MCP102-240E/LB

MCP102_14 MICROCHIP | Alldatasheet

Document overview

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Technical content

 2004-2014 Microchip Technology Inc. DS20001906D-page 1 MCP102/103/121/131 Features:

• Ultra-Low Supply Current: 1.75 µA (steady-state maximum)
• Precision Monitoring Options of: 4.63V
• Resets Microcontroller in a Power-Loss Event
• R S T Pin (active-low): - MCP121: Active-low, Open-drain - MCP131: Active-low, Open-drain with Inter- nal Pull-up Resistor - MCP102 and MCP103: Active-low, Push-pull
• Reset Delay Timer (120 ms delay, typical)
• Available in SOT-23, TO-92 and SC70 Packages
• Temperature Range: - Extended: -40°C to +125°C (except MCP1XX-195) - Industrial: -40°C to +85°C ( MCP1XX-195 only)
• Pb-free Devices Applications:
• Critical Microcontroller and Microprocessor Power-monitoring Applications
• Computers
• Intelligent Instruments
• Portable Battery-powered Equipment General Description: The MCP102/103/121/131 devices are voltage supervisor devices designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation. Table 1 shows the available features for these devices. Package Types Block Diagram SOT-23/SC70 VSS RST MCP102/121/131 VDD RST TO-92 SOT-23/SC70 VDD VSS MCP103 RST VDD VSS VDD Comparator Output Driver RST Band Gap Reference VSS Reset Delay Circuit R (1) Note: MCP131 only Micropower Voltage Supervisors

DS20001906D-page 2  2004-2014 Microchip Technology Inc. TABLE 1: DEVICE FEATURES Device Output Reset Delay (typ) Package Pinout (Pin # 1, 2, 3) Comment Type Pull-up Resistor MCP102 Push-pull No 120 ms RST , VDD, VSS MCP103 Push-pull No 120 ms V SS, RST, VDD MCP121 Open-drain External 120 ms RST , VDD, VSS MCP131 Open-drain Internal (~95 k )1 2 0 m s R S T , VDD, VSS MCP111 Open-drain External No VOUT, VSS, VDD See MCP111/112 Data Sheet (DS21889) MCP112 Push-Pull No No VOUT, VSS, VDD See MCP111/112 Data Sheet (DS21889)

 2004-2014 Microchip Technology Inc. DS20001906D-page 3 MCP102/103/121/131

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings† † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS TA = -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units Conditions Operating Voltage Range V DD 1.0 — 5.5 V Specified VDD Value to RST low V DD 1.0 — V I RST =1 0µ A , VRST <0 . 2 V Operating Current MCP102, MCP103, MCP121 IDD — < 1 1.75 µA Reset Power-up Timer (t RPU) Inactive — — 20.0 µA Reset Power-up Timer (t RPU) Active MCP131 IDD —< 1 1 . 7 5 µ A V DD >V TRIP and Reset Power-up Timer (tRPU) Inactive —— 7 5 µ A V DD <V TRIP and Reset Power-up Timer (tRPU) Inactive (Note 3) — — 90 µA Reset Power-up Timer (t RPU) Active (Note 4) Note 1: Trip point is ±1.5% from typical value. 2: Trip point is ±2.5% from typical value. 3: RST output is forced low. There is a current through the internal pull-up resistor. 4: This includes the current through the internal pull-up resistor and the reset power-up timer. 5: This specification allows this device to be used in PIC ® microcontroller applications that require In-Circuit Serial Programming™ (ICSP™) (see device-specif ic programming specifications for voltage requirements). This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (V OUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the V OUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-33. 6: This parameter is established by characterization and not 100% tested.

