MC36207 MULTICOMP | Alldatasheet
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Technical content
Page <1> V1.009/09/19 Resettable Fuse Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro Specifications: Applications : All high-density boards Product Features : Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices Temperature Range : -40°C to +85°C Electrical Characteristics (23°C) IH = Hold current-maximum current at which the device will not trip at 23°C still air IT = Trip current-minimum current at which the device will always trip at 23°C still air VMAX = Maximum voltage device can withstand without damage at its rated current (I maximum) IMAX = Maximum fault current device can withstand without damage at rated voltage (V maximum) Pd = Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment RMIN = Minimum device resistance at 23°C prior to tripping R1MAX = Maximum device resistance at 23°C measured 1 hour after tripping or reflow soldering of 260°C for 20 seconds Termination pad characteristics Termination pad materials : Pure Tin Hold Current Trip Current Rated Voltage Max. Current Typical Power Max. Time to Trip Resistance Part Number Current Time R Min. R1 Max. IH, A lT, A V Max., V DC I Max., A Pd, W Amp Sec ohms ohms 0.2 0.4 30 10 0.4 0.1 0.6 2.5 MC36207 0.35 0.75 16 40 0.3 1.2 MC36211 0.75 1.5 6 100 0.6 0.2 0.09 0.29 MC36216 1 1.8 0.3 0.055 0.21 MC36221 1.1 2.2 0.8 0.04 0.18 MC36222 1.50 3 1 0.03 0.12 MC36229 FSMD Product Dimensions MC36207 MC36211 MC36216 MC36221 MC36222 MC36229
Page <2> V1.009/09/19 Resettable Fuse Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro Thermal Derating Curve Typical Time-To-Trip at 23°C B=MC36207 C=MC36211 E=MC36216 F=MC36221 G=MC36222 H=MC36229 Dimensions : Millimetres A B C D E Part 3 3.5 5.5 1.8 0.45 0.75 0.1 0.75 - - MC36207 MC36211 1.25 0.25 0.1 0.45 MC36216 MC36221 MC36222 0.8 1.4 MC36229
Page <3> V1.009/09/19 Resettable Fuse Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro Dimensions : Millimetres Material Specification Terminal Pad Material : Pure Tin Soldering Characteristics : Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 Pad Layouts, Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1812 device Device A Nominal B Nominal C Nominal All 1206 Series 2 1 1.9 Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3°C/second maximum Preheat : Temperature Minimum (Tsmin) Temperature Maximum (Tsmax) Time (tsmin to tsmax) 150°C 200°C 60-180 seconds Time maintained above: Temperature(TL) Time (tL) 217°C 60-150 seconds Peak/Classification Temperature(Tp) 260°C Time within 5°C of actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate : 6°C/second maximum Time 25°C to Peak Temperature : 8 minutes maximum Note 1: All temperatures refer to of the package, measured on the package body surface Solder Reflow: Due to “Lead Free” nature, Temperature and Dwelling time for the soldering damage to other components. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment : < 30°C / 60% RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board.
Page <4> V1.009/09/19 Resettable Fuse Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro Description Part Number Surface Mountable PTC Resettable Fuse MC36207 MC36211 MC36216 MC36221 MC36222 MC36229 Part Number Table Important Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019.