status output provides information on the state of charge. The output can be used to illuminate external LEDs or interface to a host microcontroller. Refer to Table 5-1 for a summary of t he state of the status output during a charge cycle.

6.2 PCB Layout Issues

For optimum voltage regulation, place the battery pack as close as possible to the device’s VBAT and VSS pins. This is recommended to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. Figures 6-4 and 6-5 depict a typical layout with PCB heatsinking. FIGURE 6-4: Typical Layout (Top). FIGURE 6-5: Typical Layout (Bottom). PowerDissipation V DDMAX VPTHMIN–() IREGMAX×= Where: VDDMAX = the maximum input voltage IREGMAX = the maximum fast charge current VPTHMIN = the minimum transition threshold voltage PowerDissipation 5.5V 2.7V–() 550mA× 1.54W== COUT LED RPROG CINMCP73831 RLED VBAT VDD VSS VBAT VSS VDD

7.0 PACKAGING INFORMATION

7.1 Package Marking Information

5-Lead SOT-23 Example: XXNN KD25 8-Lead DFN (2 mm x 3 mm) Example: XXX YWW NN AAE 739 Device Code MCP73831T-2ACI/MC AAE MCP73831T-2ATI/MC AAF MCP73831T-2DCI/MC AAG MCP73831T-3ACI/MC AAH MCP73831T-4ADI/MC AAJ MCP73831T-5ACI/MC AAK MCP73832T-2ACI/MC AAL MCP73832T-2ATI/MC AAM MCP73832T-2DCI/MC AAP MCP73832T-3ACI/MC AAQ MCP73832T-4ADI/MC AAR MCP73832T-5ACI/MC AAS Note: Applies to 8-Lead DFN Device Code MCP73831T-2ACI/OT KDNN MCP73831T-2ATI/OT KENN MCP73831T-2DCI/OT KFNN MCP73831T-3ACI/OT KGNN MCP73831T-4ADI/OT KHNN MCP73831T-5ACI/OT KJNN MCP73832T-2ACI/OT KKNN MCP73832T-2ATI/OT KLNN MCP73832T-2DCI/OT KMNN MCP73832T-3ACI/OT KPNN MCP73832T-4ADI/OT KQNN MCP73832T-5ACI/OT KRNN MCP73832T-2DFI/OT LUNN Note: Applies to 5-Lead SOT-23 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.