DS20001906D-page 4  2004-2014 Microchip Technology Inc. VDD Trip Point MCP1XX-195 VTRIP 1.872 1.900 1.929 V T A = +25°C (Note 1) 1.853 1.900 1.948 V T A = -40°C to +85°C (Note 2) MCP1XX-240 2.285 2.320 2.355 V T A = +25°C (Note 1) 2.262 2.320 2.378 V Note 2 MCP1XX-270 2.591 2.630 2.670 V T A = +25°C (Note 1) 2.564 2.630 2.696 V Note 2 MCP1XX-300 2.886 2.930 2.974 V T A = +25°C (Note 1) 2.857 2.930 3.003 V Note 2 MCP1XX-315 3.034 3.080 3.126 V T A = +25°C (Note 1) 3.003 3.080 3.157 V Note 2 MCP1XX-450 4.314 4.380 4.446 V T A = +25°C (Note 1) 4.271 4.380 4.490 V Note 2 MCP1XX-475 4.561 4.630 4.700 V T A = +25°C (Note 1) 4.514 4.630 4.746 V Note 2 VDD Trip Point Tempco T TPCO — ±100 — ppm/°C Threshold Hysteresis min. = 1%, max = 6%) MCP1XX-195 VHYS 0.019 — 0.114 V T A = +25°C MCP1XX-240 0.023 — 0.139 V MCP1XX-270 0.026 — 0.158 V MCP1XX-300 0.029 — 0.176 V MCP1XX-315 0.031 — 0.185 V MCP1XX-450 0.044 — 0.263 V MCP1XX-475 0.046 — 0.278 V RST Low-level Output Voltage V OL —— 0 . 4 V I OL = 500 µA, VDD =V TRIP(MIN) RST High-level Output Voltage (MCP102 and MCP103 only) VOH VDD –0 . 6 — — V I OH = 1 mA; for MCP102/MCP103 only (push-pull output) Internal Pull-up Resistor (MCP131 only) RPU —9 5 — k  V DD =5 . 5 V Open-drain High Voltage on Output (MCP121 only) VODH — — 13.5 (5) VV DD =3 . 0 V , T i m e v o l t a g e>5 . 5 V applied  100s, current into pin limited to 2 mA, 25°C operation recommended (Note 5, Note 6) Open-drain Output Leakage Current (MCP121 only) IOD —0 . 1 — µ A DC CHARACTERISTICS (CONTINUED) TA = -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units Conditions Note 1: Trip point is ±1.5% from typical value. 2: Trip point is ±2.5% from typical value. 3: RST output is forced low. There is a current through the internal pull-up resistor. 4: This includes the current through the internal pull-up resistor and the reset power-up timer. 5: This specification allows this device to be used in PIC ® microcontroller applications that require In-Circuit Serial Programming™ (ICSP™) (see device-specif ic programming specifications for voltage requirements). This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (V OUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the V OUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-33. 6: This parameter is established by characterization and not 100% tested.

DS20001906D-page 6  2004-2014 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU =1 0 0k (MCP121 only; see Figure 4-1), TA = -40°C to +125°C. FIGURE 2-1: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP102-195). FIGURE 2-2: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP131-315). FIGURE 2-3: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP121-450). FIGURE 2-4: IDD vs. Temperature (Reset Power-up Timer Active) (MCP102-195). FIGURE 2-5: IDD vs. Temperature (Reset Power-up Timer Active) (MCP131-315). FIGURE 2-6: IDD vs. Temperature (Reset Power-up Timer Active) (MCP121-450). Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -40 -20 100 120 140 IDD (µA) Temperature (°C) 1.7V 1.0V 2.1V2.8V 4.0V 5.0V 5.5V MCP102-195 -40 -20 100 120 140 IDD (µA) Temperature (°C) 1.0V 2.9V MCP131-315 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -40 -20 100 120 140 IDD (µA) Temperature (°C) 3.0V1.0V 4.6V 4.1V 5.0V 5.5V MCP121-450 4.8V -40 -20 100 120 140 IDD (µA) Temperature (°C) 2.1V 2.8V 4.0V 5.0V 5.5V MCP102-195 -40 -20 100 120 140 IDD (µA) Temperature (°C) 3.3V 4.0V 4.5V 5.0V MCP131-3155.5V -40 -20 100 120 140 IDD (µA) Temperature (°C) 4.6V5.0V 5.5V MCP121-450 4.8V

DS20001906D-page 12  2004-2014 Microchip Technology Inc.

