MCIMX27VJP4A

I.MX27 FREESCALE | Alldatasheet

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Technical content

Data Sheet, Technical Data i.MX27 and i.MX27L

Package Information

(MAPBGA–404) Case 1931-04 (MAPBGA-473)

Ordering Information

See Ta ble 1 on page 4 for ordering information. Document Number: MCIMX27EC Rev. 1.5, 12/2009 © Freescale Semiconductor, Inc., 2007, 2009. All rights reserved. This document contains information on a new product. Specifications and information herein are subject to change without notice.

1 Introduction

The i.MX27 and i.MX27L (MCIMX27/MX27L) Multimedia Applications Processors represents the next step in low-power, high-performance application processors. Unless otherwise specified, the material in this data sheet is applicable to both the i.MX27 and i.MX27L processors and referred to singularly throughout this document as i.MX27. The i.MX27L does not include the following features: A TA-6 HDD Interface, Memory Stick Pro, VPU: MPEG-4/ H.263/H.264 HW encoder/decoder, and eMMA (PrP processing, CSC, deblock, dering). Based on an ARM926EJ-S™ microprocessor core, the i.MX27/27L processor provides the performance with low-power consumption required by modern digital devices such as the following:  Feature-rich cellular phones  Portable media players and mobile gaming machines  Personal digital assistants (PDAs) and wireless PDAs i.MX27 and i.MX27L Data Sheet Multimedia Applications Processor

Contents

5.1. Full Package Outline Drawing (17 mm × 17 mm) 105 5.3. Full Package Outline Drawing (19 mm × 19 mm) 125 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

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 Portable DVD players  Digital cameras The i.MX27/MX27L processor features the advanced and power-efficient ARM926EJ-S core operating at speeds up to 400 MHz, and is optimized for minimal power consumption using the most advanced techniques for power saving (for example, DPTC, power gating, and clock gating). With 90 nm technology and dual Vt, the i.MX27/MX27L device provides the optimal performance vs. leakage current balance. The performance of the i.MX27/MX27L processors are both boosted by an on-chip cache system, and features peripheral devices, such as an MPEG-4, H.263, an H.264 video codec (up to D1—720 x 486—@ 30 FPS), LCD, eMMA_lt, and CMOS Sensor Interface controllers. The i.MX27/MX27L processors supports connections to various types of external memories, such as 266-MHz DDR, NAND Flash, NOR Flash, SDRAM, and SRAM. The i.MX27/MX27L devices can be connected to a variety of external devices using technology, such as high-speed USBOTG 2.0, the Advanced Technology Attachment (A TA), Multimedia/Secure Data (MMC/SDIO), and CompactFlash. NOTE The i.MX27L does not support the ATA-6 HDD interface.

1.1 Features

The MX27/MX27L processors are targeted for video and voice over-IP (V2IP) and smart remote controllers. It also provides low-power solutions for any high-performance and demanding multimedia and graphics applications. The systems include the following features:  Multi-standard video codec (i.MX27 only) — MPEG-4 part-II simple profile encoding/decoding — H.264/A VC baseline profile encoding/decoding — H.263 P3 encoding/decoding — Multi-party call: one stream encoding and two streams decoding simultaneously — Multi-format: encodes MPEG-4 bitstream, and decodes H.264 bitstream simultaneously — On-the-fly video processing that reduces system memory load (for example, the power-efficient viewfinder application with no involvement of either the memory system or the ARM CPU)  Advanced power management (i.MX27/27L) — Dynamic process and temperature compensation — Multiple clock and power domains — Independent gating of power domains  Multiple communication and expansion ports Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

1.2 Block Diagram

Figure 1 shows the i.MX27 simplified interface block diagram. Figure 1. i.MX27/MX27L Simplified Interface Block Diagram

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1.3 Ordering Information

Table 1 provides ordering information for the MAPBGA, lead-free packages.

2 Functional Description and Application Information

2.1 ARM926 Microprocessor Core Platform

crossbar switch (MAX), and a “primary AHB” complex.  The data bus (D-AHB) of the ARM926EJ-S processor is connected directly to MAX Master Port 1. to as “secondary” AHBs. Each of the secondary AHB interfaces is only accessible off platform. (JIT) compiler—which is a type of Java comp iler—but without the associated code overhead. Table 1. Ordering Information1

1 Because of an order from the United States International T rade Commission, BGA-packaged

support seamless connection to a single master with no external interface logic required. implementation of several clock synchronization circuits.

2.1.1 Memory System

applications. There is also a 24-Kbyte ROM for bootstrap code.

2.2 Module Inventory

module description for additional information. Table 2. Digital and Analog Modules peripherals that conforms to the IP Bus specification, Rev 2.0.

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with IDE hard disc drives and AT API optical disc drives. point-to-multipoint configurations. The i.MX27/MX27L processors have three CSPI modules. resizing, and color space conversions. DRAM memories for the system. that can be configured as either inputs or outputs. or generate periodic output. Table 2. Digital and Analog Modules (continued)

information stored in on-chip fuse elements. built-in self-test (BIST), and boundary scan test control. to the customer memory stick. interface to standard NAND Flash memory devices. external analog power switching logic and buffering.

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memory and assists with boot authentication. used on cell phone baseband processors or wireless PDAs. blocks—the Secure RAM module, and the Security Monitor. and performing data accesses to and from the cards. buffer to the external display device. 2S) and Intel AC97 standard.

2.3 Module Descriptions

arranged in alphabetical order. register to send and receive bits over the 1-Wire bus.

1 OTG

and H.263 P3 video processing standard together. events or programming errors.

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Functional Description and Application Information

2.3.2 AHB-Lite IP Interface Module (AIPI)

The AIPI acts as an interface between the ARM Advanced High-performance Bus Lite. (AHB-Lite) and lower bandwidth peripherals conforming to the IP bus specification Rev 2.0. There are two AIPI modules in i.MX27/MX27L processors. The following list summarizes the key features of the AIPI:  All peripheral read transactions require a minimu m of two system clocks (R-AHB side) and all write transactions require a minimum of three system clocks (R-AHB side).  The AIPI supports 8-bit, 16-bit, and 32-bit IP bus peripherals. Byte, half word, and full word reads and writes are supported.  The AIPI supports multi-cycle accesses by providing 16-bit to 8-bit peripherals operations and 32-bit to both 16-bit and 8-bit peripherals operations.  The AIPI supports 31 external IP bus periphera ls each with a 4-Kbyte memory map (a slot).

2.3.3 ARM926EJ-S Interrupt Controller (AITC)

The ARM926EJ-S Interrupt Controller (AITC) is a 32-bit peripheral that collects interrupt requests from up to 64 sources and provides an interface to the ARM926EJ-S core. The AITC includes software controlled priority levels for normal interrupts. The AITC performs the following functions:  Supports up to 64 interrupt sources  Supports fast and normal interrupts  Selects normal or fast interrupt request for any interrupt source  Indicates pending interrupt sources via a register for normal and fast interrupts  Indicates highest priority interrupt number via register. (Can be used as a table index.)  Independently can enable or disable any interrupt source  Provides a mechanism for software to schedule an interrupt  Supports up to 16 software controlled priority levels for normal interrupts and priority masking  Can single-bit disable all normal interrupts and all fast interrupts. (Used in enabling of secure operations.)

2.3.4 ARM926EJ-S Platform

The ARM926EJ-S (ARM926) is a member of the ARM9 family of general-purpose microprocessors targeted at multi-tasking applications. The ARM926 supports the 32-bit ARM and 16-bit Thumb instructions sets. The ARM926 includes features for efficient execution of Java byte codes. A JTAG port is provided to support the ARM Debug Architecture, along with associated signals to support the ETM9 real-time trace module. The ARM926EJ-S is a Harvard cached architecture including an ARM9EJ-S integer core, a Memory Management Unit (MMU), separate instruction and data AMBA AHB interfaces, separate instruction and data caches, and separate instruction and data tightly coupled memory (TCM) interfaces. The ARM926 co-processor, instruction TCM, and data TCM interfaces will be tied off within the ARM926 Platform and will not be available for external connection. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 11 Functional Description and Application Information The ARM926EJ-S processor is a fully synthesizable macrocell, with a configurable memory system. Both instruction and data caches will be 16 kbytes on the platform. The cache is virtually accessed and virtually tagged. The data cached has physical tags as well. The MMU provides virtual memory facilities which are required to support various platform operating systems such as Symbian OS, Windows CE, and Linux. The MMU contains eight fully associative TLB entries for lockdown and 64 set associative entries. Refer to the ARM926EJ-S Technical Reference Manual for more information.

2.3.5 Advanced Technology Attachment (ATA)

The Advanced Technology Attachment (ATA) host controller complies with the A TA/A TAPI-6 specification. The primary use of the A TA host controller is to interface with IDE hard disc drives and Advanced Technology Attachment Packet Interface (ATAPI) optical disc drives. It interfaces with the A TA device over a number of A TA signals. This host controller supports interface protocols as specified in ATA/ATAPI-6 standard, as follows:  PIO mode 0, 1, 2, 3, and 4  Multiword DMA mode 0, 1, and 2  Ultra DMA modes 0, 1, 2, 3, and 4 with bus clock of 50 MHz or higher  Ultra DMA mode 5 with bus clock of 80 MHz or higher Before accessing the A TA bus, the host must program the timing parameters to be used on the ATA bus. The timing parameters control the timing on the ATA bus. Most timing parameters are programmable as a number of clock cycles (1 to 255). Some are implied. All of the A TA device-internal registers are visible to users, and they are defined as mirror registers in ATA host controller. As specified in A TA/A TAPI-6 standard, all the features/functions are implemented by reading/writing to the device’s internal registers. There are basically two protocols that can be active at the same time on the ATA bus, as follows:  The first and simplest protocol (PIO mode acc ess) can be started at any time by the ARM926 to the A TA bus. The PIO mode is a slow protocol, mainly intended to be used to program an ATA disc drive, but also can be used to transfer data to/from the disc drive.  The second protocol is the DMA mode access. DMA mode is started by the ATA interface after receiving a DMA request from the drive, and only if the ATA interface has been programmed to accept the DMA request. In DMA mode, either multiword-DMA or ultra-DMA protocol is used on the A TA bus. All transfers between FIFO and the host IP or DMA IP bus are zero wait states transfer, so a high-speed transfer between FIFO and DMA/host bus is possible.

2.3.6 Digital Audio MUX (AUDMUX)

The Digital Audio MUX (AUDMUX) provides programmable interconnecting for voice, audio, and synchronous data routing between host serial interfaces—for example, SSI, SAP, and peripheral serial interfaces—such as, audio and voice codecs. The AUDM UX allows audio system connectivity to be modified through programming, as opposed to altering the design of the system into which the chip is designed. The design of the AUDMUX allows multiple simultaneous audio/voice/data flows between the ports in point-to-point or point-to-multipoint configurations. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

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Functional Description and Application Information Included in the AUDMUX are two types of interfaces. The internal ports connect to the processor serial interfaces, and the external ports connect to off-chip audio devices and serial interfaces of other processors. A desired connectivity is achieved by configuring the appropriate internal and external ports. The module includes full 6-wire SSI interfaces for asynchronous receive and transmit, as well as a configurable 4-wire (synchronous) or 6-wire (asynchronous) peripheral interface. The AUDMUX allows each host interface to be connected to any other host or peripheral interface in a point-to-point or point-to-multipoint (network mode).

