MCP73113 MICROCHIP | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 34
Technical content
Features
- Complete Linear Charge Management Controller: - Integrated Input Overvoltage Protection - Integrated Pass Transistor - Integrated Current Sense - Integrated Reverse Discharge Protection
- Constant Current / Constant Voltage Operation with Thermal Regulation
- 4.15V Undervoltage Lockout (UVLO)
- 18V Absolute Maximum Input with OVP: - 6.5V (MCP73113) - 5.8V (MCP73114)
- High Accuracy Preset Voltage Regulation Through Full Temperature Range (-5°C to +55°C): + 0.5%
- Battery Charge Voltage Options: - 4.10V, 4.20V, 4.35V or 4.4V
- Resistor Programmable Fast Charge Current: - 130 mA - 1100 mA
- Preconditioning of Deeply Depleted Cells - Available Options: 10% or Disable
- Integrated Precondition Timer: - 32 Minutes or Disable
- Automatic End-of -Charge Control: - Selectable Minimu m Current Ratio: - Elapse Safety Timer: 4 HR, 6 HR, 8 HR or Disable
- Automatic Recharge: - Available Options: 95% or Disable
- Charge Status Output - Two Style Options
- Soft start
- Temperature Range: -40°C to +85°C
- Packaging: DFN-10 (3 mm x 3 mm)
Applications
- Low-Cost Li-Ion/Li-Poly Battery Chargers
- MP3 Players
- Digital Still Camera
- Portable Media Players
- Handheld Devices
- Bluetooth Headsets
- USB Chargers
Description
The MCP73113/4 are highly integrated Li-Ion battery charge management controllers for use in space- limited and cost-sensitive applications. The MCP73113/4 devices provide specific charge algorithms for Li-Ion/Li-Polymer batteries to achieve optimal capacity and safety in the shortest charging time possible. Along with their small physical size, the low number of external components make the MCP73113/4 ideally suitable for portable applications. The absolute maximum voltage, up to 18V, allows the use of MCP73113/4 in harsh environments, such as low cost wall wart or voltage spikes from plug/unplug. The MCP73113/4 devices employ a constant current/constant voltage charge algorithm. The various charging voltage regulations provide design engineers flexibility to use in different applications. The fast charge, constant current value is set with one external resistor from 130 mA to 1100 mA. The MCP73113/4 devices limit the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. The PROG pin of the MCP73113/4 also serves as enable pin. When high impedance is applied, the MCP73113/4 will be in standby mode. The MCP73113/4 devices are fully specified over the ambient temperature range of -40°C to +85°C. They are available in a 10 lead, DFN package. Package Types (Top View) MCP73113/4 3x3 DFN * VBAT VDD VBAT VSS VSS
7 STAT
- Includes Exposed Thermal Pad (EP); see Table 3-1. EP NC 5 6 NC Single-Cell Li-Ion / Li-Polymer Battery Charge Management Controller with Input Overvoltage Protection
DS22183B-page 2 © 2009 Microchip Technology Inc. Typical Application TABLE 1: AVAILABLE FACTORY PRESET OPTIONS TABLE 2: STANDARD SAMPLE OPTIONS Charge Voltage OVP Pre- conditioning Charge Current Pre- conditioning Threshold Precondition Timer Elapse Timer End-of- Charge Control Automatic Recharge Output Status
32 Minimum