DS21984E-page 20 © 2008 Microchip Technology Inc. /g27/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g39/g88/g68/g79/g3/g41/g79/g68/g87/g15/g3/g49/g82/g3/g47/g72/g68/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g11/g48/g38/g12/g3/g177/g3/g21/g91/g22/g91/g19/g17/g28/g3/g80/g80/g3/g37/g82/g71/g92/g3/g62/g39/g41/g49/g64 /g49/g82/g87/g72/g86/g29 /g20/g17 /g51/g76/g81/g3/g20/g3/g89/g76/g86/g88/g68/g79/g3/g76/g81/g71/g72/g91/g3/g73/g72/g68/g87/g88/g85/g72/g3/g80/g68/g92/g3/g89/g68/g85/g92/g15/g3/g69/g88/g87/g3/g80/g88/g86/g87/g3/g69/g72/g3/g79/g82/g70/g68/g87/g72/g71/g3/g90/g76/g87/g75/g76/g81/g3/g87/g75/g72/g3/g75/g68/g87/g70/g75/g72/g71/g3/g68/g85/g72/g68/g17 /g21/g17 /g51/g68/g70/g78/g68/g74/g72/g3/g80/g68/g92/g3/g75/g68/g89/g72/g3/g82/g81/g72/g3/g82/g85/g3/g80/g82/g85/g72/g3/g72/g91/g83/g82/g86/g72/g71/g3/g87/g76/g72/g3/g69/g68/g85/g86/g3/g68/g87/g3/g72/g81/g71/g86/g17 /g22/g17 /g51/g68/g70/g78/g68/g74/g72/g3/g76/g86/g3/g86/g68/g90/g3/g86/g76/g81/g74/g88/g79/g68/g87/g72/g71/g17 /g23/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g53/g40/g41/g29 /g53/g72/g73/g72/g85/g72/g81/g70/g72/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g15/g3/g88/g86/g88/g68/g79/g79/g92/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g15/g3/g73/g82/g85/g3/g76/g81/g73/g82/g85/g80/g68/g87/g76/g82/g81/g3/g83/g88/g85/g83/g82/g86/g72/g86/g3/g82/g81/g79/g92/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86 /g48/g44/g47/g47/g44/g48/g40/g55/g40/g53/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g49/g50/g48 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g51/g76/g81/g86 /g49 /g27 /g51/g76/g87/g70/g75 /g72 /g19/g17/g24/g19/g3/g37/g54/g38 /g50/g89/g72/g85/g68/g79/g79/g3/g43/g72/g76/g74/g75/g87 /g36 /g19/g17/g27/g19 /g19/g17/g28/g19 /g20/g17/g19/g19 /g54/g87/g68/g81/g71/g82/g73/g73/g3 /g36/g20 /g19/g17/g19/g19 /g19/g17/g19/g21 /g19/g17/g19/g24 /g38/g82/g81/g87/g68/g70/g87/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g36/g22 /g19/g17/g21/g19/g3/g53/g40/g41 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g39 /g21/g17/g19/g19/g3/g37/g54/g38 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g40 /g22/g17/g19/g19/g3/g37/g54/g38 /g40/g91/g83/g82/g86/g72/g71/g3/g51/g68/g71/g3/g47/g72/g81/g74/g87/g75 /g39/g21 /g20/g17/g22/g19 /g177 /g20/g17/g26/g24 /g40/g91/g83/g82/g86/g72/g71/g3/g51/g68/g71/g3/g58/g76/g71/g87/g75 /g40/g21 /g20/g17/g24/g19 /g177 /g20/g17/g28/g19 /g38/g82/g81/g87/g68/g70/g87/g3/g58/g76/g71/g87/g75 /g69 /g19/g17/g20/g27 /g19/g17/g21/g24 /g19/g17/g22/g19 /g38/g82/g81/g87/g68/g70/g87/g3/g47/g72/g81/g74/g87/g75 /g47 /g19/g17/g22/g19 /g19/g17/g23/g19 /g19/g17/g24/g19 /g38/g82/g81/g87/g68/g70/g87/g16/g87/g82/g16/g40/g91/g83/g82/g86/g72/g71/g3/g51/g68/g71 /g46 /g19/g17/g21/g19 /g177 /g177 D N E NOTE 1 1 2 EXPOSED PAD NOTE 1 2 1 K L N e b A3 A1 A NOTE 2 BOTTOM VIEWTOP VIEW /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g20/g21/g22/g37

© 2008 Microchip Technology Inc. DS21984E-page 21 MCP73831/2 /g27/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g39/g88/g68/g79/g3/g41/g79/g68/g87/g15/g3/g49/g82/g3/g47/g72/g68/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g11/g48/g38/g12/g3/g177/g3/g21/g91/g22/g91/g19/g17/g28/g3/g80/g80/g3/g37/g82/g71/g92/g3/g62/g39/g41/g49/g64 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74

