MCP7150

Microchip Technology

Motion Module 07/14/15

Manufacturer: Microchip Technology

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 2015 - 2016 Microchip Technology Inc. DS00001888B-page 1 Product Features

High Performance 32-bit Embedded Controller
Cost effective solution
Small form factor ideal for embedded applications
Low power; 13.25mA in active mode
System in deep sleep consumes 70µA
Host interface via I
3.3-Volt I/O
Package - 17mm x 17mm, 16-pin module Sensor Firmware
Sensor fusion firmware features include: - Self-contained 9-axis sensor fusion - Sensor data pass-through - Fast in-use background calibration of all sen- sors and calibration monitor - Magnetic immunity: Enhanced magnetic dis- tortion, detection and suppression - Gyroscope drift cancellation - Fully calibrated
Easy to implement complete turnkey sensor fusion solution
Sensor power management
Sensors Supported - Bosch BMC150 Geomagnetic Sensor/Accel- erometer - Bosch BMG160 Gyroscope Hardware Features The hardware features in the MM7150 module include the following:
I 2C Controller - Supports I 2C bus speeds to 400kHz - Host Interface Supports Slave Operation
Low Power Modes Target Markets
Internet of Things Applications
Remote Controls, Gaming
Fitness Monitoring
Applications requiring data from an accelerome- ter, magnetometer and gyroscope Temperature Ranges Available
Industrial (-40°C to +85°C)
Commercial (0°C to +70°C)

Description

The MM7150 Motion Module is a simple, cost-effective solution for integrating motion and positioning data into a wide range of applications. The module contains the SSC7150 motion coprocessor with integrated 9-axis sensor fusion as well as high performance MEMS tech- nology including a 3-axis accelerometer, gyroscope and magnetometer. All components are integrated, cal- ibrated and available on the module for PCB mounting. MM7150 Motion Module

DS00001888B-page 2  2015 - 2016 Microchip Technology Inc. TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our pub- lications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this p ublication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of t he literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:

Microchip’s Worldwide Web site; http://www.microchip.com
Your local Microchip sales office (see last page) When contacting a sales office, please specify which devi ce, revision of silicon and da ta sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 3 MM7150 Table of Contents

DS00001888B-page 4  2015 - 2016 Microchip Technology Inc.

1.0 MM7150 PINOUT

The pinout of the MM7150 Motion Module is shown in the assembly drawing.

1.1 Assembly Drawing

The assembly drawing is shown in Figure 1-1. FIGURE 1-1: ASSEMBLY DRAWING

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 5 MM7150

1.2 Recommended Land Pattern

0.00mm 2.80mm 4.00mm 6.08mm 6.53mm 8.61mm 9.08mm 11.16mm 11.62mm 13.70mm 15.04mm 17.84mm 0.00mm 2.80mm 4.00mm 6.08mm 6.53mm 8.61mm 9.08mm 11.16mm 11.62mm 13.70mm 15.04mm 17.84mm

DS00001888B-page 6  2015 - 2016 Microchip Technology Inc.

1.3 Pin Descriptions

The pin descriptions are provided in Table 1-1. TABLE 1-1: PIN DESCRIPTIONS Pin Number Name Type Description 1 HOST_TO_SH_WAKE I Used to wake Motion Module from a Sleep state. This signal must be driven high at least 11ms prior to sending any I2C traffic to the Motion Module. Active high input. This pin should be connected to VDD through a 100KΩ resistor. 11 HOST_TO_SH_RESET I Reset input. Used to reset the host I2C interface. This pin should be connected to VDD through a 100KΩ resistor. 4 HIDI2C_HOST_INT O Alert Interrupt signal fr om Motion Module to Host. Used to tell Host data from Motion Module is ready to be sent out. Active low output.