/ 6 HR / 8 HR 5% / 7.5% / 10% / 20% No / Yes Type 1 / Type 2 / 6 HR / 8 HR 5% / 7.5% / 10% / 20% No / Yes Type 1 / Type 2 / 6 HR / 8 HR 5% / 7.5% / 10% / 20% No / Yes Type 1 / Type 2 / 6 HR / 8 HR 5% / 7.5% / 10% / 20% No / Yes Type 1 / Type 2 Note 1: IREG: Regulated fast charge current. 2: VREG: Regulated charge voltage. 3: IPREG/IREG: Preconditioning charge current; ratio of regulated fast charge current. 4: ITERM/IREG: End-of-Charge control; ratio of regulated fast charge current. 5: MCP73113: VOVP = 6.5V, MCP73114: VOVP = 5.8V 6: VRTH/VREG: Recharge threshold; ratio of regulated battery voltage. 7: VPTH/VREG: Preconditioning threshold voltage STAT VDD NC PROG VBAT 1-Cell Ac-dc Adapter NC VDD VSS VSS RLED CIN COUTVBAT RPROG Li-Ion Battery MCP73113/4 Typical application Part Number VREG OVP I PREG/IREG Pre-charge Timer Elapse Timer ITERM/IREG VRTH/VREG VPTH/VREG Output Status MCP73113-16S/MF 4.10V 6.5V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1 MCP73113-06S/MF 4.20V 6.5V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1 MCP73114-0NS/MF 4.20V 5.8V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1 Note 1: Customers should contact their distributor, representatives or field application engineer (FAE) for support and sample. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http//support.microchip.com
© 2009 Microchip Technology Inc. DS22183B-page 3 MCP73113/4 Functional Block Diagram Reference, Bias, UVLO, AND SHDN VREF (1.21V) STAT PROG VBAT VSS Direction Control Precondition Term CA Charge VA Current Limit Charge Control, Timer, and Status Logic VREF VOREG VOREG UVLO VDD Input OverVP VDD - 5.8 / 6.5V Thermal Regulation TSD - 110 °C *Recharge VBAT - 95% VREG *Only available on selected options
DS22183B-page 4 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 5 MCP73113/4
1.0 ELECTRICAL
Absolute Maximum Ratings† ESD protection on all pins † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V] Parameters Sym Min Typ Max Units Conditions Supply Input Input Voltage Range V DD 4—1 6 V Operating Supply Voltage V DD 4.2 — 6.5 V Supply Current I SS — 4 5.5 µA Shutdown (V DD < VBAT - 150 mV) — 700 1500 µA Charging — 30 100 µA Standby (PROG Floating) — 50 150 µA Charge Complete; No Battery; V DD < VSTOP Battery Discharge Current Output Reverse Leakage Current IDISCHARGE — 0.5 2 µA Standby (PROG Floating) — 0.5 2 µA Shutdown (V DD < VBAT, or VDD < VSTOP) 6 17 µA Charge Complete; V DD is present Undervoltage Lockout UVLO Start Threshold V START 4.10 4.15 4.25 V UVLO Stop Threshold V STOP 4.00 4.05 4.15 V UVLO Hysteresis V HYS — 100 — mV Overvoltage Protection OVP Start Threshold V OVP 6.4 6.5 6.6 V MCP73113 5.8 5.9 6.0 V MCP73114 OVP Hysteresis V OVPHYS — 150 — mV Voltage Regulation (Constant Voltage Mode) Regulated Output Voltage Options VREG 4.079 4.10 4.121 V T A = -5°C to 55°C 4.179 4.20 4.221 V V DD = [VREG(Typical)+1V] 4.328 4.35 4.372 V I OUT = 50 mA 4.378 4.40 4.422 V Output Voltage Tolerance V RTOL -0.5 — 0.5 % Line Regulation |(ΔVBAT/VBAT) /ΔVDD| — 0.05 0.20 %/V V DD = [VREG(Typical)+1V] to 6V IOUT = 50 mA Load Regulation |ΔVBAT/VBAT| — 0.05 0.20 % I OUT = 50 mA - 150 mA VDD = [VREG(Typical)+1V] Supply Ripple Attenuation PSRR — -46 — dB I OUT = 20 mA, 10 Hz to 1 kHz —- 3 0 — d B I OUT = 20 mA, 10 Hz to 10 kHz Note 1: Not production tested. Ensured by design.
