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Features
Frequency: 3400–3650 MHz Advanced high performance in- -package Doherty Fully matched (50 ohm input/output, DC blocked) Designed for low complexity analog ordigital linearization systems Document Number: A3M35TL039 Rev. 2, 12/2020 NXP Semiconductors Technical Data 3400–3650 MHz, 28 dB, 7 W Avg. AIRFAST POWER AMPLIFIER MODULE A3M35TL039 10 mm 6 mm Module 2020 NXP B.V.
Figure 1. Pin Connections Note: Exposed backside of the package is DC and RF ground.
- VDC2 and VDP2 are DC coupled internal to the package and must be powered by a single DC power supply.
Table 1. Functional Pin Description
3 VDC2 Carrier Drain Supply, Stage 2
4 VDC1 Carrier Drain Supply, Stage 1
5 RFin RF Input
6 VGP2 Peaking Gate Supply, Stage 2
7 VGP1 Peaking Gate Supply, Stage 1
8 VGC1 Carrier Gate Supply, Stage 1
9 VGC2 Carrier Gate Supply, Stage 2
10 VDP1 Peaking Drain Supply, Stage 1
11 VDP2 Peaking Drain Supply, Stage 2
17 RFout RF Output
Table 2. Maximum Ratings Table 3. Lifetime Table 4. ESD Protection Characteristics Table 5. Moisture Sensitivity Level
Table 6. Electrical Characteristics(TA =2 5C unless otherwise noted)
- Each side of device measured separately.
Table 6. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) ISBW of 400 MHz at 30 Vdc, 3 dB Input Overdrive from 7 W Avg. Table 7. Ordering Information
- Part input and output matched to 50 ohms.
- ATE is a socketed test environment.
- All data measured in fixture with device soldered in NXP reference circuit.
- Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987,Quiescent Current
and search for AN1977 or AN1987.
- Gain flatness = Max(G(fLow to fHigh)) – Min(G(fLow to fHigh))
Figure 2. A3M35TL039 Reference Circuit Component Layout Table 8. A3M35TL039 Reference Circuit Component Designations and Values
Figure 3. Product Marking
PACKAGE INFORMATION
PRODUCT DOCUMENTATION AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family Development Tools Printed Circuit Boards FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where NXP is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local NXP Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description
0 May 2020 Initial release of data sheet
1 Sept. 2020 General updates made to align data sheet to current standard 2 Dec. 2020 Changed higher frequency operation of the part from 3600 MHz to 3650 MHz. Added 3640 MHz to performance table with corresponding measured data, p. 1 Table 4, ESD Protection Characteristics: updated Human Body Model ESD from Class 1A to 1B to reflect actual Qual Report results, p. 4
Document Number: A3M35TL039 Rev. 2, 12/2020 Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, orguarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo, Freescale, the Freescale logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E 2020 NXP B.V. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support