15 HIDI2C_HOST_CLK IOD I 2C Controller Clock to Host Interface

16 HIDI2C_HOST_DAT IOD I 2C Controller Data to Host Interface

10 NC1 - This pin should be left unconnected

2 NC2 - This pin should be left unconnected

9 NC3 - This pin should be left unconnected

12 NC4 - This pin should be left unconnected

13 NC5 - This pin should be left unconnected

14 NC6 - This pin should be left unconnected

3 NC7 - This pin should be left unconnected

5 NC8 - This pin should be left unconnected

6 NC9 - This pin should be left unconnected

7 VDD PWR VDD supply

8 VSS GND VDD associated ground

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 7 MM7150

2.0 MM7150 MODULE

The MM7150 Motion Module provides 9-axis sensor fusion th at includes a 3-axis accelerometer, a 3-axis gyroscope and a 3-axis magnetometer. The module has an I 2C interface to the host, and supports HID over I 2C. The module includes the Bosch BMC150 Geomagnetic Sensor/Accelerometer and Bosch BMG160 Gyroscope.

2.1 Module Block Diagram

The block diagram of the module is shown in Figure 2-1.

2.2 Module Features

The MM7150 Motion Module provides self-contained 9-axis sensor fusion. It supports fast in-use background calibration of all sensors and calibration monitor. Magnetic immunity features provide enhanced magnetic distortion detection and suppression. The module also provides gyroscope drift cancellation.

2.3 Calibration Requirements

User calibration is not required. The MM7150 Motion Module supports fast in-use background calibration of all sensors and calibration monitor.

2.4 Other Information

To obtain the most recent and complete documentation for this module, including: - User's Guide - Board Description - Board Schematics - Source Code - Application Examples - Links to Web Seminars Please refer to the web site: www.microchip.com/motion. FIGURE 2-1: MM7150 MODULE BLOCK DIAGRAM Microchip SSC7150 Motion Coprocessor Bosch BMG160 (Gyro) Bosch BMC150 (A+M) TPS22929 Power Load VSENSOR HIDI2C_DEVICE_CLK HIDI2C_DEVICE_DAT HIDI2C_HOST_DAT HIDI2C_HOST_CLK HIDI2C_HOST_INT HOST_TO_SH_WAKE D2_WAKE_UP +3.3V GND VDD VSS (x2) AVSS HOST_TO_SH_RESET NC1 NC2 NC3 NC4 NC5 NC6

DS00001888B-page 8  2015 - 2016 Microchip Technology Inc.

3.0 MM7150 HID FUNCTIONS

The MM7150 responds to the standard HID protocol for sensors when used over I2C, defined in References [1] and [2]. The hierarchy of descriptors used in the HID protocol is as follows: The following sections described the descriptors required for communicating with the MM7150:

3.1 HID Descriptor

3.2 Report Descriptors

Report descriptors are composed of pieces of information. Each piece of information is called an Item. The HID class driver contains a parser used to analyze items found in the Report descriptor. The parser extracts infor- mation from the descriptor in a linear fashion. The parser collects the state of each kn own item as it walks through the descriptor, and stores them in an item state table. The item state table contains the state of individual items. From the parser's point of view, a HID class device looks like the following. TABLE 3-1: HID DESCRIPTOR FORMAT (I 2C) Field Description Size Value wHIDDescLength Length of HID Descriptor UINT 16 0x001E bcdVersion Version compliance. Compli ant with Version 1.00 UINT 16 0x0100 wReportDescLength Report Descriptor Length (3213 bytes) UINT 16 0x0C8D wReportDescRegister Identifier to read Report Descriptor UINT 16 0x0002 wInputRegister Identifier to read Input Report UINT 16 0x0003 wMaxInputLength Input Report is 13 Bytes + 2 Bytes length field UINT 16 0x000D wOutputRegistert Identifier to read Output Report UINT 16 0x0000 wMaxOutputLength No Output Report UINT 16 0x0000 wCommandRegister Identifier for Command Register UINT 16 0x0005 wDataRegister Identifier for Data Register UINT 16 0x0006 wVendorID Vendor ID UINT 16 0x04D8 wProductID Product ID UINT 16 0x0F01 wVersionID Version UINT 16 0x7150 RESERVED Reserved UINT 32 0x0

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 9 MM7150 The Report descriptor is unlike other descrip tors in that it is not simply a tabl e of values. The length and content of a Report descriptor vary depending on the number of data fiel ds required for the device’s report or reports. The Report descriptor is made up of items that provide information about the device. The HID report for each sensor has two sections Feature Report and Input Report. The feature report for all the sen- sors is same. The following sections describe the Feature Report and all Input Reports returned by the Motion Module.

