MCP102-270I/LB

MCP102 MICROCHIP | Alldatasheet

Document overview

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• PDF pages: 28

Technical content

Features

• Ultra low supply current: 1.75 µA (steady-state max.)
• Precision monitoring options of: and 4.63V
• Resets microcontroller in a power-loss event
• RST pin (Active-low): - MCP121: Active-low, open-drain - MCP131: Active-low, open-drain with internal pull-up resistor - MCP102 and MCP103: Active-low, push-pull
• Reset Delay Timer (120 ms delay, typ.)
• Available in SOT23-3, TO-92 and SC-70 packages
• Temperature Range: - Extended: -40°C to +125°C (except MCP1XX-195) - Industrial: -40°C to +85°C (MCP1XX-195 only)
• Pb-free devices

Applications

• Critical Microcontroller and Microprocessor Power-monitoring Applications
• Computers
• Intelligent Instruments
• Portable Battery-powered Equipment General Description The MCP102/103/121/131 are voltage supervisor devices designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation. Table 1 shows the available features for these devices. Package Types Block Diagram TABLE 1: DEVICE FEATURES SOT23-3/SC-70 VSS RST MCP102/121/131 VDD RST TO-92 SOT23-3/SC-70 VDD VSS MCP103 RST VDD VSS VDD Comparator Output Driver RST Band Gap Reference VSS Reset Delay Circuit R (1) Note 1: MCP131 Only Device Output Reset Delay (typ) Package Pinout (Pin # 1, 2, 3) Comment Type Pull-up Resistor MCP102 Push-pull No 120 ms RST, VDD, VSS MCP103 Push-pull No 120 ms VSS, RST, VDD MCP121 Open-drain External 120 ms RST, VDD, VSS MCP131 Open-drain Internal (~95 kΩ) 120 ms RST, VDD, VSS MCP111 Open-drain External No VOUT, VSS, VDD See MCP111/112 Data Sheet (DS21889) MCP112 Push-Pull No No VOUT, VSS, VDD See MCP111/112 Data Sheet (DS21889) Micropower Voltage Supervisors

© 2005 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† All inputs and outputs (except RST) w.r.t. VSS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Operating Voltage Range VDD 1.0 5.5 V Specified VDD Value to RST low VDD 1.0 V IRST = 10 uA, VRST < 0.2V Operating Current MCP102, MCP103, IDD < 1 1.75 µA Reset Power-up Timer (tRPU) Inactive MCP121 20.0 µA Reset Power-up Timer (tRPU) Active MCP131 IDD < 1 1.75 µA VDD > VTRIP and Reset Power-up Timer (tRPU) Inactive µA VDD < VTRIP and Reset Power-up Timer (tRPU) Inactive (Note 3) µA Reset Power-up Timer (tRPU) Active (Note 4) Note Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. RST output is forced low. There is a current through the internal pull-up resistor. This includes the current through the internal pull-up resistor and the reset power-up timer. This specification allows this device to be used in PICmicro® microcontroller applications that require In-Circuit Serial Programming™ (ICSP™) (see device-specific programming specifications for voltage requirements). This specification DOES NOT allow a continuos high voltage to be present on the open-drain output pin (VOUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the VOUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-33. This parameter is established by characterization and not 100% tested.