2.3.7 Clock and Reset Module (CRM)

The Clock and Reset Module (CRM) generates clock and reset signals used throughout the i.MX27/MX27L processor and for external peripherals. It also enables system software to control, customize, or read the status of the following functions:  Chip ID  Multiplexing of I/O signals  I/O Driving Strength  I/O Pull Enable Control  Well-Bias Control  System boot mode selection  DPTC Control

2.3.8 CMOS Sensor Interface (CSI)

The CMOS Sensor Interface (CSI) is a logic interface that enables the i.MX27/MX27L processors to connect directly to external CMOS sensors and CCIR656 video source. The capabilities of the CSI include the following:  Configurable interface logic to support popular CMOS sensors in the market  Support traditional sensor timing interface  Support CCIR656 video interface, progressive mode for smart sensor, interlace mode for PAL and NTSC input  8-bit input port for YCC, YUV , Bayer, or RGB data 3 2 × 32 FIFO storing image data supporting Core data read and DMA data burst transfer to system memory  Full control of 8-bit and 16-b it data to 32-bit FIFO packing  Direct interface to eMMA-lt Pre-Processing block (PrP) - Not available on the i.MX27L  Single interrupt source to interrupt controller fro m maskable sensor interrupt sources: Start of Frame, End of Frame, Change of Field, FIFO full  Configurable master clock frequency output to sensor  Asynchronous input logic design. Sensor master clock can be driven by either the i.MX27/MX27L processor or by external clock source. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 13 Functional Description and Application Information  Statistic data generation for Auto Exposure (AE) and Auto White Balance (AWB) control of the camera (for Bayer data only)

2.3.9 Configurable Serial Peripheral Interface (CSPI)

The Configurable Serial Peripheral Interface (CSPI) is used for fast data communication with fewer software interrupts. There are three CSPI modules in the i.MX27/MX27L processors, which provide a full-duplex synchronous serial interface, capable of interfacing to the SPI master and slave devices. CSPI1 and CSPI2 are master/slave configurable and include three chip selects to support multiple peripherals. CSPI3 is only a master and has one chip-select signal. The transfer continuation function of the CSPI enables unlimited length data transfers using 32-bit wide by 8-entry FIFO for both TX and RX data DMA support. The CSPI Ready (SPI_RDY) and Chip Select (SS) control signals enable fast data communication with fewer software interrupts. When the CSPI module is configured as a master, it uses a serial link to transfer data between the CSPI and an external device. A chip-enable signal and a clock signal are used to transfer data between these two devices. When the CSPI module is configured as a slave, the user can configure the CSPI Control register to match the external SPI master’s timing.

2.3.10 Direct Memory Access Controller (DMAC)

The Direct Memory Access Controller (DMAC) provides 16 channels to support linear memory, 2D memory, FIFO, and end-of-burst enable FIFO transfers to support a wide variety of DMA operations. Features include the following:  Support of 16 channels linear memory, 2D memo ry, and FIFO for both source and destination  Support of 8-bit, 16-bit, or 32-bit FIFO port size and memory port size data transfer  Configurability of DMA burst length of up to a ma ximum of 16 words, 32 half-words, or 64 bytes for each channel  Bus utilization control for a channel that is not triggered by DMA request  Interrupts that are provided to interrupt handler on bulk data transfer complete or transfer error  DMA burst time-out error to terminate DMA cycle when the burst cannot be completed in a programmed timing period  Dedicated external DMA request and grant signal  Support of increment, decrement, and no increment for source and destination addressing  Support of DMA chaining 2.3.11 enhanced MultiMedia Accelerator Light (eMMA_lt) The enhanced MultiMedia Accelerator Light (eMMA_lt) consists of the video pre-processor (PrP) and post-processor (PP). In contrast with i.MX21 processor’s components, this eMMA does not include the video codec. A more powerful video codec is included as a separate module. NOTE The i.MX27L does not have a eMMA_lt module. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

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Functional Description and Application Information Each module has individual control and configuration registers that are accessed via the IP interface, and are capable of bus mastering the AMBA bus to independently access system memory without any CPU intervention. This enables each module to be used independently of each other, and enables the pre-processor and post-processor modules to provide acceleration features for other software codec implementations and image processing software. These blocks work together to provide video acceleration, and to off-load the CPU from computation intensive tasks. The PrP and PP can be used for generic video pre- and post-processing, such as scaling, resizing, and color space conversions. A 32-bit-to-64-bit AHB gasket is used to convert a PrP AHB bus from a 32-bit to 64-bit protocol. A bypass function is implemented to bypass this 64-bit gasket if it is not needed. eMMA_lt supports the following image/video processing features:  Pre-processor: — Data input: – System memory – Private DMA between CMOS Sensor Interface module and pre-processor — Data input formats: – Arbitrarily formatted RGB pixels (16 or 32 bits) – YUV 4:2:2 (Pixel interleaved) – YUV 4:2:0 (IYUV , YV12) — Input image size: 32 × 32 to 2044 × 2044 — Image scaling: – Programmable independent CH-1 and CH-2 re sizer. Can program to be in cascade or parallel. – Each resizer supports downscaling ratios from 1:1 to 8:1 in fractional steps. — Channel-1 output data format – Channel 1 – RGB 16 and 32 bpp – YUV 4:2:2 (YUYV , YVYU, UYVY , VYUY) — Channel-2 output data format – YUV 4:2:2 (YUYV) – YUV 4:4:4 – YUV 4:2:0 (IYUV , YV12) – RGB data and YUV data format can be generated concurrently — 32/64-bit AHB bus  Post-processor — Input data: – From system memory — Input format: – YUV 4:2:0 (IYUV , YV12) — Image Size: 32 × 32 to 2044 × 2044 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 15 Functional Description and Application Information — Output format: – YUV 4:2:2 (YUYV) – RGB16 and RGB32 bpp —I m a g e R e s i z e – Upscaling ratios ranging from 1:1 to 1:4 in fractional steps – Downscaling ratios ranging from 1:1 to 2:1 in fractional steps and a fixed 4:1 – Ratios provide scaling between QCIF, CIF, QVGA (320 × 240, 240 × 320)

2.3.12 Enhanced Synchronous Dynamic RAM Controller (ESDRAMC)

The Enhanced Synchronous Dynamic RAM Controller (ESDRAMC) provides an interface and control for synchronous DRAM memories for the system. SDRAM memories use a synchronous interface with all signals registered on a clock edge. A command protocol is used for initialization, read, write, and refresh operations to the SDRAM, and is generated on the signals by the controller (when required due to external or internal requests). It has support for both single data rate RAMs and double data rate SDRAMs. It supports 64 Mbits, 128 Mbits, 256 Mbits, and 512 Mbits, 1 Gbit, 2 Gbits, four bank synchronous DRAM by two independent chip selects and with up to 256 Mbytes addressable memory per chip select.

2.3.13 Fast Ethernet Controller (FEC)

The Fast Ethernet Controller (FEC) is designed to support both 10 and 100 Mbps Ethernet/IEEE Std 802.3™ networks. An external tran sceiver interface and transceiver function are required to complete the interface to the media. The FEC supports the 10/100 Mbps MII and the 10 Mbps-only 7-wire interface, which uses a subset of the MII pins for connection to an external Ethernet transceiver. The FEC incorporates the following features:  Support for three different Ethernet physical interfaces: — 100-Mbps IEEE 802.3 MII — 10-Mbps IEEE 802.3 MII — 10-Mbps 7-wire interface (industry standard)  IEEE 802.3 full duplex flow control  Programmable max frame length supports IEEE Std 802.1™ VLAN tags and priority  Support for full-duplex operation (200 Mbps throughput) with a minimum system clock rate of

50 MHz

 Support for half-duplex operation (100 Mbps throughput) with a minimum system clock rate of

25 MHz

 Retransmission from transmit FIFO following a collision (no processor bus utilization)  Automatic internal flushing of the receive FIFO for runts (collision fragments) and address recognition rejects (no processor bus utilization)  Address recognition — Frames with broadcast address may be always accepted or always rejected Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

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Functional Description and Application Information — Exact match for single 48-bit individual (unicast) address — Hash (64-bit hash) check of individual (unicast) addresses — Hash (64-bit hash) check of group (multicast) addresses — Promiscuous mode  Independent DMA engine with multiple channels allowing transmit data, transmit descriptor, receive data, and receive descriptor accesses to provide high performance  Independent RISC-based controller that pr ovides the following functions in the FEC: — Initialization (those internal registers not initialized by the user or hardware) — High level control of the DMA ch annels (initiating DMA transfers) — Interpreting buffer descriptors — Address recognition for receive frames — Random number generation for transmit collision backoff timer  The Message Information Block (MIB) in FEC main tains counters for a variety of network events and statistics. The counters supported are the RMON (RFC 1757) Ethernet Statistics group and some of the IEEE 802.3 counters.

2.3.14 General Purpose I/O Module (GPIO)

The general-purpose input/output (GPIO) module provides dedicated general-purpose pins that can be configured as either inputs or outputs. When it is configured as an output, you can write to an internal register to control the state driven on the output pin. When configured as an input, you can detect the state of the input by reading the state of an internal register. The GPIO includes all of the general purpose input/output logic necessary to drive a specific data to the pad and control the direction of the pad using registers in the GPIO module. The ARM926 is able to sample the status of the corresponding pads by reading the appropriate status register. The GPIO supports up to 32 interrupts and has the ability to identify interrupt edges as well as generate three active high interrupts.

2.3.15 General Purpose Timer (GPT)

The i.MX27/MX27L processors contains six identical 32-bit General Purpose Timers (GPT) with programmable prescalers and compare and capture registers. Each timer’s counter value can be captured using an external event, and can be configured to trigger a capture event on the rising or/and falling edges of an input pulse. Each GPT can also generate an event on the TOUT pin, and an interrupt when the timer reaches a programmed value. Each GPT has an 11-bit prescaler that provides a programmable clock frequency derived from multiple clock sources, including ipg_clk_32k, ipg_clk_perclk, ipg_clk_perclk/4, and external clock from the TIN pin. The counter has two operation modes: free-run and restart mode. The GPT can work in low-power mode. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 17 Functional Description and Application Information

2.3.16 Inter IC Communication (I 2C)

Inter IC Communication (I2C) is a two-wire, bidirectional serial bus that provides a simple, efficient method of data exchange, minimizing the interconnection between devices. This bus is suitable for applications requiring occasional communications over a short distance between many devices. The flexible I2C enables additional devices to be connected to the bus for expansion and system development. The I2C operates up to 400 kbps dependent on pad loading and timing. (For pad requirement details, refer to Phillips I2C Bus Specification, V ersion 2.1.) The I2C system is a true multiple-master bus, including arbitration and collision detection that prevents data corruption if multiple devices attempt to control the bus simultaneously. This feature supports complex applications with multiprocessor control and can be used for rapid testing and alignment of end products through external connections to an assembly-line computer.

