MCL4148 CHENG-YI | Alldatasheet
Document overview
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- PDF pages: 4
Technical content
Features
/C0068Saving space /C0068Hermetic sealed parts /C0068Fits onto SOD 323 / SOT 23 footprints /C0068Electrical data identical with the devices 1N4148 and 1N4448 respectively /C0068Micro Melf package
Applications
T j = 25/C0095C Parameter Test Conditions Type Symbol Value Unit Repetitive peak reverse voltage V RRM 100 V Reverse voltage V R V Peak forward surge current t p =1/C0109s I FSM A Repetitive peak forward current I FRM 450 mA Forward current I F 200 mA Average forward current V R I FAV 150 mA Power dissipation P V 500 mW Junction temperature T j 175 /C0176C Storage temperature range T stg –65...+175 /C0176C Maximum Thermal Resistance T j = 25/C0095C Parameter Test Conditions Symbol Value Unit Junction ambient mounted on epoxy–glass hard tissue, Fig. 1, 35/C0109m copper clad, 0.9 mm copper area per electrode R thJA 500 K/W PB FREE PRODUCT MCL4148 SURFACE MOUNT SMALL SIGNAL DIODE
Dimensions in inches and (millimeters) MICRO-MELF Rev.B .008(0.20) .079(2.00) .071(1.80) .008(0.20) .049(1.25) .043 (1.1 0) .043(1.10)