© 2005 Microchip Technology Inc. DS21906B-page 3 MCP102/103/121/131 VDD Trip Point MCP1XX-195 VTRIP 1.872 1.900 1.929 V TA = +25°C (Note 1) 1.853 1.900 1.948 V TA = -40°C to +85°C (Note 2) MCP1XX-240 2.285 2.320 2.355 V TA = +25°C (Note 1) 2.262 2.320 2.378 V Note 2 MCP1XX-270 2.591 2.630 2.670 V TA = +25°C (Note 1) 2.564 2.630 2.696 V Note 2 MCP1XX-300 2.886 2.930 2.974 V TA = +25°C (Note 1) 2.857 2.930 3.003 V Note 2 MCP1XX-315 3.034 3.080 3.126 V TA = +25°C (Note 1) 3.003 3.080 3.157 V Note 2 MCP1XX-450 4.314 4.380 4.446 V TA = +25°C (Note 1) 4.271 4.380 4.490 V Note 2 MCP1XX-475 4.561 4.630 4.700 V TA = +25°C (Note 1) 4.514 4.630 4.746 V Note 2 VDD Trip Point Tempco TTPCO ±100 ppm/°C Threshold Hysteresis (min. = 1%, max = 6%) MCP1XX-195 VHYS 0.019 0.114 V TA = +25°C MCP1XX-240 0.023 0.139 V MCP1XX-270 0.026 0.158 V MCP1XX-300 0.029 0.176 V MCP1XX-315 0.031 0.185 V MCP1XX-450 0.044 0.263 V MCP1XX-475 0.046 0.278 V RST Low-level Output Voltage VOL 0.4 V IOL = 500 µA, VDD = VTRIP(MIN) RST High-level Output Voltage (MCP102 and MCP103 only) VOH VDD – 0.6 V IOH = 1 mA, For MCP102/MCP103 only (push-pull output) Internal Pull-up Resistor (MCP131 only) RPU kΩ VDD = 5.5V Open-drain High Voltage on Output (MCP121 only) VODH 13.5 (5) V VDD = 3.0V, Time voltage > 5.5V applied ≤ 100s, current into pin limited to 2 mA, 25°C operation recommended (Note 5, Note 6) Open-drain Output Leakage Current (MCP121 only) IOD 0.1 µA DC CHARACTERISTICS (CONTINUED) TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Note Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. RST output is forced low. There is a current through the internal pull-up resistor. This includes the current through the internal pull-up resistor and the reset power-up timer. This specification allows this device to be used in PICmicro® microcontroller applications that require In-Circuit Serial Programming™ (ICSP™) (see device-specific programming specifications for voltage requirements). This specification DOES NOT allow a continuos high voltage to be present on the open-drain output pin (VOUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the VOUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-33. This parameter is established by characterization and not 100% tested.

© 2005 Microchip Technology Inc. DS21906B-page 11 MCP102/103/121/131 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol Function MCP102 MCP121 MCP131 MCP103 RST Output State VDD Falling: H = VDD > VTRIP L = VDD < VTRIP VDD Rising: H = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS VDD Positive power supply VSS Ground reference

© 2005 Microchip Technology Inc. DS21906B-page 15 MCP102/103/121/131 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP102 195I TO^^ 547256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e e 3-Pin SOT-23 Part Number MCP1xx = MCP102 MCP103 MCP121 MCP131 MCP1xxT-195I/TT JGNN TGNN LGNN KGNN MCP1xxT-240ETT JHNN THNN LHNN KHNN MCP1xxT-270E/TT JJNN TJNN LJNN KJNN MCP1xxT-300E/TT JKNN TKNN LKNN KKNN MCP1xxT-315E/TT JLNN TLNN LLNN KLNN MCP1xxT-450E/TT JMNN TMNN LMNN KMNN MCP1xxT-475E/TT JPNN TPNN LPNN KPNN Example: XXNN

© 2005 Microchip Technology Inc. Package Marking Information (Continued) Part Number MCP1xx = MCP102 MCP103 MCP121 MCP131 MCP1xxT-195I/LB BGN FGN DGN CGN MCP1xxT-240E/LB BHN FHN DHN CHN MCP1xxT-270E/LB BJN FJN DJN CJN MCP1xxT-300E/LB BKN FKN DKN CKN MCP1xxT-315E/LB BLN FLN DLN CLN MCP1xxT-450E/LB BMN FMN DMN CMN MCP1xxT-475E/LB BPN FPN DPN CPN 3-Pin SC-70 Top Side Example: Bottom Side XXN YWW Part Number MCP1xx = MCP102 MCP103 MCP121 MCP131 MCP1xxT-195I/LB BGNN FGNN DGNN CGNN MCP1xxT-240E/LB BHNN FHNN DHNN CHNN MCP1xxT-270E/LB BJNN FJNN DJNN CJNN MCP1xxT-300E/LB BKNN FKNN DKNN CKNN MCP1xxT-315E/LB BLNN FLNN DLNN CLNN MCP1xxT-450E/LB BMNN FMNN DMNN CMNN MCP1xxT-475E/LB BPNN FPNN DPNN CPNN Top Side Example: XXNN OR

© 2005 Microchip Technology Inc. DS21906B-page 17 MCP102/103/121/131 3-Lead Plastic Small Outline Transistor (TT) (SOT-23) β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.44 0.37 .020 .017 .015 B Lead Width 0.18 0.14 0.09 .007 .006 .004 c Lead Thickness φ Foot Angle 0.55 0.45 0.35 .022 .018 .014 L Foot Length 3.04 2.92 2.80 .120 .115 .110 D Overall Length 1.40 1.30 1.20 .055 .051 .047 Molded Package Width 2.64 2.37 2.10 .104 .093 .083 E Overall Width 0.10 0.06 0.01 .004 .002 .000 Standoff 1.02 0.95 0.88 .040 .037 .035 Molded Package Thickness 1.12 1.01 0.89 .044 .040 .035 A Overall Height 1.92 .076 Outside lead pitch (basic) 0.96 .038 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units p D B n E L c β φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 § Significant Characteristic