2.3.17 IC Identification Module (IIM)

The IC Identification Module (IIM) provides an interface for reading and in some cases programming and/or overriding identification and control information stored in on-chip fuse elements. The module supports laser fuses (L-Fuses) or electrically-programmable poly fuses (e-Fuses) or both. Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC, IIM, SAHARA2

2.3.18 JTAG Controller (JTAGC)

The JTAG Controller (JTAGC) module supports debug access to the ARM926 Platform and tristate enable of the I/O pads. The overall strategy is to achieve good test and debug features without increasing the pin count and reducing the complexity of I/O muxing. The JTAG Controller is compatible with IEEE Std 1149.1™ Standard Test Access Port and Boundary Scan Architecture.

2.3.19 Keypad Port (KPP)

The Keypad Port (KPP) is designed to interface with a keypad matrix with 2-contact or 3-point contact keys. KPP is designed to simplify the software task of scanning a keypad matrix. With appropriate software support, the KPP is capable of detecting, debouncing, and decoding one or multiple keys pressed simultaneously in the keypad. The KPP supports up to 8 × 8 external key pad matrix. Its port pins can be used as general purpose I/O. Using an open drain design, the KPP includes glitch suppression circuit design, multiple keys, long key, and standby key detection.

2.3.20 Liquid Crystal Display Controller (LCDC)

The Liquid Crystal Display Controller (LCDC) provides display data for external gray-scale or color LCD panels. The LCDC is capable of supporting black-and-white, gray-scale, passive-matrix color (passive color or CSTN), and active-matrix color (active color or TFT) LCD panels. The LCDC provides the following features:  Configurable AHB bus width (32-bit/64-bit) Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

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Functional Description and Application Information  Support for single (non-split) screen monochrome or color LCD panels and self-refresh type LCD panels  16 simultaneous gray-scale levels from a palette of 16 for monochrome display  Support for: — Maximum resolution of 800 × 600 — Passive color panel: – 4 (mapped to RGB444)/8 (mapped to RGB444)/12 (RGB444) bits per pixel (bpp) — TFT panel: – 4 (mapped to RGB666)/8 (mapped to RGB666)/12 (RGB444)/16 (RGB565)/18 (RGB666) bpp — 16 and 256 colors out of a palette of 4096 colors for 4 bpp and 8 bpp CSTN display, respectively — 16 and 256 colors out of a palette of 256 colo rs for 4 bpp and 8 bpp TFT display, respectively — True 4096 colors for a 12 bpp display — True 64-Kbyte colors for 16 bpp — True 256-Kbyte colors for 18 bpp — 16-bit AUO TFT LCD Panel — 24-bit AUO TFT LCD Panel

2.3.21 Multi-Master Memory Interface (M3IF)/M3IF-ESDCTL/MDDRC

The M3IF-ESDCTL/MDDRC interface is optimized and designed to reduce access latency by generating multiple accesses through the dedicated ESDCTL/MDDRC arbitration (MAB) module, which controls the access to and from the Enhanced SDRAM/MDDR memory controller. For the other port interfaces, the M3IF only arbitrates and forwards the master requests received through the Master Port Gasket (MPG) interface and M3IF Arbitration (M3A) module toward the respective memory controller. The masters that interface with the M3IF include the ARM Platform, FEC, LCDC, H.264, and the USB. The controllers are the ESDCTL/MDDRC, PCMCIA, NFC, and WEIM.

2.3.22 Multi-Layer AHB Crossbar Switch (MAX)

The ARM926EJ-S processor’s instruction and data buses—and all alternate bus master interfaces—arbitrate for resources via a 6 × 34 Multi-Layer AHB Crossbar Switch (MAX). There are six (M0–M5) fully functional master ports and three (S0–S2) fully functional slave ports. The MAX is uni-directional. All master and slave ports are AHB-Lite compliant. The design of the crossbar switch enables concurrent transactions to proceed from any master port to any slave port. That is, it is possible for all three slave ports to be active at the same time as a result of three independent master requests. If a particular slave port is simultaneously requested by more than one master port, arbitration logic exists inside the crossbar to allow the higher priority master port to be granted the bus, while stalling the other requestor(s) until that transaction has completed. The slave port arbitration Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 19 Functional Description and Application Information schemes supported are fixed, programmable fixed, programmable default input port parking, and a round robin arbitration scheme. The Crossbar Switch also monitors the ccm_br input (clock control module bus request), which requests a bus grant from all four slave ports. The priority of ccm_br is programmable and defaults to the highest priority. Upon receiving bus grants for all four output ports, the ccm_bg output will assert. At this point, the clock control and reset module (CRM) can turn off hclk and be assured there are no outstanding AHB transactions in progress. Once the CRM is granted a port, no other master will receive a grant on that port until the CRM bus request (ccm_br) negates.

2.3.23 Memory Stick Host Controller (MSHC)

The Memory Stick Host Controller (MSHC) is located between the AIPI and the Sony Memory Stick and provides support for data transfers between the i.MX27 processor and the Memory Stick (MS). The MSHC consists of two sub-modules; the MSHC gasket and the Sony Memory Stick Host Controller (SMSC). The SMSC module, which is the actual memory stick host controller, is compatible with Sony Memory Stick V er 1.x and Memory Stick PRO. The gasket connects the AIPI IP bus to the SMSC interface to allow communication and data transfers via the IP Bus. NOTE The i.MX27L does not include the MSHC feature. The MSHC gasket uses a reduced IP Bus interface that supports the IP bus read/write transfers that include a back-to-back read or write. DMA transfers also take place via the IP Bus interface. A transfer can be initiated by the DMA or the host (through the AIPI) response to an MSHC DMA request or interrupt. The SMSC has two DMA address modes— a single address mode and a dual address mode. The MSHC is set to dual-address mode for transfers with the DMA. In dual-address mode, when the MSHC requests a transfer with the DMA request (XDRQ), the DMA will initiate a transfer to the MSHC. NOTE Details regarding the operation of the MSHC module can be found separately in Memory Stick/Memory Stick PRO Host Controller IP Specification 1.3.

2.3.24 NAND Flash Controller (NFC)

NAND Flash Controller (NFC) interfaces standard NAND Flash devices to the i.MX27/MX27L processors and hides the complexities of accessing the NAND Flash. It provides a glueless interface to both 8-bit and 16-bit NAND Flash parts with page sizes of 512 Bytes or 2 Kbytes. Its addressing scheme enables it to access flash devices of almost limitless capacity. The 2-Kbyte RAM buffer of the NAND Flash is used as the boot RAM during a cold reset (if the i.MX27/MX27L device is configured for a boot to be carried out from the NAND Flash device). After the boot procedure completes, the RAM is available as buffer RAM. In addition, the NAND Flash controller provides an X16-bit and X32-bit interface to the AHB bus on the chip side, and an X8/X16 interface to the NAND Flash device on the external side. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

20 Freescale Semiconductor

Functional Description and Application Information

2.3.25 Personal Computer Memory Card International Association

(PCMCIA) The Personal Computer Memory Card International Association (PCMCIA) provides the PCMCIA 2.1 standard, which defines the usage of memory and I/O devices as insertable and exchangeable peripherals for personal computers or PDAs. Examples of these types of devices include CompactFlash and WLAN adapters. The pcmcia_if host adapter module provides the control logic for PCMCIA socket interfaces, and requires some additional external analog power switching logic and buffering. The additional external buffers allow the pcmcia_if host adapter module to support one PCMCIA socket. The pcmcia_if shares its chip level I/O with the external interface to memory (EIM) pins. Additional logic is required to multiplex the EIM and the pcmcia_if on the same pins.

2.3.26 Digital Phase Lock Loop (DPLL)

Two on-chip Digital Phase Lock Loop (DPLLs) provide clock generation in digital and mixed analog/digital chips designed for wireless communication and other applications. The DPLLs produce a high-frequency chip clock signals with a low frequency and phase jitter.

2.3.27 Pulse-Width Modulator (PWM)

The Pulse-Width Modulator (PWM) has a 16-bit counter and is optimized to generate sounds from stored sample audio images; it can also generate tones. The PWM uses 16-bit resolution and a 4 × 16 data FIFO to generate sound. The 16-bit up-counter has a source selectable clock with 4 × 16 FIFO to minimize interrupt overhead. Clock-in frequency is controlled by a 12-bit prescaler for the division of a clock. Capable of sound and melody generation, the PWM has an active-high or active-low configurable output, and can be programmed to be active in low-power and debug modes. The PWM can be programmed to generate interrupts at compare and rollover events.

2.3.28 Real Time Clock (RTC)

The Real Time Clock (RTC) module maintains the system clock, provides stopwatch, alarm, and interrupt functions, and supports the following features:  Full clock—days, hours, minutes, seconds  Minute countdown timer with interrupt  Programmable daily alarm with interrupt  Sampling timer with interrupt  Once-per-day, once-per-hour, once-per-mi nute, and once-per-second interrupts  Operation at 32.768 kHz or 32 kHz, or 38.4 kHz (determined by reference clock crystal) The prescaler converts the incoming crystal reference clock to a 1 Hz signal, which is used to increment the seconds, minutes, hours, and days TOD counters. The alarm functions, when enabled, generate RTC interrupts when the TOD settings reach programmed values. The sampling timer generates fixed-frequency interrupts, and the minute stopwatch allows for efficient interrupts on very small boundaries. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 21 Functional Description and Application Information

2.3.29 Run-TIme Integrity Checker (RTIC)

The Run-Time Integrity Checker (RTIC) is one of the security components in the i.MX27/MX27L processors. Its purpose is to ensure the integrity of the peripheral memory contents and assist with boot authentication. The RTIC has the ability to verify the memory contents during system boot and during run-time execution. If the memory contents at runtime fail to match the hash signature, an error in the security monitor is triggered. Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC, IIM, SAHARA2

2.3.30 Symmetric/Asymmetric Hashing and Random Accelerator

(SAHARA2) SAHARA2 is a security co-processor, it implements encryption algorithms (AES, DES, and 3DES), hashing algorithms (MD5, SHA-1, SHA_224, and SHA-256), stream cipher algorithm (ARC4), and a hardware random number generator. Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC, IIM, SAHARA2

2.3.31 Security Controller Module (SCC)

The Security Controller Module (SCC) is a hardware security component. Overall, its primary functionality is associated with establishing a centralized security state controller and hardware security state with a hardware configured, unalterable security policy. Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC, IIM, and SAHARA2.