DS22183B-page 6 © 2009 Microchip Technology Inc. Battery Short Protection BSP Start Threshold V SHORT 1.6 1.7 1.8 V BSP Hysteresis V BSPHYS - 150 - mV BSP Regulation Current I SHORT -2 5 - m A Current Regulation (Fast Charge, Constant-Current Mode) Fast Charge Current Regulation IREG 130 — 1100 mA T A = -5°C to +55°C 117 130 143 mA PROG = 10 k Ω 900 1000 1100 mA PROG = 1.1 k Ω Charge Current Tolerance I RTOL —1 0 — % Preconditioning Current Regulation (Trickle Charge Constant Current Mode) Precondition Current Ratio I PREG / IREG 81 01 5 % P R O G = 1 k Ω to 10 kΩ TA = -5°C to +55°C — 100 — % No Preconditioning Precondition Voltage Threshold Ratio VPTH / VREG 64 66.5 69 % V BAT Low-to-High 69 71.5 74 % Precondition Hysteresis V PHYS — 100 — mV V BAT High-to-Low (Note 1) Charge Termination Charge Termination Current Ratio I TERM / IREG 3.75 5 6.25 % PROG = 1 k Ω to 10 kΩ 7.5 10 12.5 % 15 20 25 % Automatic Recharge Recharge Voltage Threshold Ratio VRTH / VREG 93 95.0 97 % V BAT High-to-Low No Automatic Recharge —0 — % Pass Transistor ON-Resistance ON-Resistance R DSON — 350 — m Ω VDD = 4.5V, TJ = 105°C (Note 1) Status Indicator - STAT Sink Current I SINK —2 03 5 m A Low Output Voltage V OL —0 . 20 . 5 V I SINK = 4 mA Input Leakage Current I LK — 0.001 1 μA High Impedance, V DD on pin PROG Input Charge Impedance Range R PROG 1—2 1 k Ω Shutdown Impedance R PROG 70 200 — k Ω Impedance for Shutdown PROG Voltage Range V PROG 0— 5 V Automatic Power Down Automatic Power Down Entry Threshold VPDENTRY VBAT + 10 mV VBAT + 50 mV — V 2.3V < VBAT < VREG VDD Falling Automatic Power Down Exit Threshold VPDEXIT —V BAT + 150 mV VBAT + 250 mV V2 . 3 V < VBAT < VREG VDD Rising Thermal Shutdown Die Temperature T SD — 150 — °C Die Temperature Hysteresis TSDHYS —1 0 — °C DC CHARACTERISTICS (Continued) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V] Parameters Sym Min Typ Max Units Conditions Note 1: Not production tested. Ensured by design.
© 2009 Microchip Technology Inc. DS22183B-page 7 MCP73113/4 AC CHARACTERISTICS TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 6V, TA=-40°C to +85°C. Typical values are at +25°C, VDD= [VREG(Typical)+1.0V] Parameters Sym Min Typ Max Units Conditions Elapsed Timer Elapsed Timer Period t ELAPSED — 0 — Hours Timer Disabled 3.6 4.0 4.4 Hours 5.4 6.0 6.6 Hours 7.2 8.0 8.8 Hours Preconditioning Timer Preconditioning Timer Period t PRECHG — 0 — Hours Disabled Timer 0.4 0.5 0.6 Hours Status Indicator Status Output turn-off t OFF —— 5 0 0µ s I SINK = 1 mA to 0 mA (Note 1) Status Output turn-on, t ON —— 5 0 0 I SINK = 0 mA to 1 mA (Note 1) Note 1: Not production tested. Ensured by design. Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V] Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range T A -40 — +85 °C Operating Temperature Range T J -40 — +125 °C Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances Thermal Resistance, DFN-10 (3x3) θJA — 43 — °C/W 4-Layer JC51-7 Standard Board, Natural Convection
DS22183B-page 8 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 9 MCP73113/4
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 50 mA and TA= +25°C, Constant-voltage mode. FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). FIGURE 2-3: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). FIGURE 2-4: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). FIGURE 2-5: Charge Current (IOUT) vs. Programming Resistor (RPROG). FIGURE 2-6: Charge Current (IOUT) vs. Supply Voltage (VDD). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. The performance characteristics listed herein are not tested or guaranteed. In so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 4.180 4.185 4.190 4.195 4.200 4.205 4.210 4.215 4.220 Supply Voltage(V) Battery Regulation Voltage (V) ILOAD = 50 mA VBAT = 4.2V TA = +25°C 4.180 4.185 4.190 4.195 4.200 4.205 4.210 4.215 4.220 Supply Voltage (V) Battery Regulation Voltage (V) ILOAD = 150 mA VBAT = 4.2V TA = +25°C 4.170 4.175 4.180 4.185 4.190 4.195 4.200 4.205 4.210 4.215 4.220 - 5 5 1 52 53 54 55 5 Ambient Temperature (°C) Battery Regulation Voltage (V) ILOAD = 50 mA VDD = 5.2V 4.170 4.175 4.180 4.185 4.190 4.195 4.200 4.205 4.210 4.215 4.220 - 5 5 1 52 53 54 55 5 Ambient Temperature (°C) Battery Regulation Voltage (V) ILOAD = 150 mA VDD = 5.2V 100 200 300 400 500 600 700 800 900 1000 1100 1200 1 2 3 4 5 6 7 8 9 1011121 314151617181 920 Programming Resistor (kΩ) Charge Current (mA) VDD = 5.2V TA = +25°C 750 770 790 810 830 850 870 890 910 930 950 Supply Voltage (V) Charge Current (mA)RPROG = 1.33 kΩ TA = +25°C
DS22183B-page 12 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 13 MCP73113/4
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLES
3.1 Battery Management Input Supply
(VDD) A supply voltage of [V REG (Typical) + 0.3V] to 6.0V is recommended. Bypass to VSS with a minimum of 1 µF. The VDD pin is rated 18V absolute maximum to prevent suddenly rise of input voltage from spikes or low cost ac-dc wall adapter.
3.2 Battery Charge Control Output
(VBAT) Connect to the positive terminal of the battery. Bypass to VSS with a minimum of 1 µF to ensure loop stability when the battery is disconnected.
3.3 No Connect (NC)
No connect.
3.4 Battery Management 0V Reference
(VSS) Connect to the negative term inal of the battery and input supply.
3.5 Status Output (STAT)
STAT is an open-drain logic output for connection to an LED for charge status indication in standalone applications. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. Refer to Table 5-1 for a summary of the status output during a charge cycle.
3.6 Current Regulation Set (PROG)
The fast charge current is set by placing a resistor from PROG to V SS during constant current (CC) mode. PROG pin is rated up to 5V with 6V absolute maximum value. PROG pin also serves as charge control enable. When a typical 200 kΩ impedance is applied to PROG pin, the MCP73113/4 device is disabled until the high impedance is removed. Refer to Section 5.5 “Constant Current MODE - Fast Charge” for details.
3.7 Exposed Pad (EP)
The Exposed Thermal Pad (EP) shall be connected to the exposed copper area on the Printed Circuit Board (PCB) for the thermal enhancement. Additional vias on the copper area under the MCP73113/4 device can improve the performance of heat dissipation and simplify the assembly process. MCP73113/4 Symbol I/O Function DFN-10 1, 2 V DD I Battery Management Input Supply 3, 4 V BAT I/O Battery Charge Control Output 5, 6 NC - No Connection
7 STAT O Battery Charge Status Output
8, 9 V SS - Battery Management 0V Reference
10 PROG I/O Battery Charge Current Regulation Program and Charge Control Enable
11 EP — Exposed Pad
DS22183B-page 14 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 15 MCP73113/4
4.0 DEVICE OVERVIEW
The MCP73113/4 are simple, but fully integr ated linear charge management controllers. Figure 4-1 depicts the operational flow algorithm. FIGURE 4-1: The MCP73113/4 Flow Chart. VBAT < VPTH Timer Expired SHUTDOWN MODE VDD < VUVLO VDD < VPD or PROG > 200 kΩ STAT = HI-Z TEMPERATURE FAULT No Charge Current STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended TIMER FAULT No Charge Current STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended PRECONDITIONING MODE Charge Current = IPREG STAT = LOW Timer Reset Timer Enable FAST CHARGE MODE Charge Current = IREG STAT = LOW Timer Reset Timer Enabled CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT = LOW CHARGE COMPLETE MODE No Charge Current STAT = HI-Z Timer Reset VBAT > VPTH VBAT = VREG VBAT < ITERM VBAT > VPTH VBAT < VRTH VDD < VOVP VDD > VOVP OVERVOLTAGE PROTECTION No Charge Current STAT = Hi-Z Timer Suspended VDD > VOVP VDD < VOVPVDD > VOVP VDD < VOVP Timer Expired TIMER FAULT No Charge Current STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended Die Temperature > TSD Die Temperature < TSDHYS Charge Mode Resume BATTERY SHORT PROTECTION Charge Current = ISHORT STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended VBAT > VSHORT VBAT < VSHORT Charge Mode Resume
