MC34063A TI | Alldatasheet
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1.25-V Reference Regulator R CT Ipk Oscillator Switch Collector Switch EmitterTiming Capacitor GND 5Comparator Inverting Input VCC Ipk Sense Drive Collector 100 /c87 Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community MC33063A,MC34063A SLLS636N –DECEMBER 2004–REVISED JANUARY 2015 MC3x063A1.5-APeakBoost/Buck/InvertingSwitchingRegulators
1 Features 3 Description
The MC33063A and MC34063A devices are easy-to- 1• Wide Input Voltage Range: 3 V to 40 V use ICs containing all the primary circuitry needed for• High Output Switch Current: Up to 1.5 A building simple DC-DC converters. These devices
- Adjustable Output Voltage primarily consist of an internal temperature- compensated reference, a comparator, an oscillator,• Oscillator Frequency Up to 100 kHz a PWM controller with active current limiting, a driver,• Precision Internal Reference: 2% and a high-current output switch. Thus, the devices• Short-Circuit Current Limiting require minimal external components to build converters in the boost, buck, and inverting• Low Standby Current topologies.
2 Applications The MC33063A device is characterized for operation
from –40°C to 85°C, while the MC34063A device is• Blood Gas Analyzers: Portable characterized for operation from 0°C to 70°C.• Cable Solutions
- HMIs (Human Machine Interfaces) Device Information(1)
- Telecommunications PART NUMBER PACKAGE (PIN) BODY SIZE
- Portable Devices SOIC (8) 4.90 mm × 3.91 mm
- Consumer & Computing MC3x063A SON (8) 4.00 mm × 4.00 mm PDIP (8) 9.81 mm × 6.35 mm• Test & Measurement (1) For all available packages, see the orderable addendum at the end of the data sheet.
4 Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
MC33063A,MC34063A SLLS636N –DECEMBER 2004–REVISED JANUARY 2015 www.ti.com Table of Contents
5 Revision History
Changes from Revision M (January 2011) to Revision N Page
- Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
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Product Folder Links: MC33063A MC34063A
Comparator Inverting Input D (SOIC) OR P (PDIP) PACKAGE (TOP VIEW) DRJ (QFN) PACKAGE (TOP VIEW) Comparator Inverting Input Switch Collector 1 8 Switch Emitter Timing Capacitor GND VCC Ipk Driver Collector † The exposed thermal pad is electrically bonded internally to pin 4 (GND) . MC33063A,MC34063A www.ti.com SLLS636N –DECEMBER 2004–REVISED JANUARY 2015
6 Pin Configuration and Functions
NAME NO. Switch Collector 1 I/O High-current internal switch collector input. Switch Emitter 2 I/O High-current internal switch emitter output. Timing Capacitor 3 — Attach a timing capacitor to change the switching frequency. GND 4 — Ground Comparator 5 I Attach to a resistor divider network to create a feedback loop.Inverting Input VCC 6 I Logic supply voltage. Tie to VIN. IPK 7 I Current-limit sense input. Driver Collector 8 I/O Darlington pair driving transistor collector input. Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: MC33063A MC34063A
MC33063A,MC34063A SLLS636N –DECEMBER 2004–REVISED JANUARY 2015 www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage 40 V VIR Comparator inverting input voltage range –0.3 40 V VC(switch) Switch collector voltage 40 V VE(switch) Switch emitter voltage VPIN1 = 40 V 40 V VCE(switch) Switch collector to switch emitter voltage 40 V VC(driver) Driver collector voltage 40 V IC(driver) Driver collector current 100 mA ISW Switch current 1.5 A TJ Operating virtual junction temperature 150 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2500 V(ESD) Electrostatic discharge VCharged device model (CDM), per JEDEC specification JESD22-C101, 1500all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MC33063A –40 85 TA Operating free-air temperature °C MC34063A 0 70
7.4 Thermal Information