3.0 PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol FunctionMCP102 MCP121 MCP131 MCP103

12 R S T Output State

VDD Falling: H=V DD >V TRIP L=V DD <V TRIP VDD Rising: H=V DD >V TRIP +V HYS L=V DD <V TRIP +V HYS

23 V DD Positive power supply

31 V SS Ground reference

 2004-2014 Microchip Technology Inc. DS20001906D-page 13 MCP102/103/121/131

4.0 APPLICATION INFORMATION

For many of today’s microcontroller applications, care must be taken to prevent low-power conditions that can cause many different system problems. The most common causes are brown-out conditions, where the system supply drops below the operating level momentarily. The second most common cause is when a slowly decaying power supply causes the microcontroller to begin executing instructions without sufficient voltage to sustain volatile memory (RAM), thus producing indeterminate results. Figure 4-1 shows a typical application circuit. MCP102/103/121/131 are voltage supervisor devices designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation. These devices also operate as protection from brown-out conditions. FIGURE 4-1: Typical Application Circuit.

4.1 RST Operation

The RST output pin operation determines how the device can be used and indicates when the system should be forced into reset. To accomplish this, an internal voltage reference is used to set the voltage trip point (V TRIP). Additionally, there is a hysteresis on this trip point. When the falling edge of V DD crosses this voltage threshold, the reset power-down timer (t RPD) starts. When this delay timer times out, the RST pin is forced low. When the rising edge of V DD crosses this voltage threshold, the reset power-up timer (tRPU) starts. When this delay timer times out, the RST pin is forced high, tRPU is active and there is additional system current. The actual voltage trip point (VTRIPAC) will be between the minimum trip point (V TRIPMIN) and the maximum trip point (V TRIPMAX). The hysteresis on this trip point and the delay timer (tRPU) are to remove any “jitter” that would occur on the RST pin when the device VDD is at the trip point. Figure 4-2 shows the waveform of the RST pin as determined by the VDD voltage, while Table 4-1 shows the state of the RST pin. The VTRIP specification is for falling VDD voltages. When the VDD voltage is rising, the RST will not be driven high until VDD is at VTRIP +V HYS. Once VDD has crossed the voltage trip point, there is also a minimal delay time (tRPD) before the RST pin is driven low. FIGURE 4-2: RST Operation as Determined by the VTRIP and VHYS. VDD VDD MCLR (Reset input) (Active-low) V SS PIC® MicrocontrollerRPU Note 1: Resistor RPU may be required with the MCP121 due to the open-drain output. Resistor R PU may not be required with the MCP131 due to the internal pull-up resistor. The MCP102 and MCP103 do not require the external pull-up resistor. 0.1 µF MCP1XX VDD RST VSS TABLE 4-1: RST PIN STATES Device State of RST Pin when: Output DriverVDD <V TRIP VDD > VTRIP + VHYS MCP102 L H Push-pull MCP103 L H Push-pull MCP121 LH (1) Open-drain (1) MCP131 LH (2) Open-drain (2) Note 1: Requires external pull-up resistor 2: Has internal pull-up resistor VDD VTRIPMAX VTRIPMIN VTRIPACVTRIPAC VTRIPAC +V HYSAC RST < 1V is outside the device specificationstRPD tRPU tRPD tRPU

DS20001906D-page 14  2004-2014 Microchip Technology Inc.

4.2 Negative Going V DD Transients

The minimum pulse width (time) required to cause a reset may be an important criterion in the implementation of a Power-on Reset (POR) circuit. This time is referred to as transient duration, defined as the amount of time needed for these supervisory devices to respond to a drop in V DD. The transient duration time is dependent on the magnitude of VTRIP – VDD. Generally speaking, the transient duration decreases with increases in VTRIP –V DD. Figure 4-3 shows a typical transient duration versus reset comparator overdrive, for which the MCP102/103/121/131 will not generate a reset pulse. It shows that the farther below the trip point of the transient pulse goes, the shorter the duration of the pulse required to cause a reset gets. Figure 2-32 shows the transient response characteristics for the MCP102/103/121/131. A 0.1 µF bypass capacitor, mounted as close as possible to the V DD pin, provides additional transient immunity (refer to Figure 4-1). FIGURE 4-3: Example of Typical Transient Duration Waveform.