DS22183B-page 16 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 17 MCP73113/4
5.0 DETAILED DESCRIPTION
5.1 Undervoltage Lockout (UVLO)
An internal undervoltage lockout (UVLO) circuit monitors the input voltage and keeps the charger in shutdown mode until the input supply rises above the UVLO threshold. In the event a battery is present when the input power is applied, the input supply must rise approximately 150 mV above the battery voltage before the MCP73113/4 device become operational. The UVLO circuit places the device in shutdown mode if the input supply falls to approximately 150 mV above the battery voltage.The UVLO circuit is always active. At any time, the input supply is below the UVLO threshold or approximately 150 mV of the voltage at the V BAT pin, the MCP73113/4 device is placed in a shutdown mode.
5.2 Overvoltage Protection (OVP)
An internal overvoltage protection (OVP) circuit monitors the input voltage and keeps the charger in shutdown mode when the input supply rises above the OVP threshold. The hysteresis of OVP is approxi- mately 150 mV for the MCP73113/4 device. The MCP73113/4 device is operational between UVLO and OVP threshold. The OVP circuit is also recognized as overvoltage lock out (OVLO).
5.3 Charge Qualification
When the input power is applied, the input supply must rise 150 mV above the battery voltage before the MCP73113/4 becomes operational. The automatic power down circuit places the device in a shutdown mode if the input supply falls to within +50 mV of the battery voltage. The automatic circuit is always active. At any time the input supply is within +50 mV of the voltage at the V BAT pin, the MCP73113/4 is placed in a shutdown mode. For a charge cycle to begi n, the autom atic power down conditions must be met and the charge enable input must be above the input high threshold.
5.3.1 BATTERY MANAGEMENT INPUT
SUPPLY (VDD) The VDD input is the input supply to the MCP73113/4. The MCP73113/4 automatically enters a Power-down mode if the voltage on the V DD input falls to within +50 mV of the battery volta ge. This feature prevents draining the battery pack when the V DD supply is not present.
5.3.2 BATTERY CHARGE CONTROL
OUTPUT (VBAT) The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73113/4 devices provide constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack.
5.3.3 BATTERY DETECTION
The MCP73113/4 detects the battery presence with charging of the output capacitor. The charge flow will initiate when the voltage on V BAT is pulled below the VRECHARGE threshold. Refer to Section 1.0 “Electrical Characteristics” for VRECHARGE values. The value will be the same for non-rechargeable device. When VBAT > V REG + Hysteresis, the charge will be suspended or not start, depends on the condition to prevent over charge that may occur.
5.4 Preconditioning
If the voltage at the V BAT pin is less than the preconditioning threshold, the MCP73113/4 device enters a preconditioning mode. The preconditioning threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for preconditioning threshold options. In this mode, the MCP73113/4 device supplies 10% of the fast charge current (e stablished with the value of the resistor connected to the PROG pin) to the battery. When the voltage at the V BAT pin rises above the pre- conditioning threshold, the MCP73113/4 device enters the constant current (fast charge) mode.
