MCBB100 MULTICOMP | Alldatasheet
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www.element14.com www.farnell.com www.newark.com Page <1> V1.014/03/17 Solderless Breadboard Specifications Housing Material : ABS Plastic Spring Clips : Copper, Ni plated Wire Range : Sol 29AWG to 20AWG Rated Voltage : 300V Rated Current : 3A to 5A
2 Distribution Strip : 200 Tie-point
Pitch : 2.54mm Dimensions : 20.5mm × 165.3mm × 8.3mm Linear Dimension (Tolerance Standard GB/T 14486-2008) Variable Range to 6 Over 6 to Over 10 to Over 18 to Over 30 to Over 50 to Over 80 to 120 Over 120 to 160 Over 160 to 200 Over 200 to 250 Over 250 to all to 5 Over 5 to Over 30 to 120 Over 120 to Diagram Dimensions : Millimetres Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. © Premier Farnell Limited 2016. Part Number Table Description Part Number Solderless Breadboard MCBB100