4.3 Reset Power-up Timer (t RPU)

Figure 4-4 illustrates the device’s current states. While the system is powering down, the device has a low current. This current is dependent on the device V DD and trip point. When the device V DD rises through the voltage trip point (VTRIP), an internal timer starts. This timer consumes additional current until the RST pin is driven (or released) high. This time is known as the Reset Power-up Time (t RPU). Figure 4-4 shows when tRPU is active (device consuming additional current). FIGURE 4-4: Reset Power-up Timer Waveform.

4.3.1 EFFECT OF TEMPERATURE ON

RESET POWER-UP TIMER (TRPU) The Reset Power-up timer time-out period (t RPU) determines how long the device remains in the reset condition. This is affected by both V DD and temperature. Typical responses for different V DD values and temperatures are shown in Figures 2-26, 2-27 and 2-28. Time (µs)0VSupply Voltage VTRIP(MIN) -V DD tTRANS VTRIP(MAX) VTRIP(MIN) VTRIP VDD RST tRPU Reset Power-up Timer Inactive Reset Power-up Timer Inactive Reset Power-up Timer Active See Figures 2-1, 2-2 and 2-3 See Figures 2-4, 2-5 and 2-6 See Figures 2-1, 2-2 and 2-3

 2004-2014 Microchip Technology Inc. DS20001906D-page 15 MCP102/103/121/131

4.4 Usage in PIC ® Microcontroller,

ICSP™ Applications (MCP121 only) Figure 4-5 shows the typical application circuit for using the MCP121 for voltage supervision function when the PIC microcontroller will be programmed via the ICSP feature. Additional information is available in TB087, “Using Voltage Supervisors with PIC ® Microcontroller Systems which Implement In-Circuit Serial Programming™” , DS91087. FIGURE 4-5: Typical Application Circuit for PIC® Microcontroller with the ICSP™ Feature. Note: It is recommended that the current into the RST pin be current limited by a 1 k  resistor. VDD/VPP VDD MCLR (Reset Input) (Active-low) V SS PIC® MCU RPU 0.1 µF 1k  MCP121 VDD RST VSS

DS20001906D-page 16  2004-2014 Microchip Technology Inc.

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3-Lead SOT-23 Part Number MCP1xx = MCP102 MCP103 MCP121 MCP131 MCP1xxT-195I/TT JGNN TGNN LGNN KGNN MCP1xxT-240ETT JHNN THNN LHNN KHNN MCP1xxT-270E/TT JJNN TJNN LJNN KJNN MCP1xxT-300E/TT JKNN TKNN LKNN KKNN MCP1xxT-315E/TT JLNN TLNN LLNN KLNN MCP1xxT-450E/TT JMNN TMNN LMNN KMNN MCP1xxT-475E/TT JPNN TPNN LPNN KPNN Example YWWNNN XXXXXX XXXXXX XXXXXX MCP102 195I TO^^ 345256 3-Lead SC70 Part Number MCP1xx = MCP102 MCP103 MCP121 MCP131 MCP1xxT-195I/LB BGNN FGNN DGNN CGNN MCP1xxT-240E/LB BHNN FHNN DHNN CHNN MCP1xxT-270E/LB BJNN FJNN DJNN CJNN MCP1xxT-300E/LB BKNN FKNN DKNN CKNN MCP1xxT-315E/LB BLNN FLNN DLNN CLNN MCP1xxT-450E/LB BMNN FMNN DMNN CMNN MCP1xxT-475E/LB BPNN FPNN DPNN CPNN Example

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DS20001906D-page 20  2004-2014 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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5.2 Product Tape and Reel Specifications