5.4.1 TIMER EXPIRED DURING
If the internal timer expires before the voltage threshold is reached for fast charge mode, a timer fault is indicated and the charge cycle terminates. The MCP73113/4 device remains in this condition until the battery is removed or input power is cycled. If the battery is removed, the MCP73113/4 device enters the standby mode where it remains until a battery is reinserted. Note: The MCP73113/4 also offer options with no preconditioning. Note: The typical preconditioning timer for MCP73113/4 is 32 minutes. The MCP73113/4 also offer options with no preconditioning timer.
DS22183B-page 18 © 2009 Microchip Technology Inc.
5.5 Constant Current MODE - Fast
During the constant current mode, the programmed charge current is supplied to the battery or load. The charge current is established using a single resistor from PROG to V SS. The program resistor and the charge current are calculated using the following equation: EQUATION 5-1: EQUATION 5-2: Table 5-1 provides commonly seen E96 (1%) and E24 (5%) resistors for various charge current to reduce design time. TABLE 5-1: RESISTOR LOOKUP TABLE Constant current mode is maintained until the voltage at the V BAT pin reaches the regulation voltage, V REG. When constant current mode is invoked, the internal timer is reset.
5.5.1 TIMER EXPIRED DURING
If the internal timer expires before the recharge voltage threshold is reached, a timer fault is indicated and the charge cycle terminates. The MCP73113/4 devices remainsin this condition until the battery is removed. If the battery is removed or input power is cycled. The MCP73113/4 device enters the Stand-by mode where it remains until a battery is reinserted.
5.6 Constant Voltage Mode
When the voltage at the V BAT pin reaches the regulation voltage, V REG, constant voltage regulation begins. The regulation voltage is factory set to 4.10V,
5.7 Charge Termination
The charge cycle is termi nated when, during constant voltage mode, the average charge current diminishes below a threshold established with the value of 5%, 7.5%, 10% or 20% of fast charge current or internal timer has expired. A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature ch arge cycle termination. The timer period is factory set and can be disabled. Refer to Section 1.0 “Electrical Characteristics” for timer period options.
5.8 Automatic Recharge
The MCP73113/4 device continuously monitors the voltage at the V BAT pin in the charge complete mode. If the voltage drops below the recharge threshold, another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for recharge threshold options. For the MCP73113/4 devices with no recharge option, the MCP73113/4 will go into standby mode when termination condition is met. The charge will not restart until following condition has met:
- Battery is removed from system and insert again. DD is removed and plug in again
- RPROG is disconnected (or high impedance) and reconnect Charge Current (mA) Recommended E96 Resistor (Ω) Recommended E24 Resistor (Ω) 130 10k 10k 150 8.45k 8.20k 200 6.20k 6.20k 250 4.99k 5.10k 300 4.02k 3.90k 350 3.40k 3.30k 400 3.00k 3.00k 450 2.61k 2.70k 500 2.32k 2.37k 550 2.10k 2.20k 600 1.91k 2.00k 650 1.78k 1.80k 700 1.62k 1.60k 750 1.50k 1.50k 800 1.40k 1.50k 850 1.33k 1.30k 900 1.24k 1.20k 950 1.18k 1.20k 1000 1.10k 1.10k 1100 1.00k 1.00k IREG 1104 R 0.93–×= Where: RPROG = kilo-ohms (k Ω) IREG = milliampere (mA) RPROG 10 IREG ⎛⎞log⎝⎠ ⎛⎞ 0.93–()⁄ Where: RPROG = kilo-ohms (k Ω) IREG = milliampere (mA) Note: The MCP73113/4 also offer options with no automatic recharge.
© 2009 Microchip Technology Inc. DS22183B-page 19 MCP73113/4
5.9 THERMAL REGULATION
The MCP73113/4 shall limit the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 5-1 depicts the thermal regulation for the MCP73113/4 device. Refer to Section 1.0 “Electrical Characteristics” for thermal package resistances and Section 6.1.1.2 “Thermal Considerations” for calculating power dissipation. FIGURE 5-1: Charge Current (IOUT) vs. Junction Temperature (TJ).