DS21984E-page 22 © 2008 Microchip Technology Inc. /g24/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g54/g80/g68/g79/g79/g3/g50/g88/g87/g79/g76/g81/g72/g3/g55/g85/g68/g81/g86/g76/g86/g87/g82/g85/g3/g11/g50/g55/g12/g3/g62/g54/g50/g55/g16/g21/g22/g64 /g49/g82/g87/g72/g86/g29 /g20/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g86/g3/g39/g3/g68/g81/g71/g3/g40/g20/g3/g71/g82/g3/g81/g82/g87/g3/g76/g81/g70/g79/g88/g71/g72/g3/g80/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g17/g3/g48/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g3/g86/g75/g68/g79/g79/g3/g81/g82/g87/g3/g72/g91/g70/g72/g72/g71/g3/g19/g17/g20/g21/g26/g3/g80/g80/g3/g83/g72/g85/g3/g86/g76/g71/g72/g17 /g21/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86 /g48/g44/g47/g47/g44/g48/g40/g55/g40/g53/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g49/g50/g48 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g51/g76/g81/g86 /g49 /g24 /g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72 /g19/g17/g28/g24/g3/g37/g54/g38 /g50/g88/g87/g86/g76/g71/g72/g3/g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72/g20 /g20/g17/g28/g19/g3/g37/g54/g38 /g50/g89/g72/g85/g68/g79/g79/g3/g43/g72/g76/g74/g75/g87 /g36 /g19/g17/g28/g19 /g177 /g20/g17/g23/g24 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g36/g21 /g19/g17/g27/g28 /g177 /g20/g17/g22/g19 /g54/g87/g68/g81/g71/g82/g73/g73 /g36/g20 /g19/g17/g19/g19 /g177 /g19/g17/g20/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g40 /g21/g17/g21/g19 /g177 /g22/g17/g21/g19 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g58/g76/g71/g87/g75 /g40/g20 /g20/g17/g22/g19 /g177 /g20/g17/g27/g19 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g39 /g21/g17/g26/g19 /g177 /g22/g17/g20/g19 /g41/g82/g82/g87/g3/g47/g72/g81/g74/g87/g75 /g47 /g19/g17/g20/g19 /g177 /g19/g17/g25/g19 /g41/g82/g82/g87/g83/g85/g76/g81/g87 /g47/g20 /g19/g17/g22/g24 /g177 /g19/g17/g27/g19 /g41/g82/g82/g87/g3/g36/g81/g74/g79/g72/g73 /g19/g131 /g177 /g22/g19/g131 /g47/g72/g68/g71/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g70 /g19/g17/g19/g27 /g177 /g19/g17/g21/g25 /g47/g72/g68/g71/g3/g58/g76/g71/g87/g75 /g69 /g19/g17/g21/g19 /g177 /g19/g17/g24/g20 φ N b E D 1 2 3 e A A2 c L /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g19/g28/g20/g37

© 2008 Microchip Technology Inc. DS21984E-page 19 MCP73831/2 APPENDIX A: REVISION HISTORY Revision E (September 2008) The following is the list of modifications: 1. Package Types: Changed DFN pinout diagram. 2. 1.0 “Electrical Characteristics”: Changed “Charge Impedance Range from 20 k Ω to 67 kΩ. 3. 1.0 “Electrical Characteristics”: Misc. Format- ting changes. 4. Section 2.0 “Typical Performance Curves” : Updated Figure 2-4. 5. Section 3.0 “Pin Description” : Added Exposed Pad pin to table and added Section 3.6 “Exposed Thermal Pad (EP)”. 6. Updated Appendix A: “Revision History” 7. Added Land Patttern Package Outline Drawing for 2x3 DFN package. 8. Pagination fixes throughout document per Marcom Standards. Revision D (April 2008) The following is the list of modifications: 1. Changed Charge Termination Current Ratio to 8.5% minimum and 11.5% maximum. Revision C (October 2007) The following is the list of modifications: 1. Numerous edits throughout document. 2. Added note to Temperatur e Specifications table. 3. Updated Figure 2-4. Revision B (March 2006) The following is the list of modifications: 1. Added MCP73832 through document. Revision A (November 2005)

Original Release of this Document.