2.3.32 Secure Digital Host Controller (SDHC)

The Secure Digital Host Controller (SDHC) controls the MultiMedia Card (MMC), Secure Digital (SD) memory, and I/O cards by sending commands to cards and performing data accesses to/from the cards. The Multimedia Card/Secure Digital Host (MMC/SD) module integrates both MMC support along with SD memory and I/O functions. The SDHC is fully compatible with the MMC System Specification Version 3.0, as well as with the SD Memory Card Specification 1.0, and SD I/O Specification 1.0 with 1/4 channel(s). The maximum data rate in 4-bit mode is 100 Mbps. The SDHC uses a built-in programmable frequency counter for the SDHC bus, and provides a maskable hardware interrupt for an SDIO interrupt, internal status, and FIFO status. It has a pair of 32 × 16-bit data FIFO buffers built in. The MultiMedia Card (MMC) is a universal, low-cost data storage and communication media that is designed to cover a wide area of applications, including, for example, electronic toys, organizers, PDAs, and smart phones. The MMC communication is based on an advanced 7-pin serial bus designed to operate in a low-voltage range. The Secure Digital Card (SD) is an evolution of MMC technology, with two additional pins in the form factor. It is specifically designed to meet the security, capacity, performance, and environment requirements inherent in newly emerging audio and video consumer electronic devices. The physical form Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

22 Freescale Semiconductor

Functional Description and Application Information factor, pin assignment, and data transfer protocol are forward-compatible with the MultiMedia Card with some additions. Under SD, it can be categorized into Memory and I/O. The memory card invokes a copyright protection mechanism that complies with the security of the SDMI standard, which is faster and provides the capability for a higher memory capacity. The I/O card provides high-speed data I/O with low-power consumption for mobile electronic devices.

2.3.33 Smart Liquid Crystal Display Controller Module (SLCDC)

The Smart Liquid Crystal Display Controller (SLCDC) module transfers data from the display memory buffer to the external display device. Direct Memory Access (DMA) transfers the data transparently with minimal software intervention. Bus utilization of the DMA is controllable and deterministic. As cellular phone displays become larger and more colorful, demands on the processor increase. More CPU power is needed to render and manage the image. The role of the display controller is to reduce the CPU’s involvement in the transfer of data from memory to the display device so the CPU can concentrate on image rendering. DMA is used to optimize the transfer. Embedded control information needed by the display device is automatically read from a second buffer in system memory and inserted into the data stream at the proper time to completely eliminate the CPU’s role in the transfer. A typical scenario for a cellular phone display is to have the display image rendered in main system memory. After the image is complete, the CPU triggers the SLCDC module to transfer the image to the display device. Image transfer is accomplished by burst DMA, which steals bus cycles from the CPU. Cycle-stealing behavior is programmable so bus use is kept within predefined bounds. After the transfer is complete, a maskable interrupt is generated indicating the status. For animated displays, it is suggested that a two-buffer ping-pong scheme be implemented so that the DMA is fetching data from one buffer while the next image is rendered into the other. Several display sizes and types are used in the various products that use the SLCDC. The SLCDC module has the capability of directly interfacing to the selected display devices. Both serial and parallel interfaces are supported. The SLCDC module only supports writes to the display controller. SLCDC read operations from the display controller are not supported.

2.3.34 Synchronous Serial Interface (SSI)

The Synchronous Serial Interface (SSI) is a full-duplex serial port that allows the chip to communicate with a variety of serial devices. These serial devices can be standard codecs, Digital Signal Processors (DSPs), microprocessors, peripherals, and popular industry audio codecs that implement the inter-IC sound bus standard (I2S) and Intel AC97 standard. The SSI is typically used to transfer samples in a periodic manner. The SSI consists of independent transmitter and receiver sections with independent clock generation and frame synchronization. The SSI contains independent (asynchronous) or shared (synchronous) transmit and receive sections with separate or shared internal/external clocks and frame syncs, operating in Master or Slave mode. The SSI can work in Normal mode operation using frame sync, and in Network mode operation allowing multiple devices to share the port with as many as thirty-two time slots. The SSI provides two sets of Transmit and Receive FIFOs. Each of the four FIFOs is 8× 24 bits. The two sets of Tx/RX FIFOs can be used in Network mode to provide two independent channels for transmission Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 23 Functional Description and Application Information and reception. It also has programmable data interface modes such as I2S, LSB, and MSB aligned and programmable word lengths. Other program options include frame sync, clock generation, and programmable I2S modes (Master, Slave, or Normal). Oversampling clock, ccm_ssi_clk is available as output from SRCK in I2S Master mode. In addition to AC97 support, the SSI has completely separate clock and frame sync selections for the receive and transmit sections. In the AC97 standard, the clock is taken from an external source and frame sync is generated internally. The SSI also has a programmable internal clock divider and Time Slot Mask registers for reduced CPU overhead (for Tx and RX both).

2.3.35 Universal Asynchronous Receiver/Transmitter (UART)

The i.MX27/MX27L processors contain six UART modules. Each UART module is capable of standard RS-232 non-return-to-zero (NRZ) encoding format and IrDA-compatible infrared modes. The UART provides serial communication capability with external devices through an RS-232 cable or through use of external circuitry that converts infrared signals to electrical signals (for reception); or it transforms electrical signals to signals that drive an infrared LED (for transmission) to provide low-speed IrDA compatibility. The UART transmits and receives characters that are either 7 or 8 bits in length (program selectable). To transmit, data is written from the peripheral data bus to a 32-byte transmitter FIFO (TxFIFO). This data is passed to the shift register and shifted serially out on the transmitter pin (TXD). To receive, data is received serially from the receiver pin (RXD) and stored in a 32-half-word-deep receiver FIFO (RxFIFO). The received data is retrieved from the RxFIFO on the peripheral data bus. The RxFIFO and TxFIFO generate maskable interrupts as well as DMA requests when the data level in each of the FIFO reaches a programmed threshold level. The UART generates baud rates based on a programmable divisor and input clock. The UART also contains programmable auto baud detection circuitry to receive 1 or 2 stop bits as well as odd, even, or no parity. The receiver detects framing errors, idle conditions, BREAK characters, parity errors, and overrun errors.

2.3.36 Universal Serial Bus (USB)

The i.MX27/MX27L processors provide three USB ports. The USB module provides high performance USB On-The-Go (OTG) functionality, compliant with the USB 2.0 specification, the OTG supplement, and the ULPI 1.0 Low Pin Count specification. The module consists of three independent USB cores, each controlling one USB port. In addition to the USB cores, the USB module provides for Transceiverless Link (TLL) operation on host Ports 1 and 2, and provides the ability of routing the OTG transceiver interface to Host Port 1 such that this transceiver can be used to communicate with a USB peripheral connected to Host Port 1. The USB module has two connections to the CPU bus—one IP -bus connection for register accesses and one AHB-bus connection for the DMA transfer of data to and from the FIFOs. The USB module includes the following features:  Full Speed/Low speed Host only core (HOST 1)  Transceiverless Link Logic (TLL) for on boa rd connection to a FS/LS USB peripheral Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

24 Freescale Semiconductor

Functional Description and Application Information  Bypass mode to route Host Port 1 signals to OTG I/O port  High Speed /Full Speed/Low Speed Host Only core (Host 2)  Full Speed/Low Speed interface for Serial transceiver  TLL function for direct connection to USB peripheral in FS/LS (serial) operation  High-speed OTG core The USB module has two main modes of operation: Normal mode and Bypass mode. Furthermore, the USB interfaces can be configured for high-speed operation (480 Mbps) and/or full/low speed operation (12/1.5 Mbps). In Normal mode, each USB core controls its corresponding port. In additional to th4e major operational modes, each port can work in one or more modes, as follows: PHY mode In PHY mode, an extern al serial transceiver is connected to the port. This is used for off-board USB connections. TLL mode In TLL mode, internal logic is enabled to emulate the functionality of two back-to-back connected transceivers. This mode is typically used for on-board USB connections to USB-capable peripherals. Host Port 2 supports ULPI and Serial Transceivers. The OTG port requires a transceiver and is intended for off-board USB connections. Serial Interface mode In serial mode, a serial OT G transceiver must be connected. The port does not support dedicated signals for OTG signaling. Instead, a transceiver with built-in OTG registers must be used. Typically, the Transceiver registers are accessible over an I2C or SPI interface. ULPI mode In this mode, a ULPI transceiver is connected to the port pins to support high-speed off board USB connection. Bypass mode Bypass mode affects the operation of the OTG port and Host Port 1. This mode is only available when a serial transceiver is used on the OTG port, and the peripheral device on Port 1 is using a TLL connection. Bypass mode is activated by setting the bypass bit in the USBCONTROL register. In this mode, the USB OTG port connections are internally routed to the USB Host 1 port, such that the transceiver on the OTG port connects to a peripheral USB device on Host Port 1. The OTG core and the Host 1 core are disconnected from their ports when bypass is active. Low Power mode Each of the three USB cores has an associated power control module that is controlled by the USB core and clocked on a 32-kHz clock. When a USB bus is idle, the transceiver can be placed in low-power mode (suspend), after which the clocks to the USB core can be stopped. The 32-kHz low power clock must remain active as it is needed for walk-up detection.

2.3.37 Watchdog Timer Module (WDOG)

The Watchdog Timer module (WDOG) protects against system failures by providing a method of escaping from unexpected events or programming errors. Once the WDOG module is activated, it must be serviced by software on a periodic basis. If servicing does not take place, the timer times out. Upon a time-out, the WDOG Timer module either asserts the wdog signal or a system reset signal wdog_rst, depending on Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 25 Functional Description and Application Information software configuration. The WDOG Timer module also generates a system reset via a software write to the Watchdog Control Register (WCR) when there is a detection of a clock monitor event, an external reset, an external JTAG reset signal, or if a power-on-reset has occurred.

2.3.38 Wireless External Interface Module (WEIM)

The Wireless External Interface Module (WEIM) handles the interface to devices external to the chip, including generation of chip selects, clocks and controls for external peripherals and memory. It provides asynchronous and synchronous access to devices with an SRAM-like interface. The WEIM includes six chip selects for external devices, with two CS signals covering a range of 128 Mbytes, and the other four each covering a range of 32 Mbytes. The 128-Mbyte range can be increased to 256 Mbytes when combined with the two signals. The WEIM offers selectable protection for each chip select as well as programmable data port size. There is a programmable wait-state generator for each chip select and support for Big Endian and Little Endian modes of operation per access.