THERMAL METRIC(1) D DRJ P UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 97 41 85 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
7.5 Electrical Characteristics— Oscillator
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram) PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT fosc Oscillator frequency VPIN5 = 0 V, CT = 1 nF 25°C 24 33 42 kHz Ichg Charge current VCC = 5 V to 40 V 25°C 24 35 42 μA Idischg Discharge current VCC = 5 V to 40 V 25°C 140 220 260 μA Idischg/Ichg Discharge-to-charge current ratio VPIN7 = VCC 25°C 5.2 6.5 7.5 — VIpk Current-limit sense voltage Idischg = Ichg 25°C 250 300 350 mV
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Product Folder Links: MC33063A MC34063A
MC33063A,MC34063A www.ti.com SLLS636N –DECEMBER 2004–REVISED JANUARY 2015
7.6 Electrical Characteristics— Output Switch
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram)(1) PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT Saturation voltage –VCE(sat) ISW = 1 A, pins 1 and 8 connected Full range 1 1.3 VDarlington connection Saturation voltage – ISW = 1 A, RPIN8 = 82 Ω to VCC,VCE(sat) Full range 0.45 0.7 Vnon-Darlington connection(2) forced β ∼ 20 hFE DC current gain ISW = 1 A, VCE = 5 V 25°C 50 75 — IC(off) Collector off-state current VCE = 40 V Full range 0.01 100 μA (1) Low duty-cycle pulse testing is used to maintain junction temperature as close to ambient temperature as possible. (2) In the non-Darlington configuration, if the output switch is driven into hard saturation at low switch currents (≤300 mA) and high driver currents (≥30 mA), it may take up to 2 μs for the switch to come out of saturation. This condition effectively shortens the off time at frequencies ≥30 kHz, becoming magnified as temperature increases. The following output drive condition is recommended in the non- Darlington configuration: Forced β of output switch = IC,SW / (IC,driver – 7 mA) ≥ 10, where ∼7 mA is required by the 100-Ω resistor in the emitter of the driver to forward bias the Vbe of the switch.
7.7 Electrical Characteristics— Comparator
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram) PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT 25°C 1.225 1.25 1.275 Vth Threshold voltage V Full range 1.21 1.29 ΔVth Threshold-voltage line regulation VCC = 5 V to 40 V Full range 1.4 5 mV IIB Input bias current VIN = 0 V Full range –20 –400 nA
7.8 Electrical Characteristics— Total Device
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram) PARAMETER TEST CONDITIONS TA MIN MAX UNIT VCC = 5 V to 40 V, CT = 1 nF, ICC Supply current VPIN7 = VCC, VPIN5 > Vth, Full range 4 mA VPIN2 = GND, All other pins open Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: MC33063A MC34063A
7.9 Typical Characteristics
Figure 2. Output Switch Saturation Voltage vsFigure 1. Output Switch On-Off Time vs Figure 4. Standby Supply Current vs Supply VoltageFigure 3. Output Switch Saturation Voltage vs
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1.25-V Reference Regulator R CT Ipk Oscillator Switch Collector Switch EmitterTiming Capacitor GND 5Comparator Inverting Input VCC Ipk Sense Drive Collector 100 /c87 MC33063A,MC34063A www.ti.com SLLS636N –DECEMBER 2004–REVISED JANUARY 2015
8 Detailed Description
8.1 Overview
The MC33063A and MC34063A devices are easy-to-use ICs containing all the primary circuitry needed for building simple DC-DC converters. These devices primarily consist of an internal temperature-compensated reference, a comparator, an oscillator, a PWM controller with active current limiting, a driver, and a high-current output switch. Thus, the devices require minimal external components to build converters in the boost, buck, and inverting topologies. The MC33063A device is characterized for operation from –40°C to 85°C, while the MC34063A device is characterized for operation from 0°C to 70°C.