© 2008 Microchip Technology Inc. DS21984E-page 21 MCP73831/2 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP73831: Single-Cell Charge Controller MCP73831T: Single-Cell Charge Controller (Tape and Reel) MCP73832 Single-Cell Charge Controller MCP73832T: Single-Cell Charge Controller (Tape and Reel) Regulation Voltage: Code VREG 4.20V 4.35V 4.40V 4.50V Options: * Code I PREG/IREG VPTH/VREG ITERM/IREG VRTH/VREG AC AD AT DC 100 66.5 66.5 71.5 x 7.5 7.5 7.5 96.5 96.5 * Consult Factory for Alternative Device Options Temperature Range: I= - 4 0 °C to +85°C (Industrial) Package: MC = Dual-Flat, No-Lead (2x3 mm body), 8-Lead OT = Small Outline Transistor (SOT23), 5-Lead Examples: * a) MCP73831-2ACI/OT: 4.20V V REG, Options AC, 5LD SOT23 Pkg b) MCP73831T-2ACI/OT: Tape and Reel, 4.20V VREG, Options AC, 5LD SOT23 Pkg c) MCP73832-2ACI/MC: 4.20V V REG, Options AC, 8LD DFN Package d) MCP73832T-2ACI/MC: Tape and Reel, 4.20V VREG, Options AC, 8LD DFN Package a) MCP73831-2ATI/OT: 4.20V V REG, Options AT, 5LD SOT23 Pkg b) MCP73831T-2ATI/OT: Tape and Reel, 4.20V VREG, Options AT, 5LD SOT23 Pkg c) MCP73832-2ATI/MC: 4.20V V REG, Options AT, 8LD DFN Package d) MCP73832T-2ATI/MC: Tape and Reel, 4.20V VREG, Options AT, 8LD DFN Package a) MCP73831-2DCI/OT: 4.20V V REG, Options DC, 5LD SOT23 Pkg b) MCP73831T-2DCI/OT: Tape and Reel, 4.20V VREG, Options DC, 5LD SOT23 Pkg c) MCP73832-2DCI/MC: 4.20V V REG, Options DC, 8LD DFN Package d) MCP73832T-2DCI/MC: Tape and Reel, 4.20V VREG, Options DC, 8LD DFN Package a) MCP73831-3ACI/OT: 4.35V V REG, Options AC, 5LD SOT23 Pkg b) MCP73831T-3ACI/OT: Tape and Reel, 4.35V VREG, Options AC, 5LD SOT23 Pkg c) MCP73832-3ACI/MC: 4.35V V REG, Options AC, 8LD DFN Package d) MCP73832T-3ACI/MC: Tape and Reel, 4.35V VREG, Options AC, 8LD DFN Package a) MCP73831-4ADI/OT: 4.40V V REG, Options AD, 5LD SOT23 Pkg b) MCP73831T-4ADI/OT: Tape and Reel, 4.40V VREG, Options AD, 5LD SOT23 Pkg c) MCP73832-4ADI/MC: 4.40V V REG, Options AD, 8LD DFN Package d) MCP73832T-4ADI/MC: Tape and Reel, 4.40V VREG, Options AD, 8LD DFN Package a) MCP73831-5ACI/OT: 4.50V V REG, Options AC, 5LD SOT23 Pkg b) MCP73831T-5ACI/OT: Tape and Reel, 4.50V VREG, Options AC, 5LD SOT23 Pkg c) MCP73832-5ACI/MC: 4.50V V REG, Options AC, 8LD DFN Package d) MCP73832T-5ACI/MC: Tape and Reel, 4.50V VREG, Options AC, 8LD DFN Package * Consult Factory for Alternate Device Options PART NO. Device X VREG /XX Package XX Options X Temperature Range

© 2008 Microchip Technology Inc. DS21984E-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC 32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2008, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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Product Information

MCP73831-2ATI/MC specifications and overview.

Summary

Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers 2008

Description

Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers 2008

Source title MCP73831-2ATI/MC Datasheet(PDF) - Microchip Technology

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