2.3.39 Video Codec

The Video Codec module is the video processing module in the i.MX27 processor. It supports full duplex video codec with 25 fps VGA resolution, supports multi-party calls, and integrates multiple video processing standards, including H.264 BP, MPEG-4 SP, and H.263 P3 (including annex I, J, K, and T), D1 resolution, 30 fps—half-duplex. NOTE The Video Codec feature is not available on the i.MX27L It has three 64-bit AHB-Lite master bus interfaces connecting to the EMI, which includes two read channels and one write channel. Its 32-bit AHB-Lite master bus is connected to ARM Platform to access system-internal SRAM. The Video Codec module contains three major architectural components: video codec processing IP, AXI-to-AHB bus protocol transfer module, and a 32-bit to 64-bit AHB master bus protocol transfer module. The Video Codec module supports following video stream processing features:  Multi-standard video codec — MPEG-4 part-II simple profile encoding/decoding — H.264/A VC baseline profile encoding/decoding — H.263 P3 encoding/decoding — Multi-party call: max processing four ima ge/bitstream encoding and/or decoding simultaneously — Multi-format: for example, encodes MPEG-4 bitstream, and decodes H.264 bitstream simultaneously  Coding tools — High-performance motion estimation – Single reference frame for both MPEG-4 and H.264 encoding Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

26 Freescale Semiconductor

Functional Description and Application Information – Support 16 reference frame for H.264 decoding – Quarter-pel and half-pel accuracy motion estimation – [+/-16, +/-16] Search range – Unrestricted motion vector — All variable block sizes are supported (in case of encoding, 8 × 4, 4 × 8, and 4 × 4 block sizes are not supported). — MPEG-4 AC/DC prediction and H.264 Intra prediction — H.263 Annex I, J, K(RS = 0 and ASO =0), and T are supported. In case of encoding, the Annex I and K(RS=1 or ASO=1) are not supported. — CIR (Cyclic Intra Refresh)/AIR (Adaptive Intra Refresh) — Error resilience tools – MPEG-4 re-synchronize marker and data-partitioning with RVLC (fixed number of bits/macroblocks between macroblocks) – H.264/A VC FMO and ASO – H.263 slice structured mode — Bit-rate control (CBR and VBR)  Pre/post rotation/mirroring — 8 rotation/mirroring modes for image to be encoded — 8 rotation/mirroring modes for image to be displayed  Programmability — Embeds 16-bit DSP processor that is dedicated to processing bitstream and driving codec hardware — General purpose registers and interrupt generation for communication between system and video codec module Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

3 Signal Descriptions

organized by group, as applicable. sheet requires them to be included here. Table 3 shows the i.MX27/MX27L signal descriptions. Table 3. i.MX27/MX27L Signal Descriptions SDRAM/MDDR is not the address but the pre-charge bank select signal. EB0 Active low external enable byte signal that controls D [15:8], shared with PCMCIA PC_REG . EB1 Active low external enable byte signal that controls D [7:0], shared with PCMCIA PC_IORD . CSD [1:0] is selected. DTACK is multiplexed with CS4. CS[5:4] are multiplexed with ETMTRACECLK and ETMTRACESYNC; PF22, 21. an on-going burst sequence and initiate a new (long first access) burst sequence. BCLK Clock signal sent to external synchronous memories (such as burst flash) during burst mode. is also shared with the PCMCIA PC_WE .

28 Freescale Semiconductor

EXT_60M This is a special factory test signal. T o ensure proper operation, connect this signal to ground. EXT_266M This is a special factory test signal. T o ensure proper operation, connect this signal to ground. Table 3. i.MX27/MX27L Signal Descriptions (continued)

source: power on reset, system reset (RESET_IN), and watchdog reset. by an external RC circuit designed to detect a power-up event. oscillator circuit is shut down. handshake signals to PMIC(VSTBY). TRST T est Reset Pin—External active low signal used to asynchronously initialize the JTAG controller. TDO Serial Output for test instructions and data. Changes on the falling edge of TCK. TDI Serial Input for test instructions and data. Sampled on the rising edge of TCK. TCK T est Clock to synchronize test logic and control register access through the JT AG port. multiplexed with 1-Wire; thus, utilizing 1-Wire will render RTCK unusable and vice versa; PE16. added. This signal is multiplexed with CSPI3_MOSI; PE22. SD1_CLK SD Output Clock. This signal is multiplexed with CSPI3_SCLK; PE23.

30 Freescale Semiconductor

pull-up, via the Pull-up enable register, a 50 K–69 K external pull up resistor must be added. SD1_D[3] is muxed with CSPI3_SS while SD1_D[0] is muxed with CSPI3_MISO PE21–18. multiplexed with SLCDC1_CS; PB8. multiplexed with SLCDC1_CLK; PB9. GPIO SD2_1:0] multiplexed with SLCDC1_RS and SLDCD1_D0; PB7–PB4. through GPIO PD1 multiplexed with FEC_TXD0. SD3_CLK SD Output Clock signal. This signal is through GPIO PD0 multiplexed with FEC_TXD1. Note: SD3_DA TA is multiplexed with A TA_DAT A3–0. UART2_RXD Receive Data input signal. This signal is multiplexed with KP_ROW6 signal from KPP; PE7. UART2_TXD T ransmit Data output signal. This signal is multiplexed with KP_COL6 signal from KPP; PE6. UART2_RTS Request to Send input signal. This signal is multiplexed with KP_ROW7 signal from KPP; PE4. UART2_CTS Clear to Send output signal. This signal is multiplexed with KP_COL7 signal from KPP; PE3. Note: UART 4, 5, and 6 are multiplexed with COMS Sensor Interface signals. signal multiplexing) to choose which signal KP_COL6 is available.

Note: KP_COL[7:6] and KP_ROW[7:6] are multiplexed with UART2 signals as show above, also see UARTs table. TOUT3 of the General Purpose Timer module; PE5. Note: CSPI3 CSPI3_MOSI, CSPI3_MISO, CSPI3_SS, andCSPI3_SCLK are multiplexed with SD1 signals.

32 Freescale Semiconductor

SLCDC2_CLK; through GPIO multiplexed with PC_WAIT_B; PC31. SLCDC2_D0; through GPIO multiplexed with PC_VS1; PC28. Clock, and Reset Controller module, and is also multiplexed with GPT6_TOUT; PC15. TOUT, and is also multiplexed with GPT6_TIN; PC14. Note: TOUT2, TOUT3 are multiplexed with PWMO pad; GPT4 and GPT5 signals are multiplexed with SSI2 pads.

34 Freescale Semiconductor

driver (dedicated signal SPS for Sharp panel HR-TFT); PA29. signal). This signal is multiplexed with the SLCDC1_RS; P A25. signal is multiplexed with SLCDC1_D0; P A24. LD[15:0] signals are multiplexed with SLCDC1_DA T[15:0], SLCDC. PA23–P A6. Note: SLCDC signals are multiplexed with LCDC signals. Through GPIO also are multiplexed with SLCDC 15–0, and FEC signals; PF23, PD16–PD2. NVDD1–15, AVDD Noisy Supply for the I/O pins. There are 16 I/O voltage pads, N VDD1 through NVDD15 + AVDD.

3.1 Power-Up Sequence

of power and resets to ensure proper operation. appear in this list. The signals are listed below with the named signal that they are multiplexed. The 1-Wire input and output signal is multiplexed with JT AG RTCK pad, PE16. Note: The Rest AT A signals are multiplexed with PCMCIA Pads.

36 Freescale Semiconductor

3.2 EMI Pins Multiplexing

EMI. Table 4 lists the i.MX27 pin names, pad types, and the memory devices’ equivalent pin names. Table 4. EMI Multiplexing

Table 4. EMI Multiplexing (continued)

38 Freescale Semiconductor

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

40 Freescale Semiconductor

Electrical Characteristics

4 Electrical Characteristics

This section provides the chip-level and module-level electrical characteristics for the i.MX27/iMX27L. 4.1 i.MX27/iMX27L Chip-Level Conditions This section provides the chip-level electrical characteristics for the IC. See Table 5 for a quick reference to the individual tables and sections. Table 6 provides the DC absolute maximum operating conditions. CAUTION Stresses beyond those listed under Table 6 may cause permanent damage to device. These are stress ratings only. Functional operation of device at these or any other conditions beyond those indicated under “DC operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 7 provides the DC recommended operating conditions. Table 5. i.MX27/iMX27L Chip-Level Conditions Table 6. DC Absolute Maximum Conditions

4 Storage T emperature Range Tstorage –20 125 oC

Table 7. DC Operating Conditions

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 41

4.1.1 DPLL Frequency Specification

Table 8 provides the frequency specifications for the DPLL. Table 9 provides information for interface frequency limits. 3 RTC, SCC separate Supply Voltage RTCVDD 1.2 — 1.52 V 4 I/O Supply Voltage, Fast (7, 11, 12, 14, 15) 1 NVDD_FAST 1.75 — 2.8 V 5 I/O Supply Voltage, Slow (5, 6, 8, 9, 10, 13, AV DD)N VDD_SLOW 1.75 — 3.05 V NVDD_SLOW 1.75 — 3.1 V 6 I/O Supply Voltage, DDR (1, 2, 3, 4) 2 NVDD_DDR 1.75 — 1.9 V 7 Analog Supply Voltage: FPMV DD, UPLLVDD, MPLLVDD VDD 1.35 1.4 1.6 V

8 Fusebox read Supply Voltage FUSEV DD

(read mode) 1.7 1.875 1.95 V

9 Fusebox Program Supply Voltage FUSEVDD

(program mode) 3.00 3.15 3.30 V 10 OSC32V DD VOSC32 1.1 — 1.6 V 11 OSC26V DD VOSC26 2.68 — 2.875 V

12 Operating Ambient T emperature (17mm x17mm package) T A –20 — 85 oC

13 Operating Ambient T emperature (19mm x19mm package) T A –40 — 85 oC

Note: 1 Segments 11, 14, 15 are mixture of Fast and Slow GPIO. 2 Segments 1, 3, 4 are mixture of DDR and Fast GPIO. Table 8. DPLL FREQUENCY Specifications Table 9. Interface Frequency Table 7. DC Operating Conditions (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

42 Freescale Semiconductor

4.1.2 Current Consumption

Table 10 defines the frequency settings used for specifying power consumption in Table 11. All power states are specified. The temperature setting of 25° C is used for specifying the Deep Sleep Mode (DSM) per the temperature range shown in Table 7. Table 11 shows the power consumption for the i.MX27/iMX27L device. Table 10. Frequency Definition for Power Consumption Measurement

1 MCU core fMCUmeas@266 266 MHz

2 MCU core f MCUmeas@400 400 MHz

3 MCU AHB bus f MCU-AHBmeas 133 MHz

4 MCU IP bus f MCU-IPmeas 66 MHz

Table 11. Current Consumption

1 RUN Current

 ARM is in wait for interrupt mode. 3 Sleep Current  QV DD = 1.2 V. 4 Power Gate  NV DD13 is on. See Ta ble 7 for specific values.

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 43

4.1.3 Test Conditions and Recommended Settings

Unless specified, AC timing parameters are specified for 15 pF loading on i.MX27/iMX27L pads. Drive strength has been kept at default/reset values for testing. EMI timing has been verified with high drive strength setting and 25 pF loads. SDHC timing has also been verified with high drive strength setting. Unless otherwise noted, AC/DC parameters are guaranteed at operating conditions shown in Table 7.

4.2 Module-Level Electrical Specifications

This section contains the i.MX27/iMX27L electrical information including timing specifications, arranged in alphabetical order by module name.