8.2 Functional Block Diagram
8.3 Feature Description
- Wide Input Voltage Range: 3 V to 40 V
- High Output Switch Current: Up to 1.5 A
- Adjustable Output Voltage
- Oscillator Frequency Up to 100 kHz
- Precision Internal Reference: 2%
- Short-Circuit Current Limiting
- Low Standby Current
8.4 Device Functional Modes
8.4.1 Standard operation
Based on the application, the device can be configured in multiple different topologies. See the Application and Implementation section for how to configure the device in several different operating modes. Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: MC33063A MC34063A
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 External Switch Configurations for Higher Peak Current
configuration in Figure 7b is recommended. Figure 5. Boost Regulator Connections for IC Peak Greater Than 1.5 A
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Figure 6. Buck Regulator Connections for IC Peak Greater Than 1.5 A Figure 7. Inverting Regulator Connections for IC Peak Greater Than 1.5 A
9.2 Typical Application
9.2.1 Voltage-Inverting Converter Application
Figure 8. Voltage-Inverting Converter
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R21.25 1 R1 /c230 /c246/c45 /c43 /c231 /c247 /c232 /c248 /c40 /c41 out on ripple pp I t9 V /c40 /c41/c40 /c41 /c40 /c41 /c40 /c41 satin min on max pk switch V V tI /c230 /c246 /c45/c231 /c247 /c231 /c247 /c231 /c247 /c232 /c248 /c40 /c41pk switch 0.3 I /c40 /c41 on out max off t2 I 1 t /c230 /c246 /c43/c231 /c247 /c232 /c248 on4 10 t/c45/c180 /c40 /c41on off offt t t /c43 /c45 on off on off t t t 1t /c43 /c43 f out F in sat V V V V /c43 /c45 MC33063A,MC34063A www.ti.com SLLS636N –DECEMBER 2004–REVISED JANUARY 2015 Typical Application (continued)
9.2.1.1 Design Requirements
The user must determine the following desired parameters: Vsat = Saturation voltage of the output switch VF = Forward voltage drop of the chosen output rectifier The following power-supply parameters are set by the user: Vin = Nominal input voltage Vout = Desired output voltage Iout = Desired output current fmin = Minimum desired output switching frequency at the selected values of Vin and Iout Vripple = Desired peak-to-peak output ripple voltage. The ripple voltage directly affects the line and load regulation and, thus, must be considered. In practice, the actual capacitor value should be larger than the calculated value, to account for the capacitor's equivalent series resistance and board layout.
9.2.1.2 Detailed Design Procedure
CALCULATION VOLTAGE INVERTING ton/toff (ton + toff) toff ton CT Ipk(switch) RSC L(min) CO Vout See Figure 8 Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: MC33063A MC34063A
9.2.1.3 Application Performance
Figure 9. Current-Limit Sense Voltage vs Temperature
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28 V/175 mA
9.2.2 Step-Up Converter Application
Figure 10. Step-Up Converter
9.2.2.1 Design Requirements
calculated value, to account for the capacitor's equivalent series resistance and board layout.
R21.25 1 R1 /c230 /c246 /c43/c231 /c247 /c232 /c248 /c40 /c41 out on ripple pp I t9 V /c40 /c41/c40 /c41 /c40 /c41 /c40 /c41 satin min on max pk switch V V tI /c230 /c246 /c45/c231 /c247 /c231 /c247 /c231 /c247 /c232 /c248 /c40 /c41pk switch 0.3 I /c40 /c41 on out max off t2 I 1 t /c230 /c246 /c43/c231 /c247 /c232 /c248 on4 10 t/c45/c180 /c40 /c41on off offt t t /c43 /c45 on off on off t t t 1t /c43 /c43 f /c40 /c41 /c40 /c41 out F Vin min satin min V V V V /c45/c43 /c45 MC33063A,MC34063A SLLS636N –DECEMBER 2004–REVISED JANUARY 2015 www.ti.com
9.2.2.2 Detailed Design Procedure
(ton + toff) toff ton CT Ipk(switch) RSC L(min) CO Vout See Figure 10
9.2.2.3 Application Performance
Line regulation VIN = 8 V to 16 V, IO = 175 mA 30 mV ± 0.05% Load regulation VIN = 12 V, IO = 75 mA to 175 mA 10 mV ± 0.017% Output ripple VIN = 12 V, IO = 175 mA 400 mVPP Efficiency VIN = 12 V, IO = 175 mA 87.7% Output ripple with optional filter VIN = 12 V, IO = 175 mA 40 mVPP
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Product Folder Links: MC33063A MC34063A
5 V/500 mA
9.2.3 Step-Down Converter Application
Figure 11. Step-Down Converter
9.2.3.1 Design Requirements
calculated value, to account for the capacitor's equivalent series resistance and board layout.
