MPC7410ECS08AD NXP | Alldatasheet
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© 2010 Freescale Semiconductor, Inc. All rights reserved. Freescale Semiconductor Technical Data This document describes part-number-specific changes to the MPC7410 RISC Microprocessor Hardware Specifications (Document No. MPC7410EC). Specifications provided in this document supersede those in the MPC7410 RISC Microprocessor Hardware Specifications, Rev. 1 or later, for the part numbers listed in Table A only. Specifications not addressed herein are unchanged. Because this document is frequently updated, see the website listed on the back page of this document or contact your Freescale sales office for the latest version. Document Number: MPC7410ECS08AD Rev. 1, 11/2010 Freescale Part Numbers Affected: MPC7410THX400LE MPC7410THX450LE MPC7410THX500LE MC7410TVU400LE MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410T xxnnnLE Series
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410TxxnnnLE Series, Rev. 1
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The MPC7410TxxnnnLE series DC electrical characteristics are identical to that of the MPC7410, with the exception shown in Table B. Table A. Part-Number-Specific Changes Freescale Part Number Operating Conditions Significant Changes from Hardware SpecificationCPU Frequency (MHz) VDD TJ (°C) OVDD (V) specifications not mentioned in this document, see the MPC7410RX500LE specifications in the MPC7410 RISC Microprocessor Hardware Specifications . specifications not mentioned in this document, see the MPC7410RX450LE specifications in the MPC7410 RISC Microprocessor Hardware Specifications . specifications not mentioned in this document, see the MPC7410RX400LE specifications in the MPC7410 RISC Microprocessor Hardware Specifications . specifications not mentioned in this document, see the MC7410VU400LE specifications in the MPC7410 RISC Microprocessor Hardware Specifications . Table B. Recommended Operating Conditions Characteristic Symbol Recommended Value Unit Die-junction temperature T j –40 to 105 °C Note: See the MPC7410 RISC Microprocessor Hardware Specifications .
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410TxxnnnLE Series, Rev. 1 Freescale Semiconductor 3 Part Numbers Addressed by this Specification Table C provides the ordering information for the MPC7410TxxnnnLE series. Part Marking Parts are marked as the example shown in Figure A. Figure A. Part Marking for BGA Device Table C. Part Marking Nomenclature MPC 7410 T xx nnn LE Product Code Part Identifier Process Descriptor Package Processor Frequency 1 Application Modifier Revision Level MPC 7410 T: –40 to 105 °C HX = HCTE_CBGA 400 450 500 L: 1.8 V ±100 mV E: 1.4; PVR = 800C 1104 MC VU = HCTE_CBGA (Lead Free C5 Solder Spheres) 400 Note: 1. Processor core frequencies supported by parts addressed by this specification only. Parts addressed by other specifications may support other maximum core frequencies. BGA Notes: CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States. MMMMMM is the 6-digit mask number. ATWL YYWWA is the traceability code. MPC7410 THXnnnLE MMMMMM ATWLYYWWA 7410 nnn is the speed grade of the part.
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410TxxnnnLE Series, Rev. 1
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Table D provides a revision history for this document. Table D. Document Revision History Revision Date Substantive Chagnes(s) 1 11/2010 Removed “HX” from document title. Added MC7410TVU400LE to list of devices covered by this document. Updated Table C, “Part Marking Nomenclature,” to include MC7410TVU400LE. 0.1 4/2005 Document template update Document ID change from MPC7410THXLEPNS for Part Number Specification to MPC7410ECS08AD for Hardware Specification Addendum. 0 10/2003 Initial release.
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