4.2.1 Pads IO (PADIO) Electricals

4.2.1.1 DC Electrical Characteristics

The over-operating characteristics appear in Table 12 for GPIO pads and Table 13 for DDR (Double Data Rate) pads (unless otherwise noted). Table 12. GPIO Pads DC Electrical Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

44 Freescale Semiconductor

Pull-up resistor (22 kΩ PU) RPU —1 5 2 2 5 9 kΩ Pull-up resistor (47 kΩ PU) RPU — 30 47 128 Pull-up resistor (100 kΩ PU) RPU — 34 100 268 Pull-down resistor (100 kΩ PD) RPD — 25 100 343 Input current (no PU/PD) IIN VI = 0 VI = NVDD —0 . 3 3 ±1 μA Input current (22 kΩ PU) IIN VI = 0 VI = NVDD — — 115 0.1 μA μA Input current (47 kΩ PU) I IN VI = 0 VI = NVDD ——5 3 0.1 μA μA Input current (100 kΩ PU) I IN VI = 0 VI = NVDD ——2 5 0.1 μA μA Input current (100 kΩ PD) I IN VI = 0 VI = NVDD — — 0.25 μA μA T ri-state input leakage current I Z VI = NVDD or 0 I/O = high Z —0 . 3 3 ±2 μA High Level DC Input Voltage V IH — 0.7*VDDIO —V DDIO V Low-Level DC Input Voltage V IL — 0 — 0.3*V DDIO V Note: 1 Max High strength should be avoided due to excessive overshoot and ringing. Table 13. DDR (Double Data Rate) I/ O Pads DC Electrical Parameters Table 12. GPIO Pads DC Electrical Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 45

4.2.1.2 AC Electrical Characteristics

Figure 2 depicts the load circuit for output pads. Figure 3 depicts the output pad transition time waveform. The range of operating conditions appear in Table 14 for slow general I/O, Table 15 for fast general I/O, and Table 16 for DDR I/O (unless otherwise noted). Figure 2. Load Circuit for Output Pad Figure 3. Output Pad Transition Time Waveform 1 Max High and DDR Drive strengths should be avoided due to excessive overshoot and ringing. Table 14. AC Electrical Characteristics of Slow General I/O Pads Table 13. DDR (Double Data Rate) I/O Pads DC Electrical Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

46 Freescale Semiconductor

4.2.2 1-Wire Electrical Specifications Figure 4 depicts the RPP timing, and Table 17 lists the RPP timing parameters. Figure 4. Reset and Presence Pulses (RPP) Timing Diagram 1 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 15. AC Electrical Characteristics of Fast General I/O Pads 1 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 16. AC Electrical Characteristics of DDR I/O Pads

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

48 Freescale Semiconductor

4.2.3 ATA Electrical Specifications

This section describes the electrical information of the Parallel ATA module compliant with ATA/ATAPI-6 specification. NOTE The parallel ATA module is not available on the i.MX27L Parallel A TA module can work on PIO/Multi-Word DMA/Ultra DMA transfer modes. Each transfer mode has different data transfer rate, Ultra DMA mode 4 data transfer rate is up to 100 MB/s. Parallel ATA module interface consist of a total of 29 pins, Some pins act on different function in different transfer mode. There are different requirements of timing relationships among the function pins conform with A TA/A TAPI-6 specification and these requirements are configurable by the ATA module registers. Below defines the AC characteristics of all the interface signals on all data transfer modes.

4.2.3.1 General Timing Requirements

These are the general timing requirements for the ATA interface signals. Table 19. Write 1/Read Timing Parameters Table 20. AC Characteristics of All Interface Signals amplitude with all capacitive loads from 15 pf through 40 pf where all signals have the same capacitive load value.

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 49 Figure 8. ATA interface Signals Timing Diagram

4.2.4 Digital Audio Mux (AUDMUX)

4.2.5 CMOS Sensor Interface (CSI)

This section describes the electrical information (AC timing) of the CSI.

4.2.5.1 Gated Clock Mode Timing

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

50 Freescale Semiconductor

Figure 9 shows sensor output data on the pixel clock falling edge. The CSI latches data on the pixel clock rising edge. Figure 9. CSI Timing Diagram, Gated, PIXCLK—Sensor Data at Falling Edge, Latch Data at Rising Edge Figure 10. CSI Timing Diagram, Gated, PIXCLK—Sensor Data at Rising Edge, Latch Data at Falling Edge

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 51 HCLK = AHB System Clock, THCLK = Period for HCLK, Tp = Period of CSI_PIXCLK The limitation on pixel clock rise time/fall time is not specified. It should be calculated from the hold time and setup time based on the following assumptions: Rising-edge latch data: max rise time allowed = (positive duty cycle— hold time) max fall time allowed = (negative duty cycle— setup time) In most of case, duty cycle is 50/50, therefore: max rise time = (period/2— hold time) max fall time = (period/2— setup time) For example: Given pixel clock period = 10 ns, duty cycle = 50/50, hold time = 1 ns, setup time = 1 ns. positive duty cycle = 10/2 = 5 ns max rise time allowed = 5 –1 = 4 ns negative duty cycle = 10/2 = 5 ns max fall time allowed = 5 –1 = 4 ns Falling-edge latch data: max fall time allowed = (negative duty cycle — hold time) max rise time allowed = (positive duty cycle— setup time)

4.2.5.2 Non-Gated Clock Mode Timing

In non-gated mode only, the VSYNC, and PIXCLK signals are used; the HSYNC signal is ignored. Figure 3 and Figure 4 show the different clock edge timing of CSI and Sensor in Non-Gated Mode. Table 3 is the parameter value. Figure 11 and Figure 12 show the non-gated clock mode timings of CSI, and Table 22 lists the timing parameters. Table 21. Gated Clock Mode Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

52 Freescale Semiconductor

Figure 11 shows sensor output data on the pixel clock falling edge. The CSI latches data on the pixel clock rising edge. Figure 11. CSI Timing Diagram, Non-Gated, PIXCLK—Sensor Data at Falling Edge, Latch Data at Rising Figure 12. CSI Timing Diagram, Non-Gated, PIXCLK—Sensor Data at Rising Edge, Latch Data at Falling Table 22. Non-Gated Clock Mode Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 53 HCLK = AHB System Clock, THCLK = Period of HCLK

4.2.6 Configurable Serial Peripheral Interface (CSPI)

This section describes the electrical information of the CSPI.

4.2.6.1 CSPI Timing

Figure 13 and Figure 14 show the master mode and slave mode timings of CSPI, and Table 23 lists the timing parameters. — csi_d hold time 1 — ns — csi_pixclk high time THCLK —n s — csi_pixclk low time THCLK —n s — csi_pixclk high time 0 HCLK/2 MHz Table 22. Non-Gated Clock Mode Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

54 Freescale Semiconductor

4.3 Timing Diagrams

Figure 13 and Figure 14 depict the master mode and slave mode timing diagrams of the CSPI and Table 23 lists the timing parameters. The values shown in timing diagrams were tested using a worst case core voltage of 1.1 V , slow pad voltage of 2.68 V , and fast pad voltage of 1.65 V . Figure 13. CSPI Master Mode Timing Diagram Figure 14. CSPI Slave Mode Timing Diagram

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 55 Table 23. CSPI Interface Timing Parameters 1 The output SCLK transition time is tested with 25 pF drive.

2 Tsclk = CSPI clock period

3 Twait = Wait time as per the Sample Period Control Register value.

4 Tper = CSPI reference baud rate clock period (PERCLK2)

5 Tipg = CSPI main clock IPG_CLOCK period

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

56 Freescale Semiconductor

4.3.1 Direct Memory Access Controller (DMAC)

After assertion of External DMA Request the DMA burst will start when the corresponding DMA channel becomes the current highest priority channel. The External DMA Request should be kept asserted until it is serviced by the DMAC. One External request will initiate at least one DMA burst. The output External Grant signal from the DMAC is an active-low signal. This signal will be asserted during the time when a DMA burst is ongoing for an External DMA Request, when the following conditions are true:  The DMA channel for which the DMA burst is ongoing has requested source as external DMA Request (as per RSSR settings).  REN and CEN bit of this channel are set.  External DMA Request is asserted. Once the grant is asserted the External DMA Request will not be sampled until completion of the DMA burst. The priority of the external request will become low, for the next consecutive burst, if another DMA request signal is asserted. The waveforms are shown for the worst case—that is, smallest burst (1 byte read/write). Minimum and maximum timings for the External request and External grant signal are present in the data sheet. Figure 15 shows the minimum time for which the External Grant signal remains asserted if External DMA request is de-asserted immediately after sensing grant signal active. Figure 15. Assertion of DMA External Grant Signal sensing grant signal active such that a new burst is not initiated. Figure 16. Timing Diagram of Safe Maximums for External Request De-Assertion NOTE: Assuming worst case that the data is read/written from/to external device as per the above waveform.

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 57

4.3.2 Fast Ethernet Controller (FEC)

This section describes the AC timing specifications of the FEC. The MII signals are compatible with transceivers operating at a voltage of 3.3 V .

4.3.2.1 MII Receive Signal Timing (FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER,

and FEC_RX_CLK) The receiver functions correctly up to a FEC_RX_CLK maximum frequency of 25 MHz + 1%. There is no minimum frequency requirement. In addition, the FEC IPG clock frequency must exceed twice the FEC_RX_CLK frequency. Figure 17 shows the MII receive signal timings, and Table 25 lists the timing parameters. Figure 17. MII Receive Signal Timing Diagram Table 24. DMAC Timing Parameters Table 25. MII Receive Signal Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

58 Freescale Semiconductor

4.3.2.2 MII Transmit Signal Timing (FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER,

and FEC_TX_CLK) The transmitter functions correctly up to a FEC_TX_CLK maximum frequency of 25 MHz + 1%. There is no minimum frequency requirement. In addition, the FEC IPG clock frequency must exceed twice the FEC_TX_CLK frequency. Figure 18 shows the MII transmit signal timings, and Table 26 lists the timing parameters. Figure 18. MII Transmit Signal Timing Diagram 1 FEC_RX_DV, FEC_RX_CLK, and FEC_RXD0 have the same timing in 10 Mbps 7-wire interface mode. Table 26. MII Transmit Signal Timing Parameters 1 FEC_TX_EN, FEC_TX_CLK, and FEC_TXD0 have the same timing in 10 Mbps 7-wire interface mode. Table 25. MII Receive Signal Timing Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 59

4.3.2.3 MII Asynchronous Inputs Signal Timing (FEC_CRS and FEC_COL)

Figure 19 shows the MII asynchronous input timings, and Table 27 lists the timing parameters. Figure 19. MII Asynchronous Inputs Signal Timing Diagram

4.3.2.4 MII Serial Management Channel Timing (FEC_MDIO and FEC_MDC)

can function correctly with a maximum MDC frequency of 15 MHz. Figure 20 shows the MII serial management channel timings, and Table 28 lists the timing parameters. Figure 20. MII Serial Management Channel Timing Diagram Table 27. MII Asynchronous Inputs Signal Timing Parameter 1 FEC_COL has the same timing in 10 Mbit 7-wire interface mode.

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

60 Freescale Semiconductor

4.3.3 Inter IC Communication (I 2C)

This section describes the electrical information of the I2C module.