R21.25 1 R1 /c230 /c246 /c43/c231 /c247 /c232 /c248 /c40 /c41 /c40 /c41 /c40 /c41 pk on offswitch ripple pp I t t /c43 /c40 /c41/c40 /c41 /c40 /c41 /c40 /c41 sat outin min on max pk switch V V V tI /c230 /c246 /c45 /c45/c231 /c247 /c231 /c247 /c231 /c247 /c232 /c248 /c40 /c41pk switch 0.3 I /c40 /c41out max2 I on4 10 t/c45/c180 /c40 /c41on off offt t t /c43 /c45 on off on off t t t 1t /c43 /c43 f /c40 /c41 out F sat outin min V V V V V /c43 /c45 /c45 MC33063A,MC34063A SLLS636N –DECEMBER 2004–REVISED JANUARY 2015 www.ti.com
9.2.3.2 Detailed Design Procedure
(ton + toff) toff ton CT Ipk(switch) RSC L(min) CO Vout See Figure 11
9.2.3.3 Application Performance
Line regulation VIN = 15 V to 25 V, IO = 500 mA 12 mV ± 0.12% Load regulation VIN = 25 V, IO = 50 mA to 500 mA 3 mV ± 0.03% Output ripple VIN = 25 V, IO = 500 mA 120 mVPP Short-circuit current VIN = 25 V, RL = 0.1 Ω 1.1 A Efficiency VIN = 25 V, IO = 500 mA 83.7% Output ripple with optional filter VIN = 25 V, IO = 500 mA 40 mVPP
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Product Folder Links: MC33063A MC34063A
10 Power Supply Recommendations
11 Layout
11.1 Layout Guidelines
be thicker to handle the higher current.
11.2 Layout Example
Figure 12. Layout Example for a Step-Down Converter
12 Device and Documentation Support
12.1 Related Links
resources, tools and software, and quick access to sample or buy. Table 1. Related Links
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) MC33063AD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063AD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063ADE4 Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063ADG4 Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063ADR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063ADRE4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063ADRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M33063A MC33063ADRJR Active Production SON (DRJ) | 8 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 ZYF MC33063ADRJR.A Active Production SON (DRJ) | 8 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 ZYF MC33063AP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 MC33063AP MC33063AP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 MC33063AP MC33063APE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 MC33063AP MC34063AD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 M34063A MC34063AD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 M34063A MC34063ADE4 Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 M34063A MC34063ADG4 Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 M34063A MC34063ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 M34063A MC34063ADR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 M34063A MC34063ADRJR Active Production SON (DRJ) | 8 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR 0 to 70 ZYF MC34063ADRJR.A Active Production SON (DRJ) | 8 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR 0 to 70 ZYF MC34063ADRJRG4 Active Production SON (DRJ) | 8 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR 0 to 70 ZYF MC34063AP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 MC34063AP MC34063AP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 MC34063AP MC34063APE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 MC34063AP (1) Status: For more details on status, see our product life cycle. Addendum-Page 1
www.ti.com 23-May-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MC33063A :
- Automotive : MC33063A-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MC33063ADR SOIC D 8 2500 353.0 353.0 32.0 MC33063ADR SOIC D 8 2500 340.5 338.1 20.6 MC33063ADRJR SON DRJ 8 1000 367.0 367.0 35.0 MC34063ADR SOIC D 8 2500 353.0 353.0 32.0 MC34063ADRJR SON DRJ 8 1000 210.0 185.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) MC33063AD D SOIC 8 75 507 8 3940 4.32 MC33063AD D SOIC 8 75 506.6 8 3940 4.32 MC33063AD.A D SOIC 8 75 507 8 3940 4.32 MC33063AD.A D SOIC 8 75 506.6 8 3940 4.32 MC33063ADE4 D SOIC 8 75 506.6 8 3940 4.32 MC33063ADE4 D SOIC 8 75 507 8 3940 4.32 MC33063ADG4 D SOIC 8 75 506.6 8 3940 4.32 MC33063ADG4 D SOIC 8 75 507 8 3940 4.32 MC33063AP P PDIP 8 50 506 13.97 11230 4.32 MC33063AP.A P PDIP 8 50 506 13.97 11230 4.32 MC33063APE4 P PDIP 8 50 506 13.97 11230 4.32 MC34063AD D SOIC 8 75 507 8 3940 4.32 MC34063AD.A D SOIC 8 75 507 8 3940 4.32 MC34063ADE4 D SOIC 8 75 507 8 3940 4.32 MC34063ADG4 D SOIC 8 75 507 8 3940 4.32 MC34063AP P PDIP 8 50 506 13.97 11230 4.32 MC34063AP.A P PDIP 8 50 506 13.97 11230 4.32 MC34063APE4 P PDIP 8 50 506 13.97 11230 4.32 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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