5.10 THERMAL SHUTDOWN
The MCP73113/4 suspends charge if the die temperature exceeds +150°C. Charging will resume when the die temperature has cooled by approximately 10°C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry.
5.11 Status Indicator
The charge status outputs are open-drain outputs with two different states: Low (L), and High Impedance (Hi-Z). The charge status outputs can be used to illuminate LEDs. Optionally, the charge status outputs can be used as an interface to a host microcontroller. Table 5-2 summarize the state of the status outputs during a charge cycle.
5.12 BATTERY SHORT PROTECTION
Once a single-cell Li-Ion battery is detected, an internal battery short protection (BSP) circuit starts monitoring the battery voltage. When V BAT falls below a typical 1.7V battery short protection threshold voltage, the charging behavior is postponed. 25 mA (typical) detec- tion current is supplied for recovering from battery short condition. Preconditioning mode resumes when V BAT raises above battery short protecti on threshold. The battery voltage must rise approximately 150 mV above the battery short protection voltage before the MCP73113/4 device become operational. 100 200 300 400 500 600 25 35 45 55 65 75 85 95 105 115 125 135 145 Junction Temperature (°C) Charge Current (mA)VDD = 5.2V RPROG = 2 kΩ TABLE 5-2: STATUS OUTPUTS CHARGE CYCLE STATE STAT Shutdown Hi-Z Standby Hi-Z Preconditioning L Constant Current Fast Charge L Constant Voltage L Charge Complete - Standby Hi-Z Temperature Fault 1.6 second 50% D.C. Flashing (Type2) Hi-Z (Type 1) Timer Fault 1.6 second 50% D.C. Flashing (Type 2) Hi-Z (Type 1) Preconditioning Timer Fault 1.6 second 50% D.C. Flashing (Type 2) Hi-Z (Type 1)
DS22183B-page 20 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 21 MCP73113/4
6.0 APPLICATIONS
The MCP73113/4 deviced are designed to operate in conjunction with a host microcontroller or in standalone applications. The MCP73113/4 provides the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells Constant-current followed by Constant-voltage. Figure 6-1 depicts a typical standalone application circuit, while Figure 6-2 depicts the accompanying charge profile. FIGURE 6-1: Typical Application Circuit. FIGURE 6-2: Typical Charge Profile (875 mAh Battery).
6.1 Application Circuit Design
Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant-current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger.
6.1.1 COMPONENT SELECTION
Selection of the external components in Figure 6-1 is crucial to the integrity an d reliability of the charging system. The following discussion is intended as a guide for the component selection process.
6.1.1.1 Charge Current
The preferred fast charge current for Li-Ion / Li-Poly cells is below the 1C rate, with an absolute maximum current at the 2C rate. The recommended fast charge current should be obtained from battery manufacturer. For example, a 500 mAh battery pack with 0.7C preferred fast charge current has a charge current of 350 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life. STAT VDD NC PROG VBAT 1-Cell Ac-dc Adapter NC VDD VSS VSS RLED CIN COUTVBAT RPROG Li-Ion Battery MCP73113/4 Typical Application 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 1 53 04 56 07 59 0 1 0 5 1 2 0 Time (Minutes) Battery Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Supply Current (A) RPROG = 2 kΩ 875 mAh Battery Note: Please consult with your battery supplier or refer to battery data sheet for preferred charge rate.
DS22183B-page 22 © 2009 Microchip Technology Inc.
6.1.1.2 Thermal Considerations
The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to the Constant-current mode. In this case, the power dissipation is: Power dissipation with a 5V, ±10% input voltage source, 500 mA ±10% and preconditioning threshold voltage at 2.7V is: EQUATION 6-1: This power dissipation with the battery charger in the DFN-10 package will result approximately 63°C above room temperature.
6.1.1.3 External Capacitors
The MCP73113/4 are stable with or without a battery load. In order to maintain good AC stability in the Constant-voltage mode, a minimum capacitance of 1 µF is recommended to bypass the V BAT pin to V SS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant-voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. A minimum of 16V rated 1 µF, is recommended to apply for output capacitor and a minimum of 25V rated 1 µF, is recommended to apply for input capacitor for typical applications. TABLE 6-1: MLCC CAPACITOR EXAMPLE Virtually any good quality output filter capacitor can be used, independent of the capacitor’s minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 1 µF ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability.