DS00001888B-page 10  2015 - 2016 Microchip Technology Inc.

3.2.1 FEATURE REPORT

3.2.2 3D ACCELEROMETER INPUT REPORT

3.2.3 COMPASS INPUT REPORT

TABLE 3-2: FEATURE REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucConnectionType Connection Type UINT 8 ucReportingState Reporting State UINT 8 ucPowerState Power On State UINT 8 ucSensorState Sensor State UINT 8 uIReportInterval Reporting Interval UINT 16 usAccuracy Accuracy UINT 16 usResolution Resolution UINT 16 usChangeSensitivity Change Sensitivity UINT 16 sMaximum Maximum range INT 16 sMinimum Minimum range INT 16 minimumReportInterval Minimum report interval supported UINT16 sensorDesc[6] Sensor description, initialized “MCHPSF” INT16 TABLE 3-3: 3D ACCELEROMETER REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sAccelXValue Accelerometer X axis value INT 16 sAccelYValue Accelerometer Y axis value INT 16 sAccelZValue Accelerometer Z axis value INT 16 ucShakeDetectState Shake event detection UINT 8 TABLE 3-4: COMPASS REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sHeadingCompensatedMag- neticNorthValue Magnetic north value INT 16 sFluxXValue Magnetic field strength, X axis value INT16 sFluxYValue Magnetic field strength, Y axis value INT16 sFluxZValue Magnetic field strength, Z axis value INT16

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 11 MM7150 3.2.4 3D GYROSCOPE INPUT REPORT

3.2.5 INCLINOMETER INPUT REPORT

3.2.6 ORIENTATION INPUT REPORT

TABLE 3-5: 3D GYROSCOPE REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sGyroXValue Gyroscope X axis value INT 16 sGyroYValue Gyroscope Y axis value INT 16 sGyroZValue Gyroscope Z axis value INT 16 ucShakeDetectState Shake event detection UINT 8 TABLE 3-6: INCLINOMETER REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sIncXValue Inclinometer X axis values INT 16 sIncYValue Inclinometer Y axis value INT 16 sIncZValue Inclinometer Z axis value INT 16 TABLE 3-7: ORIENTATION REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sOriXValue Orientation X axis value INT 16 sOriYValue Orientation Y axis value INT 16 sOriZValue Orientation Z axis value INT 16 sOriWValue Orientation W axis value INT 16

DS00001888B-page 12  2015 - 2016 Microchip Technology Inc.

4.0 MM7150 HOST INTERFACE

4.1 I 2C

The MM7150 can be connected to a host via the I 2C interface. The I 2C interface is compliant with the I 2C standard described in [4], at speeds up to 400KHz. Above the transport layer, the protocol used by the MM7150 is the same HID protocol used when communicating over USB. The mapping of HID over I2C is defined in Reference [3]. The protocol and the interface, taken together, are compliant with Windows 8/8.1 certification.

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 13 MM7150

5.0 MM7150 FIRMWARE UPDATE

The firmware in the MM7150 Module may be updated at run time. See Reference [5.] for details.

DS00001888B-page 14  2015 - 2016 Microchip Technology Inc.

6.0 MM7150 REFERENCES

USB-Sig, “Device Class Definition for Human Interface Devices (HID). Firmware Sp ecification”, Version 1.11, 6/27/01 2. USB-Sig, “HID Usage Table Sensor Page”, Reques t HUTRR39, http://www.usb.org/developers/hid- page/HUTRR39b.pdf 3. Microsoft Corporation, “HID Over I 2C Protocol Specification: Device Side”, version 1.00, 04/24/2012 4. NXP Corporation, “I 2C-bus Specification and User Manual”, Rev. 6, 04/04/2014 5. Microchip Technology Inc., “MM7150 Motion Module User's Guide”, 2014