FIGURE 5-1: EMBOSSED CARRIER DIMENSIO NS (8, 12, 16 AND 24 MM TAPE ONLY) FIGURE 5-2: 3-LEAD SOT-23/SC70 D EVICE TAPE AND REEL SPECIFICATIONS FIGURE 5-3: TO-92 DEVICE TAPE AND REEL SPECIFICATIONS TABLE 5-1: CARRIER TAPE/CAVITY DIMENSIONS Case Outline Package Type Carrier Dimensions Cavity Dimensions Output Quantity Units Reel Diameter in mmW mm P mm mm mm mm TT SOT-23 3L 8 4 3.15 2.77 1.22 3000 180 LB SC70 3L 8 4 2.4 2.4 1.19 3000 180 Top Cover Tape P W Standard Reel Component Orientation Device Marking PIN 1 User Direction of Feed W P Device Marking P Seal Tape Back Tape MARK FACE User Direction of Feed W MARK FACE MARK FACE Note: Bent leads are for Tape and Reel only.

 2004-2014 Microchip Technology Inc. DS20001906D-page 23 MCP102/103/121/131 APPENDIX A: REVISION HISTORY Revision D (February 2014) The following is the list of modifications: 1. Updated Table 3-1. 2. Updated Figure 2-25. 3. Updated SC70, SOT-23 and TO-92 package drawings and markings in Section 5.0 “Packaging Information”. Revision C (January 2013)

• Added a note to each package outline drawing. Revision B (March 2005) The following is the list of modifications: 1. Added Section 4.4 “Usage in PIC® Microcontroller, ICSP™ Applications (MCP121 only)” on using the MCP121 in PIC microcontroller ICSP applications. 2. Added V ODH specifications in Section 1.0 “Electrical Characteristics” (for ICSP applications). 3. Added Figure 2-23. 4. Updated SC70 package markings and added Pb-free marking information to Section 5.0 “Packaging Information”. 5. Added Appendix A: “Revision History”. Revision A (August 2004)
• Original Release of this Document.

DS20001906D-page 24  2004-2014 Microchip Technology Inc. NOTES:

 2004-2014 Microchip Technology Inc. DS20001906D-page 25 MCP102/103/121/131 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . Device: MCP102: MicroPower Voltage Supervisor, push-pull MCP102T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP103: MicroPower Voltage Supervisor, push-pull MCP103T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP121 MicroPower Voltage Supervisor, open-drain MCP121T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) MCP131 MicroPower Voltage Supervisor, open-drain MCP131T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) Monitoring Options: 195 = 1.90V 240 = 2.32V 270 = 2.63V 300 = 2.93V 315 = 3.08V 450 = 4.38V 475 = 4.63V Temperature Range: I = -40°C to +85°C (MCP1xx(T)-195 only) E = -40°C to +125°C (Except for MCP1xx(T)-195) Package: TT = SOT-23, 3-lead LB = SC70, 3-lead TO = TO-92, 3-lead PART NO. XXX X TemperatureMonitoring Options Device Examples: a) MCP102T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, push-pull, -40°C to +85°C, SOT-23 package b) MCP102-300E/TO: 3.00V MicroPower Voltage Supervisor, push-pull, -40°C to +125°C, TO-92 package a) MCP103T-270E/TT: Tape and Reel, 2.70V MicroPower Voltage Supervisor, push-pull, -40°C to +125°C, SOT-23 package b) MCP103T-475E/LB: Tape and Reel, 4.75V MicroPower Voltage Supervisor, push-pull, -40°C to +125°C, SC70 package a) MCP121T-315E/LB: Tape and Reel, 3.15V MicroPower Voltage Supervisor, open-drain, -40°C to +125°C, SC70 package b) MCP121-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40°C to +125°C, TO-92 package a) MCP131T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, open-drain, -40°C to +85°C, SOT-23 package b) MCP131-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40°C to +125°C, TO-92 package Range XX Package X Tape/Reel Option – /

DS20001906D-page 26  2004-2014 Microchip Technology Inc. NOTES:

 2004-2014 Microchip Technology Inc. DS20001906D-page 27 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2004-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-945-3 Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

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