© 2005 Microchip Technology Inc. 3-Lead Plastic Small Outline Transistor (LB) (SC-70) 12° 12° b Mold Draft Angle Bottom 12° 12° a Mold Draft Angle Top 0.40 0.15 .016 .006 B Lead Width 0.25 0.08 .010 .003 c Lead Thickness 0.41 0.10 .016 .004 L Foot Length 2.25 1.80 .089 .071 D Overall Length 1.35 1.15 .053 .045 Molded Package Width 2.40 1.80 .094 .071 E Overall Width .010 0.00 .0004 .000 Standoff 1.00 0.80 .039 .031 Molded Package Thickness 1.10 0.80 .043 .031 A Overall Height 1.30 BSC. Outside lead pitch (basic) 0.65 BSC. p Pitch Number of Pins MAX MIN MAX MIN Dimension Limits MILLIMETERS* INCHES Units shall not exceed .005" (0.127mm) per side. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions Notes: JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 *Controlling Parameter L B E p c D b a A .026 BSC. .051 BSC.

© 2005 Microchip Technology Inc. DS21906B-page 19 MCP102/103/121/131 3-Lead Plastic Transistor Outline (TO) (TO-92) β Mold Draft Angle Bottom α 0.56 0.48 0.41 .022 .019 .016 B Lead Width 0.51 0.43 0.36 .020 .017 .014 c Lead Thickness 2.41 2.29 2.16 .095 .090 .085 R Molded Package Radius 4.95 4.64 4.32 .195 .183 .170 D Overall Length 4.95 4.71 4.45 .195 .186 .175 Overall Width 3.94 3.62 3.30 .155 .143 .130 A Bottom to Package Flat 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units R n α p L B A c β D Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49 *Controlling Parameter Mold Draft Angle Top Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101

© 2005 Microchip Technology Inc. DS21906B-page 21 MCP102/103/121/131 FIGURE 5-3: TO-92 DEVICE TAPE AND REEL SPECIFICATIONS Device Marking P Seal Tape Back Tape MARK FACE User Direction of Feed W MARK FACE MARK FACE Note: Bent leads are for Tape and Reel only.

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21906B-page 23 MCP102/103/121/131 APPENDIX A:

REVISION HISTORY

Revision B (March 2005) The following is the list of modifications: Added Section 4.4 “Using in PICmicro® Microcontroller, ICSP™ (MCP121 only)” on using the MCP121 in PICmicro microcontroller ICSP applications. Added VODH specifications in Section 1.0 “Electrical Characteristics” (for ICSP applications). Added Figure 2-33. Updated SC-70 package markings and added Pb-free marking information to Section 5.0 “Packaging information”. Added Appendix A: “Revision History”. Revision A (August 2004)

• Original Release of this Document.

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21906B-page 25 MCP102/103/121/131 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP102: MicroPower Voltage Supervisor, push-pull MCP102T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP103: MicroPower Voltage Supervisor, push-pull MCP103T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP121 MicroPower Voltage Supervisor, open-drain MCP121T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) MCP131 MicroPower Voltage Supervisor, open-drain MCP131T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) Monitoring Options: 195 = 1.90V 240 = 2.32V 270 = 2.63V 300 = 2.93V 315 = 3.08V 450 = 4.38V 475 = 4.63V Temperature Range: I = -40°C to +85°C (MCP11X-195 only) E = -40°C to +125°C (Except MCP11X-195 only) Package: TT = SOT-23B, 3-lead LB = SC-70, 3-lead TO = TO-92, 3-lead PART NO. XXX X Temperature Monitoring Options Device Examples: MCP102T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, push-pull, -40°C to +85°C, SOT-23B-3 package. MCP102-300E/TO: 3.00V MicroPower Voltage Supervisor, push-pull, -40°C to +125°C, TO-92-3 package. MCP103T-270E/TT: Tape and Reel, 2.70V MicroPower Voltage Supervisor, push-pull, -40°C to +125°C, SOT-23B-3 package. MCP103T-475E/LB: Tape and Reel, 4.75V MicroPower Voltage Supervisor, push-pull, -40°C to +125°C, SC-70-3 package. MCP121T-315I/LB: Tape and Reel, 3.15V MicroPower Voltage Supervisor, open-drain, -40°C to +125°C, SC-70-3 package. MCP121-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40°C to +125°C, TO-92-3 package. MCP131T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, open-drain, -40°C to +85°C, SOT-23B-3 package. MCP131-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40°C to +125°C, TO-92-3 package. Range XX Package X Tape/Reel Option

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21906B-page 27 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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