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 15 MM7150

7.0 MM7150 PERFORMANCE

TABLE 7-1: PERFORMANCE PARAMETERS Parameter Typical Accelerometer Range ±2G Resolution 0.98mG Accuracy ±40mG Magnetometer Range X,Y: ±1300 μT Z: ±2500μT Resolution 0.3 μT Heading Accuracy ±3° Compass Range 0° to 360° Resolution 1° Accuracy ±10° Gyroscope Range ±2000°/s Resolution 0.061°/s Accuracy ±5°/s Inclinometer Range: Pitch -180° to +180° Range: Roll -90° to +90° Range: Yaw 0° to +360° Resolution 1° Accuracy ±5° Orientation - Quaternion Range ±1.0 Resolution 0.001 Accuracy ±5°

DS00001888B-page 16  2015 - 2016 Microchip Technology Inc.

8.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of the MM7150 electric al characteristics. Additional information will be provided in future revisions of this document as it becomes available. extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings (See Note 1) Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 8-2). 3: See the “Pin List” section for the 5V tolerant pins.

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 17 MM7150

8.1 DC Characteristics

TABLE 8-2: DC CHARACTERISTICS: OPERATING/POWER-DOWN CURRENT TABLE 8-1: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS DC CHARACTERISTICS Standard Operat ing Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C  TA  +70°C Industrial Operating temperature -40°C  TA  +85°C Param. No. Symbol Characteristics Min. Typ. Max. Units Conditions Operating Voltage DC10 V DD Supply Voltage (Note 2) 2.3 — 3.6 V — DC12 V DR RAM Data Retention Voltage (Note 1) 1.75 — — V — DC16 V POR VDD Start Voltage to Ensure Internal Power-on Reset Signal 1.75 — 2.1 V — DC17 S VDD VDD Rise Rate to Ensure Internal Power-on Reset Signal Note 1: This is the limit to which VDD can be lowered without losing RAM data. 2: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. Refer to parameter BO10 in Table 8-5 for BOR values. DC CHARACTERISTICS Standard Operat ing Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C  T A  +70°C Industrial Operating temperature -40°C  TA  +85°C Parameter No. Symbol Typical Max. Units Conditions Operating/Power-Down Current (Note 1, 2) DC20 I DD 26.5 mA — DC30 I AVG 13.65 mA — DC40 I IDLE 2.5 mA — DC50 I PD 70 150 μA 0°C  TA  +70°C DC50 I PD 120 180 μA -40°C  TA  +85°C Note 1: A device’s supply current is mainly a function of the operating voltage and frequency, as well as tempera- ture. 2: The current measurements are as follows:

Operating current (IDD): This is the peak active current value.
Average current (IAVG): This value represents an average current measurement of active and low power mode time intervals during operation measured over 1 second period.
Idle current (IIDLE) This is the average idle current value when no sensor is actively providing environmental changes (and the device is not in power-down mode).
Power-Down current (IPD): This value is the current measured in power-down mode. Th is is the sleep state entered when the Host issues the SET_POWER (Sleep) Command if the I2C host interface is used. Wakeup from power-down mode requires the HOST_TO_SH_WAKE pin if the I2C host interface is used.

DS00001888B-page 18  2015 - 2016 Microchip Technology Inc. TABLE 8-3: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS DC CHARACTERISTICS Standard Operatin g Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C  TA  +70°C Industrial Operating temperature -40°C  TA  +85°C Param. No. Symbol Characteristics Min. Typical (1) Max. Units Conditions VIL Input Low Voltage DI10 I/O Pins V SS —0 . 2 V DD V DI18 SDAx, SCLx V SS —0 . 3 V DD VI 2C disabled (Note 4) DI19 SDAx, SCLx V SS —0 . 8 V I 2C enabled (Note 4) VIH Input High Voltage DI20 I/O Pins not 5V-tolerant (5) 0.65 VDD —V DD V (Note 4,6) I/O Pins 5V-tolerant(5) 0.65 VDD —5 . 5 V DI28 SDAx, SCLx 0.65 V DD —5 . 5 V I 2C disabled (Note 4,6) DI29 SDAx, SCLx 2.1 — 5.5 V I 2C enabled, 2.3V  VPIN  5.5 (Note 4,6) IIL Input Leakage Current (Note 3) DI50 I/O Ports — — + 1 AV SS  VPIN  VDD, Pin at high-impedance DI55 MCLR# (2) —— + 1 AV SS VPIN VDD Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: The leakage current on the MCLR# pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. 4: This parameter is characterized, but not tested in manufacturing. 5: See the “Pin List” section for the 5V-tolerant pins. 6: The VIH specifications are only in relation to externally applied inputs, and not with respect to the user- selectable internal pull-ups. External open drain input signals utilizing the internal pull-ups of the device are ensured to be recognized only as a logic “high” internally to the device. For External “input” logic inputs that require a pull-up source, to ensure the minimum VIH of those components, it is recommended to use an external pull-up resistor rather than the internal pull-ups of the device.