4.3.3.1 I 2C Module Timing

The I2C communication protocol consists of seven elements: START, Data Source/Recipient, Data Direction, Slave Acknowledge, Data, Data Acknowledge, and STOP. Figure 21 shows the timing of the I2C module. Table 29 lists the I2C module timing parameters. Figure 21. I2C Bus Timing Diagram Table 28. MII Serial Management Channel Timing Parameters Table 29. I2C Module Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 61

4.3.4 JTAG Controller (JTAGC)

This section details the electrical characteristics for the JTAGC module. Figure 22 shows the JTAGC test clock input timing; Figure 23 shows the JTAGC boundary scan timing; Figure 24 shows the JTAGC test access port; Figure 25 shows the JTAGC TRST timing; and Table 30 lists the JTAGC timing parameters. Figure 22. Test Clock Input Timing Diagram Figure 23. Boundary Scan Timing Diagram

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

62 Freescale Semiconductor

Figure 24. Test Access Port (TAP) Diagram Figure 25. TRST Timing Diagram Table 30. JTAGC Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 63

4.3.5 Liquid Crystal Display Controller Module (LCDC)

Figure 26 and Figure 27 depict the timings of the LCDC, and Table 31 and Table 32 list the timing parameters. Figure 26. LCDC Non-TFT Mode Timing Diagram

1 Midpoint voltage

Table 30. JTAGC Timing Parameters (continued)

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64 Freescale Semiconductor

Figure 27. LCDC TFT Mode Timing Diagram Table 31. LCDC Non-TFT Mode Timing Parameters Table 32. LCDC TFT Mode Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 65

4.3.6 Memory Stick Host Controller (MSHC)

Figure 30, Figure 28, and Figure 29 show the MSHC timings. Table 33 and Table 34 list the timing parameters. NOTE The i.MX27L does not contain an MSHC module. Figure 28. Transfer Operation Timing Diagram (Serial)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

66 Freescale Semiconductor

Figure 29. Transfer Operation Timing Diagram (Parallel) Figure 30. MSHC_CLK Timing Diagram Table 33. Serial Interface Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 67

4.3.7 NAND Flash Controller Interface (NFC)

Figure 31, Figure 32, Figure 33, and Figure 34 show the relative timing requirements among different signals of the NFC at module level, and Table 35 lists the timing parameters. The NAND Flash Controller (NFC) timing parameters are based on the internal NFC clock generated by the Clock Controller module, where time T is the period of the NFC clock in ns. The relationship between the NFC clock and the external timing parameters of the NFC is provided in Table 35. Table 35 also provides two examples of external timing parameters with NFC clock frequencies of 22.17 MHz and 33.25 MHz. Assuming a 266 MHz FCLK (CPU clock), NFCDIV should be set to divide-by-12 to generate a 22.17 MHz NFC clock and divide-by-8 to generate a 33.25 MHz NFC clock. The user should compare the parameters of the selected NAND Flash memory with the NFC external timing parameters to determine the proper NFC clock. The maximum NFC clock allowed is 66 MHz. It should also be noted that the default NFC clock on power up is 16.63 MHz. MSHC_BS Setup time tBSsu 5 — ns Hold time tBSh 5 — ns MSHC_DATA Setup time tDsu 5 — ns Hold time tDh 5 — ns Output delay time tDd — 15 ns Table 34. Parallel Interface Timing Parameters Table 33. Serial Interface Timing Parameters (continued)

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Figure 31. Command Latch Cycle Timing Diagram Figure 32. Address Latch Cycle Timing Diagram

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70 Freescale Semiconductor

High is defined as 80% of signal value and low is defined as 20% of signal value. All timings are listed according to this NFC clock frequency (multiples of NFC clock period) except NF16, which is not NFC clock related. The read data is generated by the NAND Flash device and sampled with the internal NFC clock. NF6 NFALE Setup Time tALS T — 45 — 30 — ns NF7 NFALE Hold Time tALH T — 45 — 30 — ns NF8 Data Setup Time tDS T — 45 — 30 — ns NF9 Data Hold Time tDH T — 45 — 30 — ns NF10 Write Cycle Time tWC 2T — 90 — 60 — ns NF11 NFWE Hold Time tWH T — 45 — 30 — ns NF12 Ready to NFRE Low tRR 4T — 180 — 120 — ns NF13 NFRE Pulse Width tRP 1.5T — 67.5 — 45 — ns NF14 READ Cycle Time tRC 2T — 90 — 60 — ns NF15 NFRE High Hold Time tREH 0.5T — 22.5 — 15 — ns NF16 Data Setup on READ tDSR 15 — 15 — 15 — ns NF17 Data Hold on READ tDHR 0 — 0 — 0 — ns Table 35. NFC Target Timing Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 71

4.3.8 Personal Computer Memory Card International Association

(PCMCIA) Figure 35 and Figure 36 show the timings pertaining to the PCMCIA module, each of which is an example of one clock of strobe setup time and one clock of strobe hold time. Table 36 lists the timing parameters. Figure 35. Write Accesses Timing Diagram—PSHT=1, PSST=1

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

72 Freescale Semiconductor

Figure 36. Read Accesses Timing Diagram—PSHT=1, PSST=1 Table 36. PCMCIA Write and Read Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 73

4.3.9 SDRAM (DDR and SDR) Memory Controller

Figure 37, Figure 38, Figure 39, Figure 40, Figure 41, and Figure 42 depict the timings pertaining to the ESDCTL module, which interfaces Mobile DDR or SDR SDRAM. Table 37, Table 38, Table 39, Table 40, Table 41, and Table 42 list the timing parameters. Figure 37. SDRAM Read Cycle Timing Diagram Table 37. DDR/SDR SDRAM Read Cycle Timing Parameters Note: CKE is high during the read/write cycle.

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74 Freescale Semiconductor

SDR SDRAM CLK parameters are being measured from the 50% point—that is, high is defined as 50% of signal value and low is defined as 50% of signal value. SD1 + SD2 does not exceed 7.5 ns for 133 MHz. The timing parameters are similar to the ones used in SDRAM data sheets—that is, Table 37 indicates SDRAM requirements. All output signals are driven by the ESDCTL at the negative edge of SDCLK and the parameters are measured at maximum memory frequency. SD6 Address setup time tAS 2.0 — ns SD7 Address hold time tAH 1.8 — ns SD8 SDRAM access time tAC — 6.47 ns SD9 Data out hold time 1 tOH 1.8 — ns SD10 Active to read/write command period tRC 10 — clock Note: 1 Timing parameters are relevant only to SDR SDRAM. For the specific DDR SDRAM data related timing parameters, see Ta ble 4 1 and Ta ble 4 2. Table 37. DDR/SDR SDRAM Read Cycle Timing Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 75 Figure 38. SDR SDRAM Write Cycle Timing Diagram Table 38. SDR SDRAM Write Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

76 Freescale Semiconductor

SDR SDRAM CLK parameters are being measured from the 50% point—that is, high is defined as 50% of signal value and low is defined as 50% of signal value. The timing parameters are similar to the ones used in SDRAM data sheets—that is, Table 38 indicates SDRAM requirements. All output signals are driven by the ESDCTL at the negative edge of SDCLK and the parameters are measured at maximum memory frequency. Figure 39. SDRAM Refresh Timing Diagram 1 SD11 and SD12 are determined by SDRAM controller register settings. Table 39. SDRAM Refresh Timing Parameters Table 38. SDR SDRAM Write Timing Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 77 SDR SDRAM CLK parameters are being measured from the 50% point—that is, high is defined as 50% of signal value and low is defined as 50% of signal value. The timing parameters are similar to the ones used in SDRAM data sheets—that is, Table 39 indicates SDRAM requirements. All output signals are driven by the ESDCTL at the negative edge of SDCLK and the parameters are measured at maximum memory frequency. SD3 SDRAM clock cycle time tCK 7.5 — ns SD6 Address setup time tAS 1.8 — ns SD7 Address hold time tAH 1.8 — ns SD10 Precharge cycle period 1 tRP 1 4 clock SD11 Auto precharge command period 1 tRC 2 20 clock Note: 1 SD10 and SD11 are determined by SDRAM controller register settings. Table 39. SDRAM Refresh Timing Parameters (continued)

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78 Freescale Semiconductor

Figure 40. SDRAM Self-Refresh Cycle Timing Diagram Table 40. SDRAM Self-Refresh Cycle Timing Parameters

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 79 Figure 41. Mobile DDR SDRAM Write Cycle Timing Diagram defined as 50% of signal value. parameters are measured at maximum memory frequency. Table 41. Mobile DDR SDRAM Write Cycle Timing Parameters 1 1 T est condition: Measured using delay line 5 programmed as follows: ESDCDL Y5[15:0] = 0x0703.

i.MX27 and i.MX27L Data Sheet, Rev. 1.5

80 Freescale Semiconductor

Figure 42. Mobile DDR SDRAM DQ versus DQS and SDCLK Read Cycle Timing Diagram defined as 50% of signal value. parameters are measured at maximum memory frequency.

4.3.9.1 SDHC Electrical DC Characteristics

Table 43 lists the SDHC electrical DC characteristics. Table 42. Mobile DDR SDRAM Read Cycle Timing Parameters Table 43. SDHC Electrical DC Characteristics

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 81 SD14 Supply Voltage (high voltage) 2.7 3.6 V SD15 Power Up Time — 250 ms — SD16 Supply Current 100 — mA — Bus Signal Line Load SD17 Pull-up Resistance 10 100 k Ω Internal PU SD18 Open Drain Resistance NA NA kΩ For MMC cards only Open Drain Signal Level — SD19 Output High Voltage V DD – 0.2 — V IOH=-100 mA SD20 Output Low Voltage — 0.3 V IOL= 2 mA Push-Pull Signal Levels (High Voltage) SD21 Output HIGH Voltage 0.75 x V DD —V I OH=-100 mA @VDD min SD22 Output LOW Voltage — 0.125 x V DD VI OL=100 mA @VDD min SD23 Input HIGH Voltage 0.625 x V DD VDD + 0.3 V — SD24 Input LOW Voltage VSS – 0.3 0.25 x V DD V— Push-Pull Signal Levels (Low Voltage) SD25 Output HIGH Voltage V DD – 0.2 — V I OH=-100 mA @VDD min SD26 Output LOW Voltage — 0.2 V I OL=100 mA @VDD min SD27 Input HIGH Voltage 0.7 x V DD VDD + 0.3 V — SD28 Input LOW Voltage VSS – 0.3 0.3 x V DD V—

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4.3.10 Smart Liquid Crystal Display Controller (SLCDC)

Figure 43 and Figure 44 show the timings of the SLCDC, and Table 44 and Table 45 list the timing parameters. Figure 43. SLCDC Timing Diagram—Serial Transfers to LCD Device

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 83 Figure 44. SLCDC Timing Diagram—Para llel Transfers to LCD Device Table 44. SLCDC Serial Interface Timing Parameters Table 45. SLCDC Parallel Interface Timing Parameters

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4.3.11 Synchronous Serial Interface (SSI)

This section describes the electrical information of SSI.