6.1.1.4 Reverse-Blo cking Protection
The MCP73113/4 provide protection from a faulted or shorted input. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor. PowerDissipation V DDMAX VPTHMIN–() IREGMAX×= Where: VDDMAX = the maximum input voltage IREGMAX = the maximum fast charge current VPTHMIN = the minimum transition threshold voltage PowerDissipation 5.5V 2.7V –() 550mA× 1.54W== MLCC Capacitors Temperature Range Tolerance X7R -55 °C to +125°C ±15% X5R -55 °C to +85°C ±15%
© 2009 Microchip Technology Inc. DS22183B-page 23 MCP73113/4
6.2 PCB Layout Issues
For optimum voltage regulation, place the battery pack as close as possible to the device’s VBAT and VSS pins, recommended to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. Figure 6-4 and Figure 6-5 depict a typical layout with PCB heatsinking. FIGURE 6-3: Typical Layout (Top). FIGURE 6-4: Typical Layout (Top Metal). FIGURE 6-5: Typical Layout (Bottom).
DS22183B-page 24 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 25 MCP73113/4
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
10-Lead DFN (3x3) YYWW NNN Example: 93ZI 0929 256 Standard * Part Number Code MCP73113-06SI/MF 93HI MCP73113-16SI/MF 83HI MCP73114-0NSI/MF 9MHI Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
DS22183B-page 26 © 2009 Microchip Technology Inc. /g56/g81/g76/g87/g86/g48/g44/g47/g47/g44/g48/g40/g55/g40/g53/g54 D N NOTE 1 1 2 E b e N L NOTE 1 K EXPOSED PAD BOTTOM VIEWTOP VIEW A3 A1 A NOTE 2
© 2009 Microchip Technology Inc. DS22183B-page 27 MCP73113/4
DS22183B-page 28 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 29 MCP73113/4 APPENDIX A: REVISION HISTORY Revision B (July 2009) The following is the list of modifications: 1. Added MCP73114 device throughout the document. 2. Updated specifications for the MCP73113/4 device family throughout the document. 3. Updated package marking information. 4. Updated Product Identification System page. Revision A (May 2009)
- Original Release of this Document.
DS22183B-page 30 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 31 MCP73113/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP73113: Single Cell Li-Ion/Li-Polymer Battery Device MCP73113T: Single Cell Li-Ion/Li-Polymer Battery Device, Tape and Reel MCP73114: Single Cell Li-Ion/Li-Polymer Battery Device MCP73114T: Single Cell Li-Ion/Li-Polymer Battery Device, Tape and Reel Temperature Range: I= - 4 0 °C to +85°C (Industrial) Package: MF = Plastic Dual Flat No Lead, 3x3 mm Body (DFN), 10-Lead PART NO. X XX PackageTemperature Range Device Examples: a) MCP73113-06SI/MF: Single Cell Li-Ion/Li- Polymer Battery Device b) MCP73113-16SI/MF: Single Cell Li-Ion/Li- Polymer Battery Device c) MCP73113T-06SI-MF: Tape and Reel, Single Cell Li-Ion/Li- Polymer Battery Device d) MCP73113T-16SI/MF: Tape and Reel, Single Cell Li-Ion/Li- Polymer Battery Device a) MCP73114-0NSI/MF: Single Cell Li-Ion/Li- Polymer Battery Device b) MCP73114T-0NSI/MF: Tape and Reel, Single Cell Li-Ion/Li- Polymer Battery Device
DS22183B-page 32 © 2009 Microchip Technology Inc. NOTES:
© 2009 Microchip Technology Inc. DS22183B-page 33 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICkit, PICDEM, PICDEM.net, PICtail, PIC 32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
DS22183B-page 34 © 2009 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 WORLDWIDE SALES AND SERVICE 03/26/09