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 19 MM7150 TABLE 8-4: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C  TA  +70°C Industrial Operating temperature -40°C  TA  +85°C Param. Symbol Characteristic Mi n. Typ. Max. Units Conditions DO10 Vol Output Low Voltage I/O Pins —— 0 . 4 V I OL  10 mA, VDD = 3.3V DO20 V OH Output High Voltage I/O Pins 1.5(1) —— V I OH  -14 mA, VDD = 3.3V 2.0(1) —— I OH  -12 mA, VDD = 3.3V 2.4 — — I OH  -10 mA, VDD = 3.3V 3.0(1) —— I OH  -7 mA, VDD = 3.3V Note 1: Parameters are characterized, but not tested. TABLE 8-5: ELECTRICAL CHARACTERISTICS: BROWN-OUT RESET (BOR) DC CHARACTERISTICS Standard Operat ing Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C  TA  +70°C Industrial Operating temperature -40°C  TA  +85°C Param. No. Symbol Characteristics Min. (1) Typical Max. Units Conditions BO10 Vbor BOR Event on V DD transition high-to-low(2) 2.0 — 2.3 V — Note 1: Parameters are for design guidance only and are not tested in manufacturing. 2: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. TABLE 8-6: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C  T A  +70°C Industrial Operating temperature -40°C  TA  +85°C Param. No. Symbol Characteristics Min. Typical Max. Units Comments D321 Cefc External Filter Capacitor Value 8 10 — F Capacitor must be low series resistance (1 ohm). Typical voltage on the VCAP pin is 1.8V.

DS00001888B-page 20  2015 - 2016 Microchip Technology Inc.

8.2 AC Characteristics and Timing Parameters

The information contained in this section defines MM7150 AC characteristics and timing parameters. FIGURE 8-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS TABLE 8-7: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS AC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Param. No. Symbol Characteristics Min. Typical (1) Max. Units Conditions DO56 C IO All I/O pins — — 50 pF DO58 C B SCLx, SDAx — — 400 pF In I 2C™ mode Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. VDD/2 CL RL Pin Pin VSS VSS CL RL = 464 CL = 50 pF for all pins Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2

DS00001888B-page 22  2015 - 2016 Microchip Technology Inc. TABLE 8-8: RESETS TIMING FIGURE 8-4: I 2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) FIGURE 8-5: I 2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) AC CHARACTERISTICS Standard Operat ing Conditions: 2.3V to 3.6V (unless otherwise stated) Param. No. Symbol Characteristics (1) Min. Typical (2) Max. Units Conditions SY00 T PU Power-up Period Internal Voltage Regulator Enabled —4 0 06 0 0 s— SY02 Tsysdly System Delay Period: Time Required to Reload Device Configuration Fuses plus SYSCLK(3) Delay before First instruction is Fetched. — s +

8 SYSCLK

—— — SY20 Tmclr MCLR# Pulse Width (low) 2 — — s— SY30 T BOR BOR Pulse Width (low) — 1 — s— Note 1: These parameters are characterized, but not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Characterized by design but not tested. 3: SYSCLK is 48MHz IS34 SCLx SDAx Start Condition Stop Condition IS33 Note: Refer to Figure 8-1 for load conditions. IS31 IS30 IS30 IS31 IS33 IS11 IS10 IS20 IS26 IS25 IS40 IS40 IS45 IS21 SCLx SDAx In SDAx Out Note: Refer to Figure 8-1 for load conditions.

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 23 MM7150 TABLE 8-9: I 2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) AC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Param. No. Symbol Characteristics Min. Max. Units Conditions IS10 T LO:SCL Clock Low Time 100 kHz mode 4.7 — s— 400 kHz mode 1.3 — s— IS11 T HI:SCL Clock High Time 100 kHz mode 4.0 — s— 400 kHz mode 0.6 — s— IS20 T F:SCL SDAx and SCLx Fall Time 100 kHz mode — 300 ns C B is specified to be from 10 to 400 pF 400 kHz mode 20 + 0.1 C B 300 ns IS21 T R:SCL SDAx and SCLx Rise Time 100 kHz mode — 1000 ns C B is specified to be from 10 to 400 pF 400 kHz mode 20 + 0.1 C B 300 ns IS25 T SU:DAT Data Input Setup Time 100 kHz mode 250 — ns — 400 kHz mode 100 — ns IS26 T HD:DAT Data Input Hold Time 100 kHz mode 0 — ns — 400 kHz mode 0 0.9 s IS30 T SU:STA Start Condition Setup Time 100 kHz mode 4700 — ns Only relevant for Repeated Start condition 400 kHz mode 600 — ns IS31 T HD:STA Start Condition Hold Time 100 kHz mode 4000 — ns After this period, the first clock pulse is generated 400 kHz mode 600 — ns IS33 T SU:STO Stop Condition Setup Time 100 kHz mode 4000 — ns — 400 kHz mode 600 — ns IS34 T HD:STO Stop Condition Hold Time 100 kHz mode 4000 — ns — 400 kHz mode 600 — ns IS40 T AA:SCL Output Valid from Clock 100 kHz mode 0 3500 ns — 400 kHz mode 0 1000 ns IS45 T BF:SDA Bus Free Time 100 kHz mode 4.7 — s The amount of time the bus must be free before a new transmission can start 400 kHz mode 1.3 — s IS50 C B Bus Capacitive Loading — 400 pF —

DS00001888B-page 24  2015 - 2016 Microchip Technology Inc. APPENDIX A: REVISION HISTORY TABLE A-1: REVISION HISTORY Revision Section/Figure/Entry Correction DS00001888B (01-26-16) Industrial Temp Range Added Industrial Temp Range to Data Sheet Updated IPD for Industrial Temp Range DS00001888A (02-05-15) Initial Release

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 25 MM7150 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con- tains the following information:

Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi- nars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisi ons or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi- cation” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu- ment. Technical support is available through the web site at: http://microchip.com/support

DS00001888B-page 26  2015 - 2016 Microchip Technology Inc. PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.(1) X Device Device: MM7150(1) Temperature Range: Blank = Commercial (0°C to +70°C) I = Industrial (-40°C to +85°C) Sensor Fusion Firmware: AB1 = Bosch 9-axis Sensor Fusion Example: a) MM7150-AB1, Bosch 9-axis sensor fusion, Commercial Temperature b) MM7150I-AB1, Bosch 9-axis sensor fusion., Industrial Temperature Series All package options are lead-free and RoHS compliant. For RoHS compliance and envi- ronmental information, please visit http://www.microchip.com/pagehandler/en- us/aboutus/ehs.html. Note 1: These products meet the halogen maximum concentration values per IEC61249-2-21. XXX Firmware Fusion SensorTemperature Range

 2015 - 2016 Microchip Technology Inc. DS00001888B-page 27 MM7150 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be super- seded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REP- RESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EX PRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro- chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP , Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015 - 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 9781522402169 Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

DS00001888B-page 28  2015 - 2016 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 ASIA/PACIFIC China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7828 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Worldwide Sales and Service 07/14/15

Product Information

MCP7150 specifications and overview.

Summary

Motion Module 07/14/15

Description

Motion Module 07/14/15

Source title MCP7150_16 Datasheet(PDF) - Microchip Technology

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