4.3.11.1 SSI Transmitter Timing with Internal Clock

Figure 45 and Figure 46 show the SSI transmitter timing with internal clock, and Table 46 lists the timing parameters. Figure 45. SSI Transmitter with Internal Clock Timing Diagram Table 45. SLCDC Parallel Interface Timing Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 85 Figure 46. SSI Transmitter with Internal Clock Timing Diagram Table 46. SSI Transmitter with Internal Clock Timing Parameters

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86 Freescale Semiconductor

 All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.  All timings are on AUDMUX pads when SSI is being used for data transfer.  “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.  For internal Frame Sync operation using external clock, the FS timing will be same as that of Tx Data (for example, during AC97 mode of operation).

4.3.11.2 SSI Receiver Timing with Internal Clock

Figure 47 and Figure 48 show the SSI receiver timing with internal clock, and Table 47 lists the timing parameters. Figure 47. SSI Receiver with Internal Clock Timing Diagram Table 46. SSI Transmitter with Internal Clock Timing Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 87 Figure 48. SSI Receiver with Internal Clock Timing Diagram Table 47. SSI Receiver with Internal Clock Timing Parameters

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88 Freescale Semiconductor

All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures. All timings are on AUDMUX pads when SSI is being used for data transfer. “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI. For internal Frame Sync operation using external clock, the FS timing is the same as that of Tx Data, for example, during the AC97 mode of operation.

4.3.11.3 SSI Transmitter Timing with External Clock

Figure 49 and Figure 50 show the SSI transmitter timing with external clock, and Table 48 lists the timing parameters. Figure 49. SSI Transmitter with External Clock Timing Diagram Table 47. SSI Receiver with Internal Clock Timing Parameters (continued)

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 89 Figure 50. SSI Transmitter with External Clock Timing Diagram Table 48. SSI Transmitter with External Clock Timing Parameters

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All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures. All timings are on AUDMUX pads when the SSI is being used for data transfer. “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI. For internal Frame Sync operation using external clock, the FS timing will be same as that of Tx Data, for example, during the AC97 mode of operation.

4.3.11.4 SSI Receiver Timing with External Clock

Figure 51 and Figure 52 show the SSI receiver timing with external clock, and Table 49 lists the timing parameters. Figure 51. SSI Receiver with External Clock Timing Diagram

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 91 Figure 52. SSI Receiver with External Clock Timing Diagram Table 49. SSI Receiver with External Clock Timing Parameters

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All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures. All timings are on AUDMUX pads when the SSI is being used for data transfer. “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI. For internal Frame Sync operation using external clock, the FS timing will be same as that of Tx Data, for example, during the AC97 mode of operation.

4.3.12 Wireless External Interface Module (WEIM)

All WEIM output control signals may be asserted and deasserted by internal clock related to BCLK rising edge or falling edge according to corresponding assertion/negation control fields. Address always begins related to BCLK falling edge but may be ended both on rising and falling edge in muxed mode according to control register configuration. Output data begins related to BCLK rising edge except in muxed mode where both rising and falling edge may be used according to control register configuration. Input data, ECB and DTACK all captured according to BCLK rising edge time. Figure 53 shows the timing of the WEIM module, and Table 50 lists the timing parameters. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 93 Figure 53. WEIM Bus Timing Diagram Table 50. WEIM Bus Timing Parameters

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High is defined as 80% of signal value and low is defined as 20% of signal value. Test conditions: pad voltage, 1.7–1.95 V; pad capacitance, 25 pF. Recommended drive strength for all controls, address, and BCLK is Max High. WE5 Clock rise/fall to RW Valid 0.90 2.60 ns WE6 Clock rise/fall to RW Invalid 0.90 2.60 ns WE7 Clock rise/fall to OE Valid 1.17 3.57 ns WE8 Clock rise/fall to OE Invalid 1.17 3.57 ns WE9 Clock rise/fall to EB [x] Valid 0.73 2.43 ns WE10 Clock rise/fall to EB [x] Invalid 0.73 2.43 ns WE11 Clock rise/fall to LBA Valid 1.03 2.84 ns WE12 Clock rise/fall to LBA Invalid 1.03 2.84 ns WE13 Clock rise/fall to Output Data Valid 1.04 4.01 ns WE14 Clock rise to Output Data Invalid 1.04 4.01 ns WE15 Input Data Valid to Clock rise, FCE=0 6.95 — ns WE16 Cloc/k rise to Input Data Invalid, FCE=0 2.35 — ns WE17 Input Data Valid to Clock rise, FCE=1 1.24 — ns WE18 Clock rise to Input Data Invalid, FCE=1 0.23 — ns WE19 ECB setup time, FCE=0 7.23 — ns WE20 ECB hold time, FCE=0 2.93 — ns WE21 ECB setup time, FCE=1 1.08 — ns WE22 ECB hold time, FCE=1 0 — ns WE23 DTACK setup time 5.35 — ns WE24 DTACK hold time 3.19 — ns WE25 BCLK High Level Width 1 3.0 — ns WE26 BCLK Low Level Width 1 3.0 — ns WE27 BCLK Cycle time 1 7.5 — ns Note:

1 BCLK parameters are being measured from the 50% point—that is, high is defined as 50% of signal

value and low is defined as 50% of signal value. Table 50. WEIM Bus Timing Parameters (continued)

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Figure 56. Synchronous Memory Timing Diagram for Two Non-Sequential Figure 57. Synchronous Memory TIming Diagram for Burst

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 97 Figure 58. Muxed A/D Mode Timing Diagram for Asynchronous Figure 59. Muxed A/D Mode Timing Diagram for Asynchronous

4.3.13 USBOTG Electricals

This section describes the electrical information of the USB OTG port and host ports.

4.3.14 Serial Interface

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 VP_VM bidirectional, 4-wire mode  VP_VM unidirectional, 6-wire mode

4.3.14.1 DAT_SE0 Bidirectional Mode

Figure 60. USB Transmit Waveform in DAT_SE0 Bidirectional Mode Figure 61. USB Receive Waveform in DAT_SE0 Bidirectional Mode Table 51. Signal Definitions—DAT_SE0 Bidirectional Mode

i.MX27 and i.MX27L Data Sheet, Rev. 1.5 Freescale Semiconductor 99

4.3.14.2 DAT_SE0 Unidirectional Mode

Figure 62. USB Transmit Waveform in DAT_SE0 Unidirectional Mode Table 52. OTG Port Timing Specification in DAT_SE0 Bidirectional Mode Table 53. Signal Definitions—DAT_SE0 Unidirectional Mode USB_DAT_VP Out TX data when USB_TXOE_B is low. USB_SE0_VM Out SE0 drive when USB_TXOE_B is low. USB_VP1 In Buffered data on DP when USB_TXOE_B is high. USB_VM1 In Buffered data on DM when USB_TXOE_B is high. USB_RCV In Differential RX data when USB_TXOE_B is high.

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Figure 63. USB Receive Waveform in DAT_SE0 Unidirectional Mode

4.3.14.3 VP_VM Bidirectional Mode

Table 54. OTG Port Timing Specification in DAT_SE0 Unidirectional Mode Table 55. Signal Definitions—VP_VM Bidirectional Mode

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4.3.14.4 VP_VM Unidirectional Mode

Table 56. OTG Port Timing Specification in VP_VM Bidirectional Mode Table 57. Signal Definitions—VP_VM Unidirectional Mode

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Table 58. USB Timing Specification in VP_VM Unidirectional Mode

5 Package Information and Pinout

package and a 19 mm × 19 mm, 0.8 mm pitch, 473-pin MAPBGA package.

5.1 Full Package Outline Drawing (17 mm × 17 mm)

Figure 68 shows the package drawings and dimensions of the production package. Figure 68. i.MX27/MX27L 17 mm × 17 mm Full Package MAPBGA: Mechanical Drawing

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Package Information and Pinout

5.2 Pin Assignments (17 mm × 17 mm)

Table 59 on page 107 shows the i.MX27 full 17 × 17 mm package MAPBGA pin assignments. Table 60 on page 112 identifies the pin assignments for the ball grid array (BGA) for full package. The list is sorted alphabetically by the name of the contact. The connections of these pins depend solely upon the user application, however there are a few factory test signals that are not used in a normal application. Following is a list of these signals and how they are to be terminated for proper operation of the i.MX27/MX27L processor:  CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.  OSC26M_TEST: To ensure proper operation, leave this signal as no connect.  EXT_60M: To ensure proper operation, connect this signal to ground.  EXT_266M: To ensure proper operation, connect this signal to ground.  Most of the signals shown in Table 59 are multiplexed with other signals. For ease of reference, all of the signals at a particular pad are shown in the form of a compound signal name. Please refer to Table 3 for complete information on the signal multiplexing schemes of these signals. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

Table 59. i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment

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Table 59. i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment (continued)

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Table 60. i.MX27 BGA (17 mm × 17 mm)— Contact Name Listing

Table 60. i.MX27 BGA (17 mm × 17 mm)— Contact Name Listing (continued)

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124 Freescale Semiconductor

5.3 Full Package Outline Drawing (19 mm × 19 mm)

Figure 69 shows the package drawings and dimensions of the production package. Figure 69. i.MX27/MX27L 19 × 19 mm Full Package MAPBGA: Mechanical Drawing

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Package Information and Pinout

5.4 Pin Assignments (19 mm × 19 mm)

Table 61 shows the i.MX27 full 19 × 19 mm package MAPBGA pin assignment. Table 62 identifies the pin assignments for the ball grid array (BGA) for full package. The connections of these pins depend solely upon the user application, however there are a few factory test signals that are not used in a normal application. Following is a list of these signals and how they are to be terminated for proper operation of the i.MX27/MX27L processor:  CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.  OSC26M_TEST: To ensure proper operation, leave this signal as no connect.  EXT_60M: To ensure proper operation, connect this signal to ground.  EXT_266M: To ensure proper operation, connect this signal to ground.  Most of the signals shown in Table 62 are multiplexed with other signals. For ease of reference, all of the signals at a particular pad are shown in the form of a compound signal name. Refer to Table 3 for complete information on the signal multiplexing schemes of these signals. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A

Table 61. i.MX27 Full 19 mm × 19 mm package MAPBGA Pin Assignment

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Table 61. i.MX27 Full 19 mm × 19 mm package MAPBGA Pin Assignment (continued)

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Table 62 shows the device pin list, sorted by sorted by location. Table 62. i.MX27 BGA (19 mm × 19 mm)—Contact Name Listing

Table 62. i.MX27 BGA (19 mm × 19 mm)—Contact Name Listing (continued)

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6 Product Documentation

This Data Sheet is labeled as a particular type: Product Preview, Advance Information, or Technical Data. Definitions of these types are available at: http://www.freescale.com.

7 Revision History

Table 63 summarizes revisions to this document since the previous release. Table 63. Document Revision History 1.5 12/2009  Updated T able 1, “Ordering Information,” to include new part numbers and table footnote. 1.4 5/2009  In Ta ble 11 Current Consumption a column for Max value was added. information was corrected and the table reformatted. information was corrected and the table was reformatted. I n Ta ble 23, “CSPI Interface Timing Parameters,” updated t6’ and t13, and removed t14. as MCIMX27FVOP4A has been corrected to read MCIMX27VOP4A. 1.1 7/2008 